JPH04359878A - Plug-in and plug-out type connector - Google Patents
Plug-in and plug-out type connectorInfo
- Publication number
- JPH04359878A JPH04359878A JP16095791A JP16095791A JPH04359878A JP H04359878 A JPH04359878 A JP H04359878A JP 16095791 A JP16095791 A JP 16095791A JP 16095791 A JP16095791 A JP 16095791A JP H04359878 A JPH04359878 A JP H04359878A
- Authority
- JP
- Japan
- Prior art keywords
- base
- plug
- type connector
- thickness
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009792 diffusion process Methods 0.000 claims abstract description 11
- 238000005253 cladding Methods 0.000 claims abstract description 10
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 41
- 238000005096 rolling process Methods 0.000 abstract description 10
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 abstract description 6
- 239000010956 nickel silver Substances 0.000 abstract description 6
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 5
- 238000005097 cold rolling Methods 0.000 abstract description 4
- 239000011261 inert gas Substances 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 2
- 239000010931 gold Substances 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は特にＩＣメモリーカード
等に適用して有用な挿抜式コネクターに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a removable connector which is particularly useful for IC memory cards and the like.
【０００２】0002
【従来の技術】最近のＲＡＭの高密度化と価格の低減に
ともなって、ＩＣメモリーカードがアプリケーションソ
フト等のメディア媒体として使用され始めている。この
ような使用ではソフトの切り換えごとにカードを交換す
ることになるから、挿抜回数が多くなる。2. Description of the Related Art With the recent increase in density and price reduction of RAM, IC memory cards have begun to be used as media for application software and the like. In such use, the card must be replaced every time the software is changed, which increases the number of insertions and removals.
【０００３】また更にＩＣメモリーカードがフロッピー
ディスクに代わる情報記録媒体として使用された場合に
は、上記挿抜回数は極めて大きくなり、定格挿抜回数（
安定した接触が保てる挿抜回数）は５万回ないし１０万
回程度になることが予想される。Furthermore, when an IC memory card is used as an information recording medium in place of a floppy disk, the number of insertions and removals mentioned above becomes extremely large, and the rated number of insertions and removals (
It is expected that the number of insertions and removals that can maintain stable contact will be around 50,000 to 100,000 times.
【０００４】従来、このようなＩＣメモリーカード等に
適用される挿抜式コネクターとしてはリン青銅、洋白、
Ｂｅ 含有Ｃｕ 合金等の弾性金属ベースの接点として
Ａｇ またはＡｕ をメッキした構成のものが提供され
ていた。[0004] Conventionally, phosphor bronze, nickel silver,
Contacts based on elastic metals such as Be-containing Cu alloys and plated with Ag or Au have been provided.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記Ａ
ｇ またはＡｕ のメッキ膜は硬度が低いため摩耗が大
きく、１万回前後の挿抜による摩擦によって該メッキ膜
が摩滅し、接点の接触信頼性が損なわれる。[Problem to be solved by the invention] However, the above A
Since the plating film of g or Au has low hardness, it is subject to large wear, and the plating film is worn away by the friction caused by insertion and removal about 10,000 times, impairing the contact reliability of the contact.
【０００６】またＡｇ またはＡｕ にＮｉ，Ｐｄ，Ｃ
ｄ 等を添加すると硬さや引張り強さが向上して耐蝕性
や耐摩耗性が向上することが知られているが、上記合金
をメッキすると成分によって析出電位の差によって析出
速度が異なり、均質なメッキ膜が形成されず、充分な耐
摩耗性の改良は望めない。[0006] Also, Ni, Pd, and C are added to Ag or Au.
It is known that addition of d, etc. improves hardness and tensile strength, and improves corrosion resistance and wear resistance. However, when plating the above alloys, the deposition rate varies depending on the composition and the difference in deposition potential, resulting in a homogeneous coating. No plating film is formed and sufficient improvement in wear resistance cannot be expected.
【０００７】[0007]
【課題を解決するための手段】本発明は上記従来の課題
を解決するための手段として、雄型コネクターおよび／
または雌型コネクターの弾性金属ベースの所定位置にク
ラッドによってＡｕ および／またはＡｇ 片を埋着し
て接点とした挿抜式コネクターおよび前記弾性金属ベー
スの所定位置に拡散抑制層を介してクラッドによってＡ
ｕ および／またはＡｇ 片を埋設して接点とした挿抜
式コネクターを提供するものである。[Means for Solving the Problems] The present invention provides a male connector and/or
Or, a removable connector in which a piece of Au and/or Ag is embedded in a predetermined position of an elastic metal base of a female connector with a cladding to serve as a contact, and
The present invention provides a removable connector in which U and/or Ag pieces are embedded and used as contacts.
【０００８】本発明において上記ベースとして用いられ
る金属材料としてはリン青銅、洋白、Ｂｅ 含有Ｃｕ
合金等のＣｕ を基材とした合金、ステンレススチール
等が例示されるが、ステンレススチールは切断面からの
腐蝕が発生しないこと、ばね限界値が高いこと、疲労強
度が高いこと、非磁性であること、安価であること等の
利点からベース材料として望ましいものである。特に望
ましいステンレススチールとしてはＣｒ およびＮｉ
を含むオーステナイト系ステンレススチールがあり、こ
のようなステンレススチールとしてはＳＵＳ３０１，Ｓ
ＵＳ３０６，またＡｌ を含むＳＵＳ６３１（１７Ｃｒ
−７Ｎｉ −１Ａｌ ）等が例示される。ＳＵＳ６３
１は熱処理によってばね定数が高くなる点で好ましい材
料である。Metal materials used as the base in the present invention include phosphor bronze, nickel silver, and Be-containing Cu.
Examples include Cu-based alloys such as alloys, stainless steel, etc., but stainless steel does not cause corrosion from the cut surface, has a high spring limit value, has high fatigue strength, and is non-magnetic. It is desirable as a base material because of its advantages such as its low cost and low cost. Particularly desirable stainless steels include Cr and Ni.
There are austenitic stainless steels that contain
US306, SUS631 (17Cr) containing Al
-7Ni-1Al) and the like. SUS63
No. 1 is a preferable material in that the spring constant can be increased by heat treatment.
【０００９】本発明において所定位置にクラッドされる
Ａｕ および／またはＡｇ 片（接点材料）としては純
Ａｕ 、純Ａｇ 、Ａｕ−Ａｇ 合金あるいはＡｕ お
よび／またはＡｇにＮｉ，Ｃｏ，Ｐｄ，Ｃｄ 等を添加
した合金等が用いられる。上記金属はＡｕ および／ま
たはＡｇ に通常１〜５０重量％程度添加される。In the present invention, the Au and/or Ag piece (contact material) to be clad in a predetermined position may be pure Au, pure Ag, an Au-Ag alloy, or Au and/or Ag with Ni, Co, Pd, Cd, etc. Added alloys, etc. are used. The above metals are usually added in an amount of about 1 to 50% by weight to Au and/or Ag.
【００１０】上記ベース上の所定位置に上記Ａｕ およ
び／またはＡｇ 片である接点材料を重合し、例えば圧
延ロールを用いて該ベースを該接点材料とともに圧延す
ることにより、該接点材料をベース上にクラッドして接
点とする。通常圧延後のベースの厚みは０．１〜０．２
ｍｍ、接点の厚みは望ましくは３０μ程度とする。しか
しクラッドされたＡｕ 片である接点の厚みを３０μ程
度にするとコネクターの価格が高くなるので該接点の厚
みは１μ程度とすることが望ましい。しかしＡｕ やＡ
ｇの接点の厚みを１μ程度とすると、直接ベースにクラ
ッドすることが困難であるし、接点材料のＡｕ はベー
ス中に拡散し、接点の耐久性が低いものとなってしまう
から、ベースに拡散抑制層を介して該接点材料をクラッ
ドすることが望ましい。この場合に用いられる拡散抑制
層の材料としてはＮｉ が一般に用いられる。[0010] The contact material, which is the Au and/or Ag piece, is polymerized at a predetermined position on the base, and the contact material is placed on the base by, for example, rolling the base together with the contact material using a rolling roll. Clad and use as a contact. The thickness of the base after normal rolling is 0.1-0.2
mm, and the thickness of the contact is desirably about 30 μm. However, if the thickness of the contact, which is a clad Au piece, is about 30 μm, the price of the connector will increase, so it is desirable that the thickness of the contact is about 1 μm. However, Au and A
If the thickness of the contact of g is about 1μ, it is difficult to clad the base directly, and the contact material Au will diffuse into the base, reducing the durability of the contact. It is desirable to clad the contact material via a constraining layer. In this case, Ni is generally used as the material for the diffusion suppressing layer.
【００１１】このような構成を製造するには通常接点材
料と拡散抑制層とを重合した上で圧延して該接点材料を
該拡散抑制層上にクラッドし、更に上記接点材料からク
ラッドされた拡散抑制層をベース上の所定位置に重合し
た上で圧延し、該拡散抑制層を該接点材料とともにベー
ス上にクラッドする。この場合、接点材料をクラッドし
た拡散抑制層をベース上にクラッドする前に更に１回な
いし複数回圧延してもよいし圧延後焼鈍してもよい。あ
るいはベース所定位置に溝切りをして該接点材料がクラ
ッドされた拡散抑制層をロウ付けによって固定してもよ
い。ロウ付け後所望なれば更に圧延してもよい。上記構
成では接点材料を１μ程度まで薄く圧延することが容易
であるし、また接点材料は拡散抑制層によってベース中
に拡散することを抑制される。[0011] To manufacture such a structure, the contact material and the diffusion inhibiting layer are usually polymerized and rolled to clad the contact material on the diffusion inhibiting layer, and then the diffusion inhibiting layer is clad from the contact material. The suppression layer is polymerized in place on the base and rolled to clad the diffusion suppression layer with the contact material onto the base. In this case, the diffusion suppressing layer clad with the contact material may be further rolled one or more times before being clad on the base, or may be annealed after rolling. Alternatively, a groove may be cut in a predetermined position of the base, and the diffusion suppressing layer clad with the contact material may be fixed by brazing. After brazing, further rolling may be performed if desired. With the above configuration, it is easy to roll the contact material to a thickness of about 1 μm, and the contact material is suppressed from diffusing into the base by the diffusion suppressing layer.
【００１２】0012
【作用】本発明においては、弾性金属ベースの所定位置
にＡｕ および／またはＡｇ 片を接点材料としてクラ
ッドして接点とするので、メッキに比べて接点材料の板
厚を厚くすることが容易であるため摩擦によってもこの
ようなクラッド層は摩滅せず、良好な耐摩耗性が得られ
る。
また接点材料としてＡｕ および／またはＡｇ の合金
を使用する場合、クラッドによれば硬度が高く耐蝕性、
耐摩耗性にすぐれた組成の合金からなる接点を組成が全
く偏奇することなくベース上に形成出来る。[Operation] In the present invention, since the contacts are made by cladding Au and/or Ag pieces as contact materials at predetermined positions on the elastic metal base, it is easier to increase the thickness of the contact material compared to plating. Therefore, such a cladding layer is not worn away even by friction, and good wear resistance can be obtained. In addition, when using Au and/or Ag alloys as contact materials, the cladding has high hardness and corrosion resistance.
Contacts made of an alloy with an excellent composition of wear resistance can be formed on a base without any deviation in composition.
【００１３】[0013]
〔実施例１〕厚さ１．０ｍｍの板状ＳＵＳ３０４（１８
Ｃｒ −８Ｎｉ ）をベースとし、該ベースの所定位置
に接点材料として厚さ２００μの帯状Ａｇ −３０Ｐｄ
片を重合し、冷間圧延によって図１に示すように該ベ
ース（１）Ａ上に該接点材料（２）Ａを板厚０．５ｍｍ
まで冷間クラッド圧延する。クラッドした材料を真空ま
たは不活性ガス雰囲気中、１０００℃の温度で２分以上
加熱しベース材料を軟化させた後、更に冷間圧延を施す
。圧延後のベースの厚みは０．３ｍｍ、接点材料（２）
Ａの厚みは３０μであった。
上記接点材料をクラッドしたベース（１）Ａを点線に沿
って所定巾に切断し、曲げ加工によって図２および図３
に示す雌型コネクター（１）を製造する。該雌型コネク
ター（１） において接点（２） は上記クラッドされ
たＡｇ −３０Ｐｄ 片からなり、接点間隙巾Ｗは２ｍ
ｍである。[Example 1] Plate-shaped SUS304 (18
Cr-8Ni) as a base, and a strip of Ag-30Pd with a thickness of 200μ is placed at a predetermined position on the base as a contact material.
The pieces are polymerized and the contact material (2) A is placed on the base (1) A to a plate thickness of 0.5 mm as shown in FIG. 1 by cold rolling.
Cold clad rolled to The clad material is heated in a vacuum or an inert gas atmosphere at a temperature of 1000° C. for 2 minutes or more to soften the base material, and then cold rolled. The thickness of the base after rolling is 0.3 mm, contact material (2)
The thickness of A was 30μ. The base (1) A clad with the above contact material was cut to a predetermined width along the dotted line, and by bending the base (1) A shown in FIGS. 2 and 3.
A female connector (1) shown in Figure 1 is manufactured. In the female connector (1), the contacts (2) are made of the above-mentioned clad Ag-30Pd piece, and the contact gap width W is 2 m.
It is m.
【００１４】比較として同様な雌型コネクターで接点（
２） はメッキ厚３μでＡｇ メッキすることによって
形成したものを製造する。For comparison, a similar female connector is used with contacts (
2) is manufactured by plating with Ag to a plating thickness of 3 μm.
【００１５】上記雌型コネクター（１） に図２に示す
ように厚さ０．２ｍｍのばね用洋白（ＪＩＳＨ３１３０
Ｃ７７０１）からなる雄型コネクター（３） を挿
抜きして、接点が摩滅するまでの挿抜回数を調べたとこ
ろ、本発明品は５万回以上の挿抜回数でも摩滅をみず、
比較品は２万回の挿抜で摩滅をみた。As shown in FIG. 2, the female connector (1) is made of nickel silver for springs (JISH3130) with a thickness of 0.2 mm.
When the male connector (3) made of C7701) was inserted and removed, and the number of insertions and removals until the contacts wore out was investigated, the product of the present invention showed no wear even after more than 50,000 insertions and removals.
The comparison product showed wear and tear after being inserted and removed 20,000 times.
【００１６】〔実施例２〕図４に示すように厚さ１ｍｍ
のＮｉ 帯材（１４）Ｂ 上に厚さ０．１ｍｍの帯状Ａ
ｕ −３Ｎｉ 片（１１）Ｂ を重合して、冷間圧延に
よってＡｕ −３Ｎｉ 片（１１）Ｂ をクラッドした
Ｎｉ 帯材（１４）Ｄ を作成する。圧延後該帯材（１
４）Ｄ の厚みは０．１ｍｍ、Ａｕ −３Ｎｉ 片（１
１）Ｂ の厚みは０．０１ｍｍである。更に図５に示す
ように板厚１．０ｍｍのばね用洋白（ＪＩＳＨ３１３０
Ｃ７７０１）からなるベース（１１）Ａ に上記の
ようにして作成されたＮｉ 帯材（１４）Ｄ を重ね、
加工率１／１０の冷間圧延によって板厚０．５ｍｍまで
クラッド圧延を行なう。その後、真空または不活性ガス
雰囲気中、７２０℃で２分以上加熱してベース材料を軟
化させた後、更に冷間圧延を繰り返し、板厚０．２ｍｍ
のクラッド材が得られる。上記クラッド材においてはＡ
ｕ−３Ｎｉ 片（１１）Ｂ の厚みは２μでＮｉ 帯材
（１４）Ｂ の厚みは２０μであった。その後上記クラ
ッド材を実施例１と同様に所定巾に切断し曲げ加工によ
って図６に示すようなＮｉ 帯材（１４）Ｂ に由来す
る拡散抑制層（１４）を介してＡｕ −３Ｎｉ片（１１
）Ｂ に由来する接点（１２）を有する雌型コネクター
（１１）を製造する。[Example 2] As shown in FIG. 4, the thickness is 1 mm.
0.1 mm thick strip A on top of the Ni strip (14) B
The u-3Ni piece (11)B is polymerized and cold-rolled to create a Ni strip (14)D clad with the Au-3Ni piece (11)B. After rolling, the strip material (1
4) The thickness of D is 0.1 mm, and the Au-3Ni piece (1
1) The thickness of B is 0.01 mm. Furthermore, as shown in Fig. 5, nickel silver for springs with a plate thickness of 1.0 mm (JISH3130
The Ni strip material (14) D prepared as described above is layered on the base (11) A made of C7701),
Clad rolling is performed by cold rolling at a processing rate of 1/10 to a plate thickness of 0.5 mm. After that, the base material was heated at 720°C for 2 minutes or more in a vacuum or inert gas atmosphere to soften the base material, and then cold rolling was repeated to obtain a plate with a thickness of 0.2 mm.
of cladding material is obtained. In the above cladding material, A
The thickness of the u-3Ni piece (11)B was 2μ, and the thickness of the Ni strip (14)B was 20μ. Thereafter, the cladding material was cut into a predetermined width in the same manner as in Example 1, and by bending, the Au-3Ni piece (11
) Manufacture a female connector (11) with contacts (12) originating from B.
【００１７】比較として同様な雌型コネクターで接点（
２） はメッキ厚２μでＡｕ メッキすることによって
形成したものを製造する。For comparison, a similar female connector has contacts (
2) is manufactured by plating with Au to a plating thickness of 2μ.
【００１８】上記雌型コネクター（１１）にばね用洋白
からなる雄型コネクターを実施例１と同様にして挿抜き
して、接点が摩滅するまでの挿抜回数を調べたところ、
本発明品は実施例１と同様に５万回以上の挿抜回数でも
摩滅をみず、比較品は１万回の挿抜で摩滅をみた。本実
施例では接点厚みは２μで実施例１と同様な耐摩耗性を
示し、接点に金合金を用いることにより実施例１よりも
接点部の耐蝕性に優れた雌型コネクターが提供出来る。A male connector made of nickel silver for springs was inserted into and removed from the female connector (11) in the same manner as in Example 1, and the number of insertions and removals until the contacts wore out was examined.
Similar to Example 1, the product of the present invention showed no wear even after being inserted and removed more than 50,000 times, and the comparative product showed wear after being inserted and removed 10,000 times. In this example, the contact thickness is 2μ, and the same wear resistance as in Example 1 is exhibited, and by using a gold alloy for the contacts, a female connector can be provided that has better corrosion resistance at the contact portion than in Example 1.
【００１９】[0019]
【発明の効果】したがって本発明では極めて耐摩耗性の
良い、挿抜式コネクターが提供され、接点材料をＡｕ
やＡｇ の合金を用いることで更に硬く耐蝕性を有する
ものが提供出来、このような挿抜式コネクターはＩＣメ
モリーカード等に適用されて極めて有用である。[Effects of the Invention] Accordingly, the present invention provides a mating/unmating type connector with extremely good wear resistance, and the contact material is made of Au.
By using alloys such as or Ag, it is possible to provide even harder and more corrosion-resistant connectors, and such plug-and-remove connectors are extremely useful when applied to IC memory cards and the like.
【００２０】[0020]
【図１】実施例１において圧延後のベース斜視図[Fig. 1] Perspective view of the base after rolling in Example 1
【図２
】コネクター説明図[Figure 2
】Connector explanation diagram
【図３】雌型コネクターの部分斜視図[Figure 3] Partial perspective view of female connector
【図４】実施例２においてＮｉ 帯材とＡｕ −３Ｎｉ
片との重合図[Fig. 4] Ni strip and Au-3Ni in Example 2
Overlapping figure with piece
【図５】ベース上に拡散抑制層を介して接点材料を固定
する状態の説明図[Figure 5] Explanatory diagram of the state in which the contact material is fixed on the base via the diffusion suppression layer
【図６】雌型コネクターの部分斜視図[Figure 6] Partial perspective view of female connector
（１），（１１）・・・・・・雌型コネクター（２），
（１２）・・・・・・接点(1), (11)...Female connector (2),
(12)・・・Contact
Claims (2)
ターの弾性金属ベースの所定位置にクラッドによってＡ
ｕ および／またはＡｇ 片を埋着して接点としたこと
を特徴とする挿抜式コネクターClaim 1: A cladding in place on a resilient metal base of a male connector and/or a female connector.
A removable connector characterized by having U and/or Ag pieces embedded as contacts.
ターの弾性金属ベースの所定位置に拡散抑制層を介して
クラッドによってＡｕ および／またはＡｇ 片を埋設
して接点としたことを特徴とする挿抜式コネクター[Claim 2] An insertion/removal type, characterized in that Au and/or Ag pieces are buried in predetermined positions of the elastic metal base of the male connector and/or the female connector by cladding through a diffusion suppressing layer to serve as contacts. connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16095791A JPH04359878A (en) | 1991-06-04 | 1991-06-04 | Plug-in and plug-out type connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16095791A JPH04359878A (en) | 1991-06-04 | 1991-06-04 | Plug-in and plug-out type connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04359878A true JPH04359878A (en) | 1992-12-14 |
Family
ID=15725848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16095791A Withdrawn JPH04359878A (en) | 1991-06-04 | 1991-06-04 | Plug-in and plug-out type connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04359878A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0696161A1 (en) * | 1994-08-01 | 1996-02-07 | Siemens Aktiengesellschaft | Device for effecting a contact between the housing parts of an electrical device |
| JP2002218578A (en) * | 2001-01-22 | 2002-08-02 | Citizen Electronics Co Ltd | Multifunctional sounder and its manufacturing method |
-
1991
- 1991-06-04 JP JP16095791A patent/JPH04359878A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0696161A1 (en) * | 1994-08-01 | 1996-02-07 | Siemens Aktiengesellschaft | Device for effecting a contact between the housing parts of an electrical device |
| JP2002218578A (en) * | 2001-01-22 | 2002-08-02 | Citizen Electronics Co Ltd | Multifunctional sounder and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |