JPH04264799A - Printed board mounted body - Google Patents
Printed board mounted bodyInfo
- Publication number
- JPH04264799A JPH04264799A JP4608191A JP4608191A JPH04264799A JP H04264799 A JPH04264799 A JP H04264799A JP 4608191 A JP4608191 A JP 4608191A JP 4608191 A JP4608191 A JP 4608191A JP H04264799 A JPH04264799 A JP H04264799A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- casing
- printed board
- ribs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 abstract description 7
- 241000264877 Hippospongia communis Species 0.000 abstract 1
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は通信機器等におけるプリ
ント基板を薄肉筐体に収納したプリント基板実装体に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board assembly in which a printed circuit board for communication equipment or the like is housed in a thin housing.
【０００２】0002
【従来の技術】従来、通信機器等におけるプリント基板
の実装体は、図３および図４に示すように、主機能部１
２と、それらを保護しかつ、外観を必要とする筐体１１
とで構成されている。主機能部１２はプリント基板１３
に電気１４，電子部品１５を実装（ＳＭＴ表面実装技術
）したものである。筐体１１は、外観を良くし上記主機
能部１２を固定するなどの目的でプラスチック等で上下
に分割されて製作され、この分割体１１ａ，１１ｂはプ
リント基板１３を収容してねじ１６止めにて合体してい
る。2. Description of the Related Art Conventionally, as shown in FIGS. 3 and 4, a mounted body of a printed circuit board in communication equipment, etc.
2, and a housing 11 that protects them and requires an appearance.
It is made up of. The main functional section 12 is a printed circuit board 13
Electrical parts 14 and electronic parts 15 are mounted on the board (SMT surface mounting technology). The casing 11 is manufactured by being divided into upper and lower parts made of plastic or the like for the purpose of improving the appearance and fixing the main function section 12. These divided bodies 11a and 11b accommodate the printed circuit board 13 and are secured with screws 16. are combined.
【０００３】最近は、通信機器、例えば、ポケットベル
受信機あるいはページング受信機といわれるような受信
用通信機器においては、携帯性を主眼として薄形（カー
ド型）のようなものも出現している。しかし、これらは
、金属板とフレームとを接着した構成を有し、プラスチ
ックのみでは作られていないのが実情である。[0003]Recently, thin (card-shaped) types of communication devices, such as receiving communication devices called pager receivers or paging receivers, have appeared with the main focus on portability. . However, the reality is that these have a structure in which a metal plate and a frame are glued together, and are not made only of plastic.
【０００４】これは、折曲げに対する強度が必要である
ことと、金属板をアンテナとして使うなど（公開実用新
案公報平２−９５９４３号参照）の理由によるものであ
る。そのため、ポケットに入れるものにしては、軽量化
に対する阻害要因になっている。This is due to the need for strength against bending and the use of a metal plate as an antenna (see Utility Model Publication No. 95943/1999). Therefore, it is an impediment to reducing the weight of the device when it is used in a pocket.
【０００５】したがって、プラスチックを用いて薄肉に
し、耐折曲げ強度を持たせるということが課題といえる
。上述したカード型のように薄くしようとする目的では
、プリント基板への電気，電子部品を片面に実装するの
が有利である。しかし、もう少し高機能で部品点数が多
くなると、平面積が大きくなりすぎ、実用的でなくなる
。そのため、高機能のものは、両面に部品を実装し、い
わゆる、ボックス型の筐体に収納実装するものが大部分
である。[0005] Therefore, the challenge is to use plastic to make it thin and have bending strength. For the purpose of making the card type thinner as described above, it is advantageous to mount electrical and electronic components on one side of the printed circuit board. However, if the functionality is a little higher and the number of parts increases, the surface area will become too large, making it impractical. Therefore, most high-performance devices have components mounted on both sides and are housed and mounted in a so-called box-shaped housing.
【０００６】[0006]
【発明が解決しようとする課題】ところで、ボックス型
の筐体に実装しようとするときは、プリント基板に実装
された部品の高さが不ぞろいであり、また、外部からの
押圧に対してプリント基板に実装された部品をこわさな
いようにしなければならないので、筐体の肉厚は、押圧
力に耐える厚さと、挟んだときに部品に触れないだけの
隙間とを設けておくことが必要になる。[Problems to be Solved by the Invention] By the way, when trying to mount components in a box-type housing, the heights of the components mounted on the printed circuit board are uneven, and the printed circuit board is susceptible to external pressure. Since it is necessary to avoid damaging the components mounted on the device, the wall thickness of the housing must be thick enough to withstand the pressing force and must have enough clearance to prevent the components from touching when sandwiched. .
【０００７】そのため、図３および図４に示すように、
従来の筐体では、その肉厚は、小型機器化しても割合に
厚いものが多く、例えば、全体積に対する筐体体積比は
、３０〜４０％にもなっている状況である。Therefore, as shown in FIGS. 3 and 4,
In many conventional cases, the wall thickness is relatively thick even when the device is miniaturized, and for example, the volume ratio of the case to the total volume is as high as 30 to 40%.
【０００８】これは、汎用プラスチックや汎用エンプラ
が多いためでもある。一方、曲げ弾性率の大きいスーパ
ーエンプラ等を使えば少しは肉厚を薄くすることは可能
であるが、コストは材料費で大幅に高くなってしまうた
め、一般にはなかなか普及していないのが実情である。[0008] This is also because there are many general-purpose plastics and general-purpose engineering plastics. On the other hand, it is possible to make the wall thickness slightly thinner by using super engineering plastics with a high bending modulus, but the cost is significantly higher due to material costs, so the reality is that this method is not widely used. It is.
【０００９】本発明は、上記の問題点にかんがみてなさ
れたもので、筐体が薄肉であっても耐折曲げ強度を高く
し、全体の小型軽量化を図ることができるようにしたプ
リント基板実装体の提供を目的とする。The present invention has been made in view of the above-mentioned problems, and provides a printed circuit board that has high bending strength even if the casing is thin, making it possible to reduce the overall size and weight. The purpose is to provide an implementation.
【００１０】0010
【課題を解決するための手段】上記目的を達成するため
本発明のプリント基板実装体は、通信機器等におけるプ
リント基板を薄肉のプラスチック筐体に収納したプリン
ト基板実装体において、筐体をプリント基板を挟むよう
に上下に分割し、各分割体の内側には、それぞれ、プリ
ント基板に実装された電気，電子部品間に介在するとと
もに互いに連結されて小部屋を形成するリブを設け、接
着剤を用いて、上記リブ端面をプリント基板に接着し、
プリント基板を分割体で挟んで一体に組み付けた構成と
してある。[Means for Solving the Problems] In order to achieve the above object, the printed circuit board assembly of the present invention is a printed circuit board assembly in which a printed circuit board for communication equipment, etc. is housed in a thin plastic housing, in which the housing is placed between the printed circuit board and the housing. The inner side of each divided body is provided with ribs that interpose between the electrical and electronic components mounted on the printed circuit board and are connected to each other to form a small chamber. to adhere the rib end surface to the printed circuit board using
It has a configuration in which the printed circuit board is sandwiched between divided bodies and assembled into one piece.
【００１１】[0011]
【作用】上記構成からなるプリント基板実装体によれば
、プリント基板と筐体とが一体化されるとともに、筐体
のリブが小部屋を形成するので剛性が大きくなり、筐体
が薄肉であっても、耐折曲げ強度が高くなる。[Function] According to the printed circuit board assembly having the above structure, the printed circuit board and the casing are integrated, and the ribs of the casing form a small chamber, so the rigidity is increased and the casing is thin. However, the bending strength increases.
【００１２】0012
【実施例】以下、本発明の実施例について図面を参照し
て説明する。図１は本発明の実施例係るプリント基板実
装体を示す分解斜視図、図２はその要部横断面図である
。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a printed circuit board assembly according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a main part thereof.
【００１３】図において、１は上下の分割体１ａ，１ｂ
に分割した筐体，２はプリント基板である。プリント基
板２には電気，電子部品３，４，５，６が実装されてい
る。In the figure, 1 indicates upper and lower divided bodies 1a and 1b.
2 is a printed circuit board. Electrical and electronic components 3, 4, 5, and 6 are mounted on the printed circuit board 2.
【００１４】また、各分割体１ａ，１ｂの内側には、そ
れぞれリブ７ａ，７ｂが設けられている。一般に、電気
，電子部品３，４，５，６は、プリント基板上に並べら
れているが、それらを接続する回路パターン部（図示せ
ず）があるため、実際に実装されている部品の面積比率
は５０％が実情である。そのため、部品間には隙間があ
る。上記筐体１の各分割体１ａ，１ｂの内側に設けられ
たリブ７ａ，７ｂは、これらの部品間の隙間に介在し、
互いに連結されて仕切られた小部屋（任意に配置）を形
成している。Furthermore, ribs 7a and 7b are provided inside each of the divided bodies 1a and 1b, respectively. Generally, electrical and electronic components 3, 4, 5, and 6 are arranged on a printed circuit board, but since there is a circuit pattern section (not shown) that connects them, the actual area of the mounted components is The actual ratio is 50%. Therefore, there are gaps between the parts. Ribs 7a and 7b provided inside each of the divided bodies 1a and 1b of the housing 1 are interposed in the gaps between these parts,
They are interconnected to form partitioned small rooms (arbitrarily arranged).
【００１５】また、熱硬化性の接着剤を用いて、上記リ
ブ７ａ，７ｂ端面をプリント基板２に接着し、プリント
基板２を分割体１ａ，１ｂで挟んで一体に組み付けてあ
る。Furthermore, the end surfaces of the ribs 7a and 7b are adhered to the printed circuit board 2 using a thermosetting adhesive, and the printed circuit board 2 is sandwiched between the divided bodies 1a and 1b and assembled into one piece.
【００１６】したがって、このプリント基板実装体を組
み立てるときは、プリント基板２と、前記リブ７ａ，７
ｂの端面との接する部位であって、プリント基板２上に
、数箇所熱硬化型の接着剤を塗布し（上下面）、プリン
ト基板２を挟むように上下の筐体１の分割体１ａ，１ｂ
を被せて加熱する。これにより、リブ７ａ，７ｂが、接
着剤により、プリント基板２に接着されて固定保持され
る。Therefore, when assembling this printed circuit board assembly, the printed circuit board 2 and the ribs 7a, 7
Thermosetting adhesive is applied to several places on the printed circuit board 2 that are in contact with the end surface of b (upper and lower surfaces), and the divided bodies 1a of the upper and lower casings 1 are attached so as to sandwich the printed circuit board 2 therebetween. 1b
Cover and heat. As a result, the ribs 7a and 7b are adhered and fixed to the printed circuit board 2 with the adhesive.
【００１７】そのため、組み立てられた後は、あたかも
ハニカム構造のような形態となり、剛性が大きくなる。[0017] Therefore, after being assembled, it has a form similar to a honeycomb structure, and its rigidity is increased.
【００１８】[0018]
【発明の効果】以上説明したように、本発明のプリント
基板実装体によれば、プリント基板と筐体とは一体化さ
れるとともに、筐体は小部屋状に仕切るリブによって、
いわゆるハニカム構造と同様の構造となることから、筐
体が薄肉であっても、耐折曲げ強度を高くすることがで
きる。そのため、機器全体の小型化軽量化を図ることが
できるという効果がある。[Effects of the Invention] As explained above, according to the printed circuit board assembly of the present invention, the printed circuit board and the casing are integrated, and the casing is partitioned into small chambers by ribs.
Since the structure is similar to a so-called honeycomb structure, even if the casing is thin, the bending strength can be increased. Therefore, there is an effect that the entire device can be made smaller and lighter.
【図１】本発明の実施例に係るプリント基板実装体を示
す分解斜視図である。FIG. 1 is an exploded perspective view showing a printed circuit board assembly according to an embodiment of the present invention.
【図２】実施例に係るプリント基板実装体の要部の断面
図である。FIG. 2 is a cross-sectional view of a main part of the printed circuit board mount according to the embodiment.
【図３】従来のプリント基板実装体を示す分解斜視図で
ある。FIG. 3 is an exploded perspective view showing a conventional printed circuit board assembly.
【図４】従来のプリント基板実装体の断面図である。FIG. 4 is a sectional view of a conventional printed circuit board mounting body.
１ 筐体 １ａ 分割体 １ｂ 分割体 ２ プリント基板 ３ 電気，電子部品 ４ 電気，電子部品 ５ 電気，電子部品 ６ 電気，電子部品 ７ａ リブ ７ｂ リブ １１ 筐体 １１ａ 分割体 １１ｂ 分割体 １２ 主機能部 １３ プリント基板 １４ 電気，電子部品 １５ 電気，電子部品 １６ ねじ 1 Housing 1a Split body 1b Split body 2 Printed circuit board 3 Electrical, electronic parts 4 Electrical, electronic parts 5 Electrical, electronic parts 6 Electrical, electronic parts 7a Rib 7b Rib 11 Housing 11a Split body 11b Split body 12 Main function section 13 Printed circuit board 14 Electrical, electronic parts 15 Electrical, electronic parts 16 Screw
Claims (1)
肉のプラスチック筐体に収納したプリント基板実装体に
おいて、筐体をプリント基板を挟むように上下に分割し
、各分割体の内側には、それぞれ、プリント基板に実装
された電気，電子部品間に介在するとともに互いに連結
されて小部屋を形成するリブを設け、接着剤を用いて、
上記リブ端面をプリント基板に接着し、プリント基板を
分割体で挟んで一体に組み付けたことを特徴とするプリ
ント基板実装体。Claim 1: In a printed circuit board assembly in which a printed circuit board for a communication device or the like is housed in a thin plastic housing, the housing is divided into upper and lower parts so as to sandwich the printed circuit board, and inside each divided body, there is a Ribs are provided between the electrical and electronic components mounted on the printed circuit board and are connected to each other to form small chambers, using adhesive.
A printed circuit board assembly characterized in that the rib end face is adhered to a printed circuit board, and the printed circuit board is sandwiched between dividing bodies and assembled together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4608191A JPH04264799A (en) | 1991-02-19 | 1991-02-19 | Printed board mounted body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4608191A JPH04264799A (en) | 1991-02-19 | 1991-02-19 | Printed board mounted body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04264799A true JPH04264799A (en) | 1992-09-21 |
Family
ID=12737041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4608191A Pending JPH04264799A (en) | 1991-02-19 | 1991-02-19 | Printed board mounted body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04264799A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293972A (en) * | 1996-04-24 | 1997-11-11 | Nec Corp | Compact electronic device |
| JP2005020470A (en) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | Electronic camera |
| JP2005119331A (en) * | 2003-10-14 | 2005-05-12 | Yazaki Corp | Electric junction box |
| US7583313B2 (en) | 2003-06-26 | 2009-09-01 | Kyocera Corporation | Imaging apparatus |
-
1991
- 1991-02-19 JP JP4608191A patent/JPH04264799A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293972A (en) * | 1996-04-24 | 1997-11-11 | Nec Corp | Compact electronic device |
| JP2005020470A (en) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | Electronic camera |
| US7583313B2 (en) | 2003-06-26 | 2009-09-01 | Kyocera Corporation | Imaging apparatus |
| JP2005119331A (en) * | 2003-10-14 | 2005-05-12 | Yazaki Corp | Electric junction box |
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