JPH04292617A - Maleimide resin composition - Google Patents
Maleimide resin compositionInfo
- Publication number
- JPH04292617A JPH04292617A JP5642491A JP5642491A JPH04292617A JP H04292617 A JPH04292617 A JP H04292617A JP 5642491 A JP5642491 A JP 5642491A JP 5642491 A JP5642491 A JP 5642491A JP H04292617 A JPH04292617 A JP H04292617A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- weight
- maleimide resin
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000011342 resin composition Substances 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 10
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 10
- 239000003607 modifier Substances 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 abstract description 4
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- LMBFAGIMSUYTBN-MPZNNTNKSA-N teixobactin Chemical compound C([C@H](C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H](CCC(N)=O)C(=O)N[C@H]([C@@H](C)CC)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H]1C(N[C@@H](C)C(=O)N[C@@H](C[C@@H]2NC(=N)NC2)C(=O)N[C@H](C(=O)O[C@H]1C)[C@@H](C)CC)=O)NC)C1=CC=CC=C1 LMBFAGIMSUYTBN-MPZNNTNKSA-N 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- -1 bis(phosphorus) titanium Chemical compound 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はマレイミド樹脂組成物、
特に多層積層用樹脂、導電性ペースト、電子素子保護膜
、接着剤、塗料、封止材料および成形材料の分野で有利
に用いることができる、耐熱性、可とう性、および耐ク
ラック性にすぐれたマレイミド樹脂組成物に関する。[Industrial Application Field] The present invention relates to a maleimide resin composition,
It has excellent heat resistance, flexibility, and crack resistance, and can be particularly advantageously used in the fields of multilayer lamination resins, conductive pastes, electronic device protective films, adhesives, paints, sealing materials, and molding materials. The present invention relates to a maleimide resin composition.
【０００２】0002
【従来の技術】近年、電子・電気機器、輸送機などの小
型軽量化、高性能化が進み、これに伴ない耐熱性および
耐湿性に優れた材料が望まれている。耐熱性樹脂として
はポリイミド樹脂が一般に知られているが、脱水縮合型
であるために反応に伴なって生じる縮合水のために硬化
物にボイドが発生しやすく、硬化物の信頼性を低下させ
る。一方、ポリイミド自身は不溶、不融であるので成形
が困難である。成形加工性を改良したポリイミドとして
ビスマレイミド樹脂が公知であるが、硬化物の架橋密度
が高いので、可とう性に乏しく、成形品にクラックが入
り易い。BACKGROUND OF THE INVENTION In recent years, electronic/electrical equipment, transportation equipment, etc. have become smaller, lighter, and more sophisticated, and as a result, materials with excellent heat resistance and moisture resistance have been desired. Polyimide resin is generally known as a heat-resistant resin, but since it is a dehydration condensation type, voids are likely to occur in the cured product due to condensation water generated during the reaction, reducing the reliability of the cured product. . On the other hand, since polyimide itself is insoluble and infusible, it is difficult to mold it. Bismaleimide resin is known as a polyimide with improved moldability, but since the cured product has a high crosslinking density, it has poor flexibility and is prone to cracks in molded products.
【０００３】0003
【発明が解決しようとする課題】本発明の目的は、上記
のような従来の技術の欠点を解消すること、換言すると
、広範囲の分野において有利に使用することのできる、
耐熱性、可とう性、および耐クラック性にすぐれたマレ
イミド樹脂組成物を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the drawbacks of the conventional techniques as described above, in other words, to provide a method that can be advantageously used in a wide range of fields.
An object of the present invention is to provide a maleimide resin composition having excellent heat resistance, flexibility, and crack resistance.
【０００４】0004
【課題を解決するための手段】上記課題は、マレイミド
樹脂を基材樹脂とし、[Means for solving the problem] The above problem is achieved by using maleimide resin as a base resin,
【化４】
式（１）で表される基を含む繰返し単位を１〜６個有す
るポリアリルフェノールを、マレイミド樹脂 １００重
量部に対して３０〜１２０ 重量部硬化剤として、加え
、かつエポキシ変性ポリブタジエンを、マレイミド樹脂
１００重量部に対して５〜８０重量部改質剤として、
加えたことを特徴とする、マレイミド樹脂組成物により
解決することができる。[Image Omitted] 30 to 120 parts by weight of polyallylphenol having 1 to 6 repeating units containing the group represented by formula (1) are added as a curing agent to 100 parts by weight of the maleimide resin, and epoxy-modified Polybutadiene is used as a modifier of 5 to 80 parts by weight per 100 parts by weight of maleimide resin,
The problem can be solved by a maleimide resin composition, which is characterized by the addition of the following.
【０００５】[0005]
【作用】本発明の組成物において基材樹脂として用いる
マレイミド樹脂は、一分子中に２個以上のマレイミド基
を持つものであれば、任意である。代表的なものとして
、ビスマレイミドやポリマレイミドなどが挙げられる。[Function] The maleimide resin used as the base resin in the composition of the present invention is arbitrary as long as it has two or more maleimide groups in one molecule. Typical examples include bismaleimide and polymaleimide.
【０００６】本発明の組成物において硬化剤として用い
るポリアリルフェノールは前述のように、式（１）で示
されるポリマーであり、As mentioned above, the polyallylphenol used as a curing agent in the composition of the present invention is a polymer represented by formula (1),
【化５】[C5]
【化６】
式（２），（３）で示されるポリマーを使用することが
できる。ポリアリルフェノールを硬化剤として用いるこ
とにより、硬化物の耐熱性が向上する。配合量はマレイ
ミド樹脂 １００重量部に対して３０〜１５０ 重量部
であることが望ましい。３０部未満では硬化反応が十分
に進まず、 １５０重量部を超えると硬化物の耐熱性が
劣下する。重合度が６を越える超えると、靱性が低下す
る。embedded image Polymers represented by formulas (2) and (3) can be used. By using polyallylphenol as a curing agent, the heat resistance of the cured product is improved. The blending amount is preferably 30 to 150 parts by weight per 100 parts by weight of the maleimide resin. If it is less than 30 parts, the curing reaction will not proceed sufficiently, and if it exceeds 150 parts by weight, the heat resistance of the cured product will deteriorate. When the degree of polymerization exceeds 6, toughness decreases.
【０００７】エポキシ変性ポリブタジエンは、繰返し単
位に含まれるポリブタジエンの二重結合をエポキシ化す
ることによって得られ、エポキシ化率は３〜４０％が望
ましい。３％未満でも、４０％を超えても、樹脂組成物
の可とう性向上の効果が得られない。エポキシ変性ポリ
ブタジエンはマレイミド樹脂 １００重量部に対して５
〜８０重量部添加することが望ましい。５重量部未満で
は添加効果が現れず、８０重量部を超えると硬化物の耐
熱性が低下する。Epoxy-modified polybutadiene is obtained by epoxidizing the double bonds of polybutadiene contained in repeating units, and the epoxidation rate is preferably 3 to 40%. Even if it is less than 3% or more than 40%, the effect of improving the flexibility of the resin composition cannot be obtained. Epoxy-modified polybutadiene is 5 parts per 100 parts by weight of maleimide resin.
It is desirable to add up to 80 parts by weight. If the amount is less than 5 parts by weight, no effect will be exhibited, and if it exceeds 80 parts by weight, the heat resistance of the cured product will decrease.
【０００８】なお本発明における組成物には必要に応じ
て以下の成分を添加することができる。
（１）マレイミド樹脂とポリアリルフェノールとの硬化
反応を促進させるための硬化促進剤。硬化促進剤として
は過酸化物などのラジカル重合開始剤、２−メチルイミ
ダゾールなどのイミダゾール系、トリフェニルホスフィ
ンなどのホスフィン系、ジアザビシクロウンデセン（Ｄ
ＢＵ） のフェノール塩などのＤＢＵ系を添加しても差
し支えない。[0008] The following components can be added to the composition of the present invention as necessary. (1) A curing accelerator for accelerating the curing reaction between maleimide resin and polyallylphenol. As a curing accelerator, radical polymerization initiators such as peroxide, imidazole type such as 2-methylimidazole, phosphine type such as triphenylphosphine, diazabicycloundecene (D
There is no problem in adding DBU-based substances such as phenol salts of BU).
【０００９】（２）溶融シリカ、結晶シリカ、アルミナ
、炭酸カルシウムなどの粉末状の無機質充填剤、および
ガラスファイバ、金属ファイバなど。充填剤の添加量は
組成物全体の３０〜８５重量％の範囲にあることが好ま
しい。３０重量％より少ないと添加効果が現れず、８５
重量％より多いと流れ性が低下して作業性が低下する可
能性が生ずる。(2) Powdered inorganic fillers such as fused silica, crystalline silica, alumina, and calcium carbonate, as well as glass fibers and metal fibers. The amount of filler added is preferably in the range of 30 to 85% by weight of the total composition. If it is less than 30% by weight, the addition effect will not appear, and 85
If the amount exceeds % by weight, flowability may decrease and workability may decrease.
【００１０】（３）無機質充填剤を添加する場合、樹脂
との相溶性を向上させるためのカップリング剤、例えば
３−アミノプロピルトリエトキシシランなどのシラン系
カップリング剤、あるいはテトラオクチルビス（ホスフ
ァイト）チタネートなどのチタン系カップリング剤など
である。カップリング剤の添加量は使用する無機質充填
剤の種類、量、比表面積およびカップリング剤の最小被
覆面積にもよるが、樹脂組成物 １００重量部に対して
０．１〜１５重量部が好ましい。(3) When adding an inorganic filler, a coupling agent for improving compatibility with the resin, such as a silane coupling agent such as 3-aminopropyltriethoxysilane, or a tetraoctyl bis(phosphorus) titanium-based coupling agents such as phyto) titanates. The amount of the coupling agent added depends on the type, amount, specific surface area, and minimum coverage area of the inorganic filler used, but is preferably 0.1 to 15 parts by weight per 100 parts by weight of the resin composition. .
【００１１】（４）離型補助剤としてカルナバワックス
、ステアリン酸およびその金属塩、モンタンワックスな
どを、難燃剤として臭素化エポキシ樹脂や、三酸化アン
チモンなどを、顔料としてカーボンブラックなどを添加
することができる。(4) Adding carnauba wax, stearic acid and its metal salts, montan wax, etc. as a mold release aid, brominated epoxy resin, antimony trioxide, etc. as a flame retardant, and carbon black, etc. as a pigment. Can be done.
【００１２】本発明の樹脂組成物は、上記の成分を、ロ
ール、ニーダー、エクストルーダーなどの手段を用いて
約６０〜１２０ ℃の温度で加熱することにより調製す
ることができ、また、アセトン、トルエンなどの有機溶
剤中に溶かして混合する溶剤混合法も選択できる。また
、本発明において、成形加工後のアフタキュアは、硬化
物中の未硬化エポキシ樹脂などの硬化反応を完結させる
ために、行うことが望ましい。成形加工した後のアフタ
キュアは成形加工時の温度と同程度の温度の恒温槽中所
定時間熱処理すればよい。The resin composition of the present invention can be prepared by heating the above-mentioned components at a temperature of about 60 to 120°C using a means such as a roll, a kneader, or an extruder. A solvent mixing method of dissolving and mixing in an organic solvent such as toluene can also be selected. Further, in the present invention, after-curing after molding is preferably performed in order to complete the curing reaction of the uncured epoxy resin in the cured product. The after-cure after molding may be heat-treated for a predetermined period of time in a constant temperature bath at a temperature similar to that during molding.
【００１３】[0013]
【実施例】次いで、実施例および比較例を参照しながら
本発明を説明する。
実施例１〜９
次の原材料を使用した。
マレイミド樹脂：三井東圧ビスマレイミドポリアリルフ
ェノール：式（２）で示されるポリマーエポキシ変性ポ
リブタジエン：出光石油化学 Ｐｏｌｙ ｂｄ Ｒ−４
５ＨＴEXAMPLES Next, the present invention will be explained with reference to Examples and Comparative Examples. Examples 1-9 The following raw materials were used. Maleimide resin: Mitsui Toatsu Bismaleimide Polyallylphenol: Polymer represented by formula (2) Epoxy-modified polybutadiene: Idemitsu Petrochemical Poly bd R-4
5HT
【００１４】表１に示す組成物は、原材料を一緒に加圧
ニーダーで混練することにより調製した。また試験片の
作製は以下のように行った。まず、混練により得られた
組成物を８メッシュパスのパウダーとし、このパウダー
をプレス金型に移し、 ２００℃、８０ｋｇ／ｃｍ２
にて２０分間圧縮成形したものをさらに ２００℃、８
時間の条件でアフターキュアした。The compositions shown in Table 1 were prepared by kneading the raw materials together in a pressure kneader. In addition, the test pieces were prepared as follows. First, the composition obtained by kneading was made into a powder with 8 mesh passes, this powder was transferred to a press mold, and the mixture was heated at 200℃ and 80kg/cm2.
Compression molded for 20 minutes at 200℃, 8
After cured under time conditions.
【００１５】このようにして得られた組成物について、
以下の特性評価を行った。
ガラス転移温度：熱機械分析装置（真空理工）にて測定
曲げ強度：ＪＩＳ Ｋ６９１１ による。
曲げ弾性率：ＪＩＳ Ｋ６９１１ による。
耐クラック性：成形冷却後の試料（１０×５×３０ｍｍ
）の断面を顕微鏡にて、評価。
ブリードアウト：成形品表面を実体顕微鏡にて目視する
。Regarding the composition thus obtained,
The following characteristics were evaluated. Glass transition temperature: Measured with a thermomechanical analyzer (Shinku Riko) Bending strength: According to JIS K6911. Flexural modulus: According to JIS K6911. Crack resistance: Sample after molding and cooling (10 x 5 x 30 mm
) was evaluated using a microscope. Bleedout: Visually inspect the surface of the molded product using a stereomicroscope.
【００１６】得られたマレイミド樹脂組成物の組成比お
よび特性評価を表１および２に示す。Tables 1 and 2 show the composition ratio and property evaluation of the maleimide resin composition obtained.
【表１】[Table 1]
【表２】
比較例１〜４
組成比を変えたことの他は、実施例１〜９と同様に行っ
た。その組成比および特性評価を表２に示す。[Table 2] Comparative Examples 1 to 4 The same procedures as Examples 1 to 9 were carried out except that the composition ratio was changed. Table 2 shows its composition ratio and characteristic evaluation.
【００１７】[0017]
【発明の効果】本発明によれば、基材樹脂としてのマレ
イミド樹脂に、ポリアリルフェノールを硬化剤として用
い、エポキシ変性ポリブタジエンを添加することにより
、耐熱性、可とう性、および耐クラック性に優れた樹脂
組成物を得ることができる。According to the present invention, heat resistance, flexibility, and crack resistance are improved by using polyallylphenol as a curing agent and adding epoxy-modified polybutadiene to maleimide resin as a base resin. An excellent resin composition can be obtained.
Claims (3)
１】 式（１）で表される基を含む繰返し単位を１〜６個有す
るポリアリルフェノールを、マレイミド樹脂 １００重
量部に対して３０〜１２０ 重量部硬化剤として、加え
、かつエポキシ変性ポリブタジエンを、マレイミド樹脂
１００重量部に対して５〜８０重量部改質剤として、
加えたことを特徴とする、マレイミド樹脂組成物。Claim 1: A maleimide resin is used as a base resin, and polyallylphenol having 1 to 6 repeating units containing a group represented by formula (1) is added in an amount of 30 parts by weight per 100 parts by weight of the maleimide resin. ~120 parts by weight as a curing agent, and 5 to 80 parts by weight of epoxy-modified polybutadiene as a modifier per 100 parts by weight of maleimide resin,
A maleimide resin composition comprising:
成物。2. The composition according to claim 1, wherein the polyarylphenol is a polymer represented by formula (2).
成物。3. The composition according to claim 1, wherein the polyarylphenol is a polymer represented by formula (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5642491A JPH04292617A (en) | 1991-03-20 | 1991-03-20 | Maleimide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5642491A JPH04292617A (en) | 1991-03-20 | 1991-03-20 | Maleimide resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04292617A true JPH04292617A (en) | 1992-10-16 |
Family
ID=13026718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5642491A Withdrawn JPH04292617A (en) | 1991-03-20 | 1991-03-20 | Maleimide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04292617A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018193850A1 (en) * | 2017-04-19 | 2018-10-25 | 昭和電工株式会社 | Curable resin composition, cured product thereof, and structure including cured product thereof |
| WO2020152906A1 (en) * | 2019-01-24 | 2020-07-30 | 昭和電工株式会社 | Thermosetting resin composition |
-
1991
- 1991-03-20 JP JP5642491A patent/JPH04292617A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018193850A1 (en) * | 2017-04-19 | 2018-10-25 | 昭和電工株式会社 | Curable resin composition, cured product thereof, and structure including cured product thereof |
| CN110225931A (en) * | 2017-04-19 | 2019-09-10 | 昭和电工株式会社 | Hardening resin composition, its solidfied material and the structural body comprising the solidfied material |
| JPWO2018193850A1 (en) * | 2017-04-19 | 2020-02-27 | 昭和電工株式会社 | Curable resin composition, cured product thereof, and structure containing the cured product |
| WO2020152906A1 (en) * | 2019-01-24 | 2020-07-30 | 昭和電工株式会社 | Thermosetting resin composition |
| JPWO2020152906A1 (en) * | 2019-01-24 | 2021-12-02 | 昭和電工株式会社 | Thermosetting resin composition |
| US20220112373A1 (en) * | 2019-01-24 | 2022-04-14 | Showa Denko K.K. | Thermosetting resin composition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |