JPH04342479A - Bonding of ceramic and metal - Google Patents
Bonding of ceramic and metalInfo
- Publication number
- JPH04342479A JPH04342479A JP13944891A JP13944891A JPH04342479A JP H04342479 A JPH04342479 A JP H04342479A JP 13944891 A JP13944891 A JP 13944891A JP 13944891 A JP13944891 A JP 13944891A JP H04342479 A JPH04342479 A JP H04342479A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- foil
- ceramic
- temperature
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 62
- 239000002184 metal Substances 0.000 title claims abstract description 62
- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 239000011888 foil Substances 0.000 claims abstract description 46
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010936 titanium Substances 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 6
- 239000010955 niobium Substances 0.000 claims abstract description 6
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 238000002485 combustion reaction Methods 0.000 abstract description 3
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 abstract description 3
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005219 brazing Methods 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、セラミックスと金属と
の接合方法に関し、特に、８００℃の高温雰囲気下にお
いて実用に耐える接合強度を有するセラミックスと金属
との接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining ceramics and metals, and more particularly to a method for joining ceramics and metals that has a bonding strength that can be used in practical use in a high-temperature atmosphere of 800°C.
【０００２】0002
【従来の技術】セラミックスは、特に窒化珪素、炭化珪
素又はサイアロン等のセラミックスは、高温特性が優れ
ており、そのため、高温に晒される部品素材として使用
されているが、更に、近年、この種セラミックスと金属
とを接合し、両者の得失を補う構造のセラミックスー金
属接合体が着目され、この接合体も、その特性に応じて
各種用途に使用されている。そして、この接合体として
は、従来、銀ー銅系金属ロウ「例えば田中貴金属工業社
製のＴＫＣ−７１０（液相温度：７８５℃）等」を用い
、該ロウによりセラミックスと金属とを接合したものが
知られている。[Prior Art] Ceramics, especially ceramics such as silicon nitride, silicon carbide, and sialon, have excellent high-temperature properties and are therefore used as materials for parts exposed to high temperatures. Ceramic-metal bonded bodies, which have a structure in which ceramic and metal are bonded to compensate for the advantages and disadvantages of both, have attracted attention, and these bonded bodies are also used for various purposes depending on their characteristics. Conventionally, a silver-copper metal solder such as TKC-710 (liquidus temperature: 785°C) manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. was used for this bonded body, and the ceramic and metal were joined by the solder. something is known.
【０００３】0003
【発明が解決しようとする課題】ところで、セラミック
スー金属接合体としては、５００℃以上の高温で、特に
８００℃の高温雰囲気で実用に耐える接合強度を有する
ものの出現が強く要望されている。しかしながら、従来
のセラミックスー金属接合体は、その接合材として、上
記したように、銀ー銅系金属ロウを使用するものであり
、この接合体は、５００℃以上の高温雰囲気下で接合強
度が急激に低下する欠点を有しており、そのため、この
高温下での実用に供せられる接合体が得られないもので
ある。また、セラミックスー金属接合体において、５０
０℃以上の高温での使用、特に８００℃の高温雰囲気で
の使用に耐える十分な接合強度を得るためには、ロウ材
を介してセラミックスと金属とを１０７０℃以上という
高温度で接合しなければならないが、それに適するロウ
材は、今日に至るも存在していない。By the way, there is a strong demand for a ceramic-metal bonded body that has a bonding strength that can withstand practical use at high temperatures of 500°C or higher, particularly in a high-temperature atmosphere of 800°C. However, as mentioned above, conventional ceramic-metal bonded bodies use silver-copper metal solder as the bonding material, and this bonded body has poor bonding strength in high-temperature atmospheres of 500°C or higher. It has the drawback of rapidly decreasing, and therefore, it is not possible to obtain a bonded body that can be put to practical use at this high temperature. In addition, in the ceramic-metal bonded body, 50
In order to obtain sufficient bonding strength to withstand use at high temperatures of 0°C or higher, especially in a high-temperature atmosphere of 800°C, ceramics and metal must be joined via a brazing material at a high temperature of 1070°C or higher. However, to this day, there is no brazing material suitable for this purpose.
【０００４】また、従来よりニッケルロウやパラジウム
ロウのような液相温度が高く、高温下で使用できるロウ
材も知られているが、この種ロウ材は、セラミックスに
は流れないため、セラミックスと金属との接合に用いる
ことができない。更に、ロウ材をセラミックスに流すた
めに、該ロウ材にチタン、ジルコニウム、ニオブ等の活
性金属を含有させる必要があるが、チタン、ジルコニウ
ム、ニオブ等の活性金属をロウ材中に含有させると、ロ
ウ材としての合金箔の作成が困難になるという問題点を
有している。[0004]Also, there are conventionally known brazing materials such as nickel wax and palladium wax that have a high liquidus temperature and can be used at high temperatures, but these types of brazing materials do not flow into ceramics, so they cannot be used with ceramics. Cannot be used for joining with metal. Furthermore, in order to flow the brazing material into ceramics, it is necessary to incorporate active metals such as titanium, zirconium, and niobium into the brazing material. There is a problem in that it is difficult to prepare alloy foil as a brazing material.
【０００５】そこで、本発明は、上記した従来の欠点、
問題点に着目してなされたものであって、上記要望に沿
うセラミックスと金属との接合方法を提供することを目
的とする。詳細には、本発明は、５００℃以上の高温で
、特に８００℃の高温雰囲気で実用に耐える接合強度を
有するセラミックスと金属との接合方法を提供すること
を目的とし、更には、高温に晒される部品素材、例えば
８００℃という高温雰囲気下での使用を必要とする内燃
機関等の部材への使用が期待される高温特性に優れたセ
ラミックスー金属接合体を提供することを目的とする。[0005] Therefore, the present invention solves the above-mentioned conventional drawbacks.
The present invention was developed in view of the problem and aims to provide a method for joining ceramics and metal that meets the above requirements. Specifically, an object of the present invention is to provide a method for joining ceramics and metals that has a bonding strength that can be used in practice at high temperatures of 500°C or higher, particularly in a high-temperature atmosphere of 800°C. An object of the present invention is to provide a ceramic-metal bonded body with excellent high-temperature properties, which is expected to be used as a component material for internal combustion engines, etc., which requires use in a high-temperature atmosphere of 800°C.
【０００６】[0006]
【課題を解決するための手段】そして、本発明は、上記
目的を達成する手段として、セラミックスと金属の接合
部分に活性金属箔と活性金属類を含まないロウ箔である
ニッケルとシリコンから成るロウ箔とを挿入し、１０７
０℃以上の温度で加熱し、接合する点を特徴とするもの
であり、これによって、高温特性に優れた耐熱接合体が
得られるものである。即ち、本発明は、セラミックスと
金属との接合方法において、セラミックスと金属との接
合部分に、チタン、ジルコニウム、ニオブ等の活性金属
箔と、ニッケルとシリコンから成るロウ箔とを挿入し、
１０７０℃以上の温度で加熱し、接合することを特徴と
するセラミックスと金属との接合方法である。[Means for Solving the Problems] As a means for achieving the above object, the present invention provides a soldering agent comprising an active metal foil and a wax foil containing no active metals, nickel and silicon, at the bonding portion between ceramic and metal. Insert the foil, 107
It is characterized in that it is heated and bonded at a temperature of 0° C. or higher, and thereby a heat-resistant bonded body with excellent high-temperature properties can be obtained. That is, the present invention provides a method for joining ceramics and metal, in which active metal foil such as titanium, zirconium, niobium, etc., and wax foil consisting of nickel and silicon are inserted into the joint between ceramic and metal, and
This is a method of joining ceramics and metal, which is characterized by heating and joining at a temperature of 1070° C. or higher.
【０００７】以下本発明を詳細に説明すると、本発明に
おいて、接合用セラミックスとしては、特に限定するも
のではないが、窒化珪素、炭化珪素、サイアロンは高温
特性に優れているところから、これらのセラミックスを
使用するのが好ましい。また、接合用金属としても、耐
蝕性合金、例えばステンレス合金等使用目的に応じて適
宜使用することができる。[0007] The present invention will be described in detail below. In the present invention, the bonding ceramics are not particularly limited to silicon nitride, silicon carbide, and sialon because they have excellent high-temperature properties. It is preferable to use Further, as a joining metal, a corrosion-resistant alloy such as a stainless steel alloy can be used as appropriate depending on the purpose of use.
【０００８】本発明において、活性金属箔の種類は、例
えばチタン、ニオブ、ジルコニウムの各箔であり、活性
金属であれば、いずれも使用することができる。また、
その箔は、限定するものではないが、１００μｍ前後の
厚さの箔を使用するのが好ましい。In the present invention, the types of active metal foils include, for example, titanium, niobium, and zirconium foils, and any active metal can be used. Also,
Although the foil is not limited, it is preferable to use a foil having a thickness of about 100 μm.
【０００９】更に、本発明で使用するニッケルとシリコ
ンとからなるロウ材（ロウ箔）としては、耐熱接合を目
的とするため、そのロウ材合金の液相温度が１０７０℃
以上の組成を有するものから適宜選定することができる
。具体的なロウ材を例示すると、本発明で限定するもの
でないけれども、■ ７１％Ｎｉー１９％Ｃｒー１０
％Ｓｉからなるロウ（液相温度：１０７０℃）、■
７３％Ｎｉー１１．３％Ｃｒー８％Ｗー４％Ｆｅー２．
２％Ｂー１．５％Ｓｉからなるロウ（液相温度：１１６
０℃）、■ ７３．３％Ｎｉー２０％Ｃｏー２．７％
Ｂー４％Ｓｉからなるロウ（液相温度：１１１０℃）を
挙げることができ（いずれも重量％）、いわゆるニッケ
ルーシリコンロウであって、通常、ニッケルロウと呼称
されているロウ材（ロウ箔）を使用することができる。Furthermore, since the solder metal (wax foil) made of nickel and silicon used in the present invention is intended for heat-resistant bonding, the liquidus temperature of the solder metal alloy is 1070°C.
It can be appropriately selected from those having the above compositions. Specific examples of brazing materials include (1) 71%Ni-19%Cr-10, although they are not limited to this invention.
%Si wax (liquidus temperature: 1070°C), ■
73%Ni-11.3%Cr-8%W-4%Fe-2.
Wax consisting of 2% B-1.5% Si (liquid temperature: 116
0°C), ■ 73.3%Ni-20%Co-2.7%
B-4% Si wax (liquidus temperature: 1110°C) can be mentioned (both weight %), so-called nickel-silicon wax, which is usually called nickel solder (wax). foil) can be used.
【００１０】また、本発明において、接合温度としては
、１０７０℃以上とする必要がある。この接合温度とし
て１０７０℃より低い温度では、ニッケルとシリコンと
からなるロウ材（ロウ箔）が溶融せず、目的とする高温
雰囲気下（８００℃）における接合強度の発現が不十分
となり、好ましくない。一方、接合温度の上限は、接合
すべき金属の種類及び挿入するロウ材の種類に応じ適宜
選定することができる。例えば接合すべき金属の強度劣
化が発現するまでの加熱温度とすることができ、また、
溶融するまでの温度が許される。しかし、高温で加熱し
すぎて、接合すべき金属の強度劣化が生じたり、あるい
は、溶融したりする温度は採用できない。Further, in the present invention, the bonding temperature must be 1070° C. or higher. If the bonding temperature is lower than 1070℃, the solder metal (wax foil) made of nickel and silicon will not melt, and the desired bonding strength will not be sufficiently developed in the high-temperature atmosphere (800℃), which is undesirable. . On the other hand, the upper limit of the bonding temperature can be appropriately selected depending on the type of metal to be bonded and the type of brazing material to be inserted. For example, the heating temperature can be set to the point where the strength of the metal to be joined appears to deteriorate, and
Temperatures up to melting are allowed. However, it is not possible to adopt a temperature that would cause the metals to be joined to deteriorate in strength or melt due to excessive heating.
【００１１】[0011]
【実施例】次に、本発明の実施例並びに比較例を挙げ、
本発明をより詳細に説明する。
（実施例１〜６）接合すべき金属及びセラミックスとし
て、３×４×２０ｍｍの金属（ＳＵＳ−３０４）と３×
４×２０ｍｍのセラミックス（サイアロン：日本セラテ
ック社製）を使用した。そして、この金属とセラミック
スとの間に、第１層としてロウ箔を、第２層として活性
金属箔を、第３層として第１層と同一のロウ箔を順次挿
入し、「金属（ＳＵＳ−３０４）／第１層：ロウ箔／第
２層：活性金属箔／第３層：ロウ箔／セラミックス（サ
イアロン）」とした。第１層及び第３層として使用した
ロウ箔は、ニッケルロウ箔（ＢＮｉ−５ 準拠組成品：
日本非晶質金属社製）であり、また、第２層として用い
た活性金属箔は、厚さ１００μｍのチタン箔、同厚さの
ジルコニウム箔、同厚さのニオブ箔（いずれもニラコ社
製）の活性金属箔である。実施例１〜６における各層の
箔を表１に示す。なお、上記 ＢＮｉ−５ ニッケルロ
ウ箔は、その組成が７１重量％ニッケルー１９重量％ク
ロムー１０重量％シリコンからなるロウ（液相温度：１
０７０℃）であり、ニッケルーシリコンロウであって、
通常、ニッケルロウと呼称されているものである。[Examples] Next, examples of the present invention and comparative examples are given.
The present invention will be explained in more detail. (Examples 1 to 6) As metals and ceramics to be joined, 3 x 4 x 20 mm metal (SUS-304) and 3 x
Ceramics (Sialon: manufactured by Nippon Ceratec Co., Ltd.) of 4×20 mm were used. Then, between the metal and the ceramic, a wax foil is inserted as the first layer, an active metal foil as the second layer, and the same wax foil as the first layer as the third layer. 304) / 1st layer: wax foil / 2nd layer: active metal foil / 3rd layer: wax foil / ceramics (sialon). The wax foil used as the first and third layers was nickel wax foil (BNi-5 compliant composition:
The active metal foils used as the second layer were titanium foil with a thickness of 100 μm, zirconium foil with the same thickness, and niobium foil with the same thickness (all manufactured by Nilaco Co., Ltd.). ) active metal foil. Table 1 shows the foils of each layer in Examples 1 to 6. The BNi-5 nickel wax foil has a composition of 71% nickel, 19% chromium, and 10% silicon (liquid temperature: 1% by weight).
070°C) and is a nickel-silicon wax,
It is usually called nickel wax.
【００１２】次に、これを１０−６Ｔｏｒｒの真空下で
１０７０℃又は１１７０℃に加熱してセラミックスー金
属接合体を作成した。この接合体の８００℃における接
合強度を測定した。その結果を同じく表１に示す。Next, this was heated to 1070° C. or 1170° C. under a vacuum of 10 −6 Torr to produce a ceramic-metal bonded body. The bonding strength of this bonded body at 800° C. was measured. The results are also shown in Table 1.
【００１３】[0013]
【表１】[Table 1]
【００１４】（比較例１〜１０）比較のために、活性金
属箔の代わりに活性でない金属箔（鉄又はニッケル箔）
を挿入した場合（比較例１、同２）、ニッケルロウ箔の
代わりに銅ロウの箔（Ｃｕ−ＡＢＡ ＧＴＥ−Ｗｅｓｇ
ｏ社製液相温度：１０２４℃）を挿入した場合（比較例
３〜８）以外に実施例と同一条件でセラミックスー金属
接合体を作成した。また、接合温度を１２７０℃（比較
例９）又は１０３０℃（比較例１０）とした点を除いて
実施例と同一条件でセラミックスー金属接合体を作成し
た。これらの接合体の８００℃における接合強度を測定
した。その各結果を表２に示す。(Comparative Examples 1 to 10) For comparison, inactive metal foil (iron or nickel foil) was used instead of active metal foil.
(Comparative Examples 1 and 2), copper solder foil (Cu-ABA GTE-Wesg
Ceramic-metal bonded bodies were produced under the same conditions as in the examples except for the case where a ceramic material (liquidus temperature: 1024° C. manufactured by Company O) was inserted (Comparative Examples 3 to 8). Further, ceramic-metal bonded bodies were produced under the same conditions as in the examples except that the bonding temperature was 1270°C (Comparative Example 9) or 1030°C (Comparative Example 10). The bonding strength of these bonded bodies at 800°C was measured. The results are shown in Table 2.
【００１５】[0015]
【表２】[Table 2]
【００１６】表１から明らかなように、本発明は、チタ
ン、ジルコニウム、ニオブの活性金属箔とニッケルロウ
箔とを接合材として使用し、かつ、１０７０℃以上の温
度で加熱し、接合することにより、８００℃における接
合強度が、いずれも１８．３Ｋｇ／ｍｍ２以上のセラミ
ックスー金属接合体が得られることが理解できる。As is clear from Table 1, the present invention uses activated metal foils of titanium, zirconium, and niobium and nickel wax foil as bonding materials, and heats and bonds them at a temperature of 1070° C. or higher. It can be seen that a ceramic-metal bonded body having a bonding strength of 18.3 Kg/mm2 or more at 800° C. can be obtained.
【００１７】これに対して、表２から明らかなように、
ニッケルロウ箔を使用しても、活性金属箔を用いず、鉄
又はニッケル箔を挿入した場合、比較例１、２にみられ
るように、接合不能であった。また、活性金属箔を挿入
しても、ニッケルロウ箔に代えて銅ロウの箔を使用した
比較例３〜８では、その８００℃における接合強度は、
４．６〜７．６Ｋｇ／ｍｍ２であった。更に、本発明に
おけるチタンの活性金属箔と同じくニッケルロウ箔とを
挿入しても、接合温度が本発明の範囲外の１０３０℃で
加熱した場合、使用したニッケルロウ箔が溶融せず（比
較例１０）、また、１２７０℃で加熱した場合、接合用
金属が溶融してしまい（比較例９）、いずれも目的とす
るセラミックスー金属接合体が得られなかった。On the other hand, as is clear from Table 2,
Even if nickel wax foil was used, when iron or nickel foil was inserted without using active metal foil, as seen in Comparative Examples 1 and 2, bonding was impossible. In addition, even if active metal foil is inserted, in Comparative Examples 3 to 8, in which copper braze foil was used instead of nickel braze foil, the bonding strength at 800°C was
It was 4.6 to 7.6 Kg/mm2. Furthermore, even if a nickel wax foil is inserted in the same manner as the titanium activated metal foil in the present invention, when the bonding temperature is heated at 1030°C, which is outside the range of the present invention, the nickel wax foil used does not melt (comparative example). 10), and when heated at 1270° C., the joining metal melted (Comparative Example 9), and the desired ceramic-metal joined body could not be obtained in either case.
【００１８】[0018]
【発明の効果】本発明は、以上詳記したとおり、活性金
属箔と活性金属類を含まないロウ箔であるニッケルとシ
リコンから成るロウ箔とを挿入し、１０７０℃以上の温
度で加熱し、接合するものであり、これによって、８０
０℃の高温雰囲気下での使用においても、高接合強度の
セラミックスー金属接合体が得られる顕著な効果が生ず
る。そして、本発明により、８００℃という高温雰囲気
下での使用を必要とする例えば内燃機関等の部材に好適
な素材を提供することができる。Effects of the Invention As detailed above, the present invention involves inserting an active metal foil and a wax foil made of nickel and silicon, which is a wax foil containing no active metals, and heating the foil at a temperature of 1070°C or higher. 80
Even when used in a high-temperature atmosphere of 0° C., the remarkable effect of obtaining a ceramic-metal bonded body with high bonding strength is produced. Further, according to the present invention, it is possible to provide a material suitable for a member of, for example, an internal combustion engine, which requires use in a high temperature atmosphere of 800°C.
Claims (2)
いて、セラミックスと金属との接合部分に、チタン、ジ
ルコニウム、ニオブ等の活性金属箔と、ニッケルとシリ
コンから成るロウ箔とを挿入し、１０７０℃以上の温度
で加熱し、接合することを特徴とするセラミックスと金
属との接合方法。Claim 1: In a method for joining ceramics and metal, an activated metal foil such as titanium, zirconium, niobium, etc. and a wax foil made of nickel and silicon are inserted into the joint between the ceramic and metal, and the temperature is 1070°C or higher. A method for joining ceramics and metal, which is characterized by heating and joining at a temperature of .
珪素又はサイアロンである請求項１に記載のセラミック
スと金属との接合方法。2. The method for joining ceramics and metal according to claim 1, wherein the joining ceramic is silicon nitride, silicon carbide, or sialon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13944891A JPH04342479A (en) | 1991-05-16 | 1991-05-16 | Bonding of ceramic and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13944891A JPH04342479A (en) | 1991-05-16 | 1991-05-16 | Bonding of ceramic and metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04342479A true JPH04342479A (en) | 1992-11-27 |
Family
ID=15245444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13944891A Pending JPH04342479A (en) | 1991-05-16 | 1991-05-16 | Bonding of ceramic and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04342479A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6123797A (en) * | 1995-06-23 | 2000-09-26 | The Dow Chemical Company | Method for coating a non-wetting fluidizable and material onto a substrate |
| JP2005015317A (en) * | 2003-06-30 | 2005-01-20 | Sumitomo Electric Ind Ltd | Bonded body of ceramic-metal composite, bonding method, and apparatus for manufacturing liquid crystal or semiconductor using the bonded body |
-
1991
- 1991-05-16 JP JP13944891A patent/JPH04342479A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6123797A (en) * | 1995-06-23 | 2000-09-26 | The Dow Chemical Company | Method for coating a non-wetting fluidizable and material onto a substrate |
| JP2005015317A (en) * | 2003-06-30 | 2005-01-20 | Sumitomo Electric Ind Ltd | Bonded body of ceramic-metal composite, bonding method, and apparatus for manufacturing liquid crystal or semiconductor using the bonded body |
| JP4556389B2 (en) * | 2003-06-30 | 2010-10-06 | 住友電気工業株式会社 | Bonded body and bonding method of ceramic-metal composite and semiconductor or liquid crystal manufacturing apparatus using the bonded body |
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