JPH04315782A - Low-pitch heat seal connector and manufacture thereof - Google Patents
Low-pitch heat seal connector and manufacture thereofInfo
- Publication number
- JPH04315782A JPH04315782A JP10975691A JP10975691A JPH04315782A JP H04315782 A JPH04315782 A JP H04315782A JP 10975691 A JP10975691 A JP 10975691A JP 10975691 A JP10975691 A JP 10975691A JP H04315782 A JPH04315782 A JP H04315782A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- line
- particles
- pitch
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002245 particle Substances 0.000 claims abstract description 45
- 239000012790 adhesive layer Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- 238000007665 sagging Methods 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 229920001169 thermoplastic Polymers 0.000 abstract description 4
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract 1
- 239000011295 pitch Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000009736 wetting Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電気、電子部品相互の接
続に用いる低ピッチヒートシールコネクターとその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low-pitch heat seal connector used for interconnecting electrical and electronic components and a method for manufacturing the same.
【０００２】0002
【従来の技術】従来のヒートシールコネクターは絶縁性
基材上、通常は絶縁性可撓性基材上に導電パターンを印
刷、エッチング等の方法で形成した後、その上に異方導
電接着剤層を形成したものや、ヒートシール時に接続部
に形成した絶縁性接着剤層から露出して被接続回路基板
の接続端子電極との電気的導通を得るために、上記導電
パターン中に接続用導電性粒子を含んでいるものなどが
あった。しかし、近年電気・電子機器の小型化、精密化
に伴い配線ピッチが細密化し、接続ピッチも０．０５〜
０．４ｍｍピッチという低ピッチのものが要求されるよ
うになってきた。異方導電接着剤を用いたヒートシール
コネクターでは、導電ライン間に導電性粒子が存在する
と導電ライン間の絶縁を保つことが困難となり、その絶
縁不良の危険をさけるために導電性粒子を減らすと接続
抵抗が高くなるという問題があった。また導電ライン中
に被接続端子電極との導通を得るための接続用導電性粒
子を含むものでは、導電パターンをスクリーン印刷で形
成する際に、接続用導電性粒子によるスクリーンの目詰
りを生じ、これが導電パターンの断線の原因となるため
スクリーンの目開きを大きくしなければならず、その結
果として、低ピッチの印刷ではスクリーンを通過するペ
ーストの量が多くなり、スクリーンの設定線幅より印刷
された線幅の方が広くなる、いわゆる「ダレ」が生じ易
くリークが起こるため、とくに０．０５〜０．４ｍｍピ
ッチというような低ピッチのヒートシールコネクターの
製造では、収率が非常に悪かったりライン形成が全くで
きないという問題があった。[Prior Art] Conventional heat-seal connectors are made by forming a conductive pattern on an insulating base material, usually an insulating flexible base material, by printing, etching, etc., and then applying an anisotropic conductive adhesive on top of the conductive pattern. In order to obtain electrical continuity with the connection terminal electrode of the circuit board to be connected, a conductive conductor for connection is exposed from the insulating adhesive layer formed on the connection part during heat sealing and to obtain electrical continuity with the connection terminal electrode of the circuit board to be connected. There were some that contained sexual particles. However, in recent years, as electrical and electronic devices have become smaller and more precise, the wiring pitch has become finer, and the connection pitch has also increased from 0.05 to 0.05.
A pitch as low as 0.4 mm is now required. In heat seal connectors using anisotropic conductive adhesive, it is difficult to maintain insulation between conductive lines if there are conductive particles between them.To avoid the risk of poor insulation, it is necessary to reduce the amount of conductive particles. There was a problem that the connection resistance became high. In addition, when the conductive line contains conductive particles for connection to obtain electrical continuity with the terminal electrode to be connected, when forming a conductive pattern by screen printing, the conductive particles for connection cause clogging of the screen. This causes disconnection of the conductive pattern, so the opening of the screen must be made larger, and as a result, in low-pitch printing, the amount of paste passing through the screen increases, and the printed line width is larger than the set line width of the screen. Because the line width becomes wider, so-called "sag" tends to occur, which causes leakage, so the yield is very poor, especially when manufacturing low-pitch heat seal connectors such as 0.05 to 0.4 mm pitch. There was a problem that line formation was not possible at all.
【０００３】0003
【発明が解決しようとする課題】したがって、本発明の
目的は低ピッチでの絶縁不良や断線等の導通不良に対す
る信頼性が高く接続抵抗の低い、ヒートシールコネクタ
ーとその製造方法を提供するものである。[Problems to be Solved by the Invention] Therefore, an object of the present invention is to provide a heat seal connector and a method for manufacturing the same, which have high reliability and low connection resistance against poor conductivity such as poor insulation and disconnection at low pitches. be.
【０００４】0004
【課題を解決するための手段】本発明者は、スクリーン
印刷における低ピッチでの導電パターンの形成を困難に
していた、導電ペーストのダレやカスレ現象の原因が、
導電ペーストを基材に接触させた際の広がり易さ、いわ
ゆるヌレ性（親和性）にあると考えて研究を進めた結果
、導電ライン方向に良好なヌレ性を持ちダレによるリー
クを生じさせないようにするためには、導電ラインに直
角な方向でのヌレ性を悪くすれば、導電ペースト中に接
続用粒子を含むために目開きの大きなスクリーンで印刷
しなければならないような場合でも、低ピッチの配線パ
ターンが容易に形成できることを見出し、本発明に到達
した。[Means for Solving the Problems] The present inventor has discovered that the causes of sagging and fading of conductive paste, which made it difficult to form conductive patterns at a low pitch in screen printing, are as follows:
As a result of our research, we believed that the ease with which conductive paste spreads when it comes into contact with a base material, so-called wetting property (affinity), resulted in a paste that has good wetting properties in the direction of the conductive line and prevents leaks due to sagging. In order to achieve this, if the wetting property in the direction perpendicular to the conductive line is poor, it is possible to print with a low pitch even when printing with a large screen because the conductive paste contains connection particles. The inventors have discovered that the wiring pattern can be easily formed, and have arrived at the present invention.
【０００５】すなわち、その第１の発明は、絶縁性基材
の片面または両面に導電性ペーストにより形成された導
電パターンと、少くとも被接続回路基板との接続部に設
けられた絶縁性熱接着性接着剤層とからなるヒートシー
ルコネクターにおいて、前記基材面の導電パターンの導
電ラインに沿って微細な溝および／または突条を設ける
と共に、導電性ペースト中に粒径５〜１００μｍの導電
性粒子を０．１〜５０容量％含有させてなる低ピッチヒ
ートシールコネクターに係るものであり、また第２の発
明は絶縁性基材、とくには絶縁性可撓性基材（以下、絶
縁性可撓性基材を例にとって説明する）の片面または両
面の導電パターンを形成する場所に、あらかじめ導電パ
ターンの導電ラインに沿って微細な溝および／または突
条を設け、しかる後に粒径５〜１００μｍの導電性粒子
を０．１〜５０容量％含有する導電ペーストを用いてス
クリーン印刷により導電パターンを設け、次いで前記パ
ターン上の少くとも被接続回路基板との接続部に、絶縁
性熱接着性接着剤層を設けることを特徴とする低ピッチ
ヒートシールコネクターの製造方法に係るものである。That is, the first invention is a conductive pattern formed on one or both sides of an insulating base material using a conductive paste, and an insulating thermal adhesive provided at least at a connection portion with a circuit board to be connected. In a heat seal connector consisting of a conductive adhesive layer, fine grooves and/or protrusions are provided along the conductive lines of the conductive pattern on the base material surface, and conductive paste with a particle size of 5 to 100 μm is provided in the conductive paste. The second invention relates to a low-pitch heat seal connector containing 0.1 to 50% by volume of particles, and the second invention relates to an insulating base material, particularly an insulating flexible base material (hereinafter referred to as an insulating flexible base material). Fine grooves and/or protrusions are provided in advance along the conductive lines of the conductive pattern at the location where the conductive pattern is to be formed on one or both sides of a flexible base material (explained by taking a flexible base material as an example), and then fine grooves and/or protrusions are formed in advance along the conductive lines of the conductive pattern, and then fine grooves and/or protrusions with a particle size of 5 to 100 μm are formed. A conductive pattern is provided by screen printing using a conductive paste containing 0.1 to 50% by volume of conductive particles of The present invention relates to a method for manufacturing a low pitch heat seal connector characterized by providing a layer of adhesive.
【０００６】以下、本発明の詳細を例示した図面に基づ
いてさらに詳細に説明する。図１は本発明の低ピッチヒ
ートシールコネクター１の一実施態様を示すもので、（
ａ）図は平面図、（ｂ）図は（ａ）図のＩ−Ｉ矢視線に
沿う拡大部分縦断面図である。図中、２は導電ライン、
３は導電ライン２中に含有する導電性粒子である。
４は絶縁性可撓性基材、５はこの基材４上に設けられた
導電ライン２および導電性粒子３を被覆して設けられた
絶縁性熱接着性接着剤層、６および７は基材４面に導電
ライン２と配向して設けられた突条および溝であり、こ
れらは基材表面をワイヤーブラシ、サンドペーパー等を
用いて擦ることによって削り取られた部分を溝７とし、
生じたバリを突条６としたものである。なお、（ｂ）図
では絶縁性熱接着性接着剤層５が導電性粒子３を全面的
に被覆したものを示したが、導電性粒子３の一部を露出
するように設けてもよい。図２は基材面に形成される突
条６または溝７の異なる実施態様を拡大部分縦断面図で
示すもので（ａ）図は断面がほぼ矩形の突条６の実施態
様、（ｂ）図は断面がほぼ矩形の溝７の実施態様、（ｃ
）図および（ｄ）図は突条６と溝７とを組合せた場合の
それぞれ異なる実施態様である。図３は図１に示した本
発明の低ピッチヒートシールコネクター１を被接続回路
基板８の接続端子用電極９と接続したときの状態を示す
拡大部分縦断面図である。[0006] Hereinafter, the present invention will be explained in more detail based on the drawings which illustrate the details. FIG. 1 shows an embodiment of the low pitch heat seal connector 1 of the present invention.
Figure (a) is a plan view, and figure (b) is an enlarged partial vertical cross-sectional view taken along the line of arrow II in figure (a). In the figure, 2 is a conductive line,
3 is a conductive particle contained in the conductive line 2. 4 is an insulating flexible base material, 5 is an insulating thermal adhesive layer provided to cover the conductive line 2 and conductive particles 3 provided on this base material 4, and 6 and 7 are base materials. These are protrusions and grooves provided on the surface of the material 4 in alignment with the conductive lines 2, and these are grooves 7 that are scraped off by rubbing the surface of the base material with a wire brush, sandpaper, etc.
The generated burrs are used as protrusions 6. In addition, although the insulating heat-adhesive adhesive layer 5 completely covers the conductive particles 3 in the figure (b), it may be provided so that a part of the conductive particles 3 is exposed. FIG. 2 shows an enlarged partial longitudinal sectional view of different embodiments of the protrusion 6 or groove 7 formed on the base material surface, (a) shows an embodiment of the protrusion 6 having a substantially rectangular cross section, (b) The figure shows an embodiment of a groove 7 of approximately rectangular cross section, (c
) and (d) show different embodiments in which the protrusions 6 and grooves 7 are combined. FIG. 3 is an enlarged partial vertical sectional view showing a state in which the low pitch heat seal connector 1 of the present invention shown in FIG. 1 is connected to the connection terminal electrode 9 of the connected circuit board 8.
【０００７】本発明に用いられる絶縁性基材４としては
、この用途が主に液晶ディスプレイ（ＬＣＤ）とドライ
バーＩＣを搭載したプリント配線基板（以下ＰＣＢとす
る）あるいはＰＣＢ同士の信号伝達用であることから、
１０８ Ω・ｃｍ以上、とくには１０１０Ω・ｃｍ以上
の絶縁性を持つものであることが好ましい。また基材４
は剛性を持ったものでも可撓性のものでも公知のものを
使用することができるが、ヒートシール部分における温
度変化、湿度変化等による種々の応力や振動、落下等に
よる外力に耐えるために、基材は可撓性とすることが好
ましい。これらの条件を満す材料としては、ポリエチレ
ンテレフタレート（以下ＰＥＴとする）、ポリエチレン
ナフタレート、ポリブチレンテレフタレートなどのポリ
エステルフィルム、ポリイミドフィルム、フェノール紙
、ガラス−エポキシフィルム等が例示される。The insulating base material 4 used in the present invention is mainly used for printed wiring boards (hereinafter referred to as PCBs) equipped with a liquid crystal display (LCD) and a driver IC, or for signal transmission between PCBs. Therefore,
It is preferable that it has an insulation property of 10 8 Ω·cm or more, particularly 10 10 Ω·cm or more. Also, base material 4
Known rigid or flexible materials can be used, but in order to withstand various stresses caused by temperature changes, humidity changes, etc. in the heat-sealed part, vibrations, external forces such as drops, etc. Preferably, the base material is flexible. Examples of materials satisfying these conditions include polyester films such as polyethylene terephthalate (hereinafter referred to as PET), polyethylene naphthalate, and polybutylene terephthalate, polyimide films, phenol paper, and glass-epoxy films.
【０００８】この基材の表面に形成される突条６および
溝７の幅が導電パターンのピッチより大きいとリークを
防止できなくなるので、配線パターンのピッチ以下、と
くにはピッチの１／１０以下とすることが望ましい。ま
た隣り合う突条６、溝７の間隔は近ければ近いほどよい
が、上限は配線パターンのピッチ以下、とくにはピッチ
の１／１０以下であることが望ましい。突条６あるいは
溝７は導電ライン２に沿って連続していることが好まし
いが、連続していない場合でも導電ライン２と同一方向
に配向していればよく、その配向の角度の程度は導電ラ
イン２に対して±１０°以内、とくには５°以内とする
ことがよい。導電ペーストのヌレの制御に関しては突条
６あるいは溝７の側面の傾斜角度が重要であり、基材４
面に対して好ましくは３０°以上交差した面であればよ
く、垂直に近いほど好ましい。しかしながら溝７の深さ
が浅すぎたり突条６の高さが低すぎたりすると導電ペー
ストのヌレを十分に制御できないため、溝の深さ７ある
いは突条の高さ６は０．１μｍ以上、とくには１μｍ以
上とするのが好ましい。また溝７が深すぎると基材４の
強度が弱くなり、また突条６が高すぎると基材４の可撓
性に悪影響を及ぼすため、いずれも基材４の厚さの１／
２以下の深さまたは高さとすることが望ましい。If the width of the protrusions 6 and grooves 7 formed on the surface of this base material is larger than the pitch of the conductive pattern, it will not be possible to prevent leakage. It is desirable to do so. Further, the closer the distance between adjacent protrusions 6 and grooves 7, the better, but the upper limit is desirably less than or equal to the pitch of the wiring pattern, particularly less than or equal to 1/10 of the pitch. It is preferable that the protrusions 6 or grooves 7 are continuous along the conductive line 2, but even if they are not continuous, it is sufficient if they are oriented in the same direction as the conductive line 2, and the degree of the orientation angle is determined by the conductive line 2. It is preferable that the angle is within ±10° with respect to line 2, particularly within 5°. Regarding the control of wetting of the conductive paste, the angle of inclination of the side surfaces of the protrusions 6 or grooves 7 is important;
The plane preferably intersects the plane by 30 degrees or more, and the closer to perpendicular the plane, the more preferable it is. However, if the depth of the groove 7 is too shallow or the height of the protrusion 6 is too low, wetting of the conductive paste cannot be sufficiently controlled. In particular, it is preferable that the thickness be 1 μm or more. Also, if the grooves 7 are too deep, the strength of the base material 4 will be weakened, and if the protrusions 6 are too high, it will have a negative effect on the flexibility of the base material 4, so both of these will be 1/1/2 of the thickness of the base material 4.
It is desirable that the depth or height be 2 or less.
【０００９】突条６および溝７は後に形成される導電パ
ターンに沿って形成するのであるが、溝７の形成方法と
しては、レーザー光により導電パターンに沿って加工す
る方法、金型あるいはロールに形成した凸状パターンを
プレスすることにより基材４に転写し溝とする方法など
が例示される。突条６の形成方法としてはＵＶ硬化性イ
ンキを所定の厚みに基材４面に塗工した後、所望のパタ
ーンでＵＶ露光した後、未硬化部分を除去する方法が例
示される。またサンドペーパー、ワイヤーブラシ、針等
で一定方向にこする方法やサンドブラスト加工法によれ
ば、溝７の形成と同時にえぐりとられた部分がバリとし
て残り突条６として作用するため、導電ペーストのヌレ
の制御に良好な結果を与える。The protrusions 6 and the grooves 7 are formed along the conductive pattern that will be formed later, and the grooves 7 can be formed by processing along the conductive pattern using a laser beam, or by using a mold or roll. Examples include a method in which the formed convex pattern is transferred to the base material 4 by pressing to form grooves. An example of a method for forming the protrusions 6 is a method in which UV curable ink is applied to the four surfaces of the base material to a predetermined thickness, exposed to UV light in a desired pattern, and then uncured portions are removed. Furthermore, according to the method of rubbing in a certain direction with sandpaper, a wire brush, a needle, etc., or the sandblasting method, the portion that is gouged out at the same time as the groove 7 is formed remains as a burr and acts as the protrusion 6, so that the conductive paste Gives good results in controlling wetting.
【００１０】導電ペーストとしてはカーボン、金、銀、
銅、ニッケル等の従来公知の導電性付与粉末をポリエス
テル樹脂、ポリウレタン樹脂、エポキシ樹脂、アクリル
樹脂等のバインダーに４０〜９５重量％含有させて体積
抵抗率を１００ Ω・ｃｍ以下としたものに、接続用の
導電性粒子３を０．１〜５０容量％混入させたものが好
ましい。ここで用いられる導電性付与粉末は前記バイン
ダー中に浮遊して存在し、等方導電性を付与するもので
、ラインを形成した時に長手方向の導通に寄与するもの
であり、通常粒子径は０．０１〜１μｍ程度であり、形
状は鱗片状、繊維状あるいは不定形のものが用いられる
。
一方、基材に対する導電ペーストのヌレ性を決定する要
因として、導電ペーストの粘度、基材と導電ペーストの
Ｓ．Ｐ．値（溶解度パラメータ）の差、導電ペーストの
表面張力等が考えられるが、導電ペーストは導電性付与
粉末の含有量が多いため殆ど粘度に支配され、ヌレ性を
よくするには粘度を５０〜５００ポイズに調整するのが
よい。[0010] As the conductive paste, carbon, gold, silver,
A binder such as a polyester resin, a polyurethane resin, an epoxy resin, an acrylic resin, etc. contains 40 to 95% by weight of conventionally known conductivity-imparting powder such as copper or nickel to have a volume resistivity of 100 Ω cm or less, It is preferable to mix 0.1 to 50% by volume of conductive particles 3 for connection. The conductivity imparting powder used here exists suspended in the binder and imparts isotropic conductivity, contributing to conduction in the longitudinal direction when a line is formed, and usually has a particle size of 0. The particle size is about .01 to 1 μm, and the shape is scaly, fibrous, or amorphous. On the other hand, the factors that determine the wettability of the conductive paste to the base material include the viscosity of the conductive paste and the S.sub. P. Differences in solubility parameters (solubility parameters), surface tension of the conductive paste, etc. can be considered, but since the conductive paste contains a large amount of conductivity-imparting powder, it is mostly controlled by the viscosity. It is best to adjust it to poise.
【００１１】接続用の導電性粒子３には、カーボン粒子
、金、銀、銅、プラチナ、パラジウム、ニッケル、スズ
、半田等の金属粒子、表面をメッキ加工したプラスチッ
ク粒子等を用いることができ、これらは導電パターンの
ライン２中にあって、接続回路用基板８の接続端子電極
９と基材４上の導電パターンのライン２とを電気的に導
通させるためのものであるから、少なくとも一部が導電
ライン２から露出していることが望ましいので、粒径は
５μｍ以上、好ましくは導電ラインの厚み以上とするこ
とがよく、また、大きすぎると接着強度の低下を招くた
め１００μｍ以下、好ましくは５０μｍ以下とするのが
よい。粒子の形状には種々のものを用いることができる
が、導電ペーストによる保持力を強くするため粒子表面
に凹凸を持ったものとすることがよい。また同じく保持
力を強くするために、粒子表面をカップリング剤により
処理することも有効である。導電ペーストに対する粒子
の混入量は、少なすぎると接続点数が少なくなって導通
の安定性、信頼性が悪くなり、多すぎると導電ラインの
形成が困難となるため、０．１〜５０容量％とする必要
があり、とくには１〜２０容量％とするのが好ましい。
導電ライン２はスクリーン印刷によって形成されるが、
スクリーンメッシュの目開きは接続用の導電性粒子３の
目詰りを防ぐため、粒径以上、とくには粒径の１．５倍
以上とするのが好ましい。また、目開きが大き過ぎると
乳剤による低ピッチスクリーンの製版が困難となり易い
ので、目開きは１５０μｍ以下、とくには１００μｍ以
下とするのが好ましい。[0011] As the conductive particles 3 for connection, carbon particles, metal particles such as gold, silver, copper, platinum, palladium, nickel, tin, solder, etc., plastic particles whose surfaces are plated, etc. can be used. These are in the line 2 of the conductive pattern and are for electrically connecting the connection terminal electrode 9 of the connection circuit board 8 and the line 2 of the conductive pattern on the base material 4, so at least a part of them It is desirable that the particles be exposed from the conductive line 2, so the particle size should be at least 5 μm, preferably at least the thickness of the conductive line, and if it is too large, the adhesive strength will decrease, so the particle size is preferably at most 100 μm. The thickness is preferably 50 μm or less. Although various shapes of particles can be used, it is preferable to use particles with irregularities on their surfaces in order to strengthen the holding force of the conductive paste. Similarly, in order to strengthen the retention force, it is also effective to treat the particle surface with a coupling agent. The amount of particles mixed into the conductive paste should be 0.1 to 50% by volume, because if it is too small, the number of connection points will decrease and the stability and reliability of conduction will deteriorate, and if it is too large, it will be difficult to form a conductive line. In particular, it is preferably 1 to 20% by volume. The conductive line 2 is formed by screen printing,
In order to prevent clogging of the conductive particles 3 for connection, the mesh size of the screen mesh is preferably set to be larger than the particle size, particularly 1.5 times the particle size or more. Further, if the opening is too large, it is likely to be difficult to make a low pitch screen using emulsion, so the opening is preferably 150 μm or less, particularly 100 μm or less.
【００１２】接続部に設けられる絶縁性熱接着性接着剤
はヒートシール時に接続用導電粒子が露出する程度の流
動性を示すか、あるいは接続用導電粒子がヒートシール
前に露出するように形成される場合には、単に熱接着性
を示すものであればよく、熱可塑性、熱硬化性、あるい
はこれらのブレンド品の中から任意に選択される。熱可
塑性接着剤の具体例としてはポリアミド系、ポリエステ
ル系、アイオノマー系や、エチレン−酢酸ビニル共重合
体、エチレン−アクリル酸共重合体、エチレン−メタク
リル酸共重合体、エチレン−アクリル酸メチル共重合体
などのポリエチレン系共重合体、各種合成ゴム系のもの
、さらにはこれらの変性物、複合物があげられる。熱硬
化性接着剤としてはエポキシ樹脂系、ウレタン系、アク
リル系、シリコーン系、クロロプレン系、ニトリル系な
どの合成ゴム類、もしくはこれらの混合物が例示される
。これらには、いずれの場合も硬化剤、加硫剤、制御剤
、劣化防止剤、耐熱添加剤、熱伝導向上剤、粘着付与剤
、軟化剤、着色剤、金属不活性剤などが添加されてもよ
いが、信頼性向上の点から不純物イオンの含有量はなる
べく少ない方がよい。[0012] The insulating heat-adhesive adhesive provided at the connection part exhibits such fluidity that the conductive particles for connection are exposed during heat sealing, or is formed so that the conductive particles for connection are exposed before heat sealing. In the case where the material is used, it is sufficient that the material simply exhibits thermal adhesive properties, and is arbitrarily selected from thermoplastic, thermosetting, or a blend thereof. Specific examples of thermoplastic adhesives include polyamide, polyester, ionomer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, and ethylene-methyl acrylate copolymer. Examples include polyethylene copolymers such as polymers, various synthetic rubbers, and modified products and composites thereof. Examples of the thermosetting adhesive include synthetic rubbers such as epoxy resin, urethane, acrylic, silicone, chloroprene, and nitrile, or mixtures thereof. In each case, curing agents, vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, thermal conductivity improvers, tackifiers, softeners, colorants, metal deactivators, etc. are added. However, from the viewpoint of improving reliability, it is better to keep the content of impurity ions as low as possible.
【００１３】[0013]
【作用】本発明によれば、上記したように導電ペースト
のヌレ性をライン方向に良くしラインに直角な方向に悪
くすることによって、導電ペースト中に接続用粒子を含
むため目開きの大きなスクリーンで印刷しなければなら
ない場合でも、低ピッチで導電ラインのリーク、断線に
よる不良の少ないヒートシールコネクターを得ることが
できる。[Function] According to the present invention, as described above, by improving the wettability of the conductive paste in the line direction and making it worse in the direction perpendicular to the line, the conductive paste contains connection particles, so the screen has a large opening. Even if printing is required, it is possible to obtain a heat-sealed connector with a low pitch and less defects due to conductive line leaks and disconnections.
【００１４】[0014]
【実施例】以下、本発明の具体的態様を実施例および比
較例により説明する。
実施例
厚さ２５μｍのＰＥＴフィルムの片面に、その表面をス
テンレス製の針を配列させた治具でこすることにより、
深さ０．２〜２μｍの溝と高さ０．２〜２μｍの突条と
を、それぞれのピッチが約１０μｍとなるように形成し
た。他方、ウレタン系バインダー中に導電性付与粉末と
して銀とカーボンとを配合し乾燥時の体積抵抗率を１０
−４Ω・ｃｍとした導電性ペースト１００容量部に、粒
径２０〜３０μｍの金メッキを施したＮｉ粒子を１０容
量部加えて、粘度を１５０ポイズとした導電性ペースト
を調製した。次に、目開き６０μｍのステンレスメッシ
ュ上に乳剤によりラインピッチ０．２ｍｍ、ライン幅０
．１ｍｍとなるように作成したスクリーン版を用いて、
上記導電性ペーストにより上記ＰＥＴフィルム上に導電
ラインを印刷により形成した。このとき導電ラインの厚
みは接続用導電粒子を除いて１５μｍで、接続用導電粒
子はラインより露出した状態であった。この上の全面に
スチレン−エチレン−ブチレン−スチレンブロック共重
合体の熱可塑性接着剤層をスクリーン印刷により厚さ２
５μｍとなるように設けた。これを、ライン方向の長さ
４０ｍｍ、ライン本数２４０本となるようにサイジング
し、低ピッチヒートシールコネクターを得た。[Examples] Specific embodiments of the present invention will be explained below with reference to Examples and Comparative Examples. Example: By rubbing one side of a 25 μm thick PET film with a jig equipped with stainless steel needles,
Grooves with a depth of 0.2 to 2 μm and protrusions with a height of 0.2 to 2 μm were formed at a pitch of about 10 μm. On the other hand, silver and carbon are mixed as conductive powder into a urethane binder to increase the dry volume resistivity to 10.
A conductive paste having a viscosity of 150 poise was prepared by adding 10 parts by volume of gold-plated Ni particles having a particle size of 20 to 30 μm to 100 parts by volume of a conductive paste having a viscosity of -4 Ω·cm. Next, the line pitch was 0.2 mm and the line width was 0 using emulsion on a stainless steel mesh with an opening of 60 μm.
．． Using a screen plate made to be 1mm,
A conductive line was formed on the PET film by printing using the conductive paste. At this time, the thickness of the conductive line was 15 μm excluding the connecting conductive particles, and the connecting conductive particles were exposed from the line. A thermoplastic adhesive layer of styrene-ethylene-butylene-styrene block copolymer was screen printed on the entire surface to a thickness of 2.
The thickness was set to 5 μm. This was sized to have a length in the line direction of 40 mm and a number of lines of 240 to obtain a low pitch heat seal connector.
【００１５】比較例
実施例のＰＥＴ表面に溝および突条を設ける工程のみを
省き、同様のヒートシールコネクターを作成した。
評価：実施例および比較例のヒートシールコネクター各
々１００枚について、リーク検査、導通検査を行った。
実施例においてはリークしたものは皆無であり、導通不
良したものも皆無であったのに対し、比較例ではリーク
したものは９８枚であり、リークの無かった２枚につい
てさらに導通検査を行ったところ１枚に断線が認められ
た。Comparative Example A heat-sealed connector similar to that of Example was produced by omitting only the step of providing grooves and protrusions on the PET surface. Evaluation: A leak test and a continuity test were conducted on 100 heat-sealed connectors of Examples and Comparative Examples. In the example, there were no leaks and no conductivity failures, whereas in the comparative example, there were 98 sheets that leaked, and a further continuity test was conducted on the two sheets that had no leaks. However, a disconnection was found in one of the sheets.
【００１６】[0016]
【発明の効果】本発明によれば、低ピッチでリーク、導
通不良の心配の無いヒートシールコネクターを容易に得
ることができ、製品収率が上がるためコストも低減され
る。また従来スクリーン印刷によるライン形成は困難と
されていた、０．０５ｍｍピッチ、０．１ｍｍピッチ台
のライン形成も可能となるため、本発明の低ピッチヒー
トシールコネクターを用いれば、更に電子、電気機器の
小型化、精密化を図ることができる。[Effects of the Invention] According to the present invention, it is possible to easily obtain a heat-sealed connector with a low pitch and no fear of leakage or poor conduction, and the product yield is increased and costs are also reduced. In addition, it is now possible to form lines with a pitch of 0.05 mm or 0.1 mm, which was previously considered difficult to form by screen printing, so if the low pitch heat seal connector of the present invention is used, it will be possible to form lines with a pitch of 0.05 mm or 0.1 mm. can be made smaller and more precise.
【図１】本発明の低ピッチヒートシールコネクターの一
実施態様を示すもので、（ａ）図は平面図、（ｂ）図は
（ａ）図のＩ−Ｉ矢視線に沿う拡大部分縦断面図である
。FIG. 1 shows an embodiment of the low-pitch heat-seal connector of the present invention, in which (a) is a plan view, and (b) is an enlarged partial vertical cross-section taken along the line of arrow II in (a). It is a diagram.
【図２】本発明の低ピッチヒートシールコネクターで用
いられる絶縁性可撓性基材について、基材面に形成され
る溝または突条の異なる実施態様を拡大部分縦断面図で
示すもので（ａ）図は突条の一実施態様、（ｂ）図は溝
の一実施態様、（ｃ）図および（ｄ）図は突条と溝とを
組合せた場合のそれぞれ異なる実施態様である。FIG. 2 is an enlarged partial vertical sectional view showing different embodiments of grooves or protrusions formed on the surface of the insulating flexible base material used in the low pitch heat seal connector of the present invention. The figure a) shows one embodiment of a protrusion, the figure (b) shows an embodiment of a groove, and the figures (c) and (d) show different embodiments of a combination of a protrusion and a groove.
【図３】図１に示した本発明の低ピッチヒートシールコ
ネクターを被接続回路基板と接続したときの状態を示す
、拡大部分縦断面図である。FIG. 3 is an enlarged partial vertical sectional view showing a state in which the low pitch heat seal connector of the present invention shown in FIG. 1 is connected to a connected circuit board.
１…低ピッチヒートシールコネクター、 ２
…導電ライン、
３…導電性粒子、
４…絶縁性可撓性基材、
５…絶縁性熱接着性接着剤層、
６…突条、
７…溝、
８…被接続回路基板、
９…接続端子電極。1...Low pitch heat seal connector, 2
...conductive line, 3...conductive particles,
4... Insulating flexible base material, 5... Insulating thermal adhesive layer,
6...Protrusion, 7...Groove,
8...Connected circuit board, 9...Connection terminal electrode.
Claims (2)
ストにより形成された導電パターンと、少くとも被接続
回路基板との接続部に設けられた絶縁性熱接着性接着剤
層とからなるヒートシールコネクターにおいて、前記基
材面の導電パターンの導電ラインに沿って微細な溝およ
び／または突条を設けると共に、導電性ペースト中に粒
径５〜１００μｍの導電性粒子を０．１〜５０容量％含
有させてなる低ピッチヒートシールコネクター。Claim 1: A conductive pattern formed on one or both sides of an insulating base material using a conductive paste, and an insulating heat-adhesive adhesive layer provided at least at a connection portion with a circuit board to be connected. In the heat seal connector, fine grooves and/or protrusions are provided along the conductive lines of the conductive pattern on the base material surface, and 0.1 to 50 conductive particles with a particle size of 5 to 100 μm are added to the conductive paste. A low pitch heat seal connector containing % by volume.
ンを形成する場所に、あらかじめ導電パターンの導電ラ
インに沿って微細な溝および／または突条を設け、しか
る後に粒径５〜１００μｍの導電性粒子を０．１〜５０
容量％含有する導電ペーストを用いてスクリーン印刷に
より導電パターンを設け、次いで前記パターン上の少く
とも被接続回路基板との接続部に、絶縁性熱接着性接着
剤層を設けることを特徴とする低ピッチヒートシールコ
ネクターの製造方法。[Claim 2] Fine grooves and/or protrusions are provided in advance along the conductive lines of the conductive pattern at the location where the conductive pattern is to be formed on one or both sides of the insulating substrate, and then fine grooves and/or protrusions with a particle size of 5 to 100 μm are formed. 0.1 to 50 conductive particles
A conductive pattern is provided by screen printing using a conductive paste containing a volume of Manufacturing method of pitch heat seal connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3109756A JPH0736348B2 (en) | 1991-04-15 | 1991-04-15 | Low pitch heat seal connector and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3109756A JPH0736348B2 (en) | 1991-04-15 | 1991-04-15 | Low pitch heat seal connector and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04315782A true JPH04315782A (en) | 1992-11-06 |
| JPH0736348B2 JPH0736348B2 (en) | 1995-04-19 |
Family
ID=14518449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3109756A Expired - Fee Related JPH0736348B2 (en) | 1991-04-15 | 1991-04-15 | Low pitch heat seal connector and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0736348B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007155134A (en) * | 2005-12-05 | 2007-06-21 | Getrag Ford Transmissions Gmbh | Cone ring transmission having surface-optimized contact zone |
| JP2008153208A (en) * | 2007-11-19 | 2008-07-03 | Hitachi Chem Co Ltd | Connecting member, and electrode-connecting construction using the same |
| US8314339B2 (en) | 2008-07-10 | 2012-11-20 | Fujitsu Limited | Circuit board with kneaded conductive paste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110792A (en) * | 1986-10-29 | 1988-05-16 | 株式会社東芝 | Electronic parts joint structure |
-
1991
- 1991-04-15 JP JP3109756A patent/JPH0736348B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110792A (en) * | 1986-10-29 | 1988-05-16 | 株式会社東芝 | Electronic parts joint structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007155134A (en) * | 2005-12-05 | 2007-06-21 | Getrag Ford Transmissions Gmbh | Cone ring transmission having surface-optimized contact zone |
| JP2008153208A (en) * | 2007-11-19 | 2008-07-03 | Hitachi Chem Co Ltd | Connecting member, and electrode-connecting construction using the same |
| US8314339B2 (en) | 2008-07-10 | 2012-11-20 | Fujitsu Limited | Circuit board with kneaded conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0736348B2 (en) | 1995-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |