JPH04267394A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH04267394A JPH04267394A JP2815091A JP2815091A JPH04267394A JP H04267394 A JPH04267394 A JP H04267394A JP 2815091 A JP2815091 A JP 2815091A JP 2815091 A JP2815091 A JP 2815091A JP H04267394 A JPH04267394 A JP H04267394A
- Authority
- JP
- Japan
- Prior art keywords
- content
- copper alloy
- flexible printed
- printed board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 24
- 239000011888 foil Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910052738 indium Inorganic materials 0.000 claims abstract description 6
- 229910052745 lead Inorganic materials 0.000 claims abstract description 5
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、例えばプリンターヘッ
ド部分等の駆動系統に使用されて、１万回〜１００万回
以上の屈曲がくり返されるフレキシブルプリント板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed board that is used, for example, in a drive system for a printer head, and is bent 10,000 to 1,000,000 times or more.
【０００２】0002
【従来の技術とその課題】この種のフレキシブルプリン
ト板は、図１に示すように、ポリエステル、ポリエチレ
ンテレフタレート、ポリアミド等の可撓性ベースフィル
ム１上に圧延焼鈍銅箔を加熱加圧接着し、この銅箔をエ
ッチング加工して所要の回路パターン２を形成したもの
である。[Prior Art and its Problems] As shown in FIG. 1, this type of flexible printed board is made by bonding rolled annealed copper foil under heat and pressure onto a flexible base film 1 made of polyester, polyethylene terephthalate, polyamide, etc. This copper foil is etched to form a required circuit pattern 2.
【０００３】しかしながら、その銅箔には、従来純銅が
使用されており、１万〜１００万回の屈曲をくり返すと
、回路パターン２のひび割れ等による断線が生じていた
。[0003] However, conventionally, pure copper has been used for the copper foil, and when the foil is bent 10,000 to 1,000,000 times, the circuit pattern 2 cracks and breaks.
【０００４】本発明は、以上の点に留意し、屈曲強度を
向上させることを課題とする。[0004] The present invention takes the above points into consideration and aims to improve the bending strength.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明にあっては、上記圧延焼鈍純銅箔に代えて、
本出願人の提案に係る下記の銅合金からなる圧延焼鈍箔
を採用したものである。[Means for Solving the Problems] In order to solve the above problems, in the present invention, instead of the above rolled annealed pure copper foil,
A rolled annealed foil made of the following copper alloy proposed by the present applicant is used.
【０００６】記
ＦｅおよびＰを含有し、その含有量が、Ｆｅ：０．０２
〜１重量％、Ｐ：Ｆｅ含有量に対して１５〜８０重量％
とされ、かつ、Ｉｎ、Ｓｎ、ＰｂおよびＳｂのうちの少
なくとも１種以上の物質を含有し、そのＦｅ、Ｐ以外の
物質の合計含有量が０．０１〜０．５重量％とされると
ともに、その物質各々の含有量が０．００６重量％以上
とされ、残部が銅から成る銅合金。[0006] Contains Fe and P, and the content is Fe: 0.02
~1% by weight, P: 15-80% by weight relative to Fe content
and contains at least one substance selected from In, Sn, Pb, and Sb, and the total content of substances other than Fe and P is 0.01 to 0.5% by weight. , a copper alloy in which the content of each of these substances is 0.006% by weight or more, and the balance is copper.
【０００７】上記銅合金は必らずＩｎを含有するものと
することができ、この場合にも、ＩｎとＳｎ、Ｐｂ又は
Ｓｂの合計含有量は０．０１ 〜０．５重量％とする。
また熱処理によりＦｅ−Ｐ化合物を析出させたものとす
ることができる。Ｆｅ、Ｐ以外の物質がＰｂのみの場合
は、その含有量は０．０５ 重量％以上とするとよい。
さらに、銅合金のＯ２ 含有量は５０ｐｐｍ 未満のも
のが好ましく、その組成金属の再結晶組織は５０％以下
とするとよい。
（特公昭６２−５６２１７号公報、特公昭６２−５６２
１８号公報、特開昭６１−６４８３４号公報、特開昭６
１−６４８３６号公報等参照）[0007] The above-mentioned copper alloy can necessarily contain In, and in this case as well, the total content of In, Sn, Pb, or Sb is 0.01 to 0.5% by weight. Alternatively, a Fe--P compound may be precipitated by heat treatment. When Pb is the only substance other than Fe and P, its content is preferably 0.05% by weight or more. Further, the O2 content of the copper alloy is preferably less than 50 ppm, and the recrystallized structure of the composition metal is preferably 50% or less. (Special Publication No. 62-56217, Special Publication No. 62-562
No. 18, JP-A-61-64834, JP-A-6
(Refer to Publication No. 1-64836, etc.)
【０００８】[0008]
【作用】上記の如く構成する本発明は、上記組成からな
る銅合金が、上記公報に記載のごとく、耐屈曲性に優れ
、導電性においても、純銅に比べて遜色がない。例えば
、疲労特性において、曲げ歪０．３０６％の条件では、
上記銅合金製の箔の破断屈曲回数が約１６．１万回に対
し、純銅箔のそれは約４．３万回と約４分の１であり、
曲げ歪０．２２％の条件では、上記銅合金箔：３１５０
万回以上、純銅箔：約１１．９３万回と約２６０分の１
以下、曲げ歪０．１８％の条件では、上記銅合金箔：６
２００万回以上、純銅箔：約２１．８万回と約２８０分
の１以下である。[Function] In the present invention constructed as described above, the copper alloy having the above composition has excellent bending resistance as described in the above publication, and is comparable to pure copper in terms of electrical conductivity. For example, in terms of fatigue properties, under the condition of bending strain of 0.306%,
The number of times the copper alloy foil breaks and bends is about 161,000 times, while that of pure copper foil is about 43,000 times, which is about one-fourth of that.
Under the condition of bending strain of 0.22%, the above copper alloy foil: 3150
More than 10,000 times, pure copper foil: about 119,300 times, about 1/260th
Below, under the condition of bending strain of 0.18%, the above copper alloy foil: 6
More than 2 million times, pure copper foil: about 218,000 times, less than 1/280th.
【０００９】[0009]
【実施例】図１に示すように、ポリアミドからなる５０
μｍ厚の可撓性ベースフィルム１上に、前記組成からな
る３０μｍ厚の圧延焼鈍銅合金箔２を加熱加圧接着し、
この銅合金箔２をエッチング加工して所要の回路パター
ン２（１．５ ｍｍ幅、１．０ ｍｍ間隔で１５条、図
面上は省略）を形成し、この回路パターン２上に約３０
μｍ厚のポリエステルフィルムを熱融着させて保護被膜
（図示せず）を施してフレキシブルプリント板Ｐを得た
。[Example] As shown in Figure 1, 50
A 30 μm thick rolled annealed copper alloy foil 2 having the above composition is bonded with heat and pressure on a μm thick flexible base film 1,
This copper alloy foil 2 is etched to form a required circuit pattern 2 (1.5 mm width, 15 stripes at 1.0 mm intervals, omitted in the drawing), and about 30 strips are formed on this circuit pattern 2.
A flexible printed board P was obtained by heat-sealing a μm-thick polyester film and applying a protective coating (not shown).
【００１０】また、前記組成からなる１００μｍ厚の圧
延焼鈍銅合金箔を、スリット加工して１．２ｍｍ幅の平
角箔条を形成し、この平角箔条を、１００μｍ厚のポリ
エステル製可撓性ベースフィルム１上に熱融着フィルム
を介して２．５４ｍｍのピッチで１５条引き揃えて回路
パターン２を形成し、この上に、ポリエステルの保護絶
縁フィルムを配して、この保護絶縁フィルムとベースフ
ィルム１を前記熱融着フィルムを介し熱融着してフレキ
シブルプリント板Ｐを得た。[0010] Further, a 100 μm thick rolled annealed copper alloy foil having the above composition is slit to form a 1.2 mm wide rectangular foil strip, and this rectangular foil strip is attached to a 100 μm thick polyester flexible base. A circuit pattern 2 is formed by aligning 15 stripes at a pitch of 2.54 mm on the film 1 via a heat-sealable film, and a polyester protective insulating film is placed on top of this, and this protective insulating film and base film are arranged. 1 was heat-sealed via the heat-sealing film to obtain a flexible printed board P.
【００１１】一方、比較例として、回路パターン２の材
料を純銅箔とし、その他は両実施例と同一としたものも
製作した。On the other hand, as a comparative example, a circuit pattern 2 was also manufactured in which the material was pure copper foil and the other features were the same as in both examples.
【００１２】この実施例と比較例のフレキシブルプリン
ト板Ｐを、第２図に示すように５ｍｍ径のマンドレル３
を介して実線←→鎖線のごとく繰返し屈曲を行った処、
実施例と比較例において、上記作用の項で記載した、銅
合金箔と純銅箔の疲労特性に基づく屈曲特性の差を得た
。[0012] The flexible printed boards P of this example and comparative example were placed on a mandrel 3 with a diameter of 5 mm as shown in Fig. 2.
After repeated bending as shown by the solid line ← → chain line,
In Examples and Comparative Examples, differences in bending properties based on the fatigue properties of copper alloy foils and pure copper foils were obtained, as described in the section on effects above.
【００１３】なお、上記の銅合金からなる細線を圧延し
て１００μｍ厚×１．２７ｍｍ幅の平角箔条を形成し、
その平角箔条でもって上記実施例と同様にフレキシブル
プリント板Ｐを製作したところ、同様な効果を得た。ま
た、銅合金に、請求項２に記載のものを使用しても、同
様な効果を得ることができ、Ｏ２ 含有量を５０ｐｐｍ
未満、組成金属の再結晶組織が５０％以下、又は熱処理
によりＦｅ−Ｐ化合物を析出させたものにあってはその
効果はより向上した。[0013] The thin wire made of the above copper alloy was rolled to form a rectangular foil strip with a thickness of 100 μm and a width of 1.27 mm.
When a flexible printed board P was manufactured using the rectangular foil strip in the same manner as in the above example, similar effects were obtained. Further, even if the copper alloy described in claim 2 is used, similar effects can be obtained, and the O2 content is reduced to 50 ppm.
The effect was further improved when the recrystallized structure of the composition metal was less than 50%, or when the Fe-P compound was precipitated by heat treatment.
【００１４】[0014]
【発明の効果】本発明は、以上の構成としたので、耐屈
曲性が非常に優れたものとなる。[Effects of the Invention] Since the present invention has the above structure, the bending resistance is extremely excellent.
【図１】フレキシブルプリント板の部分斜視図[Figure 1] Partial perspective view of flexible printed board
【図２】
屈曲特性試験説明図[Figure 2]
Flexural characteristic test explanatory diagram
１ 可撓性ベースフィルム ２ 導体回路パターン（銅合金箔） ３ マンドレル Ｐ フレキシブルプリント板 1 Flexible base film 2 Conductor circuit pattern (copper alloy foil) 3 Mandrel P Flexible printed board
Claims (5)
銅合金からなる圧延焼鈍箔により導体回路パターンを形
成したことを特徴とするフレキシブルプリント板。 記 ＦｅおよびＰを含有し、その含有量が、Ｆｅ：０．０２
〜１重量％、Ｐ：Ｆｅ含有量に対して１５〜８０重量％
とされ、かつ、Ｉｎ、Ｓｎ、ＰｂおよびＳｂのうちの少
なくとも１種以上の物質を含有し、そのＦｅ、Ｐ以外の
物質の合計含有量が０．０１〜０．５重量％とされると
ともに、その物質各々の含有量が０．００６重量％以上
とされ、残部が銅から成る銅合金。1. A flexible printed board characterized in that a conductive circuit pattern is formed on a flexible base film using a rolled annealed foil made of the following copper alloy. Contains Fe and P, the content of which is Fe: 0.02
~1% by weight, P: 15-80% by weight relative to Fe content
and contains at least one substance selected from In, Sn, Pb, and Sb, and the total content of substances other than Fe and P is 0.01 to 0.5% by weight. , a copper alloy in which the content of each of these substances is 0.006% by weight or more, and the balance is copper.
のとしたことを特徴とする請求項１記載のフレキシブル
プリント板。2. The flexible printed board according to claim 1, wherein the copper alloy necessarily contains In.
化合物を析出させたものであることを特徴とする請求項
１又は２に記載のフレキシブルプリント板。3. The copper alloy is made of Fe-P by heat treatment.
3. The flexible printed board according to claim 1, wherein a compound is precipitated.
０％以下であることを特徴とする請求項１乃至３のいず
れか１つに記載のフレキシブルプリント板。Claim 4: The recrystallized structure of the copper alloy composition metal is 5.
The flexible printed board according to any one of claims 1 to 3, characterized in that the content is 0% or less.
ｍ 未満としたことを特徴とする請求項１乃至４のいず
れか１つに記載のフレキシブルプリント板。Claim 5: The O2 content of the copper alloy is 50pp.
The flexible printed board according to any one of claims 1 to 4, wherein the flexible printed board is less than m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815091A JPH04267394A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815091A JPH04267394A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04267394A true JPH04267394A (en) | 1992-09-22 |
Family
ID=12240737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2815091A Pending JPH04267394A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04267394A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6051093A (en) * | 1996-06-07 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Mounting method of semiconductor element |
| EP1630239A1 (en) * | 2004-08-30 | 2006-03-01 | Dowa Mining Co., Ltd. | Copper alloy and method of manufacturing the same |
-
1991
- 1991-02-22 JP JP2815091A patent/JPH04267394A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6051093A (en) * | 1996-06-07 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Mounting method of semiconductor element |
| EP1630239A1 (en) * | 2004-08-30 | 2006-03-01 | Dowa Mining Co., Ltd. | Copper alloy and method of manufacturing the same |
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