JPH04334417A - Synthetic resin composite molded product and its manufacture - Google Patents
Synthetic resin composite molded product and its manufactureInfo
- Publication number
- JPH04334417A JPH04334417A JP13579491A JP13579491A JPH04334417A JP H04334417 A JPH04334417 A JP H04334417A JP 13579491 A JP13579491 A JP 13579491A JP 13579491 A JP13579491 A JP 13579491A JP H04334417 A JPH04334417 A JP H04334417A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- synthetic resin
- composite molded
- molded product
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 40
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 33
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 238000007772 electroless plating Methods 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 238000007788 roughening Methods 0.000 claims abstract description 10
- 239000004695 Polyether sulfone Substances 0.000 claims description 7
- 229920006393 polyether sulfone Polymers 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 150000003457 sulfones Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002519 antifouling agent Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は合成樹脂複合成形品およ
びその製造方法に関するもので、特に表面に無電解めっ
きにより形成された金属層を有する合成樹脂複合成形品
およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin composite molded article and a method for producing the same, and more particularly to a synthetic resin composite molded article having a metal layer formed on its surface by electroless plating and a method for manufacturing the same.
【０００２】0002
【従来の技術】表面に所要のパターン形状の金属層を無
電解めっきにより形成した熱可塑性樹脂射出成形体は、
無電解めっきを行う前に表面を粗化する必要があるため
、少なくとも無電解めっきを行う部分には、粗面化しや
すいポリスルホン、ポリエーテルスルホン、ポリオキシ
安息香酸等の熱可塑性樹脂が用いられている。無電解メ
ッキを施すことが容易な熱可塑性樹脂と、それが困難な
熱可塑性樹脂（以下、難めっき性樹脂と言う）を組合せ
て射出成形した複合成形品に、無電解めっきにより金属
層を形成する場合、難めっき性樹脂としては通常、ポリ
スチレン、ポリプロピレン、アクリロニトリル─スチレ
ン共重合体等が用いられている。これらは、二色成形品
の成形に一般的に用いられているものである。[Prior Art] A thermoplastic resin injection molded article having a metal layer in a desired pattern formed on its surface by electroless plating is
Since it is necessary to roughen the surface before performing electroless plating, thermoplastic resins such as polysulfone, polyethersulfone, and polyoxybenzoic acid, which are easily roughened, are used at least in the areas to be electroless plated. . A metal layer is formed by electroless plating on a composite molded product that is injection molded by combining a thermoplastic resin that is easy to electroless plate and a thermoplastic resin that is difficult to plate (hereinafter referred to as difficult-to-plate resin). In this case, polystyrene, polypropylene, acrylonitrile-styrene copolymer, etc. are usually used as the difficult-to-plate resin. These are commonly used for molding two-color molded products.
【０００３】0003
【発明が解決しようとする課題】しかし、粗面化し易く
、無電解めっきに適した熱可塑性樹脂は一般に動摩擦係
数が大きく（例えば、ポリエーテルスルホンの場合０．
４）、摺動部品を搭載する基板、あるいは物体の搬送に
用いるには、適していない。一方、複合成形品に従来用
いられているポリスチレン等の難めっき性樹脂は、靱性
が不充分で、接点等の大きな外力を受ける部分に用いた
場合、変形あるいは破壊し易く、また摺動特性も決して
よくなかった。[Problems to be Solved by the Invention] However, thermoplastic resins that are easily roughened and suitable for electroless plating generally have a large coefficient of dynamic friction (for example, in the case of polyether sulfone, the coefficient of dynamic friction is 0.
4) It is not suitable for use as a board on which sliding parts are mounted or for transporting objects. On the other hand, difficult-to-plating resins such as polystyrene, which are conventionally used in composite molded products, have insufficient toughness and are easily deformed or destroyed when used in parts that are subject to large external forces, such as contacts, and also have poor sliding properties. It was never good.
【０００４】それ故、本発明の目的は、摺動部品を搭載
する基板や物品搬送に適し、かつ大きな外力を受ける部
分に使用できる、表面に金属層を有する合成樹脂複合成
形品を実現することである。[0004] Therefore, an object of the present invention is to realize a synthetic resin composite molded product having a metal layer on its surface, which is suitable for substrates on which sliding parts are mounted and for transporting articles, and which can be used for parts subject to large external forces. It is.
【０００５】また、本発明の目的は、摺動部品を搭載す
る基板や物品搬送に適し、かつ大きな外力を受ける部分
に使用できる、表面に金属層を有する合成樹脂複合成形
品の製造方法を実現することである。Another object of the present invention is to realize a method for manufacturing a synthetic resin composite molded product having a metal layer on its surface, which is suitable for substrates on which sliding parts are mounted and for transporting articles, and can be used for parts subject to large external forces. It is to be.
【０００６】[0006]
【課題を解決するための手段】本発明では、摺動部品を
搭載する基板や物品搬送に適し、かつ大きな外力を受け
る部分に使用できる、表面に金属層を有する合成樹脂複
合成形品を実現するため、化学的粗面化が困難で、摺動
特性のすぐれた第一の熱可塑性樹脂と、靱性が大きく、
化学的に粗面化容易な第二の熱可塑性樹脂と、第二の熱
可塑性樹脂の露出した表面の所定の部分に、化学的粗面
化と無電解めっきにより形成された金属層とで、合成樹
脂複合成形品を構成した。[Means for Solving the Problems] The present invention realizes a synthetic resin composite molded product having a metal layer on its surface, which is suitable for substrates on which sliding parts are mounted and for transporting goods, and can be used for parts subject to large external forces. Therefore, it is difficult to chemically roughen the surface, and is the first thermoplastic resin with excellent sliding properties.
A second thermoplastic resin whose surface can be easily roughened chemically, and a metal layer formed by chemical roughening and electroless plating on a predetermined portion of the exposed surface of the second thermoplastic resin, A synthetic resin composite molded product was constructed.
【０００７】また、本発明では、摺動部品を搭載する基
板や物品搬送に適し、かつ大きな外力を受ける部分に使
用できる、表面に金属層を有する合成樹脂複合成形品の
製造方法を実現するため、化学的粗面化が困難で、摺動
特性のすぐれた第一の熱可塑性樹脂と、靱性が大きく、
化学的に粗面化容易な、第二の熱可塑性樹脂とを、射出
成形により複合成形し、この複合成形品の表面に易めっ
き性樹脂が露出した部分のうち、所定の部分を化学的に
粗面化し、無電解めっきを施すことにより、合成樹脂複
合成形品を製造するようにした。[0007] Furthermore, the present invention provides a method for manufacturing a synthetic resin composite molded product having a metal layer on its surface, which is suitable for substrates on which sliding parts are mounted and for transporting goods, and can be used for parts subject to large external forces. , the first thermoplastic resin that is difficult to chemically roughen, has excellent sliding properties, and has high toughness.
A second thermoplastic resin whose surface can be easily roughened chemically is composite molded by injection molding, and a predetermined portion of the easily plateable resin exposed on the surface of this composite molded product is chemically roughened. By roughening the surface and applying electroless plating, a synthetic resin composite molded product was manufactured.
【０００８】複合成形品の表面に第二の熱可塑性樹脂が
露出した部分のうち、所定の部分を化学的に粗面化する
には、所定の部分以外を化学的粗面化が困難な第三の合
成樹脂で被覆（保護）しておき、残りの部分、つまり所
定の部分のみを、粗面化するの が、一つの有利な方
法である。第三の合成樹脂は、粗面化後、除去してもよ
いし、成形品の表面にそのまま残存してもよい。In order to chemically roughen a predetermined portion of the exposed portion of the second thermoplastic resin on the surface of the composite molded product, it is difficult to chemically roughen other than the predetermined portion. One advantageous method is to cover (protect) the surface with a synthetic resin and then roughen the remaining portion, that is, only the predetermined portion. The third synthetic resin may be removed after roughening or may remain on the surface of the molded product.
【０００９】複合成形品の表面の、第二の熱可塑性樹脂
の露出した部分全部を粗面化し、無電解めっきで金属層
を形成してもよい。この場合には、第一と第二の熱可塑
性樹脂の複合成形を、金属層を形成する部分に対応して
、第二の熱可塑性樹脂が表面に露出するように行う。[0009] The entire surface of the composite molded article where the second thermoplastic resin is exposed may be roughened and a metal layer may be formed by electroless plating. In this case, composite molding of the first and second thermoplastic resins is performed such that the second thermoplastic resin is exposed on the surface corresponding to the portion where the metal layer is to be formed.
【００１０】第一の熱可塑性樹脂は動摩擦係数が０．３
５以下であることが望ましく、好ましいのは、ポリアセ
タール、ポリフェニレンスルフィド、ポリアミド等であ
る。[0010] The first thermoplastic resin has a dynamic friction coefficient of 0.3.
It is desirable that the number is 5 or less, and preferred are polyacetal, polyphenylene sulfide, polyamide, and the like.
【００１１】第二の熱可塑性樹脂として好ましいのは、
ポリスルホン、ポリエーテルスルホン、ポリアリル（ａ
ｌｌｙｌ）スルホン、ポリアリレート、ポリカーボネー
ト、ポリエーテルイミド、ポリエーテルケトン、ポリエ
ーテルエーテルケトン、ポリエチレンテレフタレート、
ポリブチレンテレフタレート等である。[0011] Preferred as the second thermoplastic resin are:
Polysulfone, polyethersulfone, polyallyl (a
llyl) sulfone, polyarylate, polycarbonate, polyetherimide, polyetherketone, polyetheretherketone, polyethylene terephthalate,
Polybutylene terephthalate, etc.
【００１２】特に好ましい第一の熱可塑性樹脂はポリフ
ェニレンスルフィド、特に好ましい第二の熱可塑性樹脂
はポリスルホンとポリエーテルスルホンである。A particularly preferred first thermoplastic resin is polyphenylene sulfide, and particularly preferred second thermoplastic resins are polysulfone and polyether sulfone.
【００１３】第三の合成樹脂としては種々のものを用い
ることができ、エポキシ樹脂系、アルキド樹脂系、メラ
ミン樹脂系、尿素樹脂系、フタル酸樹脂系、不飽和ポリ
エステル樹脂系、シリコーン樹脂系、フェノール樹脂系
、塩化ビニル樹脂系、アクリル樹脂系等から選ぶことが
できる。水溶性樹脂塗料を用いることもできる。Various types of third synthetic resin can be used, including epoxy resins, alkyd resins, melamine resins, urea resins, phthalic acid resins, unsaturated polyester resins, silicone resins, It can be selected from phenol resin, vinyl chloride resin, acrylic resin, etc. Water-soluble resin paints can also be used.
【００１４】複合成形品の表面の所定の部分に金属層を
形成させるには、複合成形品の第二の熱可塑性樹脂の露
出部の表面を一部または全部粗面化し、必要に応じ前処
理を行って、パラジウム、金、銀等の貴金属の化合物よ
り成る触媒を付与した後、無電解めっきを施す。[0014] In order to form a metal layer on a predetermined portion of the surface of the composite molded product, the surface of the exposed portion of the second thermoplastic resin of the composite molded product is partially or completely roughened, and if necessary, pretreatment is performed. After applying a catalyst made of a compound of a noble metal such as palladium, gold, or silver, electroless plating is performed.
【００１５】第二の熱可塑性樹脂の表面は、めっき層に
対し充分な接着力を有しなければならないので、粗面化
に先立ち、通常、前処理を行う。まず、アルカリクリー
ナ、界面活性剤、有機溶剤等により成形品に付着してい
る離型剤や脂分等の汚れを除去する。Since the surface of the second thermoplastic resin must have sufficient adhesion to the plating layer, it is usually pretreated prior to surface roughening. First, dirt such as a mold release agent and fat adhering to the molded product is removed using an alkaline cleaner, a surfactant, an organic solvent, or the like.
【００１６】表面を粗面化するには、クロム酸／硫酸、
水酸化カルシウム、弗化水素酸／硝酸、酸性弗化アンモ
ニウム／硝酸等のエッチング液を用いる。第二の熱可塑
性樹脂は膨潤させるが、第一の熱可塑性樹脂は膨潤させ
ないような溶剤を用いて処理する方法を、用いることも
できる。[0016] To roughen the surface, chromic acid/sulfuric acid,
An etching solution such as calcium hydroxide, hydrofluoric acid/nitric acid, acidic ammonium fluoride/nitric acid, etc. is used. It is also possible to use a method in which the second thermoplastic resin is swollen, but the first thermoplastic resin is treated with a solvent that does not swell the first thermoplastic resin.
【００１７】粗面化した第二の熱可塑性樹脂の表面に無
電解めっきを施すためには、通常、無電解めっきに対す
る触媒の存在を必要とし、第二の熱可塑性樹脂に成形前
に予めめっき触媒を添加しておくか、表面粗面化の後に
触媒を付与する方法が用いられる。触媒付与の方法とし
ては、キャタリスト─アクセラレータ法、すなわちパラ
ジウム、錫等の金属の混合触媒液に浸漬後、塩酸、しゅ
う酸等の酸で活性化して、易めっき性樹脂の粗面化され
た表面にパラジウム等を析出させる方法や、センシタイ
ジング─アクティベーティング法、すなわち塩化第一錫
、塩化ヒドラジン、次亜燐酸等の強い還元剤を粗面化さ
れた易めっき性樹脂の金属パターン形成部分に吸着させ
た後、パラジウム、金等の貴金属イオンを含む触媒液に
浸漬し、貴金属を析出させる方法がある。無電解めっき
の触媒としては周期律表第５列第ＶＩＩＩ族の金属の化
合物、例えばハロゲン化物が、好ましい。[0017] In order to apply electroless plating to the roughened surface of the second thermoplastic resin, the presence of a catalyst for electroless plating is usually required, and the second thermoplastic resin is plated in advance before molding. A method is used in which a catalyst is added in advance or the catalyst is applied after surface roughening. The method for applying the catalyst is the catalyst-accelerator method, in which the resin is immersed in a mixed catalyst solution containing metals such as palladium and tin, and then activated with an acid such as hydrochloric acid or oxalic acid to roughen the surface of the easily plated resin. Methods of depositing palladium etc. on the surface, sensitizing-activating method, i.e. metal pattern formation on roughened and easily plated resin using strong reducing agents such as stannous chloride, hydrazine chloride, hypophosphorous acid, etc. There is a method in which the precious metal is precipitated by adsorbing it onto a surface and then immersing it in a catalyst solution containing noble metal ions such as palladium and gold. The catalyst for electroless plating is preferably a compound of a metal in Group VIII of the fifth row of the periodic table, such as a halide.
【００１８】粗面化した第二の熱可塑性樹脂の表面に、
無電解めっきにより、銅、ニッケル等の金属層を形成さ
せる。金属層を電気回路の配線部として用いる場合には
、銅層あるいは銅層の上に、ニッケル、金、ハンダ等の
層を単独にまたは組み合わせて、形成させることが好ま
しい。無電解めっきで生成した層の上に、この層を導体
として通常の電気めっきにより、さらに同種または異種
の金属層を形成してもよい（例えば無電解めっき銅層の
上に電気めっきニッケル層）。この方法は、無電解めっ
きにより金属層の充分な厚さが得られない場合に有用で
ある。[0018] On the roughened surface of the second thermoplastic resin,
A metal layer of copper, nickel, etc. is formed by electroless plating. When a metal layer is used as a wiring part of an electric circuit, it is preferable to form a layer of nickel, gold, solder, etc. alone or in combination on a copper layer or on a copper layer. On the layer produced by electroless plating, a layer of the same or different metal may be formed by ordinary electroplating using this layer as a conductor (for example, an electroplated nickel layer on an electroless copper layer). . This method is useful when sufficient thickness of the metal layer cannot be obtained by electroless plating.
【００１９】第二の熱可塑性樹脂の露出部分の一部に合
成樹脂塗料等でマスクを施せば、露出部分の形状と異な
るパターンにすることができる。If a part of the exposed portion of the second thermoplastic resin is masked with a synthetic resin paint or the like, a pattern different from the shape of the exposed portion can be formed.
【００２０】本発明の複合成形品は熱可塑性樹脂に、ガ
ラス繊維、チタン酸カリウム繊維、炭酸カルシウム等の
充填剤を含んでもよい。充填剤のほか、安定剤、酸化防
止剤、滑剤、難燃化剤、着色剤等を含んでもよい。[0020] The composite molded article of the present invention may contain a filler such as glass fiber, potassium titanate fiber, calcium carbonate, etc. in the thermoplastic resin. In addition to fillers, stabilizers, antioxidants, lubricants, flame retardants, colorants, etc. may also be included.
【００２１】[0021]
【作用】本発明の複合成形品は、化学的粗面化が困難で
、摺動特性のすぐれた第一の熱可塑性樹脂と、靱性が大
きく、化学的に粗面化容易な第二の熱可塑性樹脂から成
るので、第一の熱可塑性樹脂と第二の熱可塑性樹脂の間
で無電解めっきの付着性に明白な差別が生ずるから、無
電解めっきにより金属層は第二の熱可塑性樹脂の露出面
に選択的に形成され、粗面化されない第一の熱可塑性樹
脂の露出面には形成されない。これにより、合成樹脂成
形品の表面には、第二の熱可塑性樹脂の露出部分の形状
に従い、パターン状の金属層が形成される。一部を合成
樹脂塗料で被覆すれば、それ以外の部分にパターン状の
金属層が形成される。第二の熱可塑性樹脂は靱性が大き
いので、接点等での大きな外力に耐える。また、第一の
熱可塑性樹脂は動摩擦係数が小さいので、他の電気部品
等との間で、摺動や転動が円滑に行われる。[Operation] The composite molded product of the present invention consists of a first thermoplastic resin that is difficult to chemically roughen and has excellent sliding properties, and a second thermoplastic resin that is highly tough and easy to chemically roughen. Due to electroless plating, the metal layer is made of a plastic resin, so that there is a clear difference in the adhesion of electroless plating between the first thermoplastic resin and the second thermoplastic resin. It is selectively formed on the exposed surface and is not formed on the exposed surface of the first thermoplastic resin that is not roughened. As a result, a patterned metal layer is formed on the surface of the synthetic resin molded article according to the shape of the exposed portion of the second thermoplastic resin. By coating a portion with synthetic resin paint, a patterned metal layer is formed on the other portions. Since the second thermoplastic resin has high toughness, it can withstand large external forces at contacts and the like. Furthermore, since the first thermoplastic resin has a small coefficient of dynamic friction, it can smoothly slide and roll between other electrical parts and the like.
【００２２】以下実施例を示し、本発明のさらに詳細な
説明とする。[0022] Examples will be shown below to provide a more detailed explanation of the present invention.
【００２３】[0023]
【実施例１】本発明による合成樹脂複合成形品を、図１
および図２に示す。図２は、図１の切断線ＩＩに沿った
断面を示している。複合成形品は、めっき触媒を含む一
次成形体１と、めっき触媒を含まない二次成形体２と、
電気回路形成パターン部分を除いて塗布された紫外線硬
化型樹脂塗料の層（以下、保護塗料層と言う）３とから
成る。一次成形体１には、貫通孔４が設けられ、その内
面４ａには傾斜がつけてあるので、ここに二次成形体２
が貫入して、一次成形体１と二次成形体２の係合部を形
成している。図１に示すように、一次成形体１の面に突
起１ａが設けられ、突起１ａの表面を含め一次成形体の
表面に、パターン状の金属層５が形成されている。また
、成形品を貫通する窓６があって、窓６内には二次成形
体２と同じ材質のローラ７が、二次成形体に沿った軸の
回りに回転自在に、取り付けられている。[Example 1] Fig. 1 shows a synthetic resin composite molded product according to the present invention.
and shown in FIG. FIG. 2 shows a cross section along section line II in FIG. The composite molded product includes a primary molded product 1 containing a plating catalyst, a secondary molded product 2 that does not contain a plating catalyst,
It consists of a layer 3 of an ultraviolet curable resin paint (hereinafter referred to as a protective paint layer) which is applied except for the electric circuit forming pattern portion. The primary molded body 1 is provided with a through hole 4, and its inner surface 4a is sloped, so that the secondary molded body 1 can be inserted into the through hole 4.
penetrates to form an engaging portion between the primary molded body 1 and the secondary molded body 2. As shown in FIG. 1, protrusions 1a are provided on the surface of the primary molded body 1, and a patterned metal layer 5 is formed on the surface of the primary molded body, including the surface of the protrusion 1a. Further, there is a window 6 passing through the molded product, and a roller 7 made of the same material as the secondary molded product 2 is attached within the window 6 so as to be rotatable around an axis along the secondary molded product. .
【００２４】この合成樹脂複合成形品は、以下の方法で
製造される。パラジウム触媒０．１重量％とガラス繊維
２０重量％を含むポリエーテルスルホンを射出成形して
、窓６と突起部１ａを有する一次成形体１を作る。次い
で、一次成形体１を図示しない金型内に固定し、金型内
のキャビティに、ガラス繊維３０重量％を含むポリフェ
ニレンスルフィドを充填して、二次成形体２を形成させ
る。一次成形体１は、内面が傾斜した貫通孔４を有する
ので、二次成形体はこの部分で一次成形体１に貫入し、
互いに係合される。金型の形状を、窓６に対応する部分
には二次成形体２が充填されないようにしてあるので、
一次成形体１と二次成形体２を貫通する窓６が形成され
る。金属層５に対応する部分を除いて、一次成形体１の
上面に紫外線硬化型アクリル樹脂塗料を乾燥後の厚さ２
０μｍになるように塗布し、紫外線照射により硬化させ
る。一次成形体１の金属層５を形成する部分の表面を、
化学的に粗面化する。それには、まず二次成形品２の外
面を常法により脱脂処理し、Ｎ，Ｎ−ジメチルホルムア
ミドに２分間浸漬した後、温度６０℃のクロム酸／硫酸
エッチング液に４分間浸漬してエッチングを行う。水洗
後、常法により無電解銅めっきを行い、３０ミクロンの
厚さに銅を析出させて金属層５とする。[0024] This synthetic resin composite molded article is manufactured by the following method. Polyether sulfone containing 0.1% by weight of a palladium catalyst and 20% by weight of glass fibers is injection molded to produce a primary molded body 1 having windows 6 and projections 1a. Next, the primary molded body 1 is fixed in a mold (not shown), and the cavity in the mold is filled with polyphenylene sulfide containing 30% by weight of glass fibers to form the secondary molded body 2. Since the primary molded body 1 has a through hole 4 with an inclined inner surface, the secondary molded body penetrates into the primary molded body 1 at this portion,
engaged with each other. Since the shape of the mold is such that the part corresponding to the window 6 is not filled with the secondary molded body 2,
A window 6 passing through the primary molded body 1 and the secondary molded body 2 is formed. Excluding the portion corresponding to the metal layer 5, ultraviolet curable acrylic resin paint is applied to the top surface of the primary molded body 1 to a thickness of 2 after drying.
It is applied to a thickness of 0 μm and cured by ultraviolet irradiation. The surface of the part where the metal layer 5 of the primary molded body 1 will be formed is
Chemically roughen the surface. To do this, first, the outer surface of the secondary molded product 2 is degreased by a conventional method, immersed in N,N-dimethylformamide for 2 minutes, and then immersed in a chromic acid/sulfuric acid etching solution at a temperature of 60°C for 4 minutes to perform etching. conduct. After washing with water, electroless copper plating is performed by a conventional method to deposit copper to a thickness of 30 microns to form the metal layer 5.
【００２５】パターン状に形成された金属層５は電気回
路として作用し、一次成形体１はその支持体として作用
する。二次成形体２は、さらに一次成形体１の支持体と
して作用するとともに、動摩擦係数の小さいポリフェニ
レンスルフィドで成るため、その表面２ａ，２ｂは他の
物品との間の摺動に適する。一次成形体１は靱性の大き
いポリエーテルスルホンから成るので、突起部１ａの面
の金属層を接点等として用いるときに、すぐれた接触安
定性や耐久性を示す。ローラ７は二次成形体２と同じ材
料で構成されているので、その上で他の物品を円滑に転
動させることができる。The patterned metal layer 5 acts as an electric circuit, and the primary molded body 1 acts as its support. The secondary molded body 2 further functions as a support for the primary molded body 1 and is made of polyphenylene sulfide having a small coefficient of dynamic friction, so its surfaces 2a and 2b are suitable for sliding with other articles. Since the primary molded body 1 is made of polyether sulfone having high toughness, it exhibits excellent contact stability and durability when the metal layer on the surface of the projection 1a is used as a contact point or the like. Since the roller 7 is made of the same material as the secondary molded body 2, other articles can be smoothly rolled thereon.
【００２６】[0026]
【発明の効果】本発明の合成樹脂複合成形品は、表面の
所定の部分に電気回路等として作用する金属層を有し、
金属層の形成される部分の材料には、無電解めっきの実
施に適するだけでなく、靱性の大きい合成樹脂が用いら
れているので、接点等での大きな外力に耐える。また、
金属層の形成を必要としない部分には、動摩擦係数の小
さい熱可塑性樹脂を用いているので、他の電気部品等と
の間で摺動や転動が円滑に行われ、摺動部品を搭載する
基板や物品搬送に適する。[Effects of the Invention] The synthetic resin composite molded product of the present invention has a metal layer on a predetermined portion of the surface, which acts as an electric circuit, etc.
The material of the part where the metal layer is formed is a synthetic resin that is not only suitable for electroless plating but also has high toughness, so it can withstand large external forces at contacts and the like. Also,
Thermoplastic resin with a low coefficient of dynamic friction is used in parts that do not require the formation of a metal layer, so sliding and rolling occur smoothly between other electrical parts, etc., and sliding parts can be mounted. Suitable for transporting substrates and goods.
【００２７】また、本発明の合成樹脂複合成形品の製造
方法によると、摺動部品を搭載する基板や物品搬送に適
し、かつ大きな外力を受ける部分に使用できる、表面に
金属層を有する合成樹脂複合成形品を製造することがで
きる。Further, according to the method of manufacturing a synthetic resin composite molded article of the present invention, a synthetic resin having a metal layer on the surface is suitable for substrates on which sliding parts are mounted and for transporting articles, and can be used for parts subject to large external forces. Composite molded products can be manufactured.
【図１】図１は、本発明による合成樹脂複合成形品の一
実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a synthetic resin composite molded product according to the present invention.
【図２】図２は、本発明による合成樹脂複合成形品の一
実施例を示す断面図である。FIG. 2 is a sectional view showing an embodiment of a synthetic resin composite molded product according to the present invention.
１ 一次成形体 １ａ 突起 ２ 二次成形体 ２ａ，２ｂ 二次成形体の表面 ３ 保護塗料層 ４ 貫通孔 ４ａ 貫通孔の内面 ５ 金属層 ６ 窓 ７ ローラ 1 Primary molded body 1a Protrusion 2 Secondary molded body 2a, 2b Surface of secondary molded body 3 Protective paint layer 4 Through hole 4a Inner surface of through hole 5 Metal layer 6. Window 7 Roller
Claims (6)
ぐれた第一の熱可塑性樹脂と、靱性が大きく、化学的に
粗面化容易な第二の熱可塑性樹脂と、表面の所定の部分
に前記第二の熱可塑性樹脂の化学的粗面化と無電解めっ
きにより形成された、前記第二の熱可塑性樹脂を被覆す
る金属層とから成ることを特徴とする、合成樹脂複合成
形品。Claim 1: A first thermoplastic resin that is difficult to chemically roughen and has excellent sliding properties; a second thermoplastic resin that has high toughness and is easy to chemically roughen; A synthetic resin composite comprising a metal layer covering the second thermoplastic resin, which is formed on a predetermined portion by chemical roughening of the second thermoplastic resin and electroless plating. Molding.
数が０．３５以下である、請求項１の合成樹脂複合成形
品。2. The synthetic resin composite molded article according to claim 1, wherein the first thermoplastic resin has a dynamic friction coefficient of 0.35 or less.
タール、ポリフェニレンスルフィド、ポリアミドから選
ばれる、請求項１の合成樹脂複合成形品。3. The synthetic resin composite molded article according to claim 1, wherein the first thermoplastic resin is selected from polyacetal, polyphenylene sulfide, and polyamide.
ン、ポリエーテルスルホン、ポリアリール（ａｒｙｌ）
スルホン、ポリアリレート、ポリカーボネート、ポリエ
ーテルイミド、ポリエーテルケトン、ポリエーテルエー
テルケトン、ポリエチレンテレフタレート、ポリブチレ
ンテレフタレートから選ばれる、請求項１の合成樹脂複
合成形品。4. The second thermoplastic resin is polysulfone, polyethersulfone, polyaryl (aryl).
The synthetic resin composite molded article according to claim 1, which is selected from sulfone, polyarylate, polycarbonate, polyetherimide, polyetherketone, polyetheretherketone, polyethylene terephthalate, and polybutylene terephthalate.
ぐれた第一の熱可塑性樹脂と、靱性が大きく、化学的に
粗面化容易な第二の熱可塑性樹脂とを、射出成形により
複合成形し、この複合成形品の表面に前記第二の熱可塑
性樹脂が露出した部分のうち、所定の部分を化学的に粗
面化し、無電解めっきを施すことから成る、合成樹脂複
合成形品の製造方法。5. A first thermoplastic resin that is difficult to chemically roughen and has excellent sliding properties, and a second thermoplastic resin that has high toughness and is easy to chemically roughen. A synthetic resin composite, which is formed by forming a composite by molding, chemically roughening a predetermined portion of the exposed portion of the second thermoplastic resin on the surface of the composite molded product, and subjecting it to electroless plating. Method of manufacturing molded products.
前記複合成形品の表面に前記第二の樹脂が露出した部分
のうち前記所定の部分以外を、化学的粗面化が困難な第
三の合成樹脂で被覆しておき、前記所定の部分のみを粗
面化して行う、請求項５の合成樹脂複合成形品の製造方
法。6. The chemical roughening of the predetermined portion includes:
Of the exposed portions of the second resin on the surface of the composite molded product, other than the predetermined portions are coated with a third synthetic resin that is difficult to chemically roughen, and only the predetermined portions are coated with a third synthetic resin that is difficult to chemically roughen. The method for producing a synthetic resin composite molded article according to claim 5, which is carried out by roughening the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13579491A JPH04334417A (en) | 1991-05-10 | 1991-05-10 | Synthetic resin composite molded product and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13579491A JPH04334417A (en) | 1991-05-10 | 1991-05-10 | Synthetic resin composite molded product and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04334417A true JPH04334417A (en) | 1992-11-20 |
Family
ID=15159985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13579491A Pending JPH04334417A (en) | 1991-05-10 | 1991-05-10 | Synthetic resin composite molded product and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04334417A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0849092A (en) * | 1994-05-20 | 1996-02-20 | Lacks Ind Inc | Method for selectively plating molding and molding produced thereby |
-
1991
- 1991-05-10 JP JP13579491A patent/JPH04334417A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0849092A (en) * | 1994-05-20 | 1996-02-20 | Lacks Ind Inc | Method for selectively plating molding and molding produced thereby |
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