JPH04309294A - Cooling structure for electronic component - Google Patents
Cooling structure for electronic componentInfo
- Publication number
- JPH04309294A JPH04309294A JP9173494A JP7349491A JPH04309294A JP H04309294 A JPH04309294 A JP H04309294A JP 9173494 A JP9173494 A JP 9173494A JP 7349491 A JP7349491 A JP 7349491A JP H04309294 A JPH04309294 A JP H04309294A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- duct
- electronic component
- temperature
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 13
- 239000003507 refrigerant Substances 0.000 claims abstract description 36
- 239000000919 ceramic Substances 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 description 16
- 239000002826 coolant Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子装置等に使用され
る電子部品を冷却する冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for cooling electronic components used in electronic devices and the like.
【０００２】0002
【従来の技術】従来、電子装置等に使用される電子部品
が搭載されたプリント基板を強制対流冷却により冷却す
る場合は、ヒートシンクをプリント基板に搭載される発
熱量の大きい電子部品の上面部分に半田或いは熱伝導の
良好な接着剤等により固着し、電子部品より発する熱を
半田あるいは接着剤を経てヒートシンクに伝導し、ヒー
トシンクの放熱フィンより強制対流によりプリント基板
上に導かれている冷媒に伝達していた。[Prior Art] Conventionally, when using forced convection cooling to cool a printed circuit board on which electronic components used in electronic devices are mounted, a heat sink is placed on the upper surface of the electronic component mounted on the printed circuit board, which generates a large amount of heat. It is fixed with solder or adhesive with good thermal conductivity, and the heat generated by the electronic component is conducted to the heat sink through the solder or adhesive, and then transferred to the coolant guided on the printed circuit board by forced convection through the heat sink's radiation fins. Was.
【０００３】図３は従来の電子部品の冷却構造の断面図
であり、ヒートシンク５ｄを集積回路素子２ｄを有する
セラミック基板１ｄに固着し、プリント基板４ｂに搭載
し、ファン等で冷媒９ｄを対流させ冷却していた。ヒー
トシンク５ｄは、複数の直立した平板を備えたもので、
電子部品である集積回路素子２ｄのケースの一部である
セラミック基板１ｄの表面にヒートシンク５ｄを接着剤
１０にて固着した一体構造とし、集積回路素子２ｄの発
するジャンクション熱を対流している冷媒９ｄに伝達し
ていた。FIG. 3 is a cross-sectional view of a conventional electronic component cooling structure, in which a heat sink 5d is fixed to a ceramic substrate 1d having an integrated circuit element 2d, mounted on a printed circuit board 4b, and a coolant 9d is caused to circulate using a fan or the like. It was cooling down. The heat sink 5d is equipped with a plurality of upright flat plates,
A coolant 9d has an integrated structure in which a heat sink 5d is fixed with an adhesive 10 to the surface of a ceramic substrate 1d, which is a part of the case of an integrated circuit element 2d, which is an electronic component, and convects junction heat generated by the integrated circuit element 2d. It was being communicated to.
【０００４】0004
【発明が解決しようとする課題】上記した従来の電子部
品の冷却構造において、プリント基板上には、ＩＣ等の
多数の多品種他形状の電子部品が搭載されているが、電
子部品の形状、搭載位置等によってプリント基板上に供
給される冷媒の流れは大きく乱れ、プリント基板上に実
装された各電子部品に均一な冷媒を供給することが困難
であった。通常は、最も冷媒の供給が困難な電子部品が
必要な冷媒を得ることができる様にプリント基板上に冷
媒を供給しているので他の電子部品には必要以上の冷媒
が供給されている。この為により多くの不必要な冷媒を
供給しなくてはならない。[Problems to be Solved by the Invention] In the conventional electronic component cooling structure described above, a large number of electronic components of various types and shapes, such as ICs, are mounted on the printed circuit board. The flow of the coolant supplied onto the printed circuit board is greatly disturbed depending on the mounting position and the like, making it difficult to uniformly supply the coolant to each electronic component mounted on the printed circuit board. Normally, refrigerant is supplied onto the printed circuit board so that the electronic components to which it is most difficult to receive refrigerant can obtain the necessary refrigerant, so other electronic components are supplied with more refrigerant than necessary. For this reason, more unnecessary refrigerant must be supplied.
【０００５】また、近年の電子部品の高集積化とともに
電子部品の発熱量も年々大きくなっており、冷却能力の
確保の為に、電子部品の冷却に使用されるヒートシンク
のサイズの大型化に依る電子部品からの冷媒への熱伝達
量の増加、あるいは、冷媒量自体の増量等があるが、ヒ
ートシンクの大型化の為には、例えばプリント基板の搭
載ピッチが大きくなってしまう。といっても電子部品を
プリント基板に固着する際の固着条件で、ヒートシンク
の大きさが制限される事もある。冷媒量の増量の為には
、冷却ファンなどの騒音の問題があり、小型化、高密度
実装化、低騒音化等の要求に答えられない等の問題点が
あった。[0005] In addition, as electronic components have become more highly integrated in recent years, the amount of heat generated by electronic components has been increasing year by year. There is an increase in the amount of heat transferred from electronic components to the refrigerant, or an increase in the amount of refrigerant itself, but in order to increase the size of the heat sink, for example, the mounting pitch of printed circuit boards becomes larger. However, the size of the heat sink may be limited by the fixing conditions when attaching electronic components to the printed circuit board. In order to increase the amount of refrigerant, there is a problem of noise from cooling fans, etc., and there are problems such as not being able to meet the demands for miniaturization, high density packaging, low noise, etc.
【０００６】[0006]
【課題を解決するための手段】本発明の電子部品の冷却
構造は、プリント基板上に搭載された電子部品に冷媒を
流通させるダクトを被せ、このダクトは上面に外部から
冷媒を取入れるルーバーを有する。[Means for Solving the Problems] The electronic component cooling structure of the present invention covers the electronic components mounted on a printed circuit board with a duct for circulating a refrigerant, and this duct has a louver on the top surface for introducing the refrigerant from the outside. have
【０００７】[0007]
【実施例】次に、本発明の実施例について、図１，図２
を参照して説明する。[Example] Next, regarding an example of the present invention, FIGS.
Explain with reference to.
【０００８】１ａ，１ｂ，１ｃはセラミック基板であり
、集積回路素子２ａ，２ｂ，２ｃが搭載されておりキャ
ップ３が取付けられ密閉されている。セラミック基板１
ａ，１ｂ，１ｃはプリント基板４に一列に半田付けされ
れており、セラミック基板１ａ，１ｂ，１ｃそれぞれに
は、断面形状がコの字型のダクト６が被せてある。ダク
ト６は、セラミック基板１ａ，１ｂ，１ｃが有するヒー
トシンク５ａ，５ｂ，５ｃにダクト６を有するクリップ
７ａ，７ｂ，７ｃにて保持されている。また、ダクト６
の上面には冷媒をダクト６内に取入れるルーバー８を有
している。Ceramic substrates 1a, 1b, and 1c are mounted with integrated circuit elements 2a, 2b, and 2c, and are sealed with a cap 3 attached thereto. Ceramic substrate 1
a, 1b, and 1c are soldered to a printed circuit board 4 in a line, and a duct 6 having a U-shaped cross section is placed over each of the ceramic substrates 1a, 1b, and 1c. The duct 6 is held by clips 7a, 7b, 7c having the duct 6 on heat sinks 5a, 5b, 5c of the ceramic substrates 1a, 1b, 1c. Also, duct 6
A louver 8 is provided on the upper surface of the duct 6 to introduce the refrigerant into the duct 6.
【０００９】次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
【００１０】まず、セラミック基板１ａに搭載されてい
る集積回路素子２ａより発したジャンクション熱はセラ
ミック基板１ａを伝導しヒートシンク５ａに伝わり、ヒ
ートシンク５ａの周囲を対流している冷媒９ｂに伝達さ
れる。ヒートシンク５ａの周囲を通過し、温度が上昇し
た冷媒９ｂはセラミック基板１ｂを通過する前にルーバ
ー８よりダクト内に取入れられた然る程上昇していない
冷媒９ａと混合され、温度が均一化され、冷媒９ｂより
も温度が下がった冷媒９ｃがセラミック基板１ｂ，ヒー
トシンク５ｂを通過する事になる。First, the junction heat generated by the integrated circuit element 2a mounted on the ceramic substrate 1a is conducted through the ceramic substrate 1a, transmitted to the heat sink 5a, and then transmitted to the coolant 9b that is convecting around the heat sink 5a. The refrigerant 9b, which has passed around the heat sink 5a and whose temperature has increased, is mixed with the refrigerant 9a whose temperature has not risen to a certain extent and which is introduced into the duct through the louver 8 before passing through the ceramic substrate 1b, and the temperature is made uniform. , the refrigerant 9c whose temperature is lower than that of the refrigerant 9b passes through the ceramic substrate 1b and the heat sink 5b.
【００１１】また通常は、冷媒９ｂのセラミック基板１
ａおよびヒートシンク５ａの通過、および冷媒９ａと９
ｂの混合によって、冷媒９ｃの対流は大きく乱れるが、
ダクト６によって冷媒９ｃは整流され、流速が速まる事
でセラミック基板１ｂ内の集積回路素子２ｂのジャンク
ション温度を低く押さえる事が出来る。セラミック基板
１ｂとセラミック基板１ｃの間にも同様の作用がおこり
、セラミック基板１ｃ内の集積回路素子２ｃのジャンク
ション温度も低くなる。[0011] Also, normally, the ceramic substrate 1 of the refrigerant 9b
a and the passage of the heat sink 5a, and the refrigerant 9a and 9
Although the convection of the refrigerant 9c is greatly disturbed by the mixing of b,
The coolant 9c is rectified by the duct 6, and the flow speed is increased, so that the junction temperature of the integrated circuit element 2b in the ceramic substrate 1b can be kept low. A similar effect occurs between the ceramic substrate 1b and the ceramic substrate 1c, and the junction temperature of the integrated circuit element 2c within the ceramic substrate 1c also decreases.
【００１２】0012
【発明の効果】以上説明したとおり、本発明の電子部品
の冷却構造は、プリント基板上に搭載された複数の電子
部品に、上面にルーバーを有するダクトを被せることで
電子部品を通過する際の冷媒流の乱れを整流し、流速を
高め冷却効率を向上させることができ、またルーバーよ
り温度上昇の少ない冷媒をダクト内に取込み、ダクト内
の電子部品を通過して温度が上昇した冷媒と混合し、ダ
クト内の冷媒の温度を下げることができるので、従来よ
りも少ない冷媒量で電子部品の冷却が可能となる。[Effects of the Invention] As explained above, the electronic component cooling structure of the present invention covers a plurality of electronic components mounted on a printed circuit board with a duct having a louver on the top surface. It can rectify turbulence in the refrigerant flow, increase the flow velocity, and improve cooling efficiency.It also takes refrigerant with a lower temperature rise into the duct than the louver, and mixes it with the refrigerant whose temperature has increased after passing through the electronic components in the duct. However, since the temperature of the refrigerant in the duct can be lowered, electronic components can be cooled with a smaller amount of refrigerant than in the past.
【００１３】この為に、発熱量の大きい電子部品の採用
、プリント基板の高密度実装化、電子装置の小型化、低
雑音化などの効果がある。[0013] Therefore, there are effects such as adoption of electronic components that generate a large amount of heat, higher density mounting of printed circuit boards, miniaturization of electronic devices, and lower noise.
【図１】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the invention.
【図２】図１に示す実施例の断面図である。FIG. 2 is a cross-sectional view of the embodiment shown in FIG. 1;
【図３】従来の電子部品の冷却構造の断面図である。FIG. 3 is a cross-sectional view of a conventional electronic component cooling structure.
１ａ，１ｂ，１ｃ，１ｄ セラミック基板２ａ，
２ｂ，２ｃ，２ｄ 集積回路素子３ キャ
ップ
４ａ，４ｂ プリント基板
５ａ，５ｂ，５ｃ，５ｄ ヒートシンク６
ダクト
７ａ，７ｂ，７ｃ クリップ
８ ルーバー
９ａ，９ｂ，９ｃ，９ｄ 冷媒
１０ 接着剤1a, 1b, 1c, 1d ceramic substrate 2a,
2b, 2c, 2d Integrated circuit element 3 Cap 4a, 4b Printed circuit board 5a, 5b, 5c, 5d Heat sink 6
Duct 7a, 7b, 7c Clip 8 Louver 9a, 9b, 9c, 9d Refrigerant 10 Adhesive
Claims (1)
に冷媒を流通させるダクトを被せ、このダクトは上面に
外部から冷媒を取入れるルーバーを有することを特徴と
する電子部品の冷却構造。1. A cooling structure for electronic components, characterized in that an electronic component mounted on a printed circuit board is covered with a duct for circulating a refrigerant, and the duct has a louver on the upper surface for introducing the refrigerant from the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073494A JP2913879B2 (en) | 1991-04-08 | 1991-04-08 | Electronic component cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3073494A JP2913879B2 (en) | 1991-04-08 | 1991-04-08 | Electronic component cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04309294A true JPH04309294A (en) | 1992-10-30 |
| JP2913879B2 JP2913879B2 (en) | 1999-06-28 |
Family
ID=13519873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3073494A Expired - Lifetime JP2913879B2 (en) | 1991-04-08 | 1991-04-08 | Electronic component cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2913879B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025255A1 (en) * | 1992-09-28 | 1995-09-21 | Aavid Engineering, Inc. | Apparatus and method for cooling heat generating electronic components in a cabinet |
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| US7684190B2 (en) | 2003-01-17 | 2010-03-23 | Fujitsu Limited | Heat sink with non-uniform fins and transverse protrusion |
| JP2016178285A (en) * | 2016-02-09 | 2016-10-06 | 日本電気株式会社 | Cooling structure and device |
| US20160313072A1 (en) * | 2015-04-27 | 2016-10-27 | Fanuc Corporation | Heat sink for cooling plurality of heat generating components |
| CN106793668A (en) * | 2015-11-19 | 2017-05-31 | 华为技术有限公司 | A kind of radiator and communication equipment |
| WO2023243137A1 (en) * | 2022-06-14 | 2023-12-21 | 三菱重工業株式会社 | Electric switchboard |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005015971A1 (en) * | 2003-08-08 | 2006-10-12 | 富士通株式会社 | Heat dissipation structure of electronic equipment |
-
1991
- 1991-04-08 JP JP3073494A patent/JP2913879B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025255A1 (en) * | 1992-09-28 | 1995-09-21 | Aavid Engineering, Inc. | Apparatus and method for cooling heat generating electronic components in a cabinet |
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| US7684190B2 (en) | 2003-01-17 | 2010-03-23 | Fujitsu Limited | Heat sink with non-uniform fins and transverse protrusion |
| US20160313072A1 (en) * | 2015-04-27 | 2016-10-27 | Fanuc Corporation | Heat sink for cooling plurality of heat generating components |
| JP2016207928A (en) * | 2015-04-27 | 2016-12-08 | ファナック株式会社 | Heat sink for cooling multiple heating components |
| CN106793668A (en) * | 2015-11-19 | 2017-05-31 | 华为技术有限公司 | A kind of radiator and communication equipment |
| CN106793668B (en) * | 2015-11-19 | 2019-06-11 | 华为技术有限公司 | A kind of radiator and communication equipment |
| JP2016178285A (en) * | 2016-02-09 | 2016-10-06 | 日本電気株式会社 | Cooling structure and device |
| WO2023243137A1 (en) * | 2022-06-14 | 2023-12-21 | 三菱重工業株式会社 | Electric switchboard |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2913879B2 (en) | 1999-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990316 |