JPH0434999A - Electronic component installing device - Google Patents
Electronic component installing deviceInfo
- Publication number
- JPH0434999A JPH0434999A JP2140447A JP14044790A JPH0434999A JP H0434999 A JPH0434999 A JP H0434999A JP 2140447 A JP2140447 A JP 2140447A JP 14044790 A JP14044790 A JP 14044790A JP H0434999 A JPH0434999 A JP H0434999A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- coordinate system
- installation
- command
- program
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 5
- 230000009466 transformation Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
- 230000001131 transforming effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は基板上に電子部品を装着する電子部品装着装置
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus for mounting electronic components onto a board.
（従来の技術）
ｖＳＳ図は、従来の電子部品装着装置の一例を示すブロ
ック図である。この従来装置に用いられる基板上に電子
部品を装着させるための装着プログラム１は、プログラ
マｉｔ’基板上における電子部品の装着位置やその種類
を表わす装着指令を指令することによって作成される０
例えば、第６図に示すようなＡ面、Ｂ面、０面、Ｄ面が
同一装着パターンである多面取り基板に電子部品を装着
させるための装着プログラムを作成するには、第７図に
示すように各装着面に装着する電子部品全てに対して装
着座標指令（ｘ、ｙ）と装着電子部品指令ＣＰ）を指令
する必要がある。(Prior Art) A vSS diagram is a block diagram showing an example of a conventional electronic component mounting apparatus. A mounting program 1 for mounting an electronic component on a board used in this conventional device is created by issuing a mounting command indicating the mounting position and type of the electronic component on the board to the programmer it'.
For example, to create a mounting program for mounting electronic components on a multi-panel board whose A, B, 0, and D sides have the same mounting pattern as shown in FIG. It is necessary to issue mounting coordinate commands (x, y) and mounting electronic component commands CP) to all electronic components to be mounted on each mounting surface.
このようにして作成された装着プログラム１は、装着プ
ログラム読込部２に読込まれ、装着プログラム記憶部３
に送出されて記憶される。モして、装着指令が順次機械
制御部４に読込まれて電子部品の装着が行なわれるよう
になっている。The installation program 1 created in this way is read into the installation program reading section 2, and is read into the installation program storage section 3.
is sent to and stored. Then, the mounting commands are sequentially read into the machine control section 4 and the electronic components are mounted.
（発明が解決しようとする課題）
上述した従来の電子部品装着装置では、多面取り基板の
各装着面が同一装着パターンであっても、各装着面に装
着する全ての電子部品に対して装着指令が指令された装
着プログラムを作成しなければならず、装着プログラム
の作成に時間がかかるという問題があった。(Problems to be Solved by the Invention) In the conventional electronic component mounting apparatus described above, even if each mounting surface of a multi-panel board has the same mounting pattern, mounting commands are issued to all electronic components to be mounted on each mounting surface. There is a problem in that it takes time to create a mounting program because the user has to create a mounting program that is instructed by the user.
本発明は上述の様な事情から成されたものであり、本発
明の目的は、電子部品が装着される各装着面が同一装着
パターンである多面取り基板の−装着面に装着する電子
部品に対する装着指令を装着プログラム上に指令するだ
けで、多面取り基板の各装着面に電子部品を全て装着で
きる電子部品装着装置を提供することにある。The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a method for mounting electronic components on the mounting surfaces of a multi-panel board in which each mounting surface on which electronic components are mounted has the same mounting pattern. To provide an electronic component mounting device capable of mounting all electronic components on each mounting surface of a multi-panel board simply by issuing a mounting command on a mounting program.
（課題を解決するための手段）
本発明は、基板上に電子部品を装着させるための装着プ
ログラムに従って動作する電子部品装着装置に関するも
のであり、本発明の上記目的は、同一装着パターンの装
着面が複数ある基板における特定の一装着面の装着パタ
ーンを基準装着パターンとし、この基準装着パターンの
座標系を基準座標系とし、他の装着面の座標系を前記基
準座標系からの平行移動量及び回転角で示す相対座標系
に変換し、前記基準装着パターンと前記相対座標系とが
指令された装着プログラムを解釈し、前記基準装着パタ
ーンを前記他の装着面金てに対し座標変換する変換手段
を具備する事によって達成される。(Means for Solving the Problems) The present invention relates to an electronic component mounting device that operates according to a mounting program for mounting electronic components on a board, and the above object of the present invention is to mount electronic components on a mounting surface with the same mounting pattern. The mounting pattern of a specific mounting surface on a board with a plurality of boards is defined as a reference mounting pattern, the coordinate system of this reference mounting pattern is defined as a reference coordinate system, and the coordinate systems of other mounting surfaces are defined by the amount of parallel movement from the reference coordinate system and the coordinate system of the reference mounting pattern. Conversion means for converting the reference mounting pattern into a relative coordinate system indicated by a rotation angle, interpreting the mounting program in which the reference mounting pattern and the relative coordinate system are instructed, and converting the coordinates of the reference mounting pattern with respect to the other mounting surface metal. This is achieved by having the following.
（作用）
本発明にあっては、基板における複数の装着面が同一装
着パターンである場合、任意の一装着面における装着指
令を基準として他の装着面における装着指令を自動的に
求めるようにしているので、プログラマは装着プログラ
ムを容易に作成することができる。(Function) In the present invention, when a plurality of mounting surfaces on a board have the same mounting pattern, mounting commands on any one mounting surface are automatically determined based on mounting commands on other mounting surfaces. Therefore, programmers can easily create installation programs.
（実施例）
第１図は、本発明の電子部品装着装置の一例を第５図に
対応させて示すブロック図であり、同一構成箇所は同符
号を付して説明を省略する。本発明装置に用いられる装
着プログラム１は、多面取り基板における任意の一装着
面を基準面としてその座標系を基！＃−座標系とし、基
準面の装着パターンを基準装着パターンとすることによ
り表わされる基準座標系と他の装着面（以下、一般装着
面とする）の座標系との位置関係を示す相対座標系指令
と、基準装着パターンの各電子部品の装着指令とで構成
される。(Embodiment) FIG. 1 is a block diagram showing an example of the electronic component mounting apparatus of the present invention in correspondence with FIG. 5, and the same components are given the same reference numerals and the explanation will be omitted. The mounting program 1 used in the device of the present invention is based on the coordinate system using an arbitrary mounting surface on a multi-panel board as a reference plane. Relative coordinate system that indicates the positional relationship between the reference coordinate system and the coordinate system of another mounting surface (hereinafter referred to as "general mounting surface") expressed by using the #-coordinate system and the mounting pattern of the reference surface as the reference mounting pattern. It consists of a command and a mounting command for each electronic component of the standard mounting pattern.
相対座標系指令には、“Ｏ，Ｘ、Ｙ、Ｄ”の４つのコー
ドがある。There are four codes for the relative coordinate system command: "O, X, Y, D".
“０”は、その直後に並ぶ“Ｘ、Ｙ、Ｄ”の内容が相対
Ｆｇ標茶系指令あることを示す。“0” indicates that the contents of “X, Y, D” immediately following it are relative Fg-type commands.
“Ｘ”は、基準座標系の原点から任意の一般装着面の座
標系の原点までのＸ軸方向の平行移動量を表す。“X” represents the amount of translation in the X-axis direction from the origin of the reference coordinate system to the origin of the coordinate system of any general mounting surface.
“Ｙ”は、基準座標系の原点から任意の一般装着面の座
標系の原点までのＹ軸方向の平行移動量を表す。“Y” represents the amount of translation in the Y-axis direction from the origin of the reference coordinate system to the origin of the coordinate system of any general mounting surface.
“Ｄ”は、基！１！座標系から任意の一般装着面の座標
系までの回転移動量を表す。“D” is base! 1! Represents the amount of rotational movement from the coordinate system to the coordinate system of any general mounting surface.
装着指令には、“Ｎ、Ｘ、Ｙ、Ｐ”の４つのコードがあ
る。The mounting command has four codes: "N, X, Y, P".
“Ｎ″は、その直後に並ぶ“Ｘ、Ｙ、Ｐ″の内容が基準
装着面における電子部品の装着指令である事を示す。"N" indicates that the contents of "X, Y, P" arranged immediately after it are instructions for mounting the electronic component on the reference mounting surface.
“Ｘ”は、基準座標系における電子部品のＸ軸方向の装
着位置を表す。“X” represents the mounting position of the electronic component in the X-axis direction in the reference coordinate system.
“Ｙ”は、基準座標系における電子部品のＹ軸方向の装
着位置を表す。“Y” represents the mounting position of the electronic component in the Y-axis direction in the reference coordinate system.
“Ｐ“は、装着する電子部品の種類を表す。"P" represents the type of electronic component to be mounted.
例えば、第３図に示すようなＡ面、Ｂ面、０面、０面が
同一装着パターンである多面取り基板に電子部品を装着
させるための装着プログラムを作成する場合、Ａ面を基
準面とすると、Ｂ面の相対座標系は基準座標系をＸ軸方
向に“４００”、Ｙ軸方向に“５００”平行移動させ、
１８０度回転させた座標系となるので、相対座標系指令
は第４図に示すようニ”０１ Ｘ４００ Ｙ２Ｏ２Ｄ１
８０ ” （Ｏｌステップ）となる。同様に、０面の
相対圧ｓＩ！系は基準座茶系をＸ軸方向に“４００”平
行移動させた座標系であり、Ｄ面の相対座標系は基準座
標系をＸ軸方向に“８００”、Ｙ軸方向に“５００”平
行移動させ、１８０度回転させた座標系であるから、０
面。For example, when creating a mounting program for mounting electronic components on a multi-panel board whose A, B, 0, and 0 sides have the same mounting pattern as shown in Figure 3, the A side is used as the reference surface. Then, the relative coordinate system of plane B shifts the reference coordinate system by "400" in the X-axis direction and "500" in the Y-axis direction,
Since the coordinate system is rotated 180 degrees, the relative coordinate system command is ``01 X400 Y2O2D1'' as shown in Figure 4.
80'' (Ol step).Similarly, the relative pressure sI! system on the 0 plane is a coordinate system obtained by translating the reference zacha system by 400 in the X-axis direction, and the relative coordinate system on the D plane is the reference The coordinate system is translated by "800" in the X-axis direction, "500" in the Y-axis direction, and rotated 180 degrees, so 0
surface.
Ｄ面の各相対座標系指令は“０２ Ｘ４００ ＹＯＤｏ
”（０２ステツプ） 、 ”０３ Ｘ８００ Ｙ２Ｏ
２０１８０” （０３ステツプ）となる。Each relative coordinate system command for the D plane is “02 X400 YODo
”(02 step), ”03 X800 Y2O
20180” (03 steps).
また、基準装着パターンの装着ステップは“Ｎ０ＯＩ”
から“Ｎ１１ｌ”まであり、例えば“Ｘ−１００”″
“Ｙ−３０”の位置に部品番号“１”の電子部品を装
着、する場合の装着指令は、Ｎ０ＯＩ Ｘ１００ Ｙ２
ＯＰＩ″ （ＮＯＯ１スフ ”／ブ）トする。In addition, the mounting step of the standard mounting pattern is “N0OI”
From "N11l" to "X-100", for example.
When installing the electronic component with part number “1” at the “Y-30” position, the installation command is N0OI X100 Y2
OPI'' (NOO1 step ''/button).
このようにして作成された装着プログラム１は、相対座
標系指令（０ステツプ）及び装着指令（Ｎステップ）が
判別されながら装着プログラム読込部２に読込まれ、そ
れぞれ０指令−時記憶部５及びＮ指令−時記憶部６に送
出、記憶される。The mounting program 1 created in this way is read into the mounting program reading section 2 while the relative coordinate system command (0 step) and the mounting command (N step) are being determined, and the 0 command-time storage section 5 and the N step are read, respectively. The command is sent to and stored in the time storage section 6.
そして、Ｎ指令−時記憶部６に記憶されている全Ｎステ
ップは、装着プログラム変換部７を介して装着プログラ
ム記憶部３に複写される。続いてＮ指令−時記憶部６か
ら装着プログラム変換部７にＮステップが１ステツプ毎
に読出され、０指令−時記憶部５から装着プログラム変
換部７に読出された最初の０ステツプの平行移動量と回
転移動量の情報に基づいて順次座標変換されて装着プロ
グラム記憶部３に記憶される。この処理が全０ステツプ
に対して行なわれた後、装着プログラム記憶部３に記憶
されているＮステップが順次機械制御部４に読込まれて
電子部品の装着が行なわれるようになっている。Then, all N steps stored in the N command-time storage section 6 are copied to the mounting program storage section 3 via the mounting program conversion section 7. Subsequently, N steps are read out step by step from the N command-time storage section 6 to the installation program conversion section 7, and the first 0 step parallel movement read out from the 0 command-time storage section 5 to the installation program conversion section 7 is performed. The coordinates are sequentially transformed based on the information on the amount and rotational movement amount and stored in the mounting program storage section 3. After this process is performed for all 0 steps, the N steps stored in the mounting program storage section 3 are sequentially read into the machine control section 4, and the electronic parts are mounted.
この様な構成において、その主要部である装着プログラ
ム変換部７の装着プログラム変換処理について第２図の
フローチャートをもとに説明する。In such a configuration, the mounting program conversion process of the mounting program conversion section 7, which is the main part thereof, will be explained based on the flowchart of FIG. 2.
まず、Ｎ指令−時記憶部６に記憶されている全Ｎステッ
プを装着プログラム記憶部３へ複写する（ステップＳｌ
） 、次に、０指令−時記憶部５内の０ステツプの有無
を判定しくステップＳ２） 、Ｏ指令−時記憶部５内に
０ステツプが無い場合は、多面取り基板の装着プログラ
ムではないと判定して全ての処理を終了し、一方、０指
令−時記憶部５内に０ステツプが有る場合は、０指令−
時記憶部５より最初の０ステツプを読出す（ステップＳ
３）。そして、Ｎ指令−時記憶部６よりＮステップを１
ステップ読出しくステップＳ４）、このＮステップのＸ
、Ｙ方向装着位置を、先に読出した０ステツプのＤ指令
にて回転変換しくステップＳ５）、ざらにＸ、Ｙ指令に
て平行移動して（ステップ５６）装着プログラム記憶部
３へ送出する（ステップＳ７）、そして、Ｎ指令−時記
憶部６内の全てのＮステップに対して上述した変換処理
（ステップ５４〜ステツプＳ７）を繰返しくステップＳ
８）、一つの一般装着面のＮステップを作成する。さら
に、０指令−時記憶部５内の全ての０ステツプに従って
上述した処理（ステップ５３〜ステツプ５８）を繰返し
くステップＳ９）、多面取り基板全面のＮステップを作
成して全ての処理を終了する。First, all N steps stored in the N command-time storage section 6 are copied to the mounting program storage section 3 (step Sl
), Next, it is determined whether or not there is a 0 step in the 0 command-time memory section 5 (step S2). If there is no 0 step in the O command-time memory section 5, it is assumed that the program is not a mounting program for a multi-panel board. The judgment is made and all processing is completed.On the other hand, if there is a 0 step in the 0 command-time storage unit 5, the 0 command-
Reads the first 0 step from the time storage unit 5 (step S
3). Then, the N step is set to 1 from the N command-time storage unit 6.
Step read step S4), X of this N step
, the Y-direction mounting position is rotated using the 0-step D command previously read (step S5), roughly translated in parallel using the X and Y commands (step 56), and sent to the mounting program storage unit 3 (step S5). Step S7), and Step S, in which the above-described conversion process (steps 54 to S7) is repeated for all N steps in the N command-time storage section 6.
8) Create N steps for one general mounting surface. Further, the above-mentioned processing (steps 53 to 58) is repeated according to all the 0 steps in the 0 command-time storage section 5 (step S9), and N steps are created for the entire surface of the multi-panel board, and all processing is completed. .
（発明の効果）
以上の様に本発明の電子部品装着装置によれば、各装着
面が同一装着パターンの多面取り基板に電子部品を装着
する場合、プログラマは簡単な装着プログラムを作成す
ればよいので、装着プログラムの作成時間を短縮させて
電子部品の装着動作に迅速に取掛かることができると共
に、装着プログラムのメモリを小容量に変更して電子部
品装着装置のコストダウンを図ることができる。(Effects of the Invention) As described above, according to the electronic component mounting apparatus of the present invention, when mounting electronic components on a multi-sided board in which each mounting surface has the same mounting pattern, the programmer only has to create a simple mounting program. Therefore, the time required to create a mounting program can be shortened, and the electronic component mounting operation can be started quickly, and the memory capacity of the mounting program can be changed to a small capacity, thereby reducing the cost of the electronic component mounting apparatus.
第１図は本発明の電子部品装着装置の一例を示すブロッ
ク図、第２図はその主要部の動作例を示すフローチャー
ト、第３図は多面取り基板における基準面の基準座標系
及び基準面以外の相対座標系を表す図、第４図は本発明
装置に用いられる装着プログラム例を示す図、第５図は
従来の電子部品装着装置の一例を示すブロック図、第６
図は多面取り基板の例を示す図、第７図は従来装置に用
いられる装着プログラム例を示す図である。
１・・−装着プログラム、２・・・装着プログラム読込
３・・・装着プログラム記憶部、
４・・・機械制御
５・・・０指令−時記憶部、
６・・・Ｎ指令−時記憶
７・・・装着プログラム変換部。FIG. 1 is a block diagram showing an example of the electronic component mounting apparatus of the present invention, FIG. 2 is a flowchart showing an example of the operation of its main parts, and FIG. 3 is a reference coordinate system of a reference surface on a multi-panel board and other than the reference surface. FIG. 4 is a diagram showing an example of a mounting program used in the device of the present invention, FIG. 5 is a block diagram showing an example of a conventional electronic component mounting device, and FIG.
The figure shows an example of a multi-sided board, and FIG. 7 shows an example of a mounting program used in a conventional device. 1... - Wearing program, 2... Wearing program reading 3... Wearing program storage section, 4... Machine control 5... 0 command - Hour storage section, 6... N command - Hour storage section 7 ...Wearing program converter.
Claims (1)
ムに従って動作する電子部品装着装置において、同一装
着パターンの装着面が複数ある基板における特定の一装
着面の装着パターンを基準装着パターンとし、この基準
装着パターンの座標系を基準座標系とし、他の装着面の
座標系を前記基準座標系からの平行移動量及び回転角で
示す相対座標系に変換し、前記基準装着パターンと前記
相対座標系とが指令された装着プログラムを解釈し、前
記基準装着パターンを前記他の装着面全てに対し座標変
換する変換手段を備えたことを特徴とする電子部品装着
装置。1. In an electronic component mounting device that operates according to a mounting program for mounting electronic components on a board, a mounting pattern on a specific mounting surface of a board that has multiple mounting surfaces with the same mounting pattern is taken as a reference mounting pattern, and this reference mounting pattern is used. The coordinate system of the reference coordinate system is set as a reference coordinate system, and the coordinate system of the other mounting surface is converted into a relative coordinate system indicated by the amount of parallel movement and rotation angle from the reference coordinate system, and the reference mounting pattern and the relative coordinate system are set as a command. 1. An electronic component mounting apparatus, comprising: a conversion means for interpreting a mounted mounting program and converting the coordinates of the reference mounting pattern with respect to all of the other mounting surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2140447A JPH0434999A (en) | 1990-05-30 | 1990-05-30 | Electronic component installing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2140447A JPH0434999A (en) | 1990-05-30 | 1990-05-30 | Electronic component installing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434999A true JPH0434999A (en) | 1992-02-05 |
Family
ID=15268839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2140447A Pending JPH0434999A (en) | 1990-05-30 | 1990-05-30 | Electronic component installing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434999A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103709A (en) * | 1987-10-16 | 1989-04-20 | Sanyo Electric Co Ltd | Electronic parts setting device |
-
1990
- 1990-05-30 JP JP2140447A patent/JPH0434999A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103709A (en) * | 1987-10-16 | 1989-04-20 | Sanyo Electric Co Ltd | Electronic parts setting device |
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