JPH04341715A - Electrically instrumented substrate with switch - Google Patents
Electrically instrumented substrate with switchInfo
- Publication number
- JPH04341715A JPH04341715A JP13953091A JP13953091A JPH04341715A JP H04341715 A JPH04341715 A JP H04341715A JP 13953091 A JP13953091 A JP 13953091A JP 13953091 A JP13953091 A JP 13953091A JP H04341715 A JPH04341715 A JP H04341715A
- Authority
- JP
- Japan
- Prior art keywords
- switch
- board
- electrical
- electrical board
- release button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 8
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
Landscapes
- Details Of Cameras Including Film Mechanisms (AREA)
- Shutters For Cameras (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Push-Button Switches (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、カメラ等の狭い内部
空間に配置される電装基板に外部から操作されるスイツ
チを取り付けたスイツチ付き電装基板の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an electrical board with a switch, which is arranged in a narrow internal space of a camera or the like and has an externally operated switch attached thereto.
【０００２】0002
【従来の技術】カメラのコンパクト化・多機能化に伴い
、カメラの狭い内部空間に複雑な回路を組み込む必要か
ら、回路部品の小型化や電装基板上の配線パタ−ンの微
細化が進められているが、これに比較してスイツチ等の
機構部品は、その構造からくる限界のため回路部品のよ
うには小型化されず、比較的大型の部品のまま電装基板
上に取り付けられて使用されている。[Prior Art] As cameras become more compact and multi-functional, it is necessary to incorporate complex circuits into the narrow internal space of the camera, which leads to miniaturization of circuit components and miniaturization of wiring patterns on electrical boards. However, compared to this, mechanical parts such as switches are not miniaturized like circuit parts due to limitations due to their structure, and are used as relatively large parts attached to electrical circuit boards. ing.
【０００３】図８は従来の電装基板におけるスイツチ取
り付け部分の構造を示す。図において、１は電装基板、
２はＩＣパツケ−ジ等の回路部品、３は面実装型のスイ
ツチ、４はレリ−ズ釦、４ａはレリ−ズ釦の下部に延長
されたスイツチ作動子、５はレリ−ズ釦を復帰させるス
プリング、６はカメラケ−スを示す。また、図９、図１
０は従来の電装基板における板ばねスイツチの取り付け
部分の構造を示す。図において８は板ばねスイツチで、
その他の部品については図６と同一符号を付してある。FIG. 8 shows the structure of a switch mounting portion on a conventional electrical board. In the figure, 1 is an electrical board;
2 is a circuit component such as an IC package, 3 is a surface-mounted switch, 4 is a release button, 4a is a switch actuator extended to the bottom of the release button, and 5 is a return button for the release button. 6 indicates the camera case. Also, Figure 9, Figure 1
0 shows the structure of the attachment part of a leaf spring switch on a conventional electrical board. In the figure, 8 is a leaf spring switch.
Other parts are given the same reference numerals as in FIG. 6.
【０００４】0004
【発明が解決しようとする課題】従来の電装基板におけ
るスイツチ取り付け部分の構造では、図８、図９、図１
０に示すように、板ばねスイツチ８は勿論のこと、面実
装型のスイツチ３でも小型化された回路部品２に比較す
れば非常に大型の部品であり、また、スイツチはカメラ
外部から操作されるもので、その操作性やカメラの外形
デザインによりその配置に制約をうけるから、スイツチ
を回路部品とともに電装基板１の上に取り付けるときは
どうしても無駄な空間が生じ、電装基板の実装密度を高
めることはできなかつた。この発明は、上記課題を解決
し、スイツチの操作性に基づく配置や寸法による制約を
うけることなく、実装密度の高いスイツチ付き電装基板
を提供することを目的とするものである。[Problems to be Solved by the Invention] In the structure of the switch mounting part on the conventional electrical board, the structure shown in FIGS.
0, not only the leaf spring switch 8 but also the surface-mounted switch 3 are very large components compared to the miniaturized circuit component 2, and the switch cannot be operated from outside the camera. Since the arrangement is limited by the operability and external design of the camera, when the switch is mounted on the electrical board 1 along with the circuit components, wasted space is inevitably created, which makes it difficult to increase the mounting density of the electrical board. I couldn't. It is an object of the present invention to solve the above-mentioned problems and to provide an electrical equipment board with a switch that can be mounted at a high density without being restricted by the layout or dimensions based on the operability of the switch.
【０００５】[0005]
【課題を解決するための手段】この発明は上記課題を解
決するもので、ケ−ス外部から操作部材で操作されるス
イツチ部材を備えたスイツチ付き電装基板において、電
装基板は主要な電気回路を形成した第１の電装基板と、
その下方に配置されたスイツチ部材を備えた第２の電装
基板とからなり、前記操作部材はその延長部が第１の電
装基板よりも下方に配置された前記第２の電装基板上の
スイツチ部材を操作するよう構成されたことを特徴とす
る。[Means for Solving the Problems] The present invention solves the above problems, and provides an electrical board with a switch that is operated by an operating member from outside the case. The formed first electrical board,
and a second electrical board with a switch member disposed below the operating member, and the operating member has an extension portion of the switch member on the second electrical board located below the first electrical board. It is characterized by being configured to operate.
【０００６】[0006]
【作用】電装基板を、主要な電気回路を形成した第１の
電装基板とスイツチ部材を備えた第２の電装基板とに分
離し、スイツチ部材を備えた第２の電装基板を第１の電
装基板の下方に配置するから、第１の電装基板はスイツ
チの操作性に基づく配置や寸法による制約をうけること
なく、実装密度を高くすることができる。[Operation] The electrical equipment board is separated into a first electrical equipment board that forms a main electrical circuit and a second electrical equipment board that includes a switch member, and the second electrical equipment board that includes the switch member is connected to the first electrical equipment board that includes the switch member. Since the first electrical equipment board is disposed below the board, it is possible to increase the packaging density without being restricted by the arrangement or dimensions based on the operability of the switch.
【０００７】[0007]
【実施例】以下、この発明の実施例について説明する。
図１、図２及び図３はこの発明を実施した電装基板にお
けるスイツチ取り付け部分の構造の第１実施例で、図１
はレリ−ズ釦が解放されている状態を示し、図２はレリ
−ズ釦を押し下げた状態を示す。また、図３は第１の電
装基板の平面図である。[Embodiments] Examples of the present invention will be described below. 1, 2, and 3 show a first embodiment of the structure of a switch mounting part in an electrical board according to the present invention, and FIG.
2 shows a state in which the release button is released, and FIG. 2 shows a state in which the release button is pressed down. Moreover, FIG. 3 is a plan view of the first electrical equipment board.
【０００８】この実施例では、電装基板は第１の電装基
板１と、その下方に配置された第２の電装基板１０から
なる。第１の電装基板１にはＩＣパツケ−ジその他の回
路部品２と図示しない配線パタ−ンが形成される。また
、第２の電装基板１０には面実装型のスイツチ３その他
が取り付けられる。なお、４はレリ−ズ釦、４ａはレリ
−ズ釦の下部に延長されたスイツチ作動子、５はレリ−
ズ釦を復帰させるスプリング、６はカメラケ−スを示す
。In this embodiment, the electrical equipment board consists of a first electrical equipment board 1 and a second electrical equipment board 10 arranged below it. On the first electrical equipment board 1, an IC package and other circuit components 2 and a wiring pattern (not shown) are formed. Furthermore, a surface-mounted switch 3 and other devices are attached to the second electrical board 10. In addition, 4 is a release button, 4a is a switch actuator extended below the release button, and 5 is a release button.
The spring that returns the button, 6 indicates the camera case.
【０００９】第１の電装基板１には、図３によく示され
ているように、スイツチ作動子４ａの貫通する穴１ａが
設けられており、そのスイツチ作動子４ａの先端が第２
の電装基板１０上の面実装型のスイツチ３に達しており
、レリ−ズ釦４を操作すると、スイツチ作動子４ａを介
して面実装型のスイツチ３を押圧して操作できるように
構成されている。As clearly shown in FIG. 3, the first electrical equipment board 1 is provided with a hole 1a through which the switch actuator 4a passes, and the tip of the switch actuator 4a is connected to the second
The surface-mounted switch 3 is located on the electrical board 10, and is configured so that when the release button 4 is operated, the surface-mounted switch 3 can be pressed and operated via the switch actuator 4a. There is.
【００１０】第１の電装基板１には面実装型のスイツチ
３は設けらず、スイツチ作動子４ａの貫通する穴１ａの
みが設けられるから、スイツチの操作性に基づく配置や
寸法による制約を受けることなく、また、貫通穴１ａの
みでスイツチの無い分だけ電装基板１の有効面積が増え
、また、電装基板１の両面の使用が可能となるので、配
線基板の実装密度を高くすることができる。Since the first electrical board 1 is not provided with a surface-mounted switch 3 and only has a hole 1a through which the switch actuator 4a passes, it is subject to restrictions on placement and dimensions based on the operability of the switch. In addition, the effective area of the electrical board 1 increases by the amount of the through hole 1a and no switch, and since both sides of the electrical board 1 can be used, the mounting density of the wiring board can be increased. .
【００１１】図４はこの発明を実施した電装基板におけ
るスイツチ取り付け部分の構造の第２実施例で、面実装
型のスイツチ３をレリ−ズ釦４の直下に配置できない場
合の例を示している。図において、４ｂはスイツチ作動
子４ａの下端に取り付けられたスイツチ連動部材で、第
１の電装基板１は、面実装型のスイツチ３が設けられた
第２の電装基板１０の延長部１０ａに取り付けられてい
る。FIG. 4 shows a second embodiment of the structure of the switch mounting portion of an electrical board embodying the present invention, and shows an example in which a surface-mounted switch 3 cannot be placed directly below the release button 4. . In the figure, 4b is a switch interlocking member attached to the lower end of the switch actuator 4a, and the first electrical board 1 is attached to the extension part 10a of the second electrical board 10 on which the surface-mounted switch 3 is provided. It is being
【００１２】このようなスイツチ連動部材４ｂをスイツ
チ作動子４ａの下端に取り付けることで、カメラデザイ
ン上の要求からレリ−ズ釦等のスイツチ操作部材の位置
が決定された場合でも、これから離れた位置にスイツチ
を配置することができるとともに、第１の電装基板１に
スイツチ作動子４ａの貫通穴１ａの設置を回避すること
もできる。By attaching such a switch interlocking member 4b to the lower end of the switch actuator 4a, even if the position of a switch operating member such as a release button is determined based on camera design requirements, it can be moved to a position far away from the position of the switch operating member such as the release button. In addition, it is possible to avoid providing the through hole 1a of the switch actuator 4a in the first electrical equipment board 1.
【００１３】図５はこの発明を実施した電装基板におけ
るスイツチ取り付け部分の構造の第３実施例で、第１の
電装基板１をレリ−ズ釦等のスイツチ操作部材のハウジ
ング６ａを避けて配置した例である。カメラケ−ス６と
第２の電装基板１０と間の内部空間が十分無い場合でも
第１の電装基板１を配置することができる。FIG. 5 shows a third embodiment of the structure of the switch mounting portion of the electrical board according to the present invention, in which the first electrical board 1 is arranged avoiding the housing 6a of the switch operating member such as the release button. This is an example. Even if there is not enough internal space between the camera case 6 and the second electrical board 10, the first electrical board 1 can be placed.
【００１４】図７は先に説明した第１実施例の電装基板
をカメラケ−ス内に収納した状態を示すもので、カメラ
ケ−ス６内の上面裏側に接近して、ＩＣパツケ−ジその
他の回路部品と配線パタ−ンの形成された第１の電装基
板１が配置され、この第１の電装基板１には、カメラケ
−ス上のレリ−ズ釦等のスイツチ操作部材を設ける位置
に、スイツチ操作部材貫通させる穴１ａが設けられてい
る。第１の電装基板１の下側には、第１の電装基板１に
接続されたフレキシブル材から構成された第２の電装基
板１０が配置され、この第２の電装基板１０には、スイ
ツチ操作部材により操作される面実装型のスイツチ３が
取り付けられている。FIG. 7 shows the state in which the electrical board of the first embodiment described above is housed in the camera case. A first electrical board 1 on which circuit components and wiring patterns are formed is disposed, and on this first electrical board 1 there are provided switch operation members such as a release button on the camera case at positions where switch operation members such as a release button are provided. A hole 1a is provided through which the switch operating member passes. A second electrical board 10 made of a flexible material and connected to the first electrical board 1 is disposed below the first electrical board 1. A surface-mounted switch 3 operated by a member is attached.
【００１５】第２の電装基板１０には主としてスイツチ
等の大型部品を配置し、第１の電装基板１にはスイツチ
等の大型部品を配置せず、ＩＣパツケ−ジその他の回路
部品と配線パタ−ンを配置するから、電装基板の表面面
積を有効に利用でき、高密度の実装が可能となる。Large parts such as switches are mainly arranged on the second electrical board 10, and large parts such as switches are not arranged on the first electrical board 1, and IC packages and other circuit parts and wiring patterns are arranged on the second electrical board 10. By arranging the electronic circuit board, the surface area of the electrical equipment board can be used effectively, and high-density packaging is possible.
【００１６】図８は第１の電装基板と第２の電装基板と
を１枚のフレキシブル基板により構成した第４の実施例
で、フレキシブル基板２１はＩＣパツケ−ジその他の回
路部品と配線パタ−ンの形成された部分２１ａと、面実
装型のスイツチ３が取り付けられている部分２１ｂとに
分けて構成され、部分２１ｂを折り返し部Ｌで折り返し
、部分２１ａの下側に配置するようにしたもので、部分
２１ａにはカメラケ−ス上に配置されるレリ−ズ釦等の
スイツチ操作部材の先端を貫通させる穴１ａが設けられ
ている。FIG. 8 shows a fourth embodiment in which the first electrical board and the second electrical board are constructed of one flexible board. It is divided into a part 21a where a switch is formed and a part 21b to which a surface-mounted switch 3 is attached, and the part 21b is folded back at a folding part L and placed below the part 21a. The portion 21a is provided with a hole 1a through which the tip of a switch operating member such as a release button placed on the camera case passes.
【００１７】この構成によつても、部分２１ａにスイツ
チ等の大型部品を配置せず、ＩＣパツケ−ジその他の回
路部品と配線パタ−ンのみを形成するときは、基板の表
面面積を有効に利用でき、高密度の実装が可能となる。
また、この構成では、１枚のフレキシブル基板上に回路
部品と配線パタ−ンの形成された部分２１ａと面実装型
のスイツチ３が取り付けられている部分２１ｂとを構成
するから、２種類の基板を準備する必要がなく、基板材
料や接続のためのコストを節約することができる。Even with this configuration, when large components such as switches are not placed in the portion 21a and only the IC package and other circuit components and wiring patterns are formed, the surface area of the board can be effectively used. This allows for high-density packaging. Moreover, in this configuration, since the part 21a where circuit components and wiring patterns are formed and the part 21b where the surface-mounted switch 3 is attached are formed on one flexible board, two types of boards are used. There is no need to prepare the substrate, and the cost for substrate materials and connections can be saved.
【００１８】[0018]
【発明の効果】以上説明したように、この発明によれば
、電装基板を主要な電気回路を形成した第１の電装基板
とスイツチ部材を備えた第２の電装基板とを分け、スイ
ツチ部材を備えた第２の電装基板を第１の電装基板の下
方に配置するから、第１の電装基板はスイツチの操作性
に基づく配置や寸法による制約をうけることなく回路部
品を含む高密度の配線パタ−ンを設けることができ、配
線基板の実装密度を高くすることができる。また、カメ
ラケ−スと第２の電装基板との間は、比較的大型のスイ
ツチ部材のために空間が形成されるが、この空間に主要
な電気回路を形成した第１の電装基板を配置することに
より、カメラケ−ス内の空間を有効に利用することがで
き、更にカメラのコンパクト化を図ることが可能となる
。As explained above, according to the present invention, the electrical board is divided into the first electrical board forming the main electrical circuit and the second electrical board including the switch member, and the switch member is Since the second electrical board provided with the switch is placed below the first electrical board, the first electrical board can be connected to a high-density wiring pattern containing circuit components without being restricted by layout or dimensions based on the operability of the switch. - can be provided, and the mounting density of the wiring board can be increased. Furthermore, a space is formed between the camera case and the second electrical board for a relatively large switch member, and the first electrical board on which the main electrical circuit is formed is placed in this space. As a result, the space inside the camera case can be used effectively, and the camera can be made more compact.
【図１】電装基板のスイツチ取り付け部分の構造の第１
実施例の側面断面図。[Figure 1] First structure of the switch mounting part of the electrical board
FIG. 3 is a side sectional view of the embodiment.
【図２】図１に示す第１実施例のスイツチ操作部材を操
作した状態を示す側面断面図。FIG. 2 is a side sectional view showing a state in which the switch operating member of the first embodiment shown in FIG. 1 is operated;
【図３】図１に示す第１実施例の第１の電装基板の平面
図。FIG. 3 is a plan view of the first electrical board of the first embodiment shown in FIG. 1;
【図４】電装基板のスイツチ取り付け部分の構造の第２
実施例の側面断面図。[Figure 4] Second structure of the switch mounting part of the electrical board
FIG. 3 is a side sectional view of the embodiment.
【図５】電装基板のスイツチ取り付け部分の構造の第３
実施例の側面断面図。[Figure 5] Third part of the structure of the switch attachment part of the electrical board
FIG. 3 is a side sectional view of the embodiment.
【図６】第１実施例の電装基板をカメラケ−ス内に収容
した状態を説明する斜視図。FIG. 6 is a perspective view illustrating a state in which the electrical board of the first embodiment is housed in a camera case.
【図７】電装基板の構造を示す第４実施例の斜視図。FIG. 7 is a perspective view of a fourth embodiment showing the structure of an electrical board.
【図８】従来の電装基板のスイツチ取り付け部分の構造
の一例を示す側面断面図。FIG. 8 is a side cross-sectional view showing an example of the structure of a switch mounting portion of a conventional electrical board.
【図９】従来の電装基板のスイツチ取り付け部分の構造
の他の例を示す側面断面図。FIG. 9 is a side sectional view showing another example of the structure of the switch attachment portion of the conventional electrical board.
【図１０】従来の電装基板のスイツチ取り付け部分の構
造のその他の例を示す側面断面図。FIG. 10 is a side sectional view showing another example of the structure of the switch mounting portion of the conventional electrical board.
１：第１の電装基板 ２：回路部品 ３：面実装型スイツチ ４：レリ−ズ釦 ４ａ：スイツチ作動子 ６：カメラケ−ス １０：第２の電装基板 1: First electrical board 2: Circuit parts 3: Surface mount switch 4: Release button 4a: Switch operator 6: Camera case 10: Second electrical board
Claims (1)
スイツチ部材を備えたスイツチ付き電装基板において、
電装基板は主要な電気回路を形成した第１の電装基板と
、その下方に配置されたスイツチ部材を備えた第２の電
装基板とからなり、前記操作部材はその延長部が第１の
電装基板よりも下方に配置された前記第２の電装基板上
のスイツチ部材を操作するよう構成されたことを特徴と
するスイツチ付き電装基板。[Claim 1] An electrical equipment board with a switch including a switch member operated by an operating member from outside the case,
The electrical board consists of a first electrical board that forms a main electrical circuit and a second electrical board that is provided with a switch member disposed below the first electrical board, and the operating member has an extension that extends from the first electrical board. An electrical equipment board with a switch, characterized in that it is configured to operate a switch member on the second electrical equipment board that is arranged below the second electrical equipment board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953091A JPH04341715A (en) | 1991-05-16 | 1991-05-16 | Electrically instrumented substrate with switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953091A JPH04341715A (en) | 1991-05-16 | 1991-05-16 | Electrically instrumented substrate with switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04341715A true JPH04341715A (en) | 1992-11-27 |
Family
ID=15247430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13953091A Pending JPH04341715A (en) | 1991-05-16 | 1991-05-16 | Electrically instrumented substrate with switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04341715A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023040831A (en) * | 2021-09-10 | 2023-03-23 | パナソニックＩｐマネジメント株式会社 | Release switch device and imaging device |
-
1991
- 1991-05-16 JP JP13953091A patent/JPH04341715A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023040831A (en) * | 2021-09-10 | 2023-03-23 | パナソニックＩｐマネジメント株式会社 | Release switch device and imaging device |
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