JPH04271193A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPH04271193A JPH04271193A JP3290991A JP3290991A JPH04271193A JP H04271193 A JPH04271193 A JP H04271193A JP 3290991 A JP3290991 A JP 3290991A JP 3290991 A JP3290991 A JP 3290991A JP H04271193 A JPH04271193 A JP H04271193A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- thermoplastic resin
- wiring board
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 17
- 239000011347 resin Substances 0.000 abstract description 17
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000004049 embossing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 22
- 239000011229 interlayer Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Abstract
Description
【０００１】［発明の目的］[Object of the invention]
【０００２】0002
【産業上の利用分野】本発明は多層プリント配線板の製
造方法に係り、特に熱可塑性樹脂を絶縁層とし、かつ導
体パターン層間がブライドホールなどで電気的に接続さ
れた多層プリント配線板の製造方法に関する。[Industrial Application Field] The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to the manufacturing method of a multilayer printed wiring board in which a thermoplastic resin is used as an insulating layer and conductive pattern layers are electrically connected through blind holes or the like. Regarding the method.
【０００３】0003
【従来の技術】たとえば、電子機器類の小形化や回路機
能の向上などに対応して、電子部品を搭載・実装するプ
リント配線板においても、導体パターンの多層化が図ら
れている。すなわち、実装用プリント配線板などの構成
において、絶縁基板層内に所要の導体パターンを多層的
に内装させるとともに、所要の導体パターン層間をいわ
ゆるブライドホール、ベイリドホールおよびスルーホー
ルなどを介して電気的に接続した構成の多層プリント配
線板が広く実用に供されている。ところで、前記多層プ
リント配線板の構成において、熱可塑性樹脂を絶縁層と
したものも知られている。2. Description of the Related Art For example, in response to the miniaturization of electronic devices and improvement of circuit functions, printed wiring boards on which electronic components are mounted and mounted have multilayered conductor patterns. In other words, in the configuration of printed wiring boards for mounting, etc., the required conductor patterns are installed in multiple layers within the insulating substrate layer, and the required conductor pattern layers are electrically connected via so-called blind holes, bailed holes, through holes, etc. Multilayer printed wiring boards having a connected configuration are widely used in practical use. By the way, in the structure of the multilayer printed wiring board, one in which an insulating layer is made of thermoplastic resin is also known.
【０００４】しかして、この種の熱可塑性樹脂を絶縁層
とした多層プリント配線板は、一般に次のような手段を
経て製造されている。すなわち、ポリフェニレンサルフ
ァイド樹脂などから成る熱可塑性樹脂層（フイルム）を
用意し、この熱可塑性樹脂フイルムに所要のブライドホ
ールやベイリドホールを穿設する一方、それら各熱可塑
性樹脂フイルムの主面に、所要の導体パターンをたとえ
ば導電性ペーストの印刷により被着形成する。ここで、
互いに隣接して積層される各熱可塑性樹脂フイルムの主
面には、前記穿設したブライドホールやベイリドホール
に対応した位置に、ブライドホールやベイリドホール接
続を構成するため、当然的に導体パターンの一部が配置
される。このように所要の導体パターンなどを設けた熱
可塑性樹脂フイルムを積層して、加熱加圧成型を施すこ
とによって、前記ブライドホールやベイリドホール領域
などの熱可塑変形により、開口部に隣接している導体パ
ターンがブライドホールやベイリドホール内に押し出さ
れる形を成し、所要の電気的な接続が形成される。つま
り、結果的にブライドホールやベイリドホールなどによ
る電気的な接続層の形成は、導電性ペーストを用いた導
体パターンの印刷形成の際同時に行い得ることになるの
で、製造工程を簡略化し得るという利点がある。[0004] Multilayer printed wiring boards using this type of thermoplastic resin as an insulating layer are generally manufactured by the following method. That is, a thermoplastic resin layer (film) made of polyphenylene sulfide resin or the like is prepared, and while the required blind holes and bailed holes are bored in this thermoplastic resin film, the required The conductor pattern is deposited, for example, by printing a conductive paste. here,
Naturally, a part of the conductor pattern is formed on the main surface of each thermoplastic resin film stacked adjacent to each other in order to form a blind hole or bailed hole connection at a position corresponding to the drilled blind hole or bailed hole. is placed. By laminating the thermoplastic resin films provided with the required conductor patterns and subjecting them to heat and pressure molding, the conductors adjacent to the openings are deformed by thermoplastic deformation in the blind hole and bailed hole areas. The pattern is extruded into the blind hole or bailed hole to form the required electrical connection. In other words, as a result, the formation of electrical connection layers such as blind holes and bailed holes can be performed at the same time as printing and forming conductive patterns using conductive paste, which has the advantage of simplifying the manufacturing process. be.
【０００５】[0005]
【発明が解決しようとする課題】しかし、前記多層プリ
ント配線板の製造方法の場合は、得られた多層プリント
配線板において、信頼性の点で次のような問題がある。
すなわち、ブライドホールやベイリドホール領域におい
ては、加熱加圧成型時の熱可塑性樹脂の塑性変形で、所
要の電気的な接続を達成し得るが、積層体を貫通するい
わゆるスルホール接続の点に問題がある。換言するとス
ルホール接続も、前記加熱加圧成型の工程で、層間絶縁
層を成す各熱可塑性樹脂フイルムが熱軟化し、スルホー
ル領域では***してスルホールを埋め層間接続が実現さ
れることになる。しかして、この場合、（ａ） スルホ
ール領域で確実な樹脂***が生じスルホールを十分に導
電性ペーストが埋めること、 （ｂ）樹脂***後も導電
性ペーストにより確実に所要の導電性を保持することが
が要求される。しかし、（ａ） を実現するには熱可塑
性樹脂フイルムや導電性ペーストの材質、スルホールの
径および加熱加圧成型条件などにより大きく影響され、
仕様決定上大きな制約をうけることになる。また、（ｂ
） に関しては導電性ペーストを通常スクリーン印刷し
ているため、膜厚にバラツキが生じ易いうえ、加熱加圧
成型後には、導体粒子同士が離れてしまい導通の信頼性
が損なわれるばかりでなく、スルホール内壁面の導電性
ペースト層と***した樹脂層との接合箇所で切断分離が
しばしば起きるという問題がある。However, in the case of the method for manufacturing a multilayer printed wiring board, the following problems arise in terms of reliability in the obtained multilayer printed wiring board. That is, in the blind hole and bailed hole regions, the required electrical connection can be achieved by plastic deformation of the thermoplastic resin during hot-press molding, but there is a problem with so-called through-hole connections that penetrate the laminate. . In other words, in the through-hole connection, each thermoplastic resin film forming the interlayer insulating layer is thermally softened in the heating and pressure molding process, and rises in the through-hole region to fill the through-hole and realize the interlayer connection. Therefore, in this case, (a) reliable resin protrusion occurs in the through-hole area and conductive paste sufficiently fills the through-hole, and (b) required conductivity is reliably maintained by the conductive paste even after the resin protrudes. is required. However, achieving (a) is greatly influenced by the material of the thermoplastic resin film and conductive paste, the diameter of the through hole, and the heating and pressure molding conditions.
There will be major restrictions in determining specifications. Also, (b
), conductive paste is usually screen printed, which tends to cause variations in film thickness, and after heating and pressure molding, the conductor particles separate from each other, which not only impairs continuity reliability, but also causes through-holes. There is a problem in that cutting and separation often occurs at the joint between the conductive paste layer on the inner wall surface and the raised resin layer.
【０００６】本発明は上記事情に対処してなされたもの
で、熱可塑性樹脂層を層間絶縁層と成し、かつ信頼性の
高い層間接続の形成も可能な多層プリント配線板を容易
に得られる製造方法の提供を目的とする。The present invention has been made in response to the above-mentioned circumstances, and it is possible to easily obtain a multilayer printed wiring board in which a thermoplastic resin layer is used as an interlayer insulating layer, and in which highly reliable interlayer connections can be formed. The purpose is to provide a manufacturing method.
【０００７】［発明の構成］[Configuration of the invention]
【０００８】[0008]
【課題を解決するための手段】本発明に係る多層プリン
ト配線板の製造方法は、ブライドホール用ないしベイリ
ドホール用の孔を穿設した熱可塑性樹脂層の主面に所要
の導体パターンを被着形成する工程と、前記の熱可塑性
樹脂層を位置合せして重ね加熱加圧成型して一体化する
工程と、前記一体化した積層体の所定位置にスルホール
を穿設する工程と、前記スルホール内壁面に金属めっき
を施して積層体を貫通する導体層を被着形成する工程と
を具備することを特徴とする。[Means for Solving the Problems] A method for manufacturing a multilayer printed wiring board according to the present invention includes forming a required conductive pattern on the main surface of a thermoplastic resin layer in which holes for blind holes or bailed holes are formed. a step of aligning and stacking the thermoplastic resin layers and forming them under heat and pressure to integrate them; a step of drilling through holes at predetermined positions in the integrated laminate; The method is characterized by comprising a step of applying metal plating to the laminate to form a conductor layer penetrating the laminate.
【０００９】[0009]
【作用】本発明に係る多層プリント配線板の製造方法に
おいては、信頼性を確保し易いブライドホール接続ない
しベイリドホール接続を、熱可塑性樹脂の塑性変形など
で達成し、その後別途に積層体を貫通するスルホールを
穿設し、このスルホール内壁面に接続用の金属めっき層
を形成する。したがって、前記スルホール接続は、所定
位置に精度よく形成されるばかりでなく、電気的にも信
頼性の高いスルホール接続の成された多層プリント配線
板を容易に得ることが可能となる。[Function] In the method for manufacturing a multilayer printed wiring board according to the present invention, a blind hole connection or bailed hole connection that is easy to ensure reliability is achieved by plastic deformation of a thermoplastic resin, and then the laminate is separately penetrated. A through hole is bored, and a metal plating layer for connection is formed on the inner wall surface of the through hole. Therefore, the through-hole connections are not only formed at predetermined positions with high precision, but also it is possible to easily obtain a multilayer printed wiring board with electrically reliable through-hole connections.
【００１０】0010
【実施例】以下、本発明に係る多層プリント配線板の製
造方法の実施態様および使用態様例を模式的に示す図１
、図２、図３および図４を参照し、本発明の実施例を説
明する。先ず、厚さ５０μｍ ，長さ２００ｍｍ ，幅
２００ｍｍ のポリフェニレンサルファイド樹脂フイル
ム１を複数枚用意し、これらの樹脂フイルム１の所要箇
所（位置）に直径０．３ｍｍ のブライドホール用ない
しベイリドホール用の孔２を穿設した。次いで、前記樹
脂フイルム１主面に、たとえばポリスルフォン樹脂をバ
インダとして調製した銀ペーストをスクリーン印刷し、
所要の導体パターン３を被着形成した。しかる後、上記
導体パターン３を被着形成した樹脂フイルム１を、図１
に断面的に示すごとく位置合わせして積層し、熱プレス
によって２９５ ℃、約８×１０５ Ｐａの条件で、加
熱加圧成型して一体化した。このようにして得た積層体
４は、裁断して調べたところ、図１に断面的に示すよう
に、前記ブライドホールやベイリドホールを成す孔２に
、導体パターン３を形成するため被着した銀ペースト（
導体パターン３の一部）が押し出されて所要の電気的な
接続、すなわちブライドホール２ａおよびベイリドホー
ル２ｂが形成されていた。[Example] Below, FIG. 1 schematically shows an embodiment and usage example of the method for manufacturing a multilayer printed wiring board according to the present invention
, 2, 3 and 4, embodiments of the present invention will be described. First, a plurality of polyphenylene sulfide resin films 1 each having a thickness of 50 μm, a length of 200 mm, and a width of 200 mm are prepared, and holes 2 for blind holes or bailed holes with a diameter of 0.3 mm are formed at required locations (positions) on these resin films 1. was drilled. Next, a silver paste prepared using, for example, polysulfone resin as a binder is screen printed on the main surface of the resin film 1,
A required conductor pattern 3 was deposited and formed. After that, the resin film 1 with the conductive pattern 3 formed thereon is shown in FIG.
They were aligned and laminated as shown in the cross section, and then heated and pressed under conditions of 295° C. and approximately 8×10 5 Pa to be integrated. When the thus obtained laminate 4 was cut and examined, it was found that, as shown in cross section in FIG. paste(
A portion of the conductor pattern 3) was extruded to form the required electrical connection, that is, the blind hole 2a and the bailed hole 2b.
【００１１】次に、前記一体化した積層体４の所定位置
に、この積層体４を貫通する直径０．３ 〜０．８ｍｍ
のスルホール５を穿設した後、スルホール５内壁面に
選択的に無電解銅めっき処理を施し、図３に断面的に示
すようにスルホール５内壁面に導電性金属層５ａを被着
形成して多層プリント配線板を得た。[0011] Next, at a predetermined position of the integrated laminate 4, a diameter of 0.3 to 0.8 mm is inserted through the laminate 4.
After drilling the through hole 5, electroless copper plating treatment is selectively performed on the inner wall surface of the through hole 5, and a conductive metal layer 5a is deposited on the inner wall surface of the through hole 5, as shown in cross section in FIG. A multilayer printed wiring board was obtained.
【００１２】上記で得た多層プリント配線板は、たとえ
ば実装回路装置の構成に使用でき、図４に断面的に示す
ごとく、たとえばリード挿入形電子部品６のリードを前
記スルホール５に挿着して、リフローもしくはフロー半
田付けすることが可能である。すなわち、前記スルホー
ル５内壁面には導電性金属層５ａが一様かつ比較的強固
にに被着形成されているため、所要の電気的な導通機能
を確実に保持するばかりでなく、半田付けに対しても十
分に耐え得る。The multilayer printed wiring board obtained above can be used, for example, in the construction of a mounted circuit device, and as shown in cross section in FIG. , reflow or flow soldering is possible. That is, since the conductive metal layer 5a is uniformly and relatively firmly adhered to the inner wall surface of the through-hole 5, it not only reliably maintains the required electrical conduction function, but also facilitates soldering. It can withstand it well.
【００１３】なお、上記では熱可塑性樹脂フイルム（層
）として、ポリフェニレンサルファイド樹脂フイルムを
使用した例を示したが、たとえばポリエーテルイミド樹
脂フイルム、ポリエーテルエーテルケトン樹脂フイルム
、ポリエーテルスルフォン樹脂フイルム、ポリイミド樹
脂フイルムなど他の熱可塑性樹脂フイルム（層）、もし
くはこれらの樹脂をたとえば絶縁紙やクロス類に含侵被
着させた構成のものであってもよい。さらに、導体パタ
ーンの形成も前記銀ペースト以外に、熱可塑性樹脂をバ
インダとした他のペーストであっても勿論よいし、スル
ホール内壁面のめっき金属層の形成も、無電解銅めっき
以外の他の無電解めっきによっておこなうことも可能で
ある。[0013] In the above example, polyphenylene sulfide resin film was used as the thermoplastic resin film (layer), but for example, polyetherimide resin film, polyether ether ketone resin film, polyether sulfone resin film, polyimide Other thermoplastic resin films (layers) such as resin films, or structures obtained by impregnating and adhering these resins to, for example, insulating paper or cloth may also be used. Furthermore, the conductor pattern may be formed using other pastes other than the above-mentioned silver paste, of course, using thermoplastic resin as a binder, and the plating metal layer on the inner wall surface of the through holes may be formed using other pastes other than electroless copper plating. It is also possible to perform this by electroless plating.
【００１４】[0014]
【発明の効果】上記のように、本発明に係る多層プリン
ト配線板の製造方法によれば、所要のブライドホール接
続およびベイリドホール接続を簡易に、かつ確実に達成
し得るばかりでなく、信頼性の高いスルホール接続も所
定位置に精度よく形成し得る。換言すると、繁雑な操作
を要せずに歩留まりよく、しかも種種の環境下において
も信頼性の高い機能を常に呈する多層プリント配線板を
得ることが可能となった。Effects of the Invention As described above, according to the method for manufacturing a multilayer printed wiring board according to the present invention, not only can the required blind hole connections and bailed hole connections be easily and reliably achieved, but also the reliability can be improved. Tall through-hole connections can also be formed precisely in place. In other words, it has become possible to obtain a multilayer printed wiring board that does not require complicated operations, has a high yield, and always exhibits highly reliable functions even under various environments.
【図１】本発明に係る多層プリント配線板の製造方法に
おいてブライドホールおよびベイリドホールが穿設され
かつ導体パターンを設けた熱可塑性樹脂フイルムを積層
した態様を模式的に示す断面図。FIG. 1 is a cross-sectional view schematically showing an embodiment in which thermoplastic resin films in which blind holes and bailed holes are formed and conductor patterns are laminated in the method for manufacturing a multilayer printed wiring board according to the present invention.
【図２】本発明に係る多層プリント配線板の製造方法に
おいてブライドホールおよびベイリドホールが穿設され
かつ導体パターンを設けた熱可塑性樹脂フイルムを加熱
加圧成型により積層一体化した態様を模式的に示す断面
図。FIG. 2 schematically shows an embodiment in which thermoplastic resin films in which blind holes and bailed holes are bored and conductive patterns are laminated and integrated by heating and pressure molding in the method for manufacturing a multilayer printed wiring board according to the present invention. Cross-sectional view.
【図３】本発明に係る多層プリント配線板の製造方法で
製造した多層プリント配線板の構造例を示す断面図。FIG. 3 is a cross-sectional view showing a structural example of a multilayer printed wiring board manufactured by the method for manufacturing a multilayer printed wiring board according to the present invention.
【図４】本発明に係る多層プリント配線板の製造方法で
製造した多層プリント配線板に電子部品を実装した例を
示す断面図。FIG. 4 is a cross-sectional view showing an example in which electronic components are mounted on a multilayer printed wiring board manufactured by the method for manufacturing a multilayer printed wiring board according to the present invention.
Claims (1)
ル用の孔を穿設した熱可塑性樹脂層の主面に所要の導体
パターンを被着形成する工程と、前記の熱可塑性樹脂層
を位置合せして重ね加熱加圧成型して一体化する工程と
、前記一体化した積層体の所定位置にスルホールを穿設
する工程と、前記スルホール内壁面に金属めっきを施し
て積層体を貫通する導体層を被着形成する工程とを具備
することを特徴とする多層プリント配線板の製造方法。Claim 1: A step of forming a desired conductor pattern on the main surface of a thermoplastic resin layer in which a hole for a blind hole or a bailed hole is formed, and aligning and heating the thermoplastic resin layer. A process of pressure molding and integration, a process of drilling through holes at predetermined positions of the integrated laminate, and a process of applying metal plating to the inner wall surface of the through hole to form a conductor layer that penetrates the laminate. A method for manufacturing a multilayer printed wiring board, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3290991A JPH04271193A (en) | 1991-02-27 | 1991-02-27 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3290991A JPH04271193A (en) | 1991-02-27 | 1991-02-27 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04271193A true JPH04271193A (en) | 1992-09-28 |
Family
ID=12372026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3290991A Withdrawn JPH04271193A (en) | 1991-02-27 | 1991-02-27 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04271193A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003324283A (en) * | 2002-04-30 | 2003-11-14 | Ibiden Co Ltd | Multilayer printed wiring board |
-
1991
- 1991-02-27 JP JP3290991A patent/JPH04271193A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003324283A (en) * | 2002-04-30 | 2003-11-14 | Ibiden Co Ltd | Multilayer printed wiring board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |