JPH0426168A - Electrostrictive effect element - Google Patents
Electrostrictive effect elementInfo
- Publication number
- JPH0426168A JPH0426168A JP2131852A JP13185290A JPH0426168A JP H0426168 A JPH0426168 A JP H0426168A JP 2131852 A JP2131852 A JP 2131852A JP 13185290 A JP13185290 A JP 13185290A JP H0426168 A JPH0426168 A JP H0426168A
- Authority
- JP
- Japan
- Prior art keywords
- shape memory
- case
- memory alloy
- sintered body
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000006386 memory function Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- HEPLMSKRHVKCAQ-UHFFFAOYSA-N lead nickel Chemical compound [Ni].[Pb] HEPLMSKRHVKCAQ-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Impact Printers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電歪縦効果を利用しな電歪効果素子に関し、特
にその金属ケースに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an electrostrictive element that does not utilize the electrostrictive longitudinal effect, and particularly to a metal case thereof.
従来、この種の電歪効果素子は、第７図に示すように電
歪セラミック部材と内部電極導体とを交互に積層し、一
体焼成し、外部電極導体を形成した績Ｍ焼結体３、また
は両面に電極導体を形成しな電歪セラミック単板を複数
枚接着し外部電極導体を形成した積層体と、前記積層焼
結体または積層体を取り囲み、底部が前記積層焼結体ま
たは積層体の一端と固着され前記Ｗ層焼結体またはＷ屠
体の分極方向に伸縮する機構を有する金属ケース７０と
、片面が前記積層焼結体または積層体のもう一端と固着
され前記積層体または積層焼結体の外部電極導体にリー
ド線６ａ、６ｂを介して電気的に接続されかつハーメチ
ックシールされた端子８ａ、８ｂを含みさらに前記金属
ケースとの接触部９０ａが溶接された平板状の金属ステ
ム９０を有していた。Conventionally, this type of electrostrictive effect element has a sintered body 3 in which an electrostrictive ceramic member and an internal electrode conductor are alternately laminated and integrally fired to form an external electrode conductor, as shown in FIG. or a laminate in which an external electrode conductor is formed by bonding a plurality of electrostrictive ceramic veneers without electrode conductors on both sides; a metal case 70 which is fixed to one end and has a mechanism that expands and contracts in the polarization direction of the W-layer sintered body or the W carcass; and one side is fixed to the other end of the laminated sintered body or the laminated body and has the laminated body or laminated body. A flat metal stem that includes hermetically sealed terminals 8a and 8b that are electrically connected to the external electrode conductor of the sintered body via lead wires 6a and 6b, and further has a welded contact portion 90a with the metal case. It had 90.
上述した従来の金属ケース入り電歪効果素子は、第７図
に示すとおり内部の積層焼結体又は積層体３に圧縮荷重
をかけておくことが信頼性上重要であるなめ、金属ケー
ス７０を積層体または積層焼結体３よりも短く製造し、
組立て時に凹凸部７０ａを機械的に引き伸ばしながら接
触部９０ａで溶接することにより積層焼結体または積層
体３に圧縮荷重をかけるという作業を行っており、これ
に高価な設備と多大な工数を要し、しかも必要な精度を
満たすことが困難であるという欠点がある。As shown in FIG. 7, in the conventional metal-cased electrostrictive effect element described above, it is important for reliability to apply a compressive load to the internal laminated sintered body or laminate 3, so the metal case 70 is used. Manufactured shorter than the laminate or laminate sintered body 3,
During assembly, a compressive load is applied to the laminated sintered body or laminate 3 by welding at the contact portion 90a while mechanically stretching the uneven portion 70a, which requires expensive equipment and a large number of man-hours. However, it has the disadvantage that it is difficult to meet the required accuracy.
本発明の目的は、金属ケースの凹凸部を機械的に引き伸
ばしながら溶接するという作業をなくし作業を格段に単
純にし、高価な設備と多大な工数を省き、しかも製品間
の荷重の大きさのばらつきを小さくし、素子の信頼性を
向上させた電歪効果素子を提供することにある。The purpose of the present invention is to significantly simplify the work by eliminating the work of welding while mechanically stretching the uneven parts of the metal case, to eliminate expensive equipment and a large number of man-hours, and to reduce the variation in load size between products. It is an object of the present invention to provide an electrostrictive effect element that has a reduced size and improved reliability of the element.
本発明の電歪効果素子は、電歪セラミック部材と内部電
極導体とを交互に積層し一体焼成し外部電極導体を形成
した積層焼結体、または両面に電極導体を形成した電歪
セラミック単板を複数枚接着し外部電極導体を形成した
１１層体と、前記積層焼結＃または積層体を取り囲み、
かつ前記蹟層焼結体または積層体の歪み方向に伸縮性を
有する金属ケースとを含む金属ケース入りの電歪効果素
子において、前記金属ケースの材質が形状記憶合金であ
ることを特徴として構成される。The electrostrictive effect element of the present invention is a laminated sintered body in which electrostrictive ceramic members and internal electrode conductors are alternately laminated and integrally fired to form an external electrode conductor, or an electrostrictive ceramic single plate in which electrode conductors are formed on both sides. an 11-layer body formed by bonding a plurality of layers to form an external electrode conductor, and surrounding the laminated sintered # or laminate,
and a metal case that is stretchable in the direction of strain of the sintered body or the laminate, wherein the metal case is made of a shape memory alloy. Ru.
前記積層焼結体または積層体をとり囲む金属ケースには
Ｔ ｉ −Ｎ ｉ −Ｃｕ−Ｚｎ−Ａｆ −Ｃｕ−Ａ、
１−Ｎｉ等の形状記憶合金が使用され、前記積層焼結体
長または積層体長よりも常温において短く形成されマル
テンサイト変Ｂ温度Ｍｓよりも低温に冷却した後、前記
積層焼結体または積層体長よりも長く加工され、Ｍｓ点
以下の温度で組立てられる。Ｍｓ点以下で、組立てるの
で引き伸ばしながら溶接する必要はない。組立て後オー
ステナイト変態温度Ａｓ点をこえた後当初の短く形成さ
れた形状にもどろうとするので、前記積層焼結体ｔたは
積層体に圧縮荷重をかけることができる。The metal case surrounding the laminated sintered body or the laminated body contains Ti-Ni-Cu-Zn-Af-Cu-A,
A shape memory alloy such as 1-Ni is used, and is formed to be shorter than the laminated sintered body length or the laminated body length at room temperature, and after being cooled to a temperature lower than the martensite B temperature Ms, it is formed shorter than the laminated sintered body or the laminated body length. It is also processed for a long time and assembled at temperatures below the Ms point. Since it is assembled below the Ms point, there is no need to weld it while stretching it. After assembling, after the austenite transformation temperature As point is exceeded, the laminate tries to return to its original short shape, so that a compressive load can be applied to the laminated sintered body t or the laminate.
次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例の電歪効果素子の縦断面図である。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view of an electrostrictive element according to an embodiment of the present invention.
また第２図は本発明に使用する形状記憶合金ケースおよ
び金属ステムを取り付ける前の積層焼結体の縦断面図、
第３図は完成した素子の外観斜視図である。FIG. 2 is a longitudinal sectional view of the laminated sintered body before attaching the shape memory alloy case and metal stem used in the present invention;
FIG. 3 is an external perspective view of the completed device.
先ず、第１図に示すように例えばニッケル・ニオブ酸鉛
Ｐｂ （Ｎ ｉ Ｉ／３ Ｎｂ２ｚｓ ） Ｏｓやチタ
ン酸鉛Ｐ ｂ Ｔ ｉ Ｏ３等を主成分とする電歪材料
の予焼粉末に、少量の有機バインダを添加し、この混合
物を有機溶媒中に分散させて泥漿を準備し、この泥漿で
スリップキャスティング成膜法等により層厚的１００μ
ｍの電歪セラミック部材ｌを形成する９次に、この電歪
セラミック部材１の片面に、重量比７：３の銀粉末とパ
ラジウム粉末との混合粉末を主成分とする導体ペースト
をスクリーン印刷等で約１０μｍ披着させて内部電極導
体２を形成してこれを複数積層して積層体を作成した後
、約１１００℃、２時間の条件で焼成した後側面を切断
して内部電［２１〜２□−１の端面が外部に露出しな状
態の角柱を作成する。次に、この角柱の対向する一対の
側面に露出した内部電極導体２１〜２ｆｌ−１の端部に
前述の側面において交互に電気泳動法等によりカラス粉
末の塗布および焼結を施して絶縁層４１へ一４ｎ−３を
形成する。続いて内部電極導体２１〜２ｎ−１を一層お
きに電気的に接続するために、銀粉末を主成分とする導
電ペーストを印刷塗布して焼成することにより、対の外
部電極導体５ａ、５ｂを形成し、全体で積層焼結体とす
る。さらに外部電極導体５ａ、５ｂと電気的に接続され
たリード線６ａ、６ｂを設置する。First, as shown in Fig. 1, a small amount of powder is added to a pre-fired powder of an electrostrictive material whose main components are nickel-lead niobate Pb (N i I/3 Nb2zs ) Os, lead titanate P b T i O3, etc. A slurry is prepared by adding an organic binder of
Next, on one side of the electrostrictive ceramic member 1, a conductive paste containing a mixed powder of silver powder and palladium powder at a weight ratio of 7:3 is applied by screen printing, etc. The internal electrode conductor 2 was formed by depositing the internal electrode conductor 2 to a thickness of approximately 10 μm, and a plurality of these were laminated to form a laminate. 2 Create a prism with the end face of □-1 not exposed to the outside. Next, glass powder is applied and sintered by electrophoresis or the like alternately on the aforementioned side surfaces to the ends of the internal electrode conductors 21 to 2fl-1 exposed on a pair of opposing side surfaces of this prism, thereby forming an insulating layer 41. Form 4n-3. Next, in order to electrically connect the internal electrode conductors 21 to 2n-1 every other layer, a conductive paste containing silver powder as a main component is applied by printing and fired to form the pair of external electrode conductors 5a and 5b. The whole is made into a laminated sintered body. Furthermore, lead wires 6a and 6b electrically connected to the external electrode conductors 5a and 5b are installed.
次に、Ｃｕ−Ｚ ｎ −Ａ、 １２系の形状記憶合金を
常温において片開円筒状に冷間圧延しさらに液圧押し込
み法により円筒の一部に凹凸部７ａを設け、しかもＭ
Ｎ Ｆｉ結体長２０ｍｍよりも約１ｍｍ短く成形した後
、形状記憶合金ケースをこの材料のＭｓ点−３６，５℃
以下の一４０℃に冷却し、外部より凹凸部７ａを支持し
ながら円柱状の治具を押し込み積層焼結体長よりも約１
ｍｒｎ長く引き延ばす。Next, a shape memory alloy of Cu-Zn-A, 12 series was cold-rolled into a single open cylinder shape at room temperature, and an uneven part 7a was provided in a part of the cylinder by a hydraulic indentation method.
After forming the N-Fi body to be approximately 1 mm shorter than the 20 mm length, the shape memory alloy case was molded to the Ms point of this material at -36.5°C.
Cool to 140°C below, and push in a cylindrical jig while supporting the uneven portion 7a from the outside by about 1 inch longer than the length of the laminated sintered body.
Stretch it out for a long time.
さらに積層焼結体の上下面にエポキシ樹脂等の接着剤を
塗布し２ハーメチツクシールされた鉄合金、銅合金、ニ
ッケル等からなる一対の外部端子８ａ、８ｂを有し、Ｃ
ｕ−Ｚｎ系合金からなる円板状の金属ステム９と、−４
０℃の温度に保たれている形状記憶合金ケースで積層焼
結体をとり囲み１０〜２０ワット秒程度のスポット溶接
ですばやく両者を所定位置に固定する。形状記憶合金ケ
ースの温度がＡｓ点−２８，３℃を越えると当初の形状
に縮もうとすることで積層焼結体に圧縮荷重的４ｋｇが
かかる。尚、ケース入れの前にリード線６ａ、６ｂを外
部端子８ａ、８ｂに半田付けあるいは溶着等でそれぞれ
電気的に接続しておく。Furthermore, it has a pair of external terminals 8a and 8b made of iron alloy, copper alloy, nickel, etc., which are hermetically sealed by applying an adhesive such as epoxy resin to the upper and lower surfaces of the laminated sintered body.
A disk-shaped metal stem 9 made of a u-Zn alloy, and -4
The laminated sintered body is surrounded by a shape memory alloy case maintained at a temperature of 0° C., and both are quickly fixed in place by spot welding at approximately 10 to 20 watt seconds. When the temperature of the shape memory alloy case exceeds the As point of -28.3° C., it tries to shrink to its original shape, and a compressive load of 4 kg is applied to the laminated sintered body. Incidentally, before putting the case into the case, the lead wires 6a and 6b are electrically connected to the external terminals 8a and 8b by soldering, welding, etc., respectively.
最後に真空中、ドライエアー、不活性ガス中で金属ケー
ス７と形状記憶合金ステム９の接触部９ａをレーザービ
ーム溶接、エレクＩ・ロンビーム溶接法、抵抗溶接法、
ＴＩＧ溶接法等で封止して完成する。Finally, in a vacuum, dry air, or inert gas, the contact portion 9a between the metal case 7 and the shape memory alloy stem 9 is welded by laser beam welding, Elec I long beam welding method, resistance welding method,
It is completed by sealing using TIG welding method.
第４図は本発明の他の実施例の縦断面図である。第５図
、第６図は第４図に示す第２の実施例の電歪効果素子の
形状記憶合金ケースの縦断面図を示す。第１の実施例と
同様の組成の形状記憶合金を常温において第５図の形状
、大きさに第１の実施例と同様の方法により成形する。FIG. 4 is a longitudinal sectional view of another embodiment of the invention. 5 and 6 are longitudinal cross-sectional views of the shape memory alloy case of the electrostrictive element of the second embodiment shown in FIG. 4. FIG. A shape memory alloy having the same composition as in the first example is molded at room temperature into the shape and size shown in FIG. 5 by the same method as in the first example.
さらに、この形状記憶合金ケースをＭｓ点−３６，５℃
以下の一４０℃に冷却し、この温度に保ちなからテーバ
のついた治具により第６図により第６図のように開口部
の径を広げ長さを素子長よりも伸ばし、４０℃にて保存
する。第５図（ａ）、（ｂ）。Furthermore, the Ms point of this shape memory alloy case is -36.5°C.
Cool it to 140℃ below, and while keeping it at this temperature, use a tapered jig to widen the diameter of the opening as shown in Figure 6, making the length longer than the element length, and cool it to 40℃. and save it. Figures 5(a) and (b).
第６図（ａ＞、（ｂ）は長さの比較のための内部の積層
焼結体を示す。FIGS. 6(a) and 6(b) show internal laminated sintered bodies for length comparison.
次に、第１の実施例と同様の積層焼結体３の上下面にエ
ポキシ樹脂等の接着剤を塗布し、ハーメチックシールさ
れた鉄合金、銅合金、ニッケル等からなる一対の外部端
子８ａ、８ｂを有し、Ｃｕ−Ｚｎ系合金からなる円板状
の金属ステム９と、−４０℃に保たれている形状記憶合
金ケースで積層焼結体３をとり囲む。形状記憶合金ケー
スの温度がＡｓ点−２８，３°Ｃをこえると、第６図の
開口部か当初の径にもどり金属ステムの溝に形状記憶合
金ケースの突起が引っかかると同時に凹凸部７ａが収縮
し積層焼結体３に圧縮荷重がかかる。尚、ケース入れの
前にリード線６ａ、６ｂを外部端子８ａ、、８ｂに半田
付け、あるいは溶着等でそれぞれ電気的に接続しておく
。Next, an adhesive such as epoxy resin is applied to the upper and lower surfaces of the laminated sintered body 3 similar to the first embodiment, and a pair of external terminals 8a made of iron alloy, copper alloy, nickel, etc. are hermetically sealed. The laminated sintered body 3 is surrounded by a disk-shaped metal stem 9 made of a Cu-Zn alloy and a shape memory alloy case maintained at -40°C. When the temperature of the shape memory alloy case exceeds the As point -28.3°C, the opening shown in Fig. 6 returns to its original diameter, and the protrusion of the shape memory alloy case gets caught in the groove of the metal stem, and at the same time the uneven portion 7a is formed. It contracts and a compressive load is applied to the laminated sintered body 3. Incidentally, before putting the case into the case, the lead wires 6a, 6b are electrically connected to the external terminals 8a, 8b by soldering, welding, etc., respectively.
最後に第１の実施例と同様の方法で接触部９ａを溶接封
止して完成する。Finally, the contact portion 9a is welded and sealed in the same manner as in the first embodiment.
なお図面で断面図は輪郭を重点にし斜線を削除した。In the drawings, cross-sectional views have been focused on outlines and diagonal lines have been removed.
以上説明したように本発明は、裸の積層焼結体または積
層体を圧縮荷重をかけながら金属ケースで密閉するとい
う作業において、金属ケース材質に形状記憶合金を用い
てその形状記憶作用を利用することにより、作業を格段
に単純にし、高価な設備と多大な工数を省きしかも製品
間の荷重の大きさのばらつきを小さくし素子の信頼性を
向上さぜるという効果がある。As explained above, the present invention utilizes the shape memory effect of a shape memory alloy by using a shape memory alloy as the metal case material in the work of sealing a bare laminated sintered body or laminate with a metal case while applying a compressive load. This has the effect of significantly simplifying the work, eliminating expensive equipment and a large number of man-hours, and reducing the variation in load magnitude between products and improving the reliability of the device.
尚、Ｔｊ−Ｎｉ、Ｃｕ−Ａ１１−Ｎｉ系の形状記憶合金
を用いても同様の効果が得られることは自明である。It is obvious that the same effect can be obtained by using shape memory alloys such as Tj-Ni and Cu-A11-Ni.
第１図は本発明の一実施例の電歪効果素子の縦断面図、
第２図は第１図に示ず一実施例に使用する績ＮＩ焼結体
のみの構造を示す縦断面図、第３図は第１図に示す本発
明の一実施例の外観斜視図、第４図は本発明の他の実施
例の縦断面図、第５図（ａ＞は本発明の他の実施例の形
状記憶合金ケースの常温における縦断面図、第６図（ａ
）は第２の実施例の形状記憶合金ケースのＭｓ点３６．
５℃以下に冷却した後に加工したものの縦断面図、第５
図（ｂ）、第６図（ｂ）は、内部に入れる積層焼結体を
長さの比較のために並べ°ζ書いたものである。第７図
は従来の金属ケース入り電歪効果素子の縦断面図である
。
１１〜１ｎ・・・電歪セラミック部材、２１〜２．、−
・・・内部電極導体、３・・・積層焼結体、４１〜４．
、−Ｉ・・・絶縁層、５ａ、５ｂ・・・外部電極導体、
６ａ、６ｂ・・・リード線、７・・・形状記憶合金ケー
ス、７ａ・・・凹凸部、８ａ、８ｂ・・・外部端子、９
・・・金属ステム、１１・・・接着剤、７０・・・金属
ケース、７０ａ・・凹凸部、９０・・・金属ステム、９
０ａ・・・接触部。FIG. 1 is a longitudinal cross-sectional view of an electrostrictive effect element according to an embodiment of the present invention;
FIG. 2 is a vertical cross-sectional view showing only the structure of the Ni sintered body used in one embodiment, which is not shown in FIG. 1; FIG. 3 is an external perspective view of one embodiment of the present invention shown in FIG. 1; FIG. 4 is a longitudinal sectional view of another embodiment of the present invention, FIG.
) is the Ms point 36. of the shape memory alloy case of the second embodiment.
Longitudinal cross-sectional view of the processed product after cooling to 5°C or less, No. 5
In Figures (b) and 6(b), the laminated sintered bodies to be placed inside are arranged side by side for length comparison. FIG. 7 is a longitudinal cross-sectional view of a conventional electrostrictive effect element housed in a metal case. 11-1n...electrostrictive ceramic member, 21-2. ,−
... Internal electrode conductor, 3... Laminated sintered body, 41-4.
, -I... Insulating layer, 5a, 5b... External electrode conductor,
6a, 6b... Lead wire, 7... Shape memory alloy case, 7a... Uneven part, 8a, 8b... External terminal, 9
...Metal stem, 11...Adhesive, 70...Metal case, 70a...Irregularities, 90...Metal stem, 9
0a...Contact part.
Claims (1)
一体焼成し外部電極導体を形成した積層焼結体または両
面に電極導体を形成した電歪セラミック単板を複数枚接
着し外部電極導体を形成した積層体と、前記積層焼結体
または積層体を取り囲み、かつ前記積層焼結体または積
層体の歪み方向に伸縮性を有する金属ケースとを含む金
属ケース入りの電歪効果素子において、前記金属ケース
の材質が、形状記憶合金であることを特徴とする電歪効
果素子。A laminated sintered body in which electrostrictive ceramic members and internal electrode conductors are alternately laminated and integrally fired to form an external electrode conductor, or an external electrode conductor is formed by bonding multiple electrostrictive ceramic veneers with electrode conductors formed on both sides. and a metal case that surrounds the laminated sintered body or the laminated body and has elasticity in the direction of strain of the laminated sintered body or the laminated body. An electrostrictive effect element characterized in that the material of the case is a shape memory alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2131852A JPH0426168A (en) | 1990-05-22 | 1990-05-22 | Electrostrictive effect element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2131852A JPH0426168A (en) | 1990-05-22 | 1990-05-22 | Electrostrictive effect element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426168A true JPH0426168A (en) | 1992-01-29 |
Family
ID=15067628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2131852A Pending JPH0426168A (en) | 1990-05-22 | 1990-05-22 | Electrostrictive effect element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426168A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1849993A1 (en) * | 2006-04-25 | 2007-10-31 | Delphi Technologies, Inc. | Protective encapsulation |
-
1990
- 1990-05-22 JP JP2131852A patent/JPH0426168A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1849993A1 (en) * | 2006-04-25 | 2007-10-31 | Delphi Technologies, Inc. | Protective encapsulation |
| WO2007125301A1 (en) * | 2006-04-25 | 2007-11-08 | Delphi Technologies, Inc. | Protective encapsulation |
| JP4917149B2 (en) * | 2006-04-25 | 2012-04-18 | デルファイ・テクノロジーズ・ホールディング・エス．アー．エール．エル． | Protective encapsulation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0144655B1 (en) | Electrostriction transducer comprising electrostriction layers of axially varied thicknesses | |
| JP2699619B2 (en) | Electrostrictive effect element | |
| JPH065401A (en) | Chip type resistor element and semiconductor device | |
| US4734755A (en) | Alternating load stable switchable semiconductor device | |
| US3523173A (en) | Insulated lead connection | |
| JPH0426168A (en) | Electrostrictive effect element | |
| DE3913066A1 (en) | Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating | |
| JPS63153870A (en) | Electrostrictive effect element | |
| US4106184A (en) | Method for making fused solid electrolyte capacitor assemblages and a fused capacitor made thereby | |
| US3528102A (en) | Semiconductor header assembly and method of fabrication thereof | |
| US4227300A (en) | Method for the electrical bonding of thin film tantalum capacitor networks to other networks | |
| JP2645559B2 (en) | Multilayer solid electrolytic capacitor and manufacturing method thereof | |
| JP3624740B2 (en) | Ceramic electronic components | |
| JPS63253678A (en) | Thermoelectric conversion device | |
| JPH0521291A (en) | Solid electrolytic capacitor | |
| JPH02125674A (en) | Electrostrictive element | |
| JP2000022013A (en) | Manufacture of electronic component | |
| JPH0668949A (en) | Lightning arrester | |
| JPH04105374A (en) | Piezoelectric actuator | |
| JPH09162451A (en) | Piezo-electric multilayered body | |
| JP2537130Y2 (en) | Thermal battery | |
| JPH0465087A (en) | Gas seal type lightning arrester | |
| JPH04334075A (en) | Piezoelectric actuator | |
| JPH0249310A (en) | Sensor member | |
| JPS6020930Y2 (en) | Double-sided cooling type semiconductor device |