JPH0430493A - Wiring method of board - Google Patents
Wiring method of boardInfo
- Publication number
- JPH0430493A JPH0430493A JP13601290A JP13601290A JPH0430493A JP H0430493 A JPH0430493 A JP H0430493A JP 13601290 A JP13601290 A JP 13601290A JP 13601290 A JP13601290 A JP 13601290A JP H0430493 A JPH0430493 A JP H0430493A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring
- board
- soldered
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 238000005476 soldering Methods 0.000 abstract description 7
- 230000005496 eutectics Effects 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract 4
- 239000007787 solid Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、基板配線方法に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a substrate wiring method.
さらに詳しくは、この発明は、高密度配線を可能とする
新しい基板配線方法に関するものである。More specifically, the present invention relates to a new substrate wiring method that enables high-density wiring.
（従来の技術とその課題）
近来、デジタルＩＣ実装用基板においてはその実装密度
がますます高くなる傾向にあり、これに対応して配線密
度の増大への対策が真剣に検討されてきている。(Prior art and its problems) In recent years, there has been a tendency for the mounting density of digital IC mounting boards to become higher and higher, and in response to this trend, serious consideration has been given to countermeasures for increasing wiring density.
このような対策のひとつとして多層配線基板が開発され
実用化されてきてもいる。As one such measure, multilayer wiring boards have been developed and put into practical use.
しかしながら、この多層配線基板の場合にはどうしても
コスト上昇が避けられず、配線密度の増大にはおのずと
限界がある。However, in the case of this multilayer wiring board, an increase in cost is unavoidable, and there is a limit to the increase in wiring density.
一方、多層配線基板以外の対応としては、配線そのもの
の太さ（幅）を小さ（して実装配線の密度を増大する方
法が考えられるが、これまでのＡｇベースやハンダペー
ストのスクリーン印刷法、さらにはリソグラフィー法で
は現状以上の細線化は困難であって、新しい手法の開発
がどうしても必要になっている。On the other hand, as a solution to problems other than multilayer wiring boards, it is possible to reduce the thickness (width) of the wiring itself and increase the density of the mounted wiring, but this method is not suitable for conventional Ag-based or solder paste screen printing methods, Furthermore, it is difficult to make the lines thinner than the current level using lithography methods, and there is an urgent need to develop new methods.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来の配線方法の欠点を解消し、実装用基板の高
密度配線を、簡便に、低コストで実現することのできる
新しい基板配線方法を提供することを目的としている。This invention was made in view of the above circumstances, and provides a new board that eliminates the drawbacks of conventional wiring methods and allows high-density wiring of mounting boards to be easily realized at low cost. The purpose is to provide a wiring method.
（課題を解決するための手段）
この発明は、上記の課題を解決するものとして、繊維状
ハンダを基板上に付着させることを特徴とする基板配線
方法を提供する。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a board wiring method characterized by attaching fibrous solder onto a board.
すなわち、この発明は、配線、特に極細線配線とハンダ
付けを機能的に行うハンダ極細線による配線方法を提供
するものであり、配線すべき基板に、極細径ハンダ線、
たとえば２０μｍ等５０μｍ以下の径のハンダ線を付着
させて配線することを特徴としている。That is, the present invention provides a wiring method using ultra-fine solder wire that functionally performs wiring, particularly ultra-fine wire wiring and soldering.
For example, it is characterized by wiring by attaching a solder wire having a diameter of 50 μm or less, such as 20 μm.
この配線方法においては、その付着のために、基板表面
に弱粘着性を持たせ、これによって繊維状のハンダを付
着させるなどの手段を採用する。In this wiring method, in order to attach the solder, a method is adopted in which the surface of the substrate is made to have a weak adhesive property and fibrous solder is thereby attached thereto.
この場合、繊維状ハンダとしては凝固状態、溶融状態の
いずれにあってもよく、溶融状態の場合にはそれ自体と
して基板上に付着させることもできる。In this case, the fibrous solder may be in either a solidified state or a molten state, and if it is in a molten state, it can be attached to the substrate as such.
また、ハンダ付けすべき部位には必要量のハンダ線を吹
付は等により付着させ、配線完了後に、ハンダ付けすべ
き部位を加熱溶融して／’ｔンダ付けを行うことができ
る。この場合の加熱溶融には赤外線スポット等を用いて
加熱することができる。Further, the necessary amount of solder wire is attached to the part to be soldered by spraying or the like, and after wiring is completed, the part to be soldered can be heated and melted to carry out soldering. In this case, heating and melting can be performed using an infrared spot or the like.
このハンダ付は終了後には、基板表面に使用した粘着材
同化材や絶線材を塗布することとする。After this soldering is completed, the adhesive assimilation material and wire insulation material used will be applied to the surface of the board.
なお、ハンダ付は時に配線用ハンダの断線は心配ないが
、配線にペーストやフラックスが付着すると断線しやす
くなるので、この点については留意することが必要とな
る。Note that when soldering, there is no need to worry about breaking the solder for wiring, but if paste or flux adheres to the wiring, it will be more likely to break, so it is necessary to be careful about this point.
極細線ハンダは、この発明の発明者によって確立された
ノズル噴出法によって製造することができる。この方法
は、極細径ノズルより溶融ノ１ンダを大気等のガス中に
噴出させてフィラメントとする方法であって、２０μｍ
、もしくはそれより小さ（、または大きな極細径フィラ
メントとしての繊維状ハンダの生成を可能とする。The ultrafine wire solder can be manufactured by the nozzle jetting method established by the inventor of this invention. This method is a method of ejecting molten powder into gas such as the atmosphere from an extremely small diameter nozzle to form a filament with a diameter of 20 μm.
, or smaller (or larger), making it possible to produce fibrous solder as ultrafine diameter filaments.
この時の噴出は、溶融ハンダを入れたシリンダーへのピ
ストンによる加圧、あるいはガス加圧によって行うこと
ができる。The ejection at this time can be performed by pressurizing a cylinder containing molten solder with a piston or by pressurizing a gas.
得られた繊維状ハンダはそのままこの発明において配線
に使用することができる。The obtained fibrous solder can be used as it is for wiring in the present invention.
以下、実施例を示し、さらに詳しくこの発明の方法につ
いて説明する。EXAMPLES Hereinafter, the method of the present invention will be explained in more detail by way of examples.
（実施例）
実施例 １
溶融共晶ハンダをシリンダー内に入れ、４ ｋｇ ｆ／
ｃｎｒの圧内で０．０２ｍｍ径のノズル孔より噴出さ
せて直径０．０２ ｍｍ （２０μｍ）の共晶ハンダワ
イヤを生成させた。(Example) Example 1 Melted eutectic solder was put into a cylinder and 4 kg f/
A eutectic solder wire with a diameter of 0.02 mm (20 μm) was produced by ejecting from a nozzle hole with a diameter of 0.02 mm within a pressure of cnr.
この共晶ハンダワイヤを、基板表面の直線部および半径
２ｍｍの折線において配線し、４本／印の配線密度を実
現した。This eutectic solder wire was wired on the straight portion of the substrate surface and on a broken line with a radius of 2 mm to achieve a wiring density of 4 wires/mark.
実施例 ２
５本／８でノズル孔を配置したノズルより溶融ハンダを
実施例１と同様にして噴出させ、得られた２０μｍ径の
ハンダ細線を基板上に直線状に配線した。Example 2 Molten solder was ejected from a nozzle having 5/8 nozzle holes in the same manner as in Example 1, and the obtained thin solder wire with a diameter of 20 μm was wired in a straight line on a substrate.
隣接する配線間での絶線は充分に確保することができた
。Sufficient disconnection between adjacent wires could be ensured.
実ｌ−１
第１図に示した通り、実施例２と同様にして５本／ｍｍ
の配線（１）を行い、その端部を、赤外線スポットを用
いて加熱溶融してハンダ付け（２）を行った。Actual l-1 As shown in Fig. 1, 5 pieces/mm were prepared in the same manner as in Example 2.
Wiring (1) was performed, and the ends were heated and melted using an infrared spot to perform soldering (2).
ハンダ付けは良好で、かつ、配線の加熱による断線もな
かった。The soldering was good, and there were no wire breaks due to heating.
（発明の効果）
この発明により、以上詳しく説明した通り、簡便に、か
つ、精度よ（高密度配線が実現される。(Effects of the Invention) According to the present invention, as explained in detail above, high-density wiring can be realized simply and with high precision.
これまでの細線化方法の限界を克服した新しい方法とし
て今後の高密度配線化の傾向に対応可能となる。As a new method that overcomes the limitations of conventional wire thinning methods, it will be able to respond to future trends in high-density wiring.
【図面の簡単な説明】
第１図はこの発明の方法による配線の一例を示した拡大
平面図である。
■・・・配線
２・・・ハンダ付はBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an enlarged plan view showing an example of wiring according to the method of the present invention. ■...Wiring 2...Soldered
Claims (4)
する基板配線方法。(1) A board wiring method characterized by attaching fibrous solder onto a board.
記載の基板配線方法。(2) Claim (1) in which the necessary parts are heated and melted after attachment.
The board wiring method described.
求項（１）記載の基板配線方法。(3) The board wiring method according to claim (1), wherein the fibrous solder has an extremely small diameter of 50 μm or less.
状ハンダを付着させる請求項（１）記載の基板配線方法
。(4) The board wiring method according to claim (1), wherein the molten solder is jetted from a nozzle and the generated fibrous solder is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13601290A JPH0430493A (en) | 1990-05-25 | 1990-05-25 | Wiring method of board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13601290A JPH0430493A (en) | 1990-05-25 | 1990-05-25 | Wiring method of board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430493A true JPH0430493A (en) | 1992-02-03 |
Family
ID=15165122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13601290A Pending JPH0430493A (en) | 1990-05-25 | 1990-05-25 | Wiring method of board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430493A (en) |
-
1990
- 1990-05-25 JP JP13601290A patent/JPH0430493A/en active Pending
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