JPH04337694A - Resin film protecting electronic component - Google Patents
Resin film protecting electronic componentInfo
- Publication number
- JPH04337694A JPH04337694A JP11008091A JP11008091A JPH04337694A JP H04337694 A JPH04337694 A JP H04337694A JP 11008091 A JP11008091 A JP 11008091A JP 11008091 A JP11008091 A JP 11008091A JP H04337694 A JPH04337694 A JP H04337694A
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- board
- electronic component
- discolor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 title claims abstract description 18
- 229920002050 silicone resin Polymers 0.000 claims abstract description 9
- 238000002845 discoloration Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 230000001681 protective effect Effects 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電子部品保護用樹脂膜に
関し、特に実装用基板に実装された電子部品を被覆し保
護するための電子部品保護用樹脂膜に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin film for protecting electronic components, and more particularly to a resin film for protecting electronic components for covering and protecting electronic components mounted on a mounting board.
【０００２】0002
【従来の技術】半導体装置やコンデンサおよび抵抗など
の電子部品を実装用基板（以後基板と記す）に実装する
場合、外部からの機械的衝撃や使用環境の雰囲気から電
子部品を保護するために、通常、保護用樹脂膜で電子部
品を被覆する。保護用樹脂膜としては黒色のシリコン樹
脂などがよく用いられる。勿論その他の樹脂や黒以外の
色も用いられるが、従来用いられている保護用樹脂膜は
どのようなものであっても、塗布された後では、周囲の
温度の上昇や電子部品の発熱による温度の変化によって
色が変化するようなことのない特性のものであった。[Prior Art] When mounting electronic components such as semiconductor devices, capacitors, and resistors on a mounting board (hereinafter referred to as a board), in order to protect the electronic components from external mechanical shock and the atmosphere of the usage environment, Typically, electronic components are covered with a protective resin film. Black silicone resin or the like is often used as the protective resin film. Of course, other resins and colors other than black can also be used, but no matter what type of protective resin film is used, once it has been applied, it will be susceptible to damage due to increases in ambient temperature or heat generated by electronic components. It had a characteristic that the color did not change due to changes in temperature.
【０００３】0003
【発明が解決しようとする課題】一般に、半導体装置な
どの電子部品が実装された基板に故障が発生した場合、
故障個所を目視で特定するには、故障した電子部品が発
熱する現象を利用すると便利なことがある。この場合、
発熱による温度上昇を目に見える現象に変えなければな
らない。ところが上述した従来の保護用樹脂膜では、電
子部品の故障によって温度が上昇してもその部分の保護
用樹脂膜の色や形は変化しないので、目に見えるように
するための一つの方法として、電子部品が実装された基
板に絶縁性を有する冷却剤を吹き付け、その冷却剤が故
障した電子部品から発生する熱によって融解する状態に
より故障個所を特定する方法が行われている。[Problem to be Solved by the Invention] Generally, when a failure occurs in a board on which electronic components such as semiconductor devices are mounted,
To visually identify the location of a failure, it may be convenient to utilize the phenomenon in which a failed electronic component generates heat. in this case,
We must turn the temperature rise caused by heat generation into a visible phenomenon. However, with the conventional protective resin film mentioned above, even if the temperature rises due to a failure of an electronic component, the color or shape of the protective resin film in that part does not change. A method is used in which an insulating coolant is sprayed onto a board on which electronic components are mounted, and the coolant is melted by the heat generated by the failed electronic component to identify the location of the failure.
【０００４】しかしこの故障検出方法では、絶縁性を有
する冷却剤が必要となり、また冷却剤が融解しつつある
短い時間の間に多数の電子部品が複雑に実装された基板
上で周囲より温度の高い個所をすばやく特定しなければ
ならないという困難さがあった。更に冷却剤を使用する
ため電子部品の温度が通常稼働時とは異なって低温にな
り特性が変化する、あるいは空気中の水分が電子部品が
実装された基板に結露して配線間が一時的に短絡してし
まうことがあるなど、かならずしも正確に故障個所を特
定できないというような問題点があった。However, this failure detection method requires a coolant with insulating properties, and during the short period when the coolant is melting, the temperature of the board on which many electronic components are mounted in a complex manner may be higher than that of the surroundings. There was a difficulty in quickly identifying high points. Furthermore, since a coolant is used, the temperature of the electronic components may become lower than during normal operation, causing their characteristics to change, or moisture in the air may condense on the board on which the electronic components are mounted, causing temporary damage between the wiring. There were problems such as short circuits, which made it impossible to pinpoint the location of the failure accurately.
【０００５】[0005]
【課題を解決するための手段】本発明の電子部品保護用
樹脂膜は、被覆した電子部品から発生する熱によって変
色し、その変色が定着する特性を有することを特徴とす
る。[Means for Solving the Problems] The resin film for protecting electronic parts of the present invention is characterized in that it changes color due to the heat generated from the electronic parts it covers, and has the property that the color change is fixed.
【０００６】[0006]
【実施例】次に本発明の最適な実施例について図面を参
照して説明する。図１（ａ）は本発明の一実施例の断面
図である。図１（ａ）を参照すると本実施例では、半導
体装置実装用の基板１の上にはんだ２によって実装され
た半導体装置３の上に、保護用のシリコン樹脂膜４が塗
布されている。シリコン樹脂膜４は、ロイコ染料などの
ような感熱色素を含有しており、このため温度が上ると
変色しその変色が定着する特性をもっている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1(a) is a sectional view of one embodiment of the present invention. Referring to FIG. 1A, in this embodiment, a protective silicone resin film 4 is coated on a semiconductor device 3 mounted on a substrate 1 for mounting a semiconductor device with solder 2. As shown in FIG. The silicone resin film 4 contains a heat-sensitive dye such as a leuco dye, and therefore has the property of changing color when the temperature rises and fixing the color change.
【０００７】図１（ｂ）は、図１（ａ）の半導体装置３
に短絡故障が発生した例を示す断面図である。短絡故障
が発生した半導体装置５には、過電流が流れ熱が発生し
ており１５０℃以上の温度になっている。ここで、シリ
コン樹脂膜４には、１５０℃以上の温度で変色しその変
色が定着する感熱色素を含有させてあるので、短絡故障
が発生した半導体装置５の周囲のシリコン樹脂膜４には
変色部分６が現われ、その変色が定着する。従って基板
への通電を止めた後充分に時間を掛けて故障個所を特定
することができる。しかも冷却剤を用いていないので実
使用状態に近い温度で故障個所を特定することができる
。FIG. 1(b) shows the semiconductor device 3 of FIG. 1(a).
FIG. 3 is a cross-sectional view showing an example in which a short-circuit failure occurs. In the semiconductor device 5 where the short-circuit failure has occurred, an overcurrent flows and heat is generated, and the temperature is 150° C. or higher. Here, since the silicone resin film 4 contains a heat-sensitive dye that changes color at a temperature of 150° C. or more and fixes the color change, the silicone resin film 4 around the semiconductor device 5 where the short-circuit failure has occurred will not change color. Area 6 appears and the discoloration settles. Therefore, it is possible to specify the location of the failure with sufficient time after the power supply to the board is stopped. Furthermore, since no coolant is used, the failure location can be identified at temperatures close to those in actual use.
【０００８】なお、本実施例に用いたシリコン樹脂膜は
、基板に実装された電子部品の保護用樹脂として一般に
応く用いられているものであるので、本発明を適用する
場合に製造工程や条件を大幅に変更する必要がないとい
う利点がある。樹脂として、目的，製造コストあるいは
効果の程度などに応じて他の樹脂を用いても本実施例と
同様な効果を得ることができる。[0008] The silicone resin film used in this example is generally used as a protective resin for electronic components mounted on a substrate, so when applying the present invention, the manufacturing process and The advantage is that there is no need to significantly change the conditions. The same effects as in this embodiment can be obtained even if other resins are used as the resin depending on the purpose, manufacturing cost, degree of effect, etc.
【０００９】[0009]
【発明の効果】以上説明したように本発明は、電子部品
を保護するために塗布する保護用樹脂膜が熱による変色
とその変色の定着という特性を有するので、故障して発
熱した電子部品を、実装された基板上で極めて容易にし
かも実使用状態に近い状態で特定することが可能である
という効果を有する。Effects of the Invention As explained above, the present invention has the property that the protective resin film applied to protect electronic components changes color due to heat and fixes the discoloration. , it has the effect that it is possible to identify the mounted board extremely easily and in a state close to the actual usage state.
【図１】分図（ａ）は、本発明の一実施例の断面図であ
る。分図（ｂ）は、分図（ａ）において、半導体装置３
が短絡故障した場合を示す断面図である。FIG. 1 (a) is a cross-sectional view of an embodiment of the present invention. Part (b) shows the semiconductor device 3 in part (a).
FIG. 3 is a sectional view showing a case where a short-circuit failure occurs.
１ 基板 ２ はんだ ３，５ 半導体装置 ４ シリコン樹脂膜 ６ 変色部分 1 Substrate 2 Solder 3,5 Semiconductor device 4 Silicone resin film 6 Discolored area
Claims (2)
って変色し、その変色が定着する特性を有することを特
徴とする電子部品保護用樹脂膜。1. A resin film for protecting electronic parts, which has the property of being discolored by heat generated from the electronic parts covered thereon, and the discoloration being fixed.
る請求項１記載の電子部品保護用樹脂膜。2. The resin film for protecting electronic components according to claim 1, wherein the resin film is made of silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11008091A JPH04337694A (en) | 1991-05-15 | 1991-05-15 | Resin film protecting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11008091A JPH04337694A (en) | 1991-05-15 | 1991-05-15 | Resin film protecting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04337694A true JPH04337694A (en) | 1992-11-25 |
Family
ID=14526531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11008091A Pending JPH04337694A (en) | 1991-05-15 | 1991-05-15 | Resin film protecting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04337694A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10204893B2 (en) * | 2016-05-19 | 2019-02-12 | Invensas Bonding Technologies, Inc. | Stacked dies and methods for forming bonded structures |
| US10446532B2 (en) | 2016-01-13 | 2019-10-15 | Invensas Bonding Technologies, Inc. | Systems and methods for efficient transfer of semiconductor elements |
| US11056390B2 (en) | 2015-06-24 | 2021-07-06 | Invensas Corporation | Structures and methods for reliable packages |
| US11387214B2 (en) | 2017-06-15 | 2022-07-12 | Invensas Llc | Multi-chip modules formed using wafer-level processing of a reconstituted wafer |
| US11462419B2 (en) | 2018-07-06 | 2022-10-04 | Invensas Bonding Technologies, Inc. | Microelectronic assemblies |
| US11476213B2 (en) | 2019-01-14 | 2022-10-18 | Invensas Bonding Technologies, Inc. | Bonded structures without intervening adhesive |
| US11538781B2 (en) | 2020-06-30 | 2022-12-27 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages including bonded structures |
| US11652083B2 (en) | 2017-05-11 | 2023-05-16 | Adeia Semiconductor Bonding Technologies Inc. | Processed stacked dies |
| US11728273B2 (en) | 2020-09-04 | 2023-08-15 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US11764189B2 (en) | 2018-07-06 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Molded direct bonded and interconnected stack |
| US11764177B2 (en) | 2020-09-04 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US11916054B2 (en) | 2018-05-15 | 2024-02-27 | Adeia Semiconductor Bonding Technologies Inc. | Stacked devices and methods of fabrication |
| US11935907B2 (en) | 2014-12-11 | 2024-03-19 | Adeia Semiconductor Technologies Llc | Image sensor device |
| US11955463B2 (en) | 2019-06-26 | 2024-04-09 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonded stack structures for increased reliability and improved yield in microelectronics |
| US11967575B2 (en) | 2018-08-29 | 2024-04-23 | Adeia Semiconductor Bonding Technologies Inc. | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes |
-
1991
- 1991-05-15 JP JP11008091A patent/JPH04337694A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11935907B2 (en) | 2014-12-11 | 2024-03-19 | Adeia Semiconductor Technologies Llc | Image sensor device |
| US11056390B2 (en) | 2015-06-24 | 2021-07-06 | Invensas Corporation | Structures and methods for reliable packages |
| US10446532B2 (en) | 2016-01-13 | 2019-10-15 | Invensas Bonding Technologies, Inc. | Systems and methods for efficient transfer of semiconductor elements |
| US10896902B2 (en) | 2016-01-13 | 2021-01-19 | Invensas Bonding Technologies, Inc. | Systems and methods for efficient transfer of semiconductor elements |
| US10879226B2 (en) | 2016-05-19 | 2020-12-29 | Invensas Bonding Technologies, Inc. | Stacked dies and methods for forming bonded structures |
| US10204893B2 (en) * | 2016-05-19 | 2019-02-12 | Invensas Bonding Technologies, Inc. | Stacked dies and methods for forming bonded structures |
| US11837596B2 (en) | 2016-05-19 | 2023-12-05 | Adeia Semiconductor Bonding Technologies Inc. | Stacked dies and methods for forming bonded structures |
| US11658173B2 (en) | 2016-05-19 | 2023-05-23 | Adeia Semiconductor Bonding Technologies Inc. | Stacked dies and methods for forming bonded structures |
| US11652083B2 (en) | 2017-05-11 | 2023-05-16 | Adeia Semiconductor Bonding Technologies Inc. | Processed stacked dies |
| US11387214B2 (en) | 2017-06-15 | 2022-07-12 | Invensas Llc | Multi-chip modules formed using wafer-level processing of a reconstituted wafer |
| US11916054B2 (en) | 2018-05-15 | 2024-02-27 | Adeia Semiconductor Bonding Technologies Inc. | Stacked devices and methods of fabrication |
| US11764189B2 (en) | 2018-07-06 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Molded direct bonded and interconnected stack |
| US11837582B2 (en) | 2018-07-06 | 2023-12-05 | Adeia Semiconductor Bonding Technologies Inc. | Molded direct bonded and interconnected stack |
| US11462419B2 (en) | 2018-07-06 | 2022-10-04 | Invensas Bonding Technologies, Inc. | Microelectronic assemblies |
| US11967575B2 (en) | 2018-08-29 | 2024-04-23 | Adeia Semiconductor Bonding Technologies Inc. | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes |
| US11817409B2 (en) | 2019-01-14 | 2023-11-14 | Adeia Semiconductor Bonding Technologies Inc. | Directly bonded structures without intervening adhesive and methods for forming the same |
| US11476213B2 (en) | 2019-01-14 | 2022-10-18 | Invensas Bonding Technologies, Inc. | Bonded structures without intervening adhesive |
| US11955463B2 (en) | 2019-06-26 | 2024-04-09 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonded stack structures for increased reliability and improved yield in microelectronics |
| US11631647B2 (en) | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
| US11538781B2 (en) | 2020-06-30 | 2022-12-27 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages including bonded structures |
| US11728273B2 (en) | 2020-09-04 | 2023-08-15 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US11764177B2 (en) | 2020-09-04 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
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