JPH04294890A - Al-si-ti ternary alloy brazing filler metal - Google Patents
Al-si-ti ternary alloy brazing filler metalInfo
- Publication number
- JPH04294890A JPH04294890A JP8357591A JP8357591A JPH04294890A JP H04294890 A JPH04294890 A JP H04294890A JP 8357591 A JP8357591 A JP 8357591A JP 8357591 A JP8357591 A JP 8357591A JP H04294890 A JPH04294890 A JP H04294890A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing filler
- metal
- ternary alloy
- alloy brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 title claims abstract description 25
- 239000000945 filler Substances 0.000 title abstract description 13
- 229910002058 ternary alloy Inorganic materials 0.000 title abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 7
- 229910008332 Si-Ti Inorganic materials 0.000 abstract description 6
- 229910006749 Si—Ti Inorganic materials 0.000 abstract description 6
- 238000005304 joining Methods 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 229910002056 binary alloy Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910018575 Al—Ti Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910007277 Si3 N4 Inorganic materials 0.000 description 1
- 229910004349 Ti-Al Inorganic materials 0.000 description 1
- 229910004692 Ti—Al Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子機器、機械構造な
どに好適なセラミックス部材を、他の金属とあるいはセ
ラミックス部材同士で接合する際に、使用するろう材に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing material used for joining ceramic members suitable for electronic equipment, mechanical structures, etc. to other metals or to each other.
【０００２】0002
【従来の技術】セラミックスを金属、あるいは他のセラ
ミックスと接合させる方法として、金属ろう接法はよく
知られている。この方法は、セラミックスと金属、ある
いはセラミックス同士の間に金属ろう材を挟み、真空あ
るいは不活性雰囲気中で、金属ろう材の融点以上の温度
まで加熱することにより、セラミックスと金属あるいは
セラミックス同士を接合させる方法である。この方法に
よれば低い温度で強いろう接体を作ることが可能である
。このようなろう接に用いられるろう材として、従来、
Ａｇ−ＴｉろうあるいはＡｇ−Ｃｕ−Ｔｉ系合金ろうが
用いられてきたが、貴金属のＡｇを多く使うため、ろう
材の価格が高いものにつくという欠点を有していた。2. Description of the Related Art Metal brazing is a well-known method for joining ceramics to metals or other ceramics. This method joins ceramics and metals or ceramics together by sandwiching a metal brazing material between ceramics and metals, or between ceramics, and heating it to a temperature above the melting point of the metal brazing material in a vacuum or inert atmosphere. This is the way to do it. According to this method, it is possible to make a strong solder joint at low temperature. Conventionally, brazing materials used in such brazing are
Ag-Ti solder or Ag-Cu-Ti based alloy solder has been used, but since it uses a large amount of the noble metal Ag, it has the disadvantage that the solder metal is expensive.
【０００３】一方、近年、低価格金属であるＡｌの高延
性と化学活性が注目され、ろう材として使用する試みが
なされている。しかし、Ａｌは酸化し易く、一般の真空
あるいは不活性雰囲気中において加熱すると、Ａｌろう
の表面に酸化膜（アルミナ）が形成されてろう接を妨げ
る。接合する部分の面積が小さい場合は、Ａｌろう材と
セラミックスまたは金属の接合面を平らに仕上げ、ろう
接する時に試料に圧力を掛けて接合面を密着させること
により酸化膜の形成を最小限にすることもできるが、接
合面が広くなると、酸化膜の形成を防ぐことが困難とな
り、その影響により接合体の強度のバラツキが大きくな
り、信頼性に乏しい接合体となっていた。On the other hand, in recent years, attention has been paid to the high ductility and chemical activity of Al, which is a low-cost metal, and attempts have been made to use it as a brazing material. However, Al is easily oxidized, and when heated in a general vacuum or an inert atmosphere, an oxide film (alumina) is formed on the surface of the Al solder, which hinders soldering. If the area of the part to be joined is small, minimize the formation of an oxide film by flattening the joint surface between the Al brazing material and ceramic or metal, and applying pressure to the sample during soldering to bring the joint surfaces into close contact. However, when the bonding surface becomes wider, it becomes difficult to prevent the formation of an oxide film, and this results in large variations in the strength of the bonded body, resulting in a bonded body with poor reliability.
【０００４】0004
【発明が解決しようとする課題】上述のように、価格の
安いＡｌ合金をろう材として工業的に利用しようとして
も、Ａｌ表面にはろう接に有害な酸化膜が形成され易い
ため、ろう接体の信頼性が低いという問題があった。し
たがって、Ａｌの特性を維持しつつ、酸化膜の形成を最
少限にし、または形成された酸化膜を活性化することが
できるような合金元素の添加によりＡｌろう材を改質し
て信頼性の高いろう接体がつくれるようにする必要があ
った。[Problems to be Solved by the Invention] As mentioned above, even if an attempt is made to industrially use a low-cost Al alloy as a brazing material, an oxide film that is harmful to soldering tends to form on the Al surface. There was a problem with low body reliability. Therefore, while maintaining the properties of Al, it is possible to improve the reliability by modifying the Al filler metal by adding alloying elements that can minimize the formation of oxide films or activate the formed oxide films. It was necessary to be able to make high quality solder joints.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、Ａｌとの
２元合金ろう材の開発を期して研究していたときに、Ｓ
ｉはＡｌ表面の酸化膜を薄くする効果があり、Ｔｉはこ
の酸化膜を活性化し、ろう接界面の反応を促進する効果
があることを知った。そこで、これら合金元素の各特性
に注目し、両者を同時に含むＡｌ−Ｓｉ−Ｔｉ３元合金
ろう材の開発を期して鋭意研究した結果、信頼性の高い
接合体を得ることのできる新しいろう材を見い出すこと
ができ、本発明に到達した。すなわち本発明は、Ｔｉを
０．１〜２．０ ｗｔ％、Ｓｉを０．０７〜１２．０
ｗｔ％含み、残部はＡｌと不可避的不純物とからなるこ
とを特徴とする新しいＡｌ−Ｓｉ−Ｔｉ３元合金ろう材
を提供するものである。[Means for Solving the Problems] When the present inventors were conducting research aimed at developing a binary alloy brazing filler metal with Al, they found that S
I learned that i has the effect of thinning the oxide film on the Al surface, and Ti has the effect of activating this oxide film and promoting the reaction at the solder interface. Therefore, we focused on the characteristics of each of these alloying elements, and as a result of intensive research aimed at developing an Al-Si-Ti ternary alloy brazing filler metal that simultaneously contains both elements, we developed a new brazing filler metal that can produce highly reliable joined bodies. This has led to the present invention. That is, in the present invention, Ti is 0.1 to 2.0 wt% and Si is 0.07 to 12.0 wt%.
The purpose of the present invention is to provide a new Al-Si-Ti ternary alloy brazing filler metal, which is characterized in that it contains Al-Si-Ti in an amount of wt%, and the remainder consists of Al and unavoidable impurities.
【０００６】[0006]
【作用】本発明者らの研究によれば、ＴｉまたはＳｉを
含むＡｌ合金ろう材は、Ｔｉの含有量が ０．１ｗｔ％
以下では酸化膜を活性化することができず、 ２．０ｗ
ｔ％以上では、合金の融点が高くなると共に、金属間化
合物（Ａｌ３ Ｔｉ）が多く発生することによりろう自
身が硬くなり、脆くなるという欠点を有する。一方、Ｓ
ｉはＴｉと同じようにろうを硬化するが、金属間化合物
を形成することはないので、ろう接に対する悪影響が小
さい。またＳｉを０．０７ｗｔ％以上添加すれば、Ａｌ
合金ろう材によるセラミックスろう接体の信頼性が高く
なり、Ａｌ合金の融点も低くなるが、あまり多量に入れ
るとろうが硬くなるため、本発明ではＳｉの上限含有量
をＡｌ−Ｓｉ２合金の共晶点におけるＳｉ含有量である
１２．０ｗｔ％にした。[Operation] According to the research conducted by the present inventors, an Al alloy brazing filler metal containing Ti or Si has a Ti content of 0.1 wt%.
The oxide film cannot be activated below 2.0w.
If it exceeds t%, the melting point of the alloy becomes high, and a large amount of intermetallic compound (Al3Ti) is generated, resulting in the disadvantage that the wax itself becomes hard and brittle. On the other hand, S
Although i hardens the solder in the same way as Ti, it does not form an intermetallic compound, so it has little adverse effect on brazing. Moreover, if Si is added at 0.07 wt% or more, Al
The reliability of the ceramic soldered body using the alloy brazing material increases, and the melting point of the Al alloy decreases, but if too much is added, the solder becomes hard, so in the present invention, the upper limit of the Si content is set to the same value as that of the Al-Si2 alloy. The Si content at the crystal point was set to 12.0 wt%.
【０００７】上記のような理由で、Ｓｉ、Ｔｉ各合金元
素の含有比率を定めた新規なＡｌ−Ｓｉ−Ｔｉ３元合金
ろう材をつくり、これを用いてセラミックス接合体を作
製し接合効果を調べたところ、ＳｉのＡｌ酸化防止作用
とＴｉの酸化膜活性化作用とがうまく活用でき、信頼性
の高い接合体を得ることができた。For the reasons mentioned above, a new Al-Si-Ti ternary alloy brazing material with a determined content ratio of each alloying element of Si and Ti was created, a ceramic bonded body was created using this, and the bonding effect was investigated. As a result, the Al oxidation prevention effect of Si and the oxidation film activation effect of Ti were successfully utilized, and a highly reliable bonded body could be obtained.
【０００８】以下、実施例をもって本発明を詳細に説明
する。[0008] The present invention will be explained in detail below with reference to Examples.
【０００９】[0009]
【実施例】図１に示す２つの互いに接合される窒化けい
素（Ｓｉ３ Ｎ４ ）セラミックス部品Ａ、Ｂ（図中１
、２で示す）の接合すべき面（接合面積１４ｍｍ×１６
ｍｍ）同士の間に０．２８ｗｔ％Ｓｉ−０．１９ｗｔ％
Ｔｉ−Ａｌ合金ろう材（厚さ ０．５ｍｍ）を挟み、こ
れを１０−５ｔｏｒｒの真空中において ８００℃の一
定温度に加熱し、１５分間保持してろう接を行った。別
にもう１組の同じセラミックス部品Ａ、Ｂを ９００℃
一定で１５分間加熱して同様にもう１つの接合体を得た
。[Example] Two silicon nitride (Si3 N4) ceramic parts A and B (1 in the figure) shown in Fig. 1 are bonded to each other.
, 2) to be joined (joint area 14 mm x 16
mm) 0.28wt%Si-0.19wt%
A Ti-Al alloy brazing material (thickness: 0.5 mm) was sandwiched, and this was heated to a constant temperature of 800° C. in a vacuum of 10 −5 torr, and held for 15 minutes to perform brazing. Separately, another set of the same ceramic parts A and B was heated to 900℃.
Another conjugate was similarly obtained by heating at a constant temperature for 15 minutes.
【００１０】得られた各接合体からそれぞれ図２に示す
ような曲げ試験片を切り出し、曲げ強度を４点曲げ試験
法（ＪＩＳ Ｒ １６０１）で測定した。測定結果をワ
イブル分布で整理し、ワイブル係数と平均曲げ強度でそ
れぞれ接合体の信頼性と強度を評価した。これらの結果
を表１に示す。Bending test pieces as shown in FIG. 2 were cut out from each of the obtained joined bodies, and the bending strength was measured by a four-point bending test method (JIS R 1601). The measurement results were organized using a Weibull distribution, and the reliability and strength of the joint were evaluated using the Weibull coefficient and average bending strength, respectively. These results are shown in Table 1.
【００１１】[0011]
【比較例】実施例に示したものと同じ２つの窒化けい素
セラミックス部品Ａ、Ｂ（１、２）間に、０．３３ｗｔ
％Ｓｉ、および０．１７ｗｔ％Ｔｉをそれぞれ含むＡｌ
基２元合金（Ａｌ−Ｓｉ、Ａｌ−Ｔｉ）ろう材を用い、
実施例と同様な手順でろう接体を得た後、平均曲げ強度
とワイブル係数を求め、その結果を表１に併せて示した
。[Comparative example] Between the same two silicon nitride ceramic parts A and B (1, 2) as shown in the example, 0.33 wt.
%Si and 0.17wt%Ti, respectively.
Using base binary alloy (Al-Si, Al-Ti) brazing material,
After obtaining a soldered body in the same manner as in the example, the average bending strength and Weibull coefficient were determined, and the results are also shown in Table 1.
【００１２】0012
【００１３】これらの試験の結果、 ８００℃、 ９０
０℃のうちいずれの温度で行った接合試験においても、
ＴｉとＳｉとを同時に含有した３元合金ろう材を用いた
接合体はその強度およびワイブル係数が、上記の各２元
合金ろう材をそれぞれ用いた場合より高いことがわかっ
た。また、同じ３元合金ろう材使用の場合でも加熱温度
８００℃でろう接した場合より、 ９００℃でろう接
した場合の方がより強固な接合体が得られることがわか
った。[0013] As a result of these tests, 800°C, 90°C
In bonding tests conducted at any temperature of 0°C,
It was found that the strength and Weibull coefficient of the joined body using the ternary alloy brazing filler metal containing Ti and Si at the same time were higher than those using each of the above-mentioned binary alloy brazing filler metals. It was also found that even when using the same ternary alloy brazing filler metal, a stronger joint was obtained when soldering was performed at a heating temperature of 900°C than when soldering was performed at a heating temperature of 800°C.
【００１４】[0014]
【発明の効果】上述のように、本発明によれば、安価な
Ａｌ合金ろう材を用いるろう接によって、従来品のＡｇ
系ろう材を用いた場合に比し遜色がなく信頼性の高い高
強度ろう接体を作製することができる。Effects of the Invention As described above, according to the present invention, by soldering using an inexpensive Al alloy brazing material, the Ag
It is possible to produce a high-strength brazed body that is as reliable and comparable to the case where a brazing filler metal is used.
【図１】本発明のＡｌ−Ｓｉ−Ｔｉ３元合金ろう材を用
いて２つのセラミックス部品を相互に接合した状態を示
す斜視図である。FIG. 1 is a perspective view showing a state in which two ceramic parts are bonded to each other using the Al-Si-Ti ternary alloy brazing material of the present invention.
【図２】図１の接合体から切り出した曲げ試験片を用い
て曲げ強度測定を行うときの測定方法を例示する図であ
る。2 is a diagram illustrating a measuring method when measuring bending strength using a bending test piece cut out from the joined body of FIG. 1. FIG.
１ セラミックス部品Ａ ２ セラミックス部品Ｂ ３ ろう材 ４ 曲げ試験装置の上部支点 ５ 曲げ試験装置の下部支点 1 Ceramic parts A 2 Ceramic parts B 3 Brazing filler metal 4 Upper fulcrum of bending test device 5 Lower fulcrum of bending test device
Claims (1)
と金属とをろう接するろう材であって、Ｔｉを ０．１
〜２．０ ｗｔ％、Ｓｉを ０．０７ 〜１２．０ｗｔ
％含み、残部はＡｌと不可避的不純物とからなることを
特徴とするＡｌ−Ｓｉ−Ｔｉ３元合金ろう材。[Claim 1] A brazing material for soldering ceramics to each other or ceramics to metal, comprising Ti of 0.1
~2.0 wt%, Si 0.07 ~12.0 wt%
%, with the remainder consisting of Al and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357591A JPH04294890A (en) | 1991-03-22 | 1991-03-22 | Al-si-ti ternary alloy brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357591A JPH04294890A (en) | 1991-03-22 | 1991-03-22 | Al-si-ti ternary alloy brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04294890A true JPH04294890A (en) | 1992-10-19 |
Family
ID=13806306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8357591A Pending JPH04294890A (en) | 1991-03-22 | 1991-03-22 | Al-si-ti ternary alloy brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04294890A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6170738B1 (en) | 1996-06-28 | 2001-01-09 | Showa Aluminum Corporation | Aluminum brazing alloy for cold brazing and method for brazing low-melting aluminum material |
| CN102029480A (en) * | 2010-12-28 | 2011-04-27 | 西安交通大学 | Al-Si-Ti ternary active solder for aluminum-based composite material and preparation method thereof |
| JP2016216352A (en) * | 2010-05-21 | 2016-12-22 | セラマテック インコーポレイテッド | Ceramic-ceramic joining and related method therefor |
| WO2021177030A1 (en) * | 2020-03-03 | 2021-09-10 | 日立金属株式会社 | Aluminum-based brazing material and method for producing same, and method for producing ceramic composite substrate |
-
1991
- 1991-03-22 JP JP8357591A patent/JPH04294890A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6170738B1 (en) | 1996-06-28 | 2001-01-09 | Showa Aluminum Corporation | Aluminum brazing alloy for cold brazing and method for brazing low-melting aluminum material |
| JP2016216352A (en) * | 2010-05-21 | 2016-12-22 | セラマテック インコーポレイテッド | Ceramic-ceramic joining and related method therefor |
| US10000422B2 (en) | 2010-05-21 | 2018-06-19 | Coorstek, Inc. | Ceramic to ceramic joining method |
| CN102029480A (en) * | 2010-12-28 | 2011-04-27 | 西安交通大学 | Al-Si-Ti ternary active solder for aluminum-based composite material and preparation method thereof |
| WO2021177030A1 (en) * | 2020-03-03 | 2021-09-10 | 日立金属株式会社 | Aluminum-based brazing material and method for producing same, and method for producing ceramic composite substrate |
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