JPH0431100A - Manufacture of decorative member - Google Patents
Manufacture of decorative memberInfo
- Publication number
- JPH0431100A JPH0431100A JP13898390A JP13898390A JPH0431100A JP H0431100 A JPH0431100 A JP H0431100A JP 13898390 A JP13898390 A JP 13898390A JP 13898390 A JP13898390 A JP 13898390A JP H0431100 A JPH0431100 A JP H0431100A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- adhesive layer
- conductive substrate
- decorative member
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000007747 plating Methods 0.000 claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000010437 gem Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 239000010432 diamond Substances 0.000 claims abstract description 9
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 24
- 229910001751 gemstone Inorganic materials 0.000 claims description 11
- 239000010970 precious metal Substances 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 abstract description 10
- 206010040844 Skin exfoliation Diseases 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 3
- 230000001788 irregular Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910000923 precious metal alloy Inorganic materials 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Decoration By Transfer Pictures (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は装飾部材の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing a decorative member.
［従来の技術］
本発明に関する従来技術としては、金属工７チング技術
（槙書店、昭和４８．１０．３０発行）金属表面技術便
覧（金属表面技術協会、昭和５１−１１．５０発行）等
のエレクトロフォーミング法があり、この応用特許広報
としては特開昭５９−１６９８９．５９−１４０５８４
等に記載されているがこの構成内容を第２図に示す。[Prior Art] Conventional technologies related to the present invention include 7 Metalworking Techniques (Maki Shoten, published on October 30, 1972), Metal Surface Technology Handbook (Metal Surface Technology Association, published on November 51, 1978), etc. There is an electroforming method, and the patent publication for this application is JP-A-59-16989.59-140584.
The contents of this configuration are shown in FIG. 2.
第２図（ａ）においてアルミニューム、銅、黄銅、洋白
、鉄、ステンレス等の導電性基板１にフォトレジスト法
又は印刷法により任意のパターンで不導体皮膜であるレ
ジスト層２を形成し、導体部にクロメート処理等の剥離
皮膜を施して該直上に銅、ニッケル等の電鋳層８を形成
せしめるエレクトロフォーミング法であり、必要により
得られた電鋳層８上に金、クロム、黒クロム、スズー云
ツケル、ロジューム等の装飾メツキ層９を施した後、第
２図Ｃｂ）のように粘着力がある接着層−１６ａを有す
るベースフィルム５から成る転写テープに転写して完成
とするもの又は、転写テープを仮支持体として転写され
た電鋳層８の裏面に前記接着層−１，６αより接着力の
強い感圧接着剤等の接着層−２，６ｂを塗布して第２図
（Ｃ）のように目的とするネームプレート等の装飾効果
を有する商品７に再び転写接着して転写テープを除去し
て成る方法があった。In FIG. 2(a), a resist layer 2, which is a non-conductive film, is formed in an arbitrary pattern on a conductive substrate 1 made of aluminum, copper, brass, nickel silver, iron, stainless steel, etc. by a photoresist method or a printing method, This is an electroforming method in which a peeling film such as chromate treatment is applied to the conductor part and an electroformed layer 8 of copper, nickel, etc. is formed directly on the conductor part, and if necessary, gold, chromium, black chrome, etc. After applying a decorative plating layer 9 of , plating, rhodium, etc., it is completed by transferring it to a transfer tape consisting of a base film 5 having an adhesive layer 16a with adhesive strength as shown in Fig. 2Cb). Alternatively, an adhesive layer 2, 6b such as a pressure-sensitive adhesive having a stronger adhesive force than the adhesive layer 1, 6α is applied to the back surface of the transferred electroformed layer 8 using a transfer tape as a temporary support, as shown in FIG. As shown in (C), there is a method in which the product 7 having a decorative effect such as a name plate is transfer-adhered again and the transfer tape is removed.
［発明が解決しようとする課題］
しかし従来技術の装飾部材の製造方法の電鋳層の構成は
光沢剤を含むニッケル、銅等のメツキから形成されその
外観は光沢ある曲面仕上げのみが一般的であり、その商
品バリエイジョンは装飾メツキの色調を変える程度で陳
腐化し装飾部材としての高級化対応ができないという課
題を有していた。そこで、本発明はこのような課題を解
決するもので、その目的とするところ−は、キラツキ感
がありカラーバラエティに富んだ宝石分散粒子の高級感
のある凹凸模様の装飾部材の製造方法を提供することに
ある。[Problems to be Solved by the Invention] However, the structure of the electroformed layer in the conventional decorative member manufacturing method is formed from plating of nickel, copper, etc. containing a brightening agent, and its appearance generally only has a glossy curved surface finish. However, the problem was that the product variations were only limited to changing the color tone of the decorative plating, making it obsolete and unable to meet the needs of high-end decorative components. SUMMARY OF THE INVENTION The present invention is intended to solve these problems, and its purpose is to provide a method for manufacturing a decorative member with a luxurious uneven pattern made of gem-dispersed particles that has a sparkling appearance and is rich in color variety. It's about doing.
［課題を解決するための手段］
本発明の装飾部材の製造方法は、導電性基板に選択的に
レジスト層を形成して必要パターンの導電部に剥離処理
を施し貴金属又はその合金をマトリックスとするダイヤ
モンド等の宝石分散粒子を該マトリックス上部に突出す
るように複合メツキする工程と、前記導電性基板から複
合メツキを剥離し裏面に接着層を形成する工程と、次い
で接着層を介して商品に５転写したことを特徴とする。[Means for Solving the Problems] The method for manufacturing a decorative member of the present invention includes selectively forming a resist layer on a conductive substrate, performing a peeling process on the conductive portions of a necessary pattern, and using a noble metal or an alloy thereof as a matrix. A process of composite plating so that gemstone dispersion particles such as diamonds protrude above the matrix, a process of peeling the composite plating from the conductive substrate and forming an adhesive layer on the back surface, and then attaching the product to the product via the adhesive layer. It is characterized by being transcribed.
［実施例］
以下本発明について実施例にもとづき具体的に説明する
。[Examples] The present invention will be specifically described below based on Examples.
第１図は本発明の装飾部材の製造方法の工程断面図を示
す。FIG. 1 shows a process sectional view of the method for manufacturing a decorative member of the present invention.
第１図（ａ）は導電性基板に選択的にレジスト層を形成
し導電部に複合メツキされた工程断面図を示しており、
黄銅、洋白、ステンレス、アルミニウム等の導電性基板
１ （０，１２ｍｎ）に液状又はドライフィルムでフォ
トレジストを５〜２５μｍ形成してデザインに対応する
必要パターンを露光現像させたレジスト層２以外の導電
部にクロメート皮膜等の剥離処理を施して、シアンアル
カリ浴から成る金、銀、メツキ液、硫酸浴から成るロジ
ューム、プラチナメツキ液等の貴金属メツキ液及びクエ
ン酸浴から成る金−ニッケル、塩化物浴から成るパラジ
ー−ムーニッケル等の貴金属合金メツキ液に夕゛イヤモ
ノド（ダイヤモンド電着工具用：ダイヤモンド工業協会
規格よりＡＳ ）及びこれと同等品質のフルーサファイ
ヤ、ルビー、エメラルド等の宝石分散粒子４（粒度＃８
０〜＃４００）を添加し攪拌して貴金属又はその合金の
マトリックス５の上部に突出するように複合メツキする
。この場合の貴金属又はその合金マトリックス６の厚さ
は宝石分散粒子４が＃４００の場合約１０μｍ、＃２０
０の場合は約２０μｍは必要とし粒度が大きくなるほど
貴金属又はその合金マ）１ツクス６を厚く設定する必要
がある。FIG. 1(a) shows a cross-sectional view of a process in which a resist layer is selectively formed on a conductive substrate and composite plating is applied to a conductive part.
A conductive substrate 1 (0.12 mm) made of brass, nickel silver, stainless steel, aluminum, etc. is coated with a photoresist of 5 to 25 μm in thickness using a liquid or dry film, and a necessary pattern corresponding to the design is exposed and developed. Conductive parts are subjected to peeling treatment such as chromate film, gold plating solution made of cyan alkali bath, rhodium made of sulfuric acid bath, gold-nickel plating solution made of noble metal plating solution such as platinum plating solution, and gold-nickel, chloride made of citric acid bath. Diamond diamond (for diamond electrodeposition tools: AS from the Diamond Industry Association standard) and gemstone dispersion particles such as full sapphire, ruby, emerald, etc. of equivalent quality are added to a plating solution made of a precious metal alloy such as Paragym nickel. (Particle size #8
0 to #400) is added and stirred to perform composite plating so as to protrude from the top of the matrix 5 of noble metal or its alloy. In this case, the thickness of the noble metal or its alloy matrix 6 is about 10 μm when the gemstone dispersion particles 4 are #400, and about 10 μm when the gemstone dispersion particles 4 are #20.
In the case of 0, approximately 20 μm is required, and the larger the particle size, the thicker the noble metal or its alloy matrix 6 needs to be.
次に第１図（７５）のように接着層−１６αを有−を石
ベースフィルム５から戊る仮す枝体である転写テープに
導電性基板１から剥離転写し、転ずされた宝石公社粒子
４を有する貴金属又はその合金マトリックス５の裏面に
前記接着層−１，６ａより接着力の大きい感圧接着剤等
の接着層−２６ｂを形成させて最後に第１図（ｃ）のよ
うに時計、指輪、ネックレス、タイピン、カフス、メガ
ネ等の装飾効果のある商品７に再転写し転写テープを除
去して加圧して完成とする。Next, as shown in FIG. 1 (75), the adhesive layer -16α- is peeled off and transferred from the conductive substrate 1 to a transfer tape, which is a temporary branch formed from the stone base film 5, and transferred. An adhesive layer 26b made of a pressure-sensitive adhesive or the like having a stronger adhesive strength than the adhesive layers 1 and 6a is formed on the back surface of the noble metal or its alloy matrix 5 having particles 4, and finally, as shown in FIG. 1(c). The product is retransferred onto a decorative product 7 such as a watch, ring, necklace, tie pin, cufflinks, glasses, etc., the transfer tape is removed, and pressure is applied to complete the product.
本実施例によればキラツキ感がありカラーバラエティ−
に富んだ宝石分散粒子の凹凸模様の装飾部材を容易に形
成転写できる。According to this example, there is a feeling of sparkle and a variety of colors.
It is possible to easily form and transfer a decorative member with a concavo-convex pattern of gemstone-rich dispersed particles.
［発明の効果］
以上述べたように本発明によれば、導電性基板に選択的
にレジスト層を形成して必要パターンの導電部に剥離処
理を施し貴金属又はその合金をマトリックスとするダイ
ヤモンド等の宝石分散粒子を該マトリックス上部に突出
するように複合メツキする工程と、前記導電性基板から
複合メツキを剥離し裏面に接着層を影線する丁珂夫−ン
ケいで排着層を介して商品に転写したことを特徴とし次
のような効果を有する。[Effects of the Invention] As described above, according to the present invention, a resist layer is selectively formed on a conductive substrate, and the conductive parts of the required pattern are subjected to a peeling process, and a diamond or the like having a noble metal or its alloy as a matrix is formed. A process of composite plating so that the gemstone dispersion particles protrude above the matrix, and a process of peeling off the composite plating from the conductive substrate and placing an adhesive layer on the back side to form a product via a discharge layer. It is characterized by being transferred and has the following effects.
（１） デザインに対応した任意のパターンでキラツキ
感がありカラーバラエティに冨んだ凹凸宝石模様の装飾
部材を容易に形成、転写できる。(1) It is possible to easily form and transfer a decorative member with a concave-convex jewel pattern, which has a sparkling appearance and is rich in color variety, in any pattern corresponding to the design.
（２） 複合メツキによる構成であるため微細な宝石を
容易に固定できる。(2) Since it is composed of composite plating, minute gemstones can be easily fixed.
（３） 装飾品の高級化に対応できる。(3) It can respond to the increasing luxury of decorative items.
（４） 宝石分散粒子の種類や粒度を変えることにより
希望の装飾部材の外観かえられる。(4) By changing the type and particle size of the gem dispersion particles, the appearance of the desired decorative member can be changed.
このように本発明の実用的効果は極めて大きいAs described above, the practical effects of the present invention are extremely large.
第１図（−）〜（Ｃ）は本発明の装飾部材の製造方法を
示し、第１図（α）は複合メツキされた導電性基板の工
程断面図。
第１図Ｃｂ）は導電性基板から複合メツキを剥離し接着
層を形成した工程断面図。
第１図（Ｃ）は商品に装飾部材を転写した工程断（ａ）
〜（Ｃ）は従来技術の構成断面。
・・・・・・・・・導電性基板
・・・・・・・・・レジスト層
・・・・・・・−貴金属又はその合金マ） ＩＪソック
ス・・・・・・・・宝石分散粒子
・・・・・・・・・ベースフィルム
α・・・・・・接着層−１
ｂ−、・・・接着層−２
・・・−・−商 品
台・・・−・電鋳層
−・・・・−・装飾メツキ層
以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴木喜三部（他１名）第
図
第
図FIGS. 1(-) to (C) show a method for manufacturing a decorative member of the present invention, and FIG. 1(α) is a process sectional view of a composite plated conductive substrate. FIG. 1Cb) is a cross-sectional view of the process in which the composite plating is peeled off from the conductive substrate and an adhesive layer is formed. Figure 1 (C) is a process cut-out (a) of transferring the decorative members to the product.
~(C) is a cross section of the structure of the prior art.・・・・・・・・・Conductive substrate・・・・・・Resist layer・・・・Precious metal or alloy thereof) IJ socks・・・・・・・Gem dispersion particles ...Base film α...Adhesive layer-1 b-,...Adhesive layer-2 ...--Product stand...--Electroformed layer- ...Decorative plating layer and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki (and 1 other person) Fig.
Claims (1)
ンの導電部に剥離処理を施し貴金属又はその合金をマト
リックスとするダイヤモンド等の宝石分散粒子を該マト
リックス上部に突出するように複合メッキする工程と、
前記導電性基板から複合メッキを剥離し裏面に接着層を
形成する工程と、次いで接着層を介して商品に転写した
ことを特徴とする装飾部材の製造方法。A process in which a resist layer is selectively formed on a conductive substrate, a peeling process is performed on the conductive parts of the required pattern, and composite plating is performed so that gemstone particles such as diamond, which have a precious metal or its alloy as a matrix, protrude above the matrix. and,
A method for manufacturing a decorative member, comprising the steps of peeling off the composite plating from the conductive substrate and forming an adhesive layer on the back surface, and then transferring it to a product via the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898390A JPH0431100A (en) | 1990-05-29 | 1990-05-29 | Manufacture of decorative member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898390A JPH0431100A (en) | 1990-05-29 | 1990-05-29 | Manufacture of decorative member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0431100A true JPH0431100A (en) | 1992-02-03 |
Family
ID=15234737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13898390A Pending JPH0431100A (en) | 1990-05-29 | 1990-05-29 | Manufacture of decorative member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0431100A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1013476A1 (en) * | 1998-12-18 | 2000-06-28 | D. Swarovski & Co. | Device and method for applying elements of glass |
| WO2000058548A1 (en) * | 1999-03-29 | 2000-10-05 | D. Swarovski & Co. | Glass element |
| WO2008026017A1 (en) * | 2006-08-31 | 2008-03-06 | Ban Leo | Procedure for the production of conveyance jewelry, especially motorcar jewelry, and conveyance, especially motorcar jewelry |
| JP2019084344A (en) * | 2017-11-07 | 2019-06-06 | ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド | Method for crimping stone |
-
1990
- 1990-05-29 JP JP13898390A patent/JPH0431100A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1013476A1 (en) * | 1998-12-18 | 2000-06-28 | D. Swarovski & Co. | Device and method for applying elements of glass |
| WO2000058548A1 (en) * | 1999-03-29 | 2000-10-05 | D. Swarovski & Co. | Glass element |
| WO2008026017A1 (en) * | 2006-08-31 | 2008-03-06 | Ban Leo | Procedure for the production of conveyance jewelry, especially motorcar jewelry, and conveyance, especially motorcar jewelry |
| JP2019084344A (en) * | 2017-11-07 | 2019-06-06 | ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド | Method for crimping stone |
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