JPH04368199A - Box structure of electronic device - Google Patents
Box structure of electronic deviceInfo
- Publication number
- JPH04368199A JPH04368199A JP14436791A JP14436791A JPH04368199A JP H04368199 A JPH04368199 A JP H04368199A JP 14436791 A JP14436791 A JP 14436791A JP 14436791 A JP14436791 A JP 14436791A JP H04368199 A JPH04368199 A JP H04368199A
- Authority
- JP
- Japan
- Prior art keywords
- exhaust
- housing
- box
- cooling fan
- circuit unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 230000000694 effects Effects 0.000 abstract description 5
- 238000007493 shaping process Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子機器の筺体構造に
関し、特に強制空冷を要する電子機器装置の中でも比較
的筺体高さの低い電子機器装置の筺体構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing structure for an electronic device, and more particularly to a housing structure for an electronic device whose housing height is relatively low among electronic devices that require forced air cooling.
【０００２】0002
【従来の技術】図２は従来の電子機器の筺体構造の断面
図である。筺体１中に電子回路ユニット２を収納し、冷
却ファン３により筺体１の底面よりの吸気６で電子回路
ユニット２を冷却し、冷却ファンの排気７を排気スペー
ス８を通して筺体１の天井部に当て、排気方向を転換し
、筺体１の背面に設けた排気孔５より排出する構造とな
っていた。2. Description of the Related Art FIG. 2 is a sectional view of a conventional electronic device housing structure. An electronic circuit unit 2 is housed in a housing 1, and a cooling fan 3 cools the electronic circuit unit 2 with intake air 6 from the bottom of the housing 1, and the exhaust air 7 of the cooling fan is applied to the ceiling of the housing 1 through an exhaust space 8. The structure was such that the exhaust direction was changed and the exhaust was discharged through an exhaust hole 5 provided on the back surface of the housing 1.
【０００３】0003
【発明が解決しようとする課題】高集積化が進んだ現代
、内蔵の電子回路ユニットの発熱密度が上がり、強制空
冷用冷却ファンの性能を最大限に活用する必要があり、
且つまた、筺体の小型化も必然的な要求となってきてい
る。従って冷却ファンの排気を直に、筺体天井部に排気
孔を設け排出する方法が考えられるが、筺体高さの低い
電子機器においては、筺体天井部に物を置かれ易く無意
識のうちに排気孔を塞ぎ、冷却効率の低下を招き装置の
信頼性の低下に繋がるという問題点があった。[Problem to be solved by the invention] In the modern era where high integration has progressed, the heat density of built-in electronic circuit units has increased, and it is necessary to make maximum use of the performance of cooling fans for forced air cooling.
Furthermore, there is an inevitable demand for downsizing of the housing. Therefore, it is conceivable to directly exhaust the exhaust air from the cooling fan by installing an exhaust hole in the ceiling of the housing, but with electronic equipment that has a low housing height, it is easy for objects to be placed on the ceiling of the housing, and the exhaust hole may be unintentionally removed. There is a problem in that the cooling efficiency is decreased, leading to a decrease in the reliability of the device.
【０００４】この問題点を解決するために排気を筺体天
井部から排出せず、図２に示すように一度筺体天井部に
当て、排気方向を転換し、筺体背面側に設けた排気孔よ
り排出する構造を採っていた。しかしながらこの方法で
は筺体天井部と内蔵ユニットとの間に排気方向転換用ス
ペースが必要となり、小型化実装の妨げとなる問題点が
あった。[0004] In order to solve this problem, instead of exhausting the exhaust air from the ceiling of the housing, as shown in Figure 2, the exhaust air is once directed to the ceiling of the housing, the direction of the exhaust is changed, and the exhaust is discharged through the exhaust hole provided on the back side of the housing. It had a structure that However, this method requires a space between the housing ceiling and the built-in unit for changing the direction of the exhaust gas, which poses a problem that hinders miniaturization.
【０００５】[0005]
【課題を解決するための手段】本発明の電子機器の筺体
構造は、電子回路ユニットと、該電子回路ユニットに隣
接した冷却ファンと、該ユニットと該冷却ファンとを実
装した筺体とを有し、該冷却ファンによる該電子回路ユ
ニットを冷却した冷却風を該筺体の天井部に設けた傾斜
面に穿った排気孔から排気することを特徴とする。[Means for Solving the Problems] A housing structure for an electronic device according to the present invention includes an electronic circuit unit, a cooling fan adjacent to the electronic circuit unit, and a housing in which the unit and the cooling fan are mounted. , the cooling air used by the cooling fan to cool the electronic circuit unit is exhausted from an exhaust hole bored in an inclined surface provided in the ceiling of the housing.
【０００６】[0006]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.
【０００７】図１は本発明の一実施例の側断面図を示す
。筺体１に実装された電子回路ユニット２を冷却すべく
、冷却ファン３によって取り入れられた吸気６は、電子
回路ユニット２内を通り、筺体天井部に形成された傾斜
面４に設けられた排気孔５から、排気７と排出される。FIG. 1 shows a side sectional view of one embodiment of the invention. In order to cool the electronic circuit unit 2 mounted in the housing 1, intake air 6 taken in by the cooling fan 3 passes through the electronic circuit unit 2 and passes through an exhaust hole provided in the inclined surface 4 formed in the ceiling of the housing. 5, the exhaust gas 7 is discharged.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、冷却ファ
ンの排気面側となる筺体天井部に傾斜面を形成し、この
傾斜面に排気孔を穿つ構造にすることにより、従来の筺
体天井部の平面に排気孔を設けた構造の時にありがちな
、排気孔上に物を置くことを避けることが可能となり、
冷却効果の低下を防ぐという効果がある。Effects of the Invention As explained above, the present invention has a structure in which an inclined surface is formed in the ceiling of the housing, which is the exhaust side of the cooling fan, and exhaust holes are bored in this inclined surface, thereby improving the structure of the ceiling of the housing, which is the exhaust side of the cooling fan. This makes it possible to avoid placing objects on top of the exhaust hole, which is common when the exhaust hole is provided on the flat surface of the unit.
This has the effect of preventing the cooling effect from decreasing.
【０００９】また上記問題点の解決策として従来、採ら
れてきた筺体天井部と電気回路ユニットまたは、冷却フ
ァンとの間に空間を設け、筺体背面に排気する構造で問
題点となる筺体の小型化ができない点についても、本発
明の構造では筺体天井部に筺体排気の方向転換スペース
を必要としないため、筺体の小型化が図れる効果がある
。[0009] Furthermore, as a solution to the above-mentioned problems, the conventional structure has been to provide a space between the ceiling of the housing and the electric circuit unit or the cooling fan, and to exhaust the air to the rear of the housing, but this problem has arisen due to the small size of the housing. Regarding the point that cannot be made smaller, the structure of the present invention does not require a space on the ceiling of the housing to change the direction of the exhaust air from the housing, so it has the effect of reducing the size of the housing.
【図１】本発明の一実施例の側断面図である。FIG. 1 is a side sectional view of an embodiment of the invention.
【図２】従来の電子機器の筺体構造の側断面図である。FIG. 2 is a side sectional view of a conventional electronic device housing structure.
１ 筺体 ２ 電子回路ユニット ３ 冷却ファン ４ 傾斜面 ５ 排気孔 ６ 吸気 ７ 排気 ８ 排気スペース 1 Housing 2 Electronic circuit unit 3 Cooling fan ４ Slope 5 Exhaust hole 6 Intake 7 Exhaust 8 Exhaust space
Claims (1)
ットに隣接した冷却ファンと、該ユニットと該冷却ファ
ンとを実装した筺体とを有し、該冷却ファンによる該電
子回路ユニットを冷却した冷却風を該筺体の天井部に設
けた傾斜面に穿った排気孔から排気することを特徴とす
る電子機器の筺体構造。1. An electronic circuit unit, a cooling fan adjacent to the electronic circuit unit, and a housing in which the unit and the cooling fan are mounted, the cooling air cooling the electronic circuit unit by the cooling fan. A casing structure for an electronic device, characterized in that the air is exhausted from an exhaust hole bored in an inclined surface provided in the ceiling of the casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14436791A JPH04368199A (en) | 1991-06-17 | 1991-06-17 | Box structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14436791A JPH04368199A (en) | 1991-06-17 | 1991-06-17 | Box structure of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04368199A true JPH04368199A (en) | 1992-12-21 |
Family
ID=15360469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14436791A Pending JPH04368199A (en) | 1991-06-17 | 1991-06-17 | Box structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04368199A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000060669A (en) * | 1999-03-18 | 2000-10-16 | 이종훈 | Arrangement and configuration of heatsinks for cooling power semiconductors |
| US6412292B2 (en) | 2000-05-09 | 2002-07-02 | Toc Technology, Llc | Computer rack heat extraction device |
| US6494050B2 (en) | 2000-02-18 | 2002-12-17 | Toc Technology, Llc | Computer rack heat extraction device |
| US6557357B2 (en) | 2000-02-18 | 2003-05-06 | Toc Technology, Llc | Computer rack heat extraction device |
| US6574970B2 (en) | 2000-02-18 | 2003-06-10 | Toc Technology, Llc | Computer room air flow method and apparatus |
| US6668565B1 (en) | 2002-04-12 | 2003-12-30 | American Power Conversion | Rack-mounted equipment cooling |
| US6859366B2 (en) | 2003-03-19 | 2005-02-22 | American Power Conversion | Data center cooling system |
| US7173820B2 (en) | 2003-03-19 | 2007-02-06 | American Power Conversion Corporation | Data center cooling |
| US7259963B2 (en) | 2004-12-29 | 2007-08-21 | American Power Conversion Corp. | Rack height cooling |
| US7841199B2 (en) | 2005-05-17 | 2010-11-30 | American Power Conversion Corporation | Cold aisle isolation |
| JP2014072211A (en) * | 2012-09-27 | 2014-04-21 | Fanuc Ltd | Motor driving device and control board |
-
1991
- 1991-06-17 JP JP14436791A patent/JPH04368199A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000060669A (en) * | 1999-03-18 | 2000-10-16 | 이종훈 | Arrangement and configuration of heatsinks for cooling power semiconductors |
| US6494050B2 (en) | 2000-02-18 | 2002-12-17 | Toc Technology, Llc | Computer rack heat extraction device |
| US6557357B2 (en) | 2000-02-18 | 2003-05-06 | Toc Technology, Llc | Computer rack heat extraction device |
| US6574970B2 (en) | 2000-02-18 | 2003-06-10 | Toc Technology, Llc | Computer room air flow method and apparatus |
| US6722151B2 (en) | 2000-02-18 | 2004-04-20 | Toc Technology, Llc | Computer rack heat extraction device |
| US6745579B2 (en) | 2000-02-18 | 2004-06-08 | Toc Technology, Llc | Computer room air flow method and apparatus |
| US6412292B2 (en) | 2000-05-09 | 2002-07-02 | Toc Technology, Llc | Computer rack heat extraction device |
| US6668565B1 (en) | 2002-04-12 | 2003-12-30 | American Power Conversion | Rack-mounted equipment cooling |
| US6859366B2 (en) | 2003-03-19 | 2005-02-22 | American Power Conversion | Data center cooling system |
| US7173820B2 (en) | 2003-03-19 | 2007-02-06 | American Power Conversion Corporation | Data center cooling |
| US7881057B2 (en) | 2003-03-19 | 2011-02-01 | American Power Conversion Corporation | Data center cooling |
| US8432690B2 (en) | 2003-03-19 | 2013-04-30 | American Power Conversion Corporation | Data center cooling |
| US8780555B2 (en) | 2003-03-19 | 2014-07-15 | American Power Conversion Corporation | Data center cooling |
| US7259963B2 (en) | 2004-12-29 | 2007-08-21 | American Power Conversion Corp. | Rack height cooling |
| US7841199B2 (en) | 2005-05-17 | 2010-11-30 | American Power Conversion Corporation | Cold aisle isolation |
| US7992402B2 (en) | 2005-05-17 | 2011-08-09 | American Power Conversion Corporation | Cold aisle isolation |
| US8156753B2 (en) | 2005-05-17 | 2012-04-17 | American Power Conversion Corporation | Cold aisle isolation |
| JP2014072211A (en) * | 2012-09-27 | 2014-04-21 | Fanuc Ltd | Motor driving device and control board |
| US9545036B2 (en) | 2012-09-27 | 2017-01-10 | Fanuc Corporation | Motor driver and cabinet |
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