JPH04300079A - Adhering method - Google Patents
Adhering methodInfo
- Publication number
- JPH04300079A JPH04300079A JP6504191A JP6504191A JPH04300079A JP H04300079 A JPH04300079 A JP H04300079A JP 6504191 A JP6504191 A JP 6504191A JP 6504191 A JP6504191 A JP 6504191A JP H04300079 A JPH04300079 A JP H04300079A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- materials
- tin
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 46
- 239000000463 material Substances 0.000 claims abstract description 76
- 238000007747 plating Methods 0.000 claims abstract description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 238000000137 annealing Methods 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052718 tin Inorganic materials 0.000 claims abstract description 26
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 23
- 239000011701 zinc Substances 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 5
- 239000012298 atmosphere Substances 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 14
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 229910052742 iron Inorganic materials 0.000 abstract description 7
- 229910000906 Bronze Inorganic materials 0.000 abstract description 3
- 239000010974 bronze Substances 0.000 abstract description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 22
- 230000003749 cleanliness Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、メッキが可能な材料の
接着方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of adhering materials that can be plated.
【０００２】0002
【従来の技術】金属の接着方法としては、溶接で行うも
の、半田により行うものや接着剤で行うものなどがある
。溶接の場合、接着させる面が広い場合には、全面で接
着させることは難しい。接着剤を用いる場合は、一般に
高温では強度が得にくいなど問題がある。半田で接着さ
せる場合には、ペーストを用いるため、清浄性で問題に
なったりする。また、接着後、旋盤加工を加えたりする
必要がある場合には、強度が必要となるが、強度の強い
接着法である溶接では全面接着でない場合には不可能な
場合が多い。2. Description of the Related Art Methods for bonding metals include welding, soldering, and adhesives. In the case of welding, if the surface to be bonded is wide, it is difficult to bond the entire surface. When using adhesives, there are generally problems such as difficulty in obtaining strength at high temperatures. When bonding with solder, a paste is used, which may cause problems with cleanliness. Further, if it is necessary to perform lathe processing after bonding, strength is required, but welding, which is a strong bonding method, is often not possible unless the entire surface is bonded.
【０００３】そこで、非常に接着強度が高く、接着しよ
うとする材料と同程度の接着強度が得られ、しかも、接
着後、旋盤加工等の加工もでき、接着により清浄性が損
なわれない接着方法が望まれている。[0003] Therefore, an adhesion method that has extremely high adhesion strength, can obtain an adhesion strength comparable to that of the materials to be adhered, can be processed by lathe processing etc. after adhesion, and does not impair cleanliness due to adhesion. is desired.
【０００４】0004
【発明が解決しようとする課題】本発明は、非常に接着
強度が高く、接着しようとする材料と同程度の接着強度
が得られ、しかも接着後、旋盤加工等の加工もでき、接
着により清浄性が損なわれない接着方法を提供すること
を目的とするものである。[Problems to be Solved by the Invention] The present invention has an extremely high adhesive strength, can obtain an adhesive strength comparable to that of the materials to be adhered, and can be processed by lathe processing etc. after adhesion, and can be cleaned easily by adhesion. The purpose of this invention is to provide an adhesive method that does not impair properties.
【０００５】[0005]
【課題を解決するための手段】本発明の要旨とするとこ
ろは下記のとおりである。
（１） 接着しようとする材料の接着面に全部或いは
部分的にメッキを施した後、加熱して材料間を焼き付き
状態にすることを特徴とする接着方法。
（２） 接着面にメッキを施した材料と施していない
材料を接着させることを特徴とする前項１記載の接着方
法。[Means for Solving the Problems] The gist of the present invention is as follows. (1) A bonding method characterized by applying plating to the entire or partial surface of the materials to be bonded, and then applying heat to bring the bond between the materials into a burned state. (2) The bonding method according to item 1 above, characterized in that a material whose bonding surface is plated and a material which is not plated are bonded.
【０００６】（３） 接着し合う２つの材料の表面に
施されるメッキ材料が、異なる種類であることを特徴と
する前項１または２記載の接着方法。
（４） メッキ材料を銅、錫、亜鉛、またはこれらの
合金とする前項１、２または３記載の接着方法。
（５） 一方のメッキ材料が銅であり、もう一方の異
なる種類のメッキ材料を錫、亜鉛、またはこれらの合金
とする前項４記載の接着方法。(3) The bonding method according to item 1 or 2 above, wherein the plating materials applied to the surfaces of the two materials to be bonded together are of different types. (4) The adhesion method according to item 1, 2 or 3 above, wherein the plating material is copper, tin, zinc, or an alloy thereof. (5) The bonding method according to item 4 above, wherein one plating material is copper and the other plating material of a different type is tin, zinc, or an alloy thereof.
【０００７】（６） 接着し合う２つの材料の表面に
施されるメッキ材料の双方合わせた銅と錫の比率を、銅
１に対し、錫を０．０５〜０．２５とする前項４または
５記載の接着方法。
（７） 接着し合う２つの材料の表面に施されるメッ
キ材料の双方合わせた銅と亜鉛の比率を、銅１に対し、
亜鉛を０．１〜０．５とする前項４または５記載の接着
方法。(6) The ratio of copper and tin in the plating materials applied to the surfaces of two materials to be bonded together is 0.05 to 0.25 to 1 copper, or 4 or above. 5. The adhesion method described in 5. (7) The ratio of copper and zinc in the plating materials applied to the surfaces of the two materials to be bonded to each other is 1 to 1 copper.
5. The adhesion method according to item 4 or 5 above, wherein the zinc content is 0.1 to 0.5.
【０００８】（８） 焼き付きを起こすための焼鈍が
、還元性雰囲気下でなされるものである前項１、２、３
、４、５、６または７記載の接着方法。
（９） 焼き付きを起こすための焼鈍を７５０℃以上
で行うことを特徴とする前項４、５、６、７または８に
記載の接着方法。
（１０） 接着し合う材料の表面に施されるメッキの
厚さが、両面で、前記材料の表面粗さ以上の厚さとする
前項１、２、３、４、５、６、７、８または９記載の接
着方法
（１１） 焼き付き焼鈍を直接加熱方式とする前項
１、２、３、４、５、６、７、８、９または１０記載の
接着方法。(8) Items 1, 2, and 3 above, in which the annealing to cause seizure is performed in a reducing atmosphere.
, 4, 5, 6 or 7. (9) The bonding method according to item 4, 5, 6, 7, or 8 above, characterized in that annealing to cause seizure is performed at 750° C. or higher. (10) Paragraph 1, 2, 3, 4, 5, 6, 7, 8 or above, in which the thickness of the plating applied to the surfaces of the materials to be bonded to each other is greater than or equal to the surface roughness of the materials on both sides. Bonding method according to Item 9 (11) The bonding method according to Item 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, wherein the baking annealing is a direct heating method.
【０００９】（１２） 焼き付き焼鈍を加圧下で行
う前項１、２、３、４、５、６、７、８、９、１０また
は１１記載の接着方法。
以下に、本発明を詳細に説明する。本発明で取り扱う材
料とは、他の材料と接着しようとするもので、主にメッ
キ可能な金属であり、他のものでも、メッキが可能で、
その後行われる焼き付きのための焼鈍が可能ならばよい
。接着し合う材料は、異なった材料であっても構わない
。(12) The bonding method described in the preceding item 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11, wherein the seizure annealing is performed under pressure. The present invention will be explained in detail below. The materials handled in this invention are those that are intended to be bonded to other materials, and are mainly metals that can be plated, but other materials can also be plated.
It is sufficient if the subsequent annealing for seizure is possible. The materials to be bonded together may be different materials.
【００１０】接着をしようとする材料の表面に、焼き付
きを起こさせるためのメッキを施すが、メッキ材料とし
ては、銅、亜鉛、錫、鉛、アルミニウム、ニッケルなど
やこれらの合金或いは２種類以上を使用してもよく、メ
ッキが可能ならば、何でもよい。しかし、接着をしよう
とする材料にメッキ可能なものであり、しかも接着しよ
うとする他方の材料と焼き付きを起こさせることが可能
なものである必要がある。また、用途に応じて、あるい
は接着強度や加工性、清浄性に応じて選択する必要があ
る。高温で使用したり、接着後の加工性が要求されたり
、強度が要求される場合には、メッキ材料に、銅、錫、
亜鉛やこれらの合金を使用するとよい。[0010] Plating is applied to the surface of the material to be bonded to cause seizure, and the plating material may be copper, zinc, tin, lead, aluminum, nickel, or an alloy of these or two or more thereof. Any material may be used as long as it can be plated. However, it needs to be able to be plated on the material to be bonded, and also to be able to cause seizure to the other material to be bonded. Further, it is necessary to select the material depending on the application, adhesive strength, workability, and cleanliness. When used at high temperatures, when workability after adhesion is required, or when strength is required, use copper, tin, etc. as the plating material.
It is recommended to use zinc or an alloy of these.
【００１１】このメッキは、一種の材料で行うだけでは
なく、異なる種類のメッキ材料を多層に行ってもよい。
また、接着しようとする材料の双方に行う必要はなく、
問題がなければ、片方だけでもよい。さらに、接着しよ
うとする材料の双方の面のメッキは、異なる種類或いは
異なる厚さでもよい。接着しようとする材料の表面は、
可能ならばそのままメッキしても差し支えないが、メッ
キを容易にしたり、焼き付きを起こし易くしたり、また
接着後、目的に応じた接着強度、加工性、清浄性などを
得るために、メッキを行う前に、酸洗、油洗、研磨等の
前処理を行うとよい。特に、接着しようとする双方の材
料の面が十分に接触できるように表面粗さを小さくした
り、面の平坦度等の面形状を合わせる必要がある。必要
ならば、接着面の位置がずれないように、面に凹凸を付
けておいてもよい。接着面は、目的に応じた強度等が得
られるならば、全面でなく部分的でもよい。[0011] This plating may be performed not only with one type of material, but also with multiple layers of different types of plating materials. Also, there is no need to do this on both sides of the material you are trying to bond.
If there is no problem, you can use only one side. Furthermore, the plating on both sides of the material to be bonded may be of different types or thicknesses. The surface of the material to be bonded is
If possible, it may be plated as is, but plating may be used to make plating easier, to prevent seizure, or to obtain adhesion strength, workability, cleanliness, etc., depending on the purpose after adhesion. It is recommended to perform pretreatment such as pickling, oil washing, and polishing beforehand. In particular, it is necessary to reduce the surface roughness and match the surface shapes such as the flatness of the surfaces so that the surfaces of both materials to be bonded can sufficiently contact each other. If necessary, the surface may be textured to prevent the adhesive surface from shifting. The adhesive surface may not be the entire surface, but may be a partial surface, as long as the strength suitable for the purpose can be obtained.
【００１２】メッキを施した後に、焼き付き焼鈍を行う
必要がある。この焼き付き焼鈍は、加熱によるメッキ材
料の溶解、化学反応などにより接着せしめるか、或いは
接着しようとする材料との化学反応を利用してもよい。
例えば銅に対して錫や亜鉛を組み合わせると、反応して
青銅や黄銅になり、強い接着面が得られる。従って、メ
ッキ金属として銅と錫或いは亜鉛を組み合わせたものを
用いようとするときは、銅と錫或いは亜鉛を合金したも
のを材料表面にメッキするようにしてもよいが、一方の
材料の表面に銅をメッキし、他方の材料の表面に錫或い
は亜鉛をメッキし、双方の材料を接着する過程で合金と
するようにしてもよい。このように、メッキ材料として
、銅、錫、亜鉛を使用する場合は、或いは銅に錫や亜鉛
を組み合わせるためには、焼き付き焼鈍を７５０℃以上
で行うとよい。この焼き付き焼鈍は、酸化防止のため或
いは接着を起こさせる化学反応を十分に行わせるために
還元雰囲気で行うとよい。十分な焼き付きを起こさせる
には、接着面を加圧して焼き付き焼鈍を行うと効果的で
ある。焼き付き焼鈍の時間は、十分に焼き付きを起こさ
せるに十分な時間であることが好ましく、メッキ材料の
溶解や反応などが十分に進んでいることが好ましい。
焼き付き焼鈍の冷却速度は、接着面などでの熱歪の発生
ができるだけ抑制されるように遅くするとよい。この焼
き付き焼鈍は他の目的の焼鈍と兼ねても構わない。焼き
付き焼鈍は、通常の外部から熱を与える加熱方式とする
か、或いは直接接着部やその近傍で熱を発生させて加熱
する直接加熱方式とすることができ、直接加熱方式とし
ては、電流を流して熱を発生させる直接通電方式、高周
波加熱方式、レーザや光照射による加熱方式などがあり
、これらの加熱方式によれば、短時間で接着させる場合
に効果的である。直接通電方式を用いる場合には、電流
を流す電極で加圧或いは加圧成形してもよく、効率的で
ある。[0012] After plating, it is necessary to perform baking annealing. This burn-in annealing may be performed by melting the plating material by heating, by a chemical reaction, or by utilizing a chemical reaction with the material to be bonded. For example, when copper is combined with tin or zinc, it reacts to form bronze or brass, creating a strong adhesive surface. Therefore, when a combination of copper and tin or zinc is to be used as a plating metal, an alloy of copper and tin or zinc may be plated on the surface of the material; Copper may be plated on the surface of the other material, and tin or zinc may be plated on the surface of the other material to form an alloy in the process of adhering both materials. As described above, when copper, tin, or zinc is used as the plating material, or when copper is combined with tin or zinc, the baking annealing is preferably performed at 750° C. or higher. This burn-in annealing is preferably performed in a reducing atmosphere to prevent oxidation or to sufficiently carry out the chemical reaction that causes adhesion. In order to cause sufficient seizure, it is effective to perform seizure annealing by applying pressure to the adhesive surface. It is preferable that the time for the burn-in annealing is sufficient to sufficiently cause burn-in, and it is preferable that the melting and reaction of the plating material proceed sufficiently. The cooling rate for seizure annealing is preferably slow enough to suppress the occurrence of thermal strain on the bonding surface as much as possible. This burn-in annealing may also be used as annealing for other purposes. Burning annealing can be performed using a normal heating method that applies heat from the outside, or a direct heating method that generates heat directly at or near the bonded area. There are direct energization methods that generate heat, high-frequency heating methods, and heating methods that use laser or light irradiation.These heating methods are effective for bonding in a short time. When using a direct energization method, pressure or pressure molding may be performed using an electrode through which current flows, which is efficient.
【００１３】メッキの厚さは必要とする接着強度等を得
るに十分な厚さが必要であり、できれば接着しようとす
る材料の表面の粗さより接着し合う材料の表面に施され
るメッキの厚さが厚いとよい。一方、焼き付き焼鈍によ
る焼き付きが、メッキ材料等による化学反応であれば、
焼き付き温度は反応の進む温度であることは言うまでも
ないが、メッキ厚さは設定された焼鈍時間に反応が進む
と推定される量に相当する厚さ以下であることが必要で
あるか、或いはメッキ厚さに応じた焼鈍時間とすること
がが必要である。The thickness of the plating must be sufficient to obtain the required adhesive strength, etc., and if possible, the thickness of the plating applied to the surfaces of the materials to be bonded should be determined by the roughness of the surfaces of the materials to be bonded. The thicker the better. On the other hand, if the seizure caused by annealing is a chemical reaction caused by the plating material, etc.
It goes without saying that the baking temperature is the temperature at which the reaction progresses, but the plating thickness must be equal to or less than the amount at which the reaction is estimated to proceed during the set annealing time, or It is necessary to set the annealing time according to the thickness.
【００１４】[0014]
【実施例】実施例１
図１は、鉄の角棒１に両面で１μｍの銅メッキ２を行っ
たものであり、図２は鉄の角棒１′に両面で０．１〜０
．２μｍの錫メッキ３を行ったものである。鉄の角棒１
、１′は、接着位置を合わせるための凹凸部分ａ、ａ′
を有している。これらを接着しようとする状態に保持し
ながら、８５０℃、２時間、５％水素を含んだ窒素雰囲
気中で、４０ｇ／ｃｍ２ の加圧下で焼き付き焼鈍を行
って得られたものを図３に示す。図３の４が接着部で、
銅メッキ２と錫メッキ３が接着面で、焼き付き焼鈍によ
り反応し、青銅になり、接着状態となっている。[Example] Example 1 Figure 1 shows a square iron bar 1 plated with 1 μm of copper 2 on both sides, and Figure 2 shows a square iron bar 1' plated with 0.1 to 0.0 μm of copper on both sides.
．． 2 μm tin plating 3 was performed. square iron bar 1
, 1' are uneven parts a, a' for adjusting the bonding position.
have. While holding these in a state where they are to be bonded, seizure annealing was performed at 850°C for 2 hours under a pressure of 40 g/cm2 in a nitrogen atmosphere containing 5% hydrogen. The result is shown in Figure 3. . 4 in Figure 3 is the adhesive part,
The copper plating 2 and the tin plating 3 react on the bonding surface by baking annealing to become bronze and are in a bonded state.
【００１５】表１に銅メッキのみの実施例２、３と、先
ず銅メッキを行い、次いで錫メッキを行った場合の実施
例４〜８を示す。４０ｇ／ｃｍ２ の加圧下で、２時間
、５％水素を含んだ窒素雰囲気中で焼き付き焼鈍を行っ
た。表中のメッキ厚は、片面あたりの値である。銅メッ
キだけでも８００℃で、２ｋｇ／ｍｍ２、９００℃で、
１８ｋｇ／ｍｍ２の接着強度を得ている。銅メッキのみ
より、銅と錫メッキを同時に使用した場合の方が接着強
度が高い。銅１のメッキに対し、錫０．０５以上、０．
２５以下の比率のメッキである場合に、２０ｋｇ／ｍｍ
２が得られている。また、７５０℃以上の焼き付き焼鈍
で、接着強度が得られている。Table 1 shows Examples 2 and 3 in which only copper plating was performed, and Examples 4 to 8 in which copper plating was first performed and then tin plating was performed. Seizure annealing was performed under a pressure of 40 g/cm2 for 2 hours in a nitrogen atmosphere containing 5% hydrogen. The plating thickness in the table is the value per one side. Copper plating alone at 800℃, 2kg/mm2, 900℃,
An adhesive strength of 18 kg/mm2 was obtained. Adhesive strength is higher when copper and tin plating are used simultaneously than when copper plating is used alone. For plating of copper 1, tin is 0.05 or more, 0.
20kg/mm when plating with a ratio of 25 or less
2 is obtained. Furthermore, adhesive strength was obtained by baking annealing at 750° C. or higher.
【００１６】表２に銅メッキと亜鉛メッキを行った場合
の実施例９〜１１を示す。２時間、５％水素を含んだ窒
素雰囲気中で焼き付き焼鈍を行ったものである。銅１の
メッキに対し、亜鉛０．１以上、０．５以下の比率のメ
ッキである場合に、９ｋｇ／ｍｍ２の接着強度が得られ
ている。Table 2 shows Examples 9 to 11 in which copper plating and zinc plating were performed. Seizure annealing was performed for 2 hours in a nitrogen atmosphere containing 5% hydrogen. When the ratio of zinc to copper plating was 0.1 or more and 0.5 or less, an adhesive strength of 9 kg/mm2 was obtained.
【００１７】[0017]
【表１】[Table 1]
【００１８】[0018]
【表２】[Table 2]
【００１９】[0019]
【発明の効果】本発明は、非常に接着強度が高く、接着
しようとする材料と同程度の接着強度が得られ、しかも
接着後、旋盤加工等の加工もでき、接着により清浄性が
損なわれない接着方法を提供するものである。溶接の場
合、接着させる面が広いときは、全面で接着させること
は難しいが、本発明の接着方法によれば容易に全面での
接着が可能である。また、通常の接着剤を用いる場合と
較べると、本発明の接着方法によれば高温での強度が得
易い。半田を用いる場合のように、ペーストを用いる必
要がなく、清浄性でも優れている場合が多い。また、接
着後、旋盤加工を加えたりする必要がある場合にも、適
用可能である。[Effect of the invention] The adhesive strength of the present invention is extremely high, and it is possible to obtain adhesive strength comparable to that of the materials to be bonded, and furthermore, it can be processed by lathe processing etc. after bonding, and cleanliness is not impaired by bonding. It provides an adhesive method that does not require In the case of welding, when the surface to be bonded is wide, it is difficult to bond the entire surface, but according to the bonding method of the present invention, it is possible to bond the entire surface easily. Furthermore, compared to the case of using ordinary adhesives, the bonding method of the present invention makes it easier to obtain strength at high temperatures. Unlike the case of using solder, there is no need to use paste, and the cleanliness is often excellent. It is also applicable to cases where it is necessary to add lathe processing after bonding.
【００２０】本発明の接着方法は、メッキを施すことを
必要とするが、メッキを全てに施さなくても、何れか一
方に行ったり、或いは異なった２種類のメッキを施す必
要がある場合には、それぞれ１種類を、片方の材料の表
面に行えばよく、工程が簡単にできる。メッキ材料の種
類としては、銅、錫、亜鉛を使うと、メッキも容易な場
合が多く、また銅と、錫や亜鉛を組み合わせると、焼き
付き焼鈍を７５０℃以上で行うことができ、接着しよう
とする材料の熱変形が抑えられる温度以下で可能となる
。例えば、鉄を接着しようとすれば、９００℃以下で接
着できる。[0020] The bonding method of the present invention requires plating, but it is possible to apply plating to only one side without plating everything, or when it is necessary to apply two different types of plating. Only one type of each can be applied to the surface of one of the materials, making the process simple. As for the types of plating materials, copper, tin, and zinc are often used for easy plating, and when copper is combined with tin and zinc, baking annealing can be performed at 750°C or higher, making it difficult to bond. This is possible at a temperature below which thermal deformation of the material is suppressed. For example, if you want to bond iron, you can bond it at 900 degrees Celsius or lower.
【００２１】接着し合う２つの材料の表面に施される両
メッキ材料の合計した成分の比率、例えば銅１に対し錫
を０．０５〜０．２５としたり、或いは銅１に対し亜鉛
を０．１〜０．５とすると、機械的強度も高く加工性も
優れたものが得られるので、用途を拡張できる。焼き付
き焼鈍を還元性雰囲気下で行うと、接着しようとする材
料や接着部等の酸化が防止され、また接着力も損なわれ
ない。また、直接通電方式で接着面を直接加熱すると、
簡単に或いは短時間で接着を行うことが可能である。こ
の場合、直接通電方式を用いると、電極で加圧成形する
ことも可能であり、有利である。[0021] The ratio of the total components of both plating materials applied to the surfaces of two materials to be bonded together, for example, 0.05 to 0.25 tin to 1 copper, or 0 zinc to 1 copper. When the value is between .1 and 0.5, a product with high mechanical strength and excellent workability can be obtained, so that the range of uses can be expanded. When the baking annealing is performed in a reducing atmosphere, oxidation of the materials to be bonded, the bonded portion, etc. is prevented, and the adhesive strength is not impaired. In addition, if the adhesive surface is directly heated using the direct current method,
Bonding can be performed easily or in a short time. In this case, it is advantageous to use a direct energization method, since it is also possible to perform pressure molding using electrodes.
【００２２】接着し合う材料の表面に施されるメッキの
厚さを、両面合計で前記材料の表面粗さ以上の厚さとす
ることにより、表面粗さが大きいことによる接着面積低
下に起因する接着力低下を抑制できる。[0022] By making the thickness of the plating applied to the surfaces of the materials to be adhered to be greater than the surface roughness of the materials in total on both sides, the adhesion caused by the reduction in the adhesion area due to the large surface roughness can be prevented. It can suppress power decline.
【図１】図１は鉄の角棒に両面で１μｍの銅メッキを行
った状態を示す図である。FIG. 1 is a diagram showing a square iron bar plated with 1 μm of copper on both sides.
【図２】図２は鉄の角棒に両面で０．１〜０．２μｍの
錫メッキを行った状態を示す図である。FIG. 2 is a diagram showing a square iron bar plated with tin to a thickness of 0.1 to 0.2 μm on both sides.
【図３】図３は図１の角棒と図２の角棒とを焼き付き焼
鈍で接着させた状態を示す図である。FIG. 3 is a diagram showing a state in which the square bar of FIG. 1 and the square bar of FIG. 2 are bonded together by baking annealing.
Claims (12)
或いは部分的にメッキを施した後、加熱して材料間を焼
き付き状態にすることを特徴とする接着方法。1. A bonding method, which comprises plating the bonding surfaces of materials to be bonded in whole or in part, and then applying heat to bring the bond between the materials into a burned state.
いない材料を接着させることを特徴とする請求項１記載
の接着方法。2. The bonding method according to claim 1, wherein a material whose bonding surface is plated and a material which is not plated are bonded.
るメッキ材料が、異なる種類であることを特徴とする請
求項１または２記載の接着方法。3. The bonding method according to claim 1, wherein the plating materials applied to the surfaces of the two materials to be bonded together are of different types.
れらの合金とする請求項１、２または３記載の接着方法
。4. The bonding method according to claim 1, wherein the plating material is copper, tin, zinc, or an alloy thereof.
方の異なる種類のメッキ材料を錫、亜鉛、またはこれら
の合金とする請求項４記載の接着方法。5. The bonding method according to claim 4, wherein one plating material is copper, and the other plating material of a different type is tin, zinc, or an alloy thereof.
るメッキ材料の双方合わせた銅と錫の比率を、銅１に対
し、錫を０．０５〜０．２５とする請求項４または５記
載の接着方法。6. The plating material applied to the surfaces of the two materials to be bonded together has a ratio of copper to tin of 0.05 to 0.25 of tin to 1 of copper. 5. The adhesion method described in 5.
るメッキ材料の双方合わせた銅と亜鉛の比率を、銅１に
対し、亜鉛を０．１〜０．５とする請求項４または５記
載の接着方法。7. The plating material applied to the surfaces of the two materials to be bonded together has a ratio of copper to zinc of 0.1 to 0.5 to 1 of copper. 5. The adhesion method described in 5.
性雰囲気下でなされるものである請求項１、２、３、４
、５、６または７記載の接着方法。[Claim 8] Claims 1, 2, 3, 4, wherein the annealing to cause seizure is performed in a reducing atmosphere.
, 5, 6 or 7.
℃以上で行うことを特徴とする請求項４、５、６、７ま
たは８に記載の接着方法。[Claim 9] Annealing to 750 to cause seizure.
9. The bonding method according to claim 4, 5, 6, 7, or 8, characterized in that the bonding method is carried out at a temperature of .degree. C. or higher.
ッキの厚さが、両面で、前記材料の表面粗さ以上の厚さ
とする請求項１、２、３、４、５、６、７、８または９
記載の接着方法10. The thickness of the plating applied to the surfaces of the materials to be bonded together is greater than the surface roughness of the materials on both sides. , 8 or 9
Adhesion method described
請求項１、２、３、４、５、６、７、８、９または１０
記載の接着方法。Claim 11: Claims 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, wherein the burning annealing is performed by a direct heating method.
Adhesion method described.
１、２、３、４、５、６、７、８、９、１０または１１
記載の接着方法。12. Claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11, wherein the seizure annealing is performed under pressure.
Adhesion method described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6504191A JPH04300079A (en) | 1991-03-28 | 1991-03-28 | Adhering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6504191A JPH04300079A (en) | 1991-03-28 | 1991-03-28 | Adhering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04300079A true JPH04300079A (en) | 1992-10-23 |
Family
ID=13275481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6504191A Withdrawn JPH04300079A (en) | 1991-03-28 | 1991-03-28 | Adhering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04300079A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016171024A (en) * | 2015-03-13 | 2016-09-23 | 東芝ホクト電子株式会社 | Magnetron |
| US20190198280A1 (en) * | 2016-05-17 | 2019-06-27 | Toshiba Hokuto Electronics Corporation | Magnetron |
-
1991
- 1991-03-28 JP JP6504191A patent/JPH04300079A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016171024A (en) * | 2015-03-13 | 2016-09-23 | 東芝ホクト電子株式会社 | Magnetron |
| US20190198280A1 (en) * | 2016-05-17 | 2019-06-27 | Toshiba Hokuto Electronics Corporation | Magnetron |
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