JPH04345001A - Separating method of chip resistor - Google Patents
Separating method of chip resistorInfo
- Publication number
- JPH04345001A JPH04345001A JP3117455A JP11745591A JPH04345001A JP H04345001 A JPH04345001 A JP H04345001A JP 3117455 A JP3117455 A JP 3117455A JP 11745591 A JP11745591 A JP 11745591A JP H04345001 A JPH04345001 A JP H04345001A
- Authority
- JP
- Japan
- Prior art keywords
- rollers
- resistors
- chip
- chip resistors
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000000926 separation method Methods 0.000 abstract description 22
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、バレルめっき処理を施
した後の互いに付着し合ったチップ抵抗器を分離するチ
ップ抵抗器の分離方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating chip resistors that are attached to each other after barrel plating.
【０００２】0002
【従来の技術】チップ抵抗器は、一般に、抵抗体と電極
（導体）とを有する多数の素子を基板上に形成し、これ
を個々に分断して製造される。更に通常は、分断後のチ
ップ抵抗器に、バレルめっきによって半田めっきを施す
。バレルめっきは、周知の如く、陰極となるばらばらの
被めっき体とチップ抵抗器とを容器中に入れ、容器を回
転させることでめっきを行う機械的めっき法である。2. Description of the Related Art Chip resistors are generally manufactured by forming a large number of elements each having a resistor and an electrode (conductor) on a substrate, and then cutting the elements into individual pieces. Furthermore, solder plating is usually applied to the chip resistor after being divided by barrel plating. Barrel plating, as is well known, is a mechanical plating method in which a separate object to be plated, which serves as a cathode, and a chip resistor are placed in a container, and plating is performed by rotating the container.
【０００３】しかし、バレルめっきを行うと、チップ抵
抗器同士が付着してしまうことがある。特にチップ抵抗
器の裏面同士が付着して、２つの抵抗器が一体になるこ
とが多い。このような場合、相互付着したチップ抵抗器
を分離する必要がある。分離には、従来は超音波を利用
して行う方法がよく採用されている。この分離方法に用
いる超音波洗浄機は、図２に示すように、基本的には水
を入れた大容器１０内に小容器１１を配置した構成であ
り、小容器１１内にはダイフロン１２を入れてある。な
お、図面には示していないが、大容器１０の周囲には超
音波発生器を設置してある。そして、互いに付着した２
つのチップ抵抗器２０を小容器１１内のダイフロン１２
に浸漬した後、超音波発生器を作動させて、超音波を発
生させる。超音波は、大容器１０内の水を経て、小容器
１１内のダイフロン１２に伝わり、ダイフロン１２を微
振動させる。これにより、チップ抵抗器２０を個々の抵
抗器に分離する。However, when barrel plating is performed, chip resistors may adhere to each other. In particular, the back sides of chip resistors often adhere to each other, making the two resistors one piece. In such cases, it is necessary to separate the mutually attached chip resistors. Conventionally, methods using ultrasonic waves have often been used for separation. As shown in FIG. 2, the ultrasonic cleaner used in this separation method basically has a structure in which a small container 11 is placed inside a large container 10 containing water, and a Daiflon 12 is placed inside the small container 11. It's included. Although not shown in the drawings, an ultrasonic generator is installed around the large container 10. And the two attached to each other
The two chip resistors 20 are placed in the Diflon 12 in the small container 11.
After immersing it in water, the ultrasonic generator is activated to generate ultrasonic waves. The ultrasonic waves are transmitted to the Daiflon 12 in the small container 11 through the water in the large container 10, causing the Daiflon 12 to vibrate slightly. This separates the chip resistor 20 into individual resistors.
【０００４】0004
【発明が解決しようとする課題】しかしながら、上記分
離方法では、チップ抵抗器の分離率が高々５０％程度で
あり、分離処理を行っても未だ付着し合ったチップ抵抗
器が半分近く残る。その上、超音波をチップ抵抗器に与
えることから、抵抗器に形成してある電極や標印が消滅
したり、電極から剥がれて酸化された黒色化半田等の汚
れがめっき表面に付いたりし、製品としては不良品にな
ることが多い。そのため、上記分離方法は、付着したチ
ップ抵抗器を分離する方法としては最適ではない。However, in the above separation method, the separation rate of the chip resistors is about 50% at most, and even after the separation process, nearly half of the chip resistors still adhere to each other remain. Furthermore, since ultrasonic waves are applied to chip resistors, the electrodes and markings formed on the resistors may disappear, and stains such as blackened solder that has peeled off from the electrodes and oxidized may adhere to the plating surface. , products are often defective. Therefore, the above separation method is not optimal as a method for separating adhered chip resistors.
【０００５】従って、本発明の目的は、分離率を高める
と共に、分離処理を行っても製品としてできるだけ不良
品にならないチップ抵抗器の分離方法を提供することに
ある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for separating chip resistors that increases the separation rate and prevents the product from being defective as much as possible even after separation treatment.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
に、本発明のチップ抵抗器の分離方法は、一定間隔を置
いて２つのローラを対向配置し、互いに異なる速度で両
ローラを回転させ、相互付着したチップ抵抗器を両ロー
ラ間に送り込み、両ローラによってチップ抵抗器を分離
することを特徴とする。[Means for Solving the Problems] In order to achieve the above object, the method for separating chip resistors of the present invention involves arranging two rollers facing each other at a constant interval, and rotating both rollers at different speeds. , the chip resistors attached to each other are fed between both rollers, and the chip resistors are separated by both rollers.
【０００７】本発明の分離方法は、互いに異なる速度で
回転する２つのローラ間に、相互付着したチップ抵抗器
を送り込むので、両ローラ間を抵抗器が通過する際に抵
抗器に分離力が作用し、容易に抵抗器を分離できる。本
発明の分離方法では、ローラの回転速度を変えてあるこ
とが重要であり、回転速度の相違がチップ抵抗器の分離
作用に大きく寄与する。そのため、各ローラの回転数の
比率を適切に設定することが肝要である。具体的に、高
速ローラの回転数と低速ローラの回転数との比率は、高
速ローラの回転数を１とすると、１：０．７〜０．８程
度、好ましくは１：０．８程度である。因みに、２つの
ローラの回転数が同一であると、チップ抵抗器は殆ど分
離されなくなる。[0007] In the separation method of the present invention, the mutually attached chip resistors are fed between two rollers rotating at different speeds, so that a separation force is applied to the resistors when they pass between the two rollers. The resistor can be easily separated. In the separation method of the present invention, it is important to vary the rotational speed of the roller, and the difference in rotational speed greatly contributes to the separation effect of the chip resistor. Therefore, it is important to appropriately set the ratio of the rotation speeds of each roller. Specifically, the ratio of the rotation speed of the high speed roller to the rotation speed of the low speed roller is about 1:0.7 to 0.8, preferably about 1:0.8, assuming that the rotation speed of the high speed roller is 1. be. Incidentally, if the rotation speeds of the two rollers are the same, the chip resistors will hardly be separated.
【０００８】又、各ローラの回転数も適当に選定する必
要がある。即ち、２つのローラの回転数は好適には８〜
１０ｒｐｍ程度である。ローラは、付着し合ったチップ
抵抗器を両ローラ間の間隙に通すため、良好な分離作用
が得られた上で、抵抗器を傷付けたり、破損したりしな
いような材質であることが好ましい。かかる材料として
は、弾性材が妥当であり、例えばゴム、ウレタンがある
。[0008] Furthermore, it is necessary to appropriately select the rotation speed of each roller. That is, the number of rotations of the two rollers is preferably 8 to 8.
The speed is about 10 rpm. Since the rollers pass the chip resistors adhered to each other through the gap between the two rollers, they are preferably made of a material that provides a good separation effect and does not damage or damage the resistors. Appropriate examples of such materials include elastic materials, such as rubber and urethane.
【０００９】[0009]
【実施例】以下、本発明のチップ抵抗器の分離方法を実
施例に基づいて説明する。本発明の分離方法を実施する
際に用いる装置の構成例を図１に示す。この装置では、
適当な径のゴムローラ１、２を、同一回転軸上に一定間
隔を置いて対向配置してある。ローラ１、２は同一径で
あり、両ローラ１、２の間隔は裏面同士が付着した２つ
のチップ抵抗器５の高さよりも若干狭い。ローラ２の下
流側（抵抗器５の送り込み側）には、相互付着したチッ
プ抵抗器をローラ１、２間に次々に移送するベルトコン
ベヤ等の搬送手段３を設けてある。EXAMPLES The method for separating chip resistors according to the present invention will be explained below based on examples. FIG. 1 shows an example of the configuration of an apparatus used to carry out the separation method of the present invention. With this device,
Rubber rollers 1 and 2 having appropriate diameters are arranged facing each other on the same rotating shaft at a constant interval. The rollers 1 and 2 have the same diameter, and the distance between the rollers 1 and 2 is slightly narrower than the height of the two chip resistors 5 whose back surfaces are attached to each other. On the downstream side of the rollers 2 (on the feeding side of the resistors 5), a conveying means 3 such as a belt conveyor is provided for successively conveying the mutually attached chip resistors between the rollers 1 and 2.
【００１０】このように構成した装置で、ローラ１、２
をそれぞれ矢印方向に回転させる。ローラ１の回転数は
１０ｒｐｍ、ローラ２の回転数は８ｒｐｍである。ここ
で、付着したチップ抵抗器５を搬送手段３によってロー
ラ１、２間に送り込むと、抵抗器５は両ローラ１、２で
挟持される。この時、ローラ１、２の回転速度が異なる
ため、抵抗器５には分離力が作用し、チップ抵抗器５は
ローラ１、２間から排出される時に個々の抵抗器５ａ、
５ｂに容易に分離される。又、分離の際には、ローラ１
、２がゴム製であるため、各抵抗器５ａ、５ｂを損傷す
ることもない。なお、分離した抵抗器５ａ、５ｂは適当
な容器等で受け止めればよい。[0010] In the device configured as described above, rollers 1 and 2
Rotate each in the direction of the arrow. The rotation speed of roller 1 is 10 rpm, and the rotation speed of roller 2 is 8 rpm. Here, when the attached chip resistor 5 is sent between the rollers 1 and 2 by the conveyance means 3, the resistor 5 is sandwiched between both the rollers 1 and 2. At this time, since the rotational speeds of the rollers 1 and 2 are different, a separating force acts on the resistor 5, and when the chip resistor 5 is ejected from between the rollers 1 and 2, the individual resistors 5a,
5b. Also, when separating, roller 1
, 2 are made of rubber, so that each resistor 5a, 5b will not be damaged. Note that the separated resistors 5a and 5b may be received in a suitable container or the like.
【００１１】[0011]
【発明の効果】本発明のチップ抵抗器の分離方法は、以
上説明したように、付着したチップ抵抗器を互いに異な
る速度で回転する２つのローラ間に送り込むので、下記
の効果を奏する。
（１）付着し合ったチップ抵抗器の分離率が、超音波洗
浄機を用いた従来の分離方法よりも格段に高くなる。特
に、ローラの回転数、回転数の比率、材質等を適切に選
定することで、分離率をほぼ１００％近くまで高めるこ
とができる。
（２）ローラ間でチップ抵抗器を挟持して分離する様態
を採ることから、チップ抵抗器を傷付けたり、破損した
りすることはなく、汚れの付着も全くない。そのため、
分離処理後のチップ抵抗器が製品として不良品になるよ
うなことは殆どない。Effects of the Invention As explained above, the chip resistor separation method of the present invention feeds the adhered chip resistors between two rollers rotating at different speeds, so that the following effects are achieved. (1) The separation rate of chip resistors that adhere to each other is much higher than that of the conventional separation method using an ultrasonic cleaner. In particular, by appropriately selecting the rotation speed, rotation speed ratio, material, etc. of the roller, the separation rate can be increased to nearly 100%. (2) Since the chip resistor is sandwiched and separated between the rollers, the chip resistor is not damaged or damaged, and there is no dirt attached to it. Therefore,
Chip resistors after separation treatment rarely become defective products.
【図１】本発明の分離方法を説明するための図である。FIG. 1 is a diagram for explaining the separation method of the present invention.
【図２】超音波洗浄機を用いた従来の分離方法を説明す
るための図である。FIG. 2 is a diagram for explaining a conventional separation method using an ultrasonic cleaner.
１、２ ゴムローラ
３ 搬送手段
５ 付着したチップ抵抗器５ａ、５
ｂ 分離したチップ抵抗器1, 2 Rubber roller 3 Conveying means 5 Attached chip resistors 5a, 5
b Separated chip resistor
Claims (1)
し、互いに異なる速度で両ローラを回転させ、相互付着
したチップ抵抗器を両ローラ間に送り込み、両ローラに
よってチップ抵抗器を分離することを特徴とするチップ
抵抗器の分離方法。Claim 1: Two rollers are arranged facing each other at a constant interval, both rollers are rotated at different speeds, and the mutually attached chip resistors are sent between the two rollers, and the chip resistors are separated by both rollers. A method for separating chip resistors, characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3117455A JP2703129B2 (en) | 1991-05-22 | 1991-05-22 | Chip resistor separation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3117455A JP2703129B2 (en) | 1991-05-22 | 1991-05-22 | Chip resistor separation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04345001A true JPH04345001A (en) | 1992-12-01 |
| JP2703129B2 JP2703129B2 (en) | 1998-01-26 |
Family
ID=14712090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3117455A Expired - Fee Related JP2703129B2 (en) | 1991-05-22 | 1991-05-22 | Chip resistor separation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2703129B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298902A (en) * | 1988-10-05 | 1990-04-11 | Taiyo Yuden Co Ltd | Transfer apparatus of chip-shaped electronic component |
-
1991
- 1991-05-22 JP JP3117455A patent/JP2703129B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298902A (en) * | 1988-10-05 | 1990-04-11 | Taiyo Yuden Co Ltd | Transfer apparatus of chip-shaped electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2703129B2 (en) | 1998-01-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |