JPH04298091A - Manufacture of board for high-frequency circuit - Google Patents
Manufacture of board for high-frequency circuitInfo
- Publication number
- JPH04298091A JPH04298091A JP3062992A JP6299291A JPH04298091A JP H04298091 A JPH04298091 A JP H04298091A JP 3062992 A JP3062992 A JP 3062992A JP 6299291 A JP6299291 A JP 6299291A JP H04298091 A JPH04298091 A JP H04298091A
- Authority
- JP
- Japan
- Prior art keywords
- frequency circuit
- resin
- heat
- board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000002966 varnish Substances 0.000 claims abstract description 15
- 239000011888 foil Substances 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 6
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims 2
- 239000000088 plastic resin Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 6
- -1 polyethylene Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920006393 polyether sulfone Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- LLYYNOVSVPBRGV-MVNKZKPCSA-N valnemulin Chemical compound CC(C)[C@@H](N)C(=O)NCC(C)(C)SCC(=O)O[C@@H]1C[C@@](C)(C=C)[C@@H](O)[C@H](C)[C@@]23CC[C@@H](C)[C@]1(C)[C@@H]2C(=O)CC3 LLYYNOVSVPBRGV-MVNKZKPCSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、低誘電率かつ板厚の精
度に優れた高周波回路用基板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a high frequency circuit board having a low dielectric constant and excellent thickness accuracy.
【０００２】0002
【従来の技術】回路用基板は、一般に紙、ガラス布及び
ガラス不織布等の基材に、熱硬化性樹脂のワニスを含浸
乾燥し半硬化状態（Ｂステージ化）として得たプリプレ
グを必要枚数重ね、銅箔等の導体と重ね合わせて加熱加
圧成形して作る。又、この応用として多層基板等がある
。しかし、上記の従来の方法では、所望の基板厚みとす
るためにプリプレグを必要枚数重ねる必要があり、加熱
加圧成形で樹脂の流動があり、基板端部が薄くなって板
厚が不均一となる欠点がある。上記従来の基板の高周波
回路関係用途については、基材及び樹脂の誘電率が比較
的高く、誘電体（絶縁層）厚みのばらつきが大きいため
に、高周波回路用基板としては不適当である。[Prior Art] Circuit boards are generally made by stacking a required number of prepregs obtained by impregnating a base material such as paper, glass cloth, or glass nonwoven fabric with a thermosetting resin varnish and drying it to a semi-cured state (B stage). It is made by stacking it with a conductor such as copper foil and forming it under heat and pressure. Further, as an application of this, there are multilayer substrates and the like. However, in the conventional method described above, it is necessary to stack the required number of prepreg sheets to obtain the desired board thickness, and the resin flows during hot-pressure molding, resulting in thinning of the board edges and uneven board thickness. There is a drawback. Regarding applications related to high frequency circuits, the above-mentioned conventional substrates are unsuitable as substrates for high frequency circuits because the dielectric constants of the base material and resin are relatively high and the thickness of the dielectric (insulating layer) varies widely.
【０００３】0003
【発明が解決しようとする課題】高周波回路用基板が求
められる超勢のなかで解決しようとする問題点は、高周
波回路用基板の製造方法である。本発明は、基材及び樹
脂の誘導率が低く、板厚が均一な高周波回路用基板の製
造方法を提供することを目的とする。Problems to be Solved by the Invention Amid the ever-increasing demand for high-frequency circuit boards, a problem to be solved is the method of manufacturing high-frequency circuit boards. An object of the present invention is to provide a method for manufacturing a high-frequency circuit board in which the inductivity of the base material and resin is low and the board thickness is uniform.
【０００４】0004
【課題を解決するための手段】上記の目的を達成するた
めに、本発明は、プラスチック粉末焼結多孔質体シート
に耐熱性の熱可塑性樹脂充填物入り熱硬化性樹脂ワニス
を含浸し、得た誘電体と金属箔とを重ねて加熱加圧成形
一体化する。使用する多孔質体シートは、プラスチック
粉末を加熱焼結して成形するが、生成気孔は連通孔とな
り、気孔率は基板の用途、誘電率、用いるプラスチック
粉末、熱可塑性樹脂充填物入り熱硬化性樹脂ワニス、そ
の樹脂ワニスの表面張力あるいは粘度等によって最適値
とする必要がある。[Means for Solving the Problems] In order to achieve the above object, the present invention impregnates a sintered plastic powder porous sheet with a thermosetting resin varnish containing a heat-resistant thermoplastic resin filler. The dielectric and metal foil are stacked and integrated by heating and pressure molding. The porous sheet used is molded by heating and sintering plastic powder, and the generated pores are continuous pores, and the porosity depends on the purpose of the substrate, the dielectric constant, the plastic powder used, and the thermosetting resin filled with thermoplastic resin. It is necessary to set the optimum value depending on the surface tension or viscosity of the varnish and the resin varnish.
【０００５】多孔質体シートの加熱焼結に用いるプラス
チック粉末は熱可塑性樹脂粉末及び熱硬化性樹脂粉末と
する。熱可塑性樹脂を例示すると、ポリエチレン、ポリ
プロピレン、ポリ−１−ブテン、ポリ−４−メチルペン
テン、エチレン−プロピレン共重合体、エチレン−１−
ブテン共重合体、プロピレン−１−ブテンン共重合体、
エチレン酢酸ビニル共重合体、ポリテトラフルオロエチ
レン、テトラフルオロエチレン−ヘキサフルオロエチレ
ン共重合体、テトラフルオロエチレン−パ−フルオロア
ルコキシエチレン共重合体、トリフルオロクロルエチレ
ン−テトラフルオロエチレン共重合体、ポリフッ化ビニ
リデン、ポリスチレン、アクリロニトリル−スチレン共
重合体、アクリロニトリル−ブタジエン−スチレン共重
合体、ポリカーボネート、ポリメチルメタアクリレート
、ポリビニルブチラール、ポリビニルホルマール、ポリ
イミド、ポリアミド、ポリアミドイミド、ポリフェニレ
ンサルファイド、ポリエーテルサルホン、ポリサルホン
、ポリアリレート、ポリエーテルエーテルケトン、ポリ
フェニレンオキサイド、ポリエーテルアミド、ポリエー
テルイミド、ポリイソブチレン、ポリオキシベンジレン
、ポリブチレンテレフタレート、ポリブタジエン、ポリ
エステル、ポリ塩化ビニル、ポリ塩化ビニリデン等であ
る。又、熱硬化性樹脂を例示すると、尿素樹脂、メラミ
ン樹脂、ベンゾグアナミン樹脂、フェノ−ル樹脂、エポ
キシ樹脂、シリコーン樹脂、ホルマリン樹脂、キシレン
樹脂、フラン樹脂、ジアリルフタレート樹脂、ポリイソ
シアネート樹脂、フェノキシ樹脂等があるが、これらを
必要によって変性して使用することができる。又、これ
らの複合体としての混合物あるいは共重合物でも良く、
これらを主成分とし、必要に応じて架橋剤、硬化剤及び
添加物を用いてもよい。又、これらプラスチックを他樹
脂で被覆しても使用可能である。The plastic powder used for heating and sintering the porous sheet is a thermoplastic resin powder or a thermosetting resin powder. Examples of thermoplastic resins include polyethylene, polypropylene, poly-1-butene, poly-4-methylpentene, ethylene-propylene copolymer, ethylene-1-
butene copolymer, propylene-1-butene copolymer,
Ethylene vinyl acetate copolymer, polytetrafluoroethylene, tetrafluoroethylene-hexafluoroethylene copolymer, tetrafluoroethylene-perfluoroalkoxyethylene copolymer, trifluorochloroethylene-tetrafluoroethylene copolymer, polyfluoride Vinylidene, polystyrene, acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, polycarbonate, polymethyl methacrylate, polyvinyl butyral, polyvinyl formal, polyimide, polyamide, polyamideimide, polyphenylene sulfide, polyether sulfone, polysulfone, These include polyarylate, polyetheretherketone, polyphenylene oxide, polyetheramide, polyetherimide, polyisobutylene, polyoxybenzylene, polybutylene terephthalate, polybutadiene, polyester, polyvinyl chloride, polyvinylidene chloride, and the like. Examples of thermosetting resins include urea resin, melamine resin, benzoguanamine resin, phenol resin, epoxy resin, silicone resin, formalin resin, xylene resin, furan resin, diallyl phthalate resin, polyisocyanate resin, phenoxy resin, etc. However, these can be modified and used if necessary. Also, a mixture or copolymer of these as a composite may be used.
These are the main components, and a crosslinking agent, a curing agent, and an additive may be used as necessary. Moreover, these plastics can be used even if they are coated with other resins.
【０００６】熱硬化性樹脂ワニスに添加する熱可塑性樹
脂充填物は、ポリエーテルサルホン、ポリサルホン、ポ
リエーテルイミド、ポリアミドイミド、オキシベンゾイ
ルポリエステル、ポリエーテルエ−テルケトン、ポリフ
ェニレンサルファイド、ベクトラ（ポリプラスチックス
）、ザイダー（日本石油化学）、ロンドラン（ユニチカ
）、エコノール（住友化学）、Ｘ７Ｇ（Ｅａｓｔｍａｎ
Ｋｏｄａｋ）、テフロン（三井フルオロケミカル）
等の耐熱性樹脂とする。The thermoplastic resin filler added to the thermosetting resin varnish includes polyethersulfone, polysulfone, polyetherimide, polyamideimide, oxybenzoyl polyester, polyetheretherketone, polyphenylene sulfide, Vectra (Polyplastics), Xider (Japan Petrochemical), Rondran (Unitika), Econor (Sumitomo Chemical), X7G (Eastman)
Kodak), Teflon (Mitsui Fluorochemical)
Heat-resistant resin such as
【０００７】熱硬化性樹脂は、フェノ−ル樹脂、エポキ
シ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂等で
ある。これをトルエン、メタノール、メチルエチルケト
ン、ＤＭＦ、スチレン等で調整して、これに上記耐熱性
の熱可塑性樹脂充填物入り熱硬化性樹脂ワニスとする。[0007] Thermosetting resins include phenol resins, epoxy resins, unsaturated polyester resins, polyimide resins, and the like. This is adjusted with toluene, methanol, methyl ethyl ketone, DMF, styrene, etc. to form the above-mentioned heat-resistant thermoplastic resin filled thermosetting resin varnish.
【０００８】上記ワニスをプラスチック粉末焼結多孔質
体シートに含浸、塗工、場合によっては乾燥して誘導体
を作成する。この誘導体の片面または両面に金属箔（例
えば銅、鉄、アルミニウム等）を重ねて一体成形する。A derivative is prepared by impregnating a sintered plastic powder porous sheet with the above varnish, coating it, and optionally drying it. Metal foil (for example, copper, iron, aluminum, etc.) is stacked on one or both sides of this derivative and integrally molded.
【０００９】本発明の誘導体の一体成形には、多段プレ
ス方法、連続ベルト式プレス、連続ロール加熱加圧で行
なうが、基材がプラスチック粉末焼結多孔質体であるた
め低圧成形が可能でありかつ厚さのばらつきが少ない。
又、上記誘導体（樹脂含浸多孔質体）と回路用金属層か
らなる高周波回路用基板を組合わせると多層配線板とな
る。回路形成にはエッチング加工或るいはめっき法によ
る。[0009] The integral molding of the derivative of the present invention is carried out by a multi-stage press method, continuous belt press, or continuous roll heating and pressing, but since the base material is a porous sintered plastic powder material, low-pressure molding is possible. And there is little variation in thickness. Furthermore, a multilayer wiring board is obtained by combining the above-mentioned derivative (resin-impregnated porous material) with a high-frequency circuit board made of a circuit metal layer. The circuit is formed by etching or plating.
【００１０】又、本発明の誘導体とガラスエポキシプリ
プレグ、ガラスエポキシ積層板、紙フェノールプリプレ
グ、紙フェノ−ル積層板、ガラスポリイミドプリプレグ
、ガラスポリイミド積層板等と金属箔とを積層して加熱
加圧して一体成形する。Further, the derivative of the present invention, glass epoxy prepreg, glass epoxy laminate, paper phenol prepreg, paper phenol laminate, glass polyimide prepreg, glass polyimide laminate, etc., and metal foil are laminated and heated and pressed. integrally molded.
【００１１】上記成形板を高周波回路用基板とすると、
耐衝撃性及び反り特性が向上する。[0011] When the above molded plate is used as a high frequency circuit board,
Impact resistance and warping properties are improved.
【００１２】又、複数の誘導体と上記いくつかのガラス
エポキシプリプレグ、いくつかのガラスエポキシ積層板
及びいくつかの回路用金属箔を含む層と一体成形して多
層配線板とすることができる。必要な層に必要な誘電率
を持つ層を組合わせるこも可能である。[0012] Furthermore, a multilayer wiring board can be obtained by integrally molding a plurality of dielectrics and layers containing some of the glass epoxy prepregs, some glass epoxy laminates, and some metal foils for circuits. It is also possible to combine the required layers with layers having the required dielectric constant.
【００１３】[0013]
【作用】プラスチック粉末焼結多孔質体シートは、厚さ
の寸法精度が良く、かつ低誘電率を示す。さらに、これ
に耐熱性熱可塑性樹脂を混入した熱硬化性樹脂ワニスを
含浸すると低誘電率を示すと共に、後工程の熱加工に耐
え、かつ耐熱性の熱可塑樹脂の混入量で誘電率を調整で
きる。[Operation] The plastic powder sintered porous sheet has good dimensional accuracy in thickness and exhibits a low dielectric constant. Furthermore, when this is impregnated with a thermosetting resin varnish mixed with a heat-resistant thermoplastic resin, it exhibits a low dielectric constant, and the dielectric constant can be adjusted by adjusting the amount of the heat-resistant thermoplastic resin mixed in, which can withstand heat processing in the post-process. can.
【００１４】[0014]
【実施例】実施例１
プラスチック粉末としてハイゼックスミリオン２４０Ｍ
（超高分子量ポリオレフィンパウダー、三井石油化学）
を使用し、これを０．８ｍｍ厚の焼結多孔質体シートに
成形した。気孔率は約４３％であった。[Example] Example 1 HIZEX MILLION 240M as plastic powder
(Ultra high molecular weight polyolefin powder, Mitsui Petrochemical)
This was molded into a 0.8 mm thick sintered porous sheet. The porosity was about 43%.
【００１５】比誘電率３．４（１０ＭＨｚ）のポリエー
テルサルホン粉末を充填物とし、これを積層板用エポキ
シ樹脂ワニスに添加して得た含浸用ワニスを上記多孔質
体シートに含浸乾燥してプリプレグを得た。[0015] The porous sheet was impregnated with an impregnating varnish obtained by adding polyether sulfone powder having a dielectric constant of 3.4 (10 MHz) as a filler to an epoxy resin varnish for laminates and drying. prepreg was obtained.
【００１６】このプリプレグと３５ｍｍ厚の電解銅箔と
を重ね合わせ多段プレスで１７０℃、５Ｋｇ／ｃｍ２
で６０分成形し、高周波回路用基板を得た。その特性を
表１に示す。[0016] This prepreg and a 35 mm thick electrolytic copper foil were stacked together in a multi-stage press at 170°C and 5 kg/cm2.
The product was molded for 60 minutes to obtain a high frequency circuit board. Its characteristics are shown in Table 1.
【００１７】実施例２
実施例１と同様にして得た焼結多孔質体シートに、比誘
電率３．１（１０ＭＨｚ）のザイダー（日本石油化学）
粉末を充填物とし、ポリエステル樹脂積層板用ワニスに
添加した含浸用ワニスを含浸し、連続ベルトプレスを用
いて、１３０℃、５Ｋｇ／ｃｍ２ で１５分間加熱加圧
成形し、高周波回路用基板を得た。その特性を表１に示
す。Example 2 A sintered porous sheet obtained in the same manner as in Example 1 was coated with Zydar (Nippon Petrochemical) having a dielectric constant of 3.1 (10 MHz).
The powder was used as a filler and impregnated with the impregnating varnish added to the varnish for polyester resin laminates, and heated and pressure molded at 130°C and 5 kg/cm2 for 15 minutes using a continuous belt press to obtain a high frequency circuit board. Ta. Its characteristics are shown in Table 1.
【００１８】比較例
ガラス布基材に実施例１に示した積層板用エポキシ樹脂
ワニスを含浸して得たプリプレグ４枚と３５ｍｍ厚の電
解箔を重ね合わせて、多段プレスで１７０℃、８０Ｋｇ
／ｃｍ２ で６０分間加熱加圧成形し、回路用基板を得
た。（この条件で圧を５Ｋｇ／ｃｍ２ とするとボイド
が発生した）。その特性を表１に示す。Comparative Example Four sheets of prepreg obtained by impregnating a glass cloth base material with the epoxy resin varnish for laminates shown in Example 1 and electrolytic foil with a thickness of 35 mm were laminated and pressed at 170° C. in a multistage press at 80 kg.
/cm2 for 60 minutes to obtain a circuit board. (When the pressure was set to 5 kg/cm2 under these conditions, voids were generated). Its characteristics are shown in Table 1.
【００１９】[0019]
【表１】[Table 1]
【００２０】[0020]
【発明の効果】表１に示す結果で明らかであるが、本発
明による多孔質シート基材プリプレグ法で得た基板の比
誘電率は小さな値を示し高周波回路基板に適する。これ
に反して、比較例の従来法では適さない。又、板厚精度
も本発明による方法による方法では良い数値であるが、
プリプレグを４枚重ねた従来法では精度が悪い。Effects of the Invention As is clear from the results shown in Table 1, the dielectric constant of the substrate obtained by the porous sheet base material prepreg method according to the present invention is a small value and is suitable for high frequency circuit boards. On the other hand, the conventional method of the comparative example is not suitable. In addition, although the plate thickness accuracy is also a good value with the method according to the present invention,
The conventional method of stacking four sheets of prepreg has poor accuracy.
Claims (2)
性の熱可塑性樹脂充填物入り熱硬化性樹脂ワニスを含浸
し、得た誘電体と金属箔とを重ね合わせ加熱加圧成形す
ることを特徴とする高周波回路用基板の製造方法。[Claim 1] A sintered porous body of plastic powder is impregnated with a thermosetting resin varnish containing a heat-resistant thermoplastic resin filler, and the obtained dielectric body and metal foil are superimposed and molded under heat and pressure. A method of manufacturing a high frequency circuit board.
プレグ又は繊維基材積層板とを重ね、さらに金属箔を重
ね合わせて加熱加圧成形することを特徴とする高周波回
路基板の製造方法。2. A method for manufacturing a high-frequency circuit board, which comprises stacking the dielectric material according to claim 1 and a fiber-based prepreg or a fiber-based laminate, and further superimposing a metal foil and molding the same under heat and pressure. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3062992A JPH04298091A (en) | 1991-03-27 | 1991-03-27 | Manufacture of board for high-frequency circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3062992A JPH04298091A (en) | 1991-03-27 | 1991-03-27 | Manufacture of board for high-frequency circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04298091A true JPH04298091A (en) | 1992-10-21 |
Family
ID=13216378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3062992A Pending JPH04298091A (en) | 1991-03-27 | 1991-03-27 | Manufacture of board for high-frequency circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04298091A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332021A (en) * | 2005-04-26 | 2006-12-07 | Hitachi Chem Co Ltd | Dielectric constant conditioner and resin composition |
-
1991
- 1991-03-27 JP JP3062992A patent/JPH04298091A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332021A (en) * | 2005-04-26 | 2006-12-07 | Hitachi Chem Co Ltd | Dielectric constant conditioner and resin composition |
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