JPH04247680A - Substrate projection portion cutting device - Google Patents
Substrate projection portion cutting deviceInfo
- Publication number
- JPH04247680A JPH04247680A JP1355491A JP1355491A JPH04247680A JP H04247680 A JPH04247680 A JP H04247680A JP 1355491 A JP1355491 A JP 1355491A JP 1355491 A JP1355491 A JP 1355491A JP H04247680 A JPH04247680 A JP H04247680A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- rotary table
- board
- wiring
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 118
- 238000005520 cutting process Methods 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007779 soft material Substances 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は例えば配線基板において
基板の表面に形成した配線の凸部を切断除去する基板凸
部切断装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate protrusion cutting device for cutting and removing protrusions of wiring formed on the surface of a wiring board, for example.
【０００２】0002
【従来の技術】配線基板において基板１の表面に配線を
形成する方法として、図６に示すように基板１の表面か
ら離れて立ち上がる凸部３を有する配線２を基板１の表
面に形成し、次いで凸部３を切断除去して配線２を分断
する方法がある。図中４は基板１の他の面に形成した配
線である。この配線形成方法においては、配線２の凸部
３を切断する工程で、基板１を搬送しながら配線２の凸
部３を切断する装置が使用されている。2. Description of the Related Art As a method for forming wiring on the surface of a substrate 1 in a wiring board, as shown in FIG. Next, there is a method of cutting and removing the convex portion 3 and dividing the wiring 2. In the figure, reference numeral 4 indicates wiring formed on the other surface of the substrate 1. In this wiring forming method, in the process of cutting the protrusions 3 of the wiring 2, an apparatus is used that cuts the protrusions 3 of the wiring 2 while transporting the substrate 1.
【０００３】従来、配線基板には、一般的にフェノ−ル
フ樹脂などの軟質な材料で形成した基板が用いられてい
る。従来の配線の凸部を切断する装置としては、この基
板の材料を考慮して次に述べるものが用いられている。Conventionally, wiring boards have generally been made of a soft material such as phenol resin. As a conventional device for cutting convex portions of wiring, the following device is used in consideration of the material of the substrate.
【０００４】図７に示すようにＶ溝ロ−ラ５、６を対向
して配置し、基板１を回転する各Ｖ溝ロ−ラ５、６の間
に通すことにより、基板１を各Ｖ溝ロ−ラ５、６の溝部
で支えて搬送しながらＶ溝ロ−ラ５、６の下側に設けた
カッタ７で配線２の凸部３を切断する装置である。この
カッタ７は円盤形をなすもので、回転させて凸部３を切
断する。As shown in FIG. 7, V-groove rollers 5 and 6 are arranged facing each other, and the substrate 1 is passed between the rotating V-groove rollers 5 and 6, thereby allowing the substrate 1 to be placed between each V-groove roller 5 and 6. This device cuts the convex portion 3 of the wiring 2 with a cutter 7 provided below the V-groove rollers 5 and 6 while supporting and conveying it with the grooves of the groove rollers 5 and 6. This cutter 7 is disk-shaped and cuts the convex portion 3 by rotating it.
【０００５】[0005]
【発明が解決しようとする課題】ところで、最近の電子
機器の高度化に応じて配線基板に用いる基板として、軟
質材料に代えて電気絶縁性や熱伝導性に優れたセラミッ
クスで形成したものが採用されつつある。そして、この
セラミックスからなる基板を用いた配線基板においても
、基板に形成した配線の凸部を切断除去するために従来
の方式の装置が用いてられている。このセラミックスか
らなる基板は大変硬度が高いために、従来の方式の装置
を用いて配線の凸部を切断する上で次に述べる問題があ
る。[Problem to be solved by the invention] By the way, in response to the recent advancement of electronic devices, substrates made of ceramics with excellent electrical insulation and thermal conductivity are being used instead of soft materials for wiring boards. It is being done. Even in wiring boards using ceramic substrates, conventional devices are used to cut and remove convex portions of wiring formed on the substrate. Since this ceramic substrate has very high hardness, there is a problem described below when cutting the convex portion of the wiring using a conventional type of device.
【０００６】すなわち、基板の幅寸法や厚さ寸法は製造
上の誤差によりバラツキがある。従来の基板は軟質な材
料からなるものであったため、図７に示すように基板１
の幅寸法が大きく基板１が平坦なままでＶ溝ロ−ラ５、
６の溝部に入らない場合でも、基板１自体が撓んでＶ溝
ロ−ラ５、６の溝部間に入ることを可能としている。That is, the width and thickness of the substrate vary due to manufacturing errors. Since conventional substrates were made of soft materials, the substrate 1 as shown in FIG.
The V-groove roller 5 has a large width and the substrate 1 remains flat.
Even if the substrate 1 does not fit into the grooves of the V-groove rollers 5 and 6, it is possible for the substrate 1 itself to bend and fit between the grooves of the V-groove rollers 5 and 6.
【０００７】しかし、セラミックスからなる基板１は堅
くて撓まないために、基板１の幅寸法が大きい場合には
、基板１を平坦なままでＶ溝ロ−ラ５、６の溝部に入れ
ることができず、配線２の凸部３の切断ができなくなり
、無理にＶ溝ロ−ラ５、６の間に入ると基板１がＶ溝ロ
−ラ５、６に押し潰されて破損することがある。However, since the substrate 1 made of ceramics is hard and does not bend, if the width of the substrate 1 is large, it is difficult to insert the substrate 1 flat into the grooves of the V-groove rollers 5 and 6. If the board 1 is forced to enter between the V-groove rollers 5 and 6, the board 1 may be crushed by the V-groove rollers 5 and 6 and damaged. There is.
【０００８】また、基板１の幅寸法が標準寸法より小さ
い場合には、基板１がＶ溝ロ−ラ５、６の溝部の斜面に
沿って下降して基板１が近接し、基板１の下面がカッタ
７に触れて基板１が損傷することがある。Further, when the width dimension of the substrate 1 is smaller than the standard dimension, the substrate 1 descends along the slopes of the grooves of the V-groove rollers 5 and 6, and the substrate 1 approaches the bottom surface of the substrate 1. may come into contact with the cutter 7 and damage the substrate 1.
【０００９】このような問題点を解決するために、基板
１をホルダに入れ、このホルダを図７に示すようなＶ溝
ロ−ラの間に通してカッタで配線２の凸部３を切断する
装置も採用されている。In order to solve this problem, the board 1 is placed in a holder, the holder is passed between V-groove rollers as shown in FIG. 7, and the convex portion 3 of the wiring 2 is cut with a cutter. A device that does this is also used.
【００１０】この方式の装置では、基板を保持するホル
ダは正確な幅寸法に製作することができるので、前者の
方式の装置のような問題は発生しない。しかし、基板を
１個づつホルダにセットする必要があるために、その作
業に手数を要して加工能率が低下するという問題がある
。[0010] In this type of apparatus, the holder for holding the substrate can be manufactured to have an accurate width dimension, so the problems that occur in the former type of apparatus do not occur. However, since it is necessary to set the substrates one by one in the holder, there is a problem in that the work is time-consuming and processing efficiency is reduced.
【００１１】本発明は前記事情に基づいてなされたもの
で、基板に存在する凸部を、基板の材料にかかわらず基
板を傷つけることなく能率良く切断することができる基
板凸部切断装置を提供することを目的とする。The present invention has been made based on the above-mentioned circumstances, and provides a substrate protrusion cutting device capable of efficiently cutting protrusions existing on a substrate without damaging the substrate, regardless of the material of the substrate. The purpose is to
【００１２】0012
【課題を解決するための手段】前記目的を達成するため
に本発明の基板凸部切断装置は、搬送体と、この搬送体
に並べて設けられ基板を下側から着脱自在に受けて支持
する基板受け部材と、この基板受け部材に支持された基
板を上側から着脱自在に押える基板押え部材と、前記搬
送体による搬送動作の途中で前記基板押え部材を基板押
え状態に動作させる押え部材駆動機構と、この押え部材
駆動機構が前記基板押え部材を基板押え状態に動作させ
ている範囲に設けられ前記基板押え部に支持された基板
に存在する凸部を切断するカッタとを具備してなること
を特徴とするものである。Means for Solving the Problems In order to achieve the above object, the substrate protrusion cutting device of the present invention includes a carrier, and a substrate that is disposed side by side with the carrier and detachably receives and supports the substrate from below. a receiving member, a substrate holding member that removably presses the substrate supported by the substrate holding member from above, and a holding member drive mechanism that operates the substrate holding member to a substrate holding state during the transport operation by the transport body. The holding member driving mechanism is provided with a cutter that is provided in a range where the substrate holding member is operated to hold the substrate and cuts a convex portion present on the substrate supported by the substrate holding portion. This is a characteristic feature.
【００１３】[0013]
【作用】上記の構成において、搬送体に設けた基板受け
部材に基板を載せ、基板押え部材で基板を押えることに
より、基板を傷つけることなく支持してカッタで基板の
凸部を切断除去することができ、また基板を基板受け部
材に載せるだけで押え部材駆動機構が基板押え部材を駆
動して基板を自動的に押えるので、基板の取扱いに手数
を要さず、さらに搬送体の駆動により基板受け部材で受
けた基板をカッタまで搬送することにより、多数の基板
を連続的に搬送して各基板の凸部を連続して能率的に切
断することができる。[Operation] In the above configuration, by placing the substrate on the substrate receiving member provided on the carrier and holding the substrate with the substrate holding member, the substrate is supported without being damaged and the convex portion of the substrate is cut and removed with the cutter. In addition, just by placing the board on the board receiving member, the holding member drive mechanism drives the board holding member and automatically holds the board, so there is no need for trouble handling the board, and furthermore, the board can be moved by driving the carrier. By conveying the substrate received by the receiving member to the cutter, a large number of substrates can be continuously conveyed and the convex portions of each substrate can be continuously and efficiently cut.
【００１４】[0014]
【実施例】以下、本発明の一実施例について図１ないし
図５について説明する。この実施例は、図６に示す基板
１に形成した配線２の凸部３を切断するために使用する
基板凸部切断装置を対象にしている。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. This embodiment is directed to a substrate protrusion cutting device used to cut the protrusion 3 of the wiring 2 formed on the substrate 1 shown in FIG.
【００１５】図１および図２は全体図を示しており、図
中１１はべ−ス１２に直立して設けられたダイレクトド
ライブ型のサ−ボモ−タで、このサ−ボモ−タ１１の上
部には搬送体として例えば円盤型をなすロ−タリテ−ブ
ル１３が設けてある。このロ−タリテ−ブル１３はサ−
ボモ−タ１１により回転される。ロ−タリテ−ブル１３
は円周方向に１２個の切欠部１４が並べて形成してある
。この切欠部１４はロ−タリテ−ブル１３の周縁から中
心に向けて形成され、後述する配線基板の最大寸法に応
じた幅寸法と長さ寸法を有している。FIGS. 1 and 2 show an overall view. In the figures, 11 is a direct drive type servo motor installed upright on a base 12. A rotary table 13 in the form of a disk, for example, is provided at the top as a carrier. This rotary table 13 is
It is rotated by a motor 11. rotary table 13
Twelve notches 14 are formed side by side in the circumferential direction. This notch 14 is formed from the periphery of the rotary table 13 toward the center, and has a width and length corresponding to the maximum dimension of the wiring board, which will be described later.
【００１６】ロ−タリテ−ブル１３の各切欠部１４には
一対の基板受け部材１５、１６が取付けてある。図３お
よび図４にも示すように基板受け部材１５、１６は平板
状をなすもので、切欠部１４におけるロ−タリテ−ブル
１３の長手方向に沿う一対の側縁に分かれてロ−タリテ
−ブル１３の下面に当接して配置され、切欠部１４の側
縁から切欠部１４の内側に張り出す部分には基板受け部
１５ａ 、１６ａ が切欠部１４の側縁に沿って形成さ
れている。A pair of board receiving members 15 and 16 are attached to each notch 14 of the rotary table 13. As shown in FIGS. 3 and 4, the board receiving members 15 and 16 have a flat plate shape, and are divided into a pair of side edges along the longitudinal direction of the rotary table 13 in the notch 14. Board receiving portions 15a and 16a are formed along the side edges of the cutout 14 at portions that are disposed in contact with the lower surface of the cutout 13 and project inward from the side edges of the cutout 14.
【００１７】各基板受け部材１５、１６に形成したねじ
孔１７に、ロ−タリテ−ブル１３に形成した孔１８から
ボルト１９を通して各部材１５、１６がロ−タリテ−ブ
ル１３に固定されている。また、基板受け部材１５に形
成した孔２０とロ−タリテ−ブル１３に形成した孔２１
にピン２２を通して部材１６を位置決めしてある。なお
、基板受け部材１６のねじ孔１７に対応するロ−タリテ
−ブル１３の孔１８を切欠部１４の長さ方向に対して直
角な方向に沿う長孔として、基板受け部材１６にの取り
付け位置を調整できるようになっている。図４は基板受
け部材１５ではピン２２のみを示している。Each member 15, 16 is fixed to the rotary table 13 by passing a bolt 19 through a hole 18 formed in the rotary table 13 into a screw hole 17 formed in each board receiving member 15, 16. . In addition, a hole 20 formed in the substrate receiving member 15 and a hole 21 formed in the rotary table 13.
The member 16 is positioned through a pin 22. Note that the hole 18 of the rotary table 13 corresponding to the screw hole 17 of the board receiving member 16 is formed as a long hole extending in a direction perpendicular to the length direction of the notch 14, so that the mounting position on the board receiving member 16 can be adjusted. can be adjusted. FIG. 4 shows only the pins 22 in the board receiving member 15. As shown in FIG.
【００１８】図２に示すようにロ−タリテ−ブル１３に
は各切欠部１４の内側端部に夫々対応し基板２を押える
部材およびこの押え部材を駆動する機構が設けてある。
ロ−タリテ−ブル１３に上下方向に貫通して形成した孔
２３には支持部材２４が嵌合され、この支持部材２４は
ボルトによりロ−タリテ−ブル１３に固定されている。
支持部材２４に垂直方向に形成した孔２４ａ には軸受
２５を介して丸軸からなるラック２６が昇降自在に挿入
支承され、このラック２６には切欠部２４に面して上下
方向に歯部が形成されている、ラック２６の上端にはこ
ろがり軸受２７がボルト２８により取り付けられている
。As shown in FIG. 2, the rotary table 13 is provided with a member for pressing the substrate 2 corresponding to the inner end of each notch 14, and a mechanism for driving the pressing member. A support member 24 is fitted into a hole 23 formed vertically through the rotary table 13, and the support member 24 is fixed to the rotary table 13 with bolts. A rack 26 consisting of a round shaft is inserted and supported in a hole 24a formed in the vertical direction in the support member 24 via a bearing 25 so as to be able to move up and down. A rolling bearing 27 is attached to the upper end of the formed rack 26 by bolts 28.
【００１９】切欠部１４に面した支持部材２４の部分に
は腕２４ｂ がロ−タリテ−ブル１３の面方向に設けら
れ、この腕２４ｂ には水平に配置された回転軸２９が
回転自在に支承してある。この回動軸２９にはラック２
６の歯部に噛合するピニオン３０と、押えレバ−３１の
基端部とが固定してある。押えレバ−３１には、該押え
レバ−３１が水平位置にある時に上下方向に位置する基
板押え軸３２が着脱可能に取り付けてあり、この基板押
え軸３２の下端には押えパット３３が取り付けてある。
この押えパット３３は吸盤形をなすものである。An arm 24b is provided in the part of the support member 24 facing the notch 14 in the direction of the surface of the rotary table 13, and a horizontally arranged rotating shaft 29 is rotatably supported on this arm 24b. It has been done. This rotating shaft 29 has a rack 2
A pinion 30 that meshes with the teeth of 6 and the base end of the presser lever 31 are fixed. A board holding shaft 32 that is located vertically when the holding lever 31 is in a horizontal position is detachably attached to the holding lever 31, and a holding pad 33 is attached to the lower end of this board holding shaft 32. be. This presser pad 33 has a suction cup shape.
【００２０】なお、ラック２６の下端はフランジ２６ａ
が形成されており、このフランジ２６ａ は支持部材
２４の下端に衝突してラック２６の上限用ストッパとし
ての機能を有している。なお、ラック２６は下端の下側
に設けた圧縮コイルばね（図示せず）で上方への弾性力
を加えている。Note that the lower end of the rack 26 has a flange 26a.
is formed, and this flange 26a collides with the lower end of the support member 24 to function as an upper limit stopper for the rack 26. Note that the rack 26 applies an upward elastic force using a compression coil spring (not shown) provided below the lower end.
【００２１】押えレバ−３１は通常その重量により水平
位置にあり、これに応じてラック２６は上昇している。
そして、ラック２６を下降させると、ピニオン３０が回
動して回動軸２９を介して押えレバ−３１が上向きに９
０度の角度で回動する。The presser lever 31 is normally in a horizontal position due to its weight, and the rack 26 is raised accordingly. Then, when the rack 26 is lowered, the pinion 30 rotates and the presser lever 31 is moved upward 9 through the rotation shaft 29.
Rotates at an angle of 0 degrees.
【００２２】さて、図１においてロ−タリテ−ブル１３
はサ−ボモ−タ１１により反時計方向に回転される。図
１においてロ−タリテ−ブル１３の右側部中央に対向し
て図示しない基板供給装置により基板１が供給され、且
つ左側部中央には対向する箇所にはベ−ス１２に後述す
るカッタが設けてある。Now, in FIG. 1, the rotary table 13
is rotated counterclockwise by the servo motor 11. In FIG. 1, a substrate 1 is supplied by a substrate supply device (not shown) opposite the center of the right side of the rotary table 13, and a cutter, which will be described later, is provided on the base 12 at a location opposite to the center of the left side. There is.
【００２３】図１および図２において３４はカム体で、
このカム体２４はロ−タリテ−ブル１３の中心からのラ
ック２６の上側に至る大きさの半径を有する平面扇形を
なすもので、ロ−タリテ−ブル１３の上側に同心をもっ
て配置されている。カム体３４の外周縁部は下向きに屈
曲してラック２６の上端に上側から当接するカム部３４
ａ となっている。このカム部３４ａ の高さは、ピニ
オン３０を回動して揺動レバ−３１を水平位置から垂直
に起立させるようにラック２６を下降させる距離に対応
する大きさである。In FIGS. 1 and 2, 34 is a cam body;
The cam body 24 has a planar fan shape with a radius extending from the center of the rotary table 13 to the upper side of the rack 26, and is arranged concentrically above the rotary table 13. The outer peripheral edge of the cam body 34 is bent downward to form a cam portion 34 that abuts the upper end of the rack 26 from above.
It is a. The height of the cam portion 34a corresponds to the distance by which the rack 26 is lowered by rotating the pinion 30 to vertically raise the swing lever 31 from a horizontal position.
【００２４】扇形をなすカム体３４の一端縁は、ロ−タ
リテ−ブル１３における基板供給位置から回転カッタま
での一方の半円部に位置し、カム体３４の他端縁は、ロ
−タリテ−ブル１３における基板供給位置から回転カッ
タまでの他方の半円部に位置する。カム体３４に中心部
はホルダ３５を介してスタンド３６に固定されている。
スタンド３６はロ−タリテ−ブル１３およびモ−タ１１
を貫通してベ−ス１２に直立して固定されている。One end edge of the fan-shaped cam body 34 is located in one semicircle between the substrate supply position and the rotary cutter on the rotary table 13, and the other end edge of the cam body 34 is located at the rotary table 13. - located in the other semicircular portion from the substrate supply position to the rotary cutter in the bull 13; The center portion of the cam body 34 is fixed to a stand 36 via a holder 35. The stand 36 supports the rotary table 13 and the motor 11.
It is fixed upright to the base 12 by penetrating through it.
【００２５】なお、図５に示すようにカム体３４の下面
部には発光部３７ａ と受光部３７ｂを備えた１組の検
出器が設けてある。各基板押え機構の夫々のラック２６
の上部には下面部には発光部３７ａ と受光部３７ａ
の間を通過する検出子３８が取り付けてある。As shown in FIG. 5, a pair of detectors including a light emitting section 37a and a light receiving section 37b are provided on the lower surface of the cam body 34. Each rack 26 of each board holding mechanism
A light emitting section 37a and a light receiving section 37a are provided on the upper and lower surfaces of the
A detector 38 is attached that passes between the two.
【００２６】また、カッタ３８は図１においてロ−タリ
テ−ブル１３の左側部中央に下側に位置して設けられ、
モ−タ３９により回転される。すなわち、モ−タ３９は
ベ−ス１２上に立てて設置され、このモ−タ３９の垂直
な回転軸（図示せず）の上端部には水平に配置された円
盤形をなすカッタ３８が取り付けられている。このよう
に構成された基板凸部切断装置の動作について説明する
。In addition, the cutter 38 is provided at the center of the left side of the rotary table 13 in FIG.
It is rotated by a motor 39. That is, the motor 39 is installed vertically on the base 12, and a horizontally disposed disk-shaped cutter 38 is attached to the upper end of the vertical rotation axis (not shown) of the motor 39. attached. The operation of the substrate protrusion cutting device configured as described above will be explained.
【００２７】ロ−タリテ−ブル１における各切欠部１４
に夫々設けた一対の基板受け部材１５、１６の間隔寸法
の大きさを、対象とする配線基板１の幅寸法に合せた大
きさとする。この場合、一方の基板受け部材１５を位置
基準とするために固定しておき、他方の基板受け部材１
５を長孔１８に沿って位置調整し、一対の基板受け部材
１５、１６の基板受け部１５ａ 、１６ａ の間隔寸法
を対象とする配線基板の基板１の幅寸法に合せた大きさ
に調整する。Each notch 14 in the rotary table 1
The distance between the pair of board receiving members 15 and 16 provided at each of the substrate receiving members 15 and 16 is set to match the width of the target wiring board 1. In this case, one board receiving member 15 is fixed to serve as a position reference, and the other board receiving member 1
5 along the elongated hole 18, and adjust the distance between the board receiving parts 15a and 16a of the pair of board receiving members 15 and 16 to match the width of the board 1 of the target wiring board. .
【００２８】サ−ボモ−タ１１を駆動してロ−タリテ−
ブル１３を図２の矢印方向に回転させる。サ−ボモ−タ
１１の駆動を制御してロ−タリテ−ブル１３を必要とす
る形態で回転させる。ロ−タリテ−ブル１３の各切欠部
１４がカム体３４の下側を通過する時には、各駆動機構
のラック２６が圧縮ばねのばね力に抗してカム体３４の
カム部３４ａ に押されて下側に移動し、押えレバ−３
１が上側に９０度の角度で回動して起立する。[0028] Drive the servo motor 11 to rotate the rotary position.
Rotate the bull 13 in the direction of the arrow in FIG. The drive of the servo motor 11 is controlled to rotate the rotary table 13 in the required form. When each notch 14 of the rotary table 13 passes under the cam body 34, the rack 26 of each drive mechanism is pushed by the cam part 34a of the cam body 34 against the spring force of the compression spring. Move to the bottom and presser foot lever 3
1 rotates upward at a 90 degree angle and stands up.
【００２９】そして、ロ−タリテ−ブル１３の各切欠部
１４が基板供給装置の箇所（ロ−タリテ−ブル１３の右
側部中央）を通過する時に、基板供給装置が切欠部１４
に上側から基板１を供給する。図４に示すように基板１
は凸部３を有する配線２が下側に位置するように向きを
設定する。供給された基板１はロ−タリテ−ブル１３の
切欠部１４に設けた一対の基板受け部材１５、１６に載
せられて支持される。この場合には、基板１の両側縁部
は一対の基板受け部材１５、１６における基板受け部１
５ａ 、１６ａ で支持され、基板１の幅方向の移動が
阻止される。なお、一方の基板受け部材１５の内側の端
部にストッパ４０を設けて基板１の長さ方向の移動を阻
止する。Then, when each notch 14 of the rotary table 13 passes the location of the substrate supply device (the center of the right side of the rotary table 13), the substrate supply device passes through the notch 14 of the rotary table 13.
The substrate 1 is supplied from above. Substrate 1 as shown in Figure 4
The direction is set so that the wiring 2 having the convex portion 3 is located on the lower side. The supplied substrate 1 is placed on and supported by a pair of substrate receiving members 15 and 16 provided in a notch 14 of a rotary table 13. In this case, both side edges of the board 1 are the board receiving portions 1 of the pair of board receiving members 15 and 16.
5a and 16a, and movement of the substrate 1 in the width direction is prevented. Note that a stopper 40 is provided at the inner end of one of the substrate receiving members 15 to prevent movement of the substrate 1 in the length direction.
【００３０】ロ−タリテ−ブル１３の回転により基板受
け部材１５、１６、駆動機構および基板１が移動してカ
ム体３４の端部から外れると、ラック２６がカム体３４
の押圧から解放されてばねにより押し上げられて上昇す
る。押えレバ−３１が下側に向けて揺動し、この押えレ
バ−３１に設けた基板押え軸３２に取り付けられる押え
パット３３が、ロ−タリテ−ブル１３の基板受け部材１
５、１６に支持されている基板１の上面に当接して基板
１を上側から押える。これにより基板１を上下、左右お
よび左右の各方向に移動を阻止して保持する。When the substrate receiving members 15, 16, the drive mechanism, and the substrate 1 move and come off the end of the cam body 34 due to the rotation of the rotary table 13, the rack 26 is moved from the end of the cam body 34.
It is released from the pressure and is pushed up by the spring and rises. The presser lever 31 swings downward, and the presser pad 33 attached to the substrate holding shaft 32 provided on the presser lever 31 presses against the substrate receiving member 1 of the rotary table 13.
5 and 16 to press the board 1 from above. As a result, the substrate 1 is held while being prevented from moving in the vertical, horizontal, and horizontal directions.
【００３１】さらに、ロ−タリテ−ブル１３が回動して
基板受け部材１５、１６、基板押え機構および基板１が
カッタ３９の上側を通過する。カッタ３８はモ−タ３９
により図２の矢印方向に回転されている。基板受け部材
１５、１６に支持された基板１の下面に形成した配線２
の凸部３はカッタ３８により切断される。Further, the rotary table 13 rotates, and the substrate receiving members 15 and 16, the substrate holding mechanism, and the substrate 1 pass above the cutter 39. The cutter 38 is driven by a motor 39.
is rotated in the direction of the arrow in FIG. Wiring 2 formed on the lower surface of the board 1 supported by the board receiving members 15 and 16
The convex portion 3 is cut by a cutter 38.
【００３２】ロ−タリテ−ブル１３に設けた基板受け部
材１５、１６の下面とカッタ３６との上下間隔は、基板
１の配線２に形成した凸部３をできるだけ根元から切断
できるようにその高さを考慮して設定する。基板受け部
材１５、１６はロ−タリテ−ブル１３に一定の高さで固
定され、基板１を水平な一定の高さ位置に支持される、
このため、基板受け部材１５、１６に支持した基板１と
カッタ３８との上下間隔が一定である。すなわち、基板
１の幅寸法や厚さ寸法のバラツキに関係なく、また基板
１の材料の種類に関係無く配線２の凸部３を根元から確
実に切断でき、また、凸部３の切断に際して基板１がカ
ッタ３８に接触して損傷させることがない。The vertical distance between the cutter 36 and the lower surface of the board receiving members 15 and 16 provided on the rotary table 13 is determined so that the height of the protrusion 3 formed on the wiring 2 of the board 1 can be cut as far as possible from the root. Make settings taking into consideration the The substrate receiving members 15 and 16 are fixed to the rotary table 13 at a constant height, and support the substrate 1 at a horizontal constant height position.
Therefore, the vertical distance between the cutter 38 and the substrate 1 supported by the substrate receiving members 15 and 16 is constant. That is, regardless of variations in the width and thickness of the substrate 1, and regardless of the type of material of the substrate 1, the protrusion 3 of the wiring 2 can be reliably cut from the root, and when cutting the protrusion 3, the substrate 1 will not come into contact with the cutter 38 and damage it.
【００３３】配線２の凸部３を切断し終えた後に基板１
はロ−タリテ−ブル１３の回転とともに移動され、基板
受け部材１５、１６および基板押え機構が再びカム体３
４の下側に入る。この時点で図示しない基板取り上げ装
置により基板１をロ−タリテ−ブル１３の基板受け部材
１５、１６から取り上げて別な箇所に搬送する。After cutting the convex portion 3 of the wiring 2, the substrate 1 is
is moved with the rotation of the rotary table 13, and the board receiving members 15, 16 and the board holding mechanism are moved again to the cam body 3.
Enter the lower part of 4. At this point, the board 1 is picked up from the board receiving members 15, 16 of the rotary table 13 by a board picking up device (not shown) and transported to another location.
【００３４】この動作に繰り返しにより各基板１に形成
した配線２の凸部２ａを切断する。なお、本発明は前記
実施例に限定されるものではなく、要旨を変更しない範
囲で種々変形して実施することができる。例えば搬送体
としてはロ−タリテ−ブルに限定されず、例えば無端状
のベルトを用いることも可能である。By repeating this operation, the convex portion 2a of the wiring 2 formed on each substrate 1 is cut. It should be noted that the present invention is not limited to the embodiments described above, and can be implemented with various modifications without changing the gist. For example, the conveyor is not limited to a rotary table, and an endless belt may also be used.
【００３５】[0035]
【発明の効果】以上説明したように本発明によれば、基
板の材質や寸法のばらつきにかかわらず基板を傷つける
ことなく支持して回転カッタで基板に存在する凸部を精
度良く切断することができ、また凸部の切断に際しての
基板の取扱いに手数を要することがなく基板に存在する
凸部を能率良く切断することができい基板凸部切断装置
を提供することができる。[Effects of the Invention] As explained above, according to the present invention, it is possible to support the substrate without damaging it and cut the protrusions on the substrate with high accuracy using a rotary cutter, regardless of the variations in the material and dimensions of the substrate. Furthermore, it is possible to provide a substrate protrusion cutting device that can efficiently cut the protrusions present on the substrate without requiring any trouble in handling the substrate when cutting the protrusions.
【図１】本発明の基板凸部切断装置の一実施例を示す一
部切欠正面図。FIG. 1 is a partially cutaway front view showing an embodiment of a substrate protrusion cutting device of the present invention.
【図２】同じ実施例の基板凸部切断装置を示す平面図。FIG. 2 is a plan view showing a substrate protrusion cutting device of the same embodiment.
【図３】同じ実施例の基板凸部切断装置におけるロ−タ
リテ−ブルの基板受け部を示す斜視図。FIG. 3 is a perspective view showing a substrate receiving portion of a rotary table in the substrate protrusion cutting device of the same embodiment.
【図４】図２Ａ−Ａ線に沿う拡大断面図。FIG. 4 is an enlarged cross-sectional view taken along line A-A in FIG.
【図５】図２Ｂ−Ｂ線に沿う拡大断面図。FIG. 5 is an enlarged sectional view taken along the line B-B in FIG.
【図６】基板の一例を拡大して示す図。FIG. 6 is an enlarged view of an example of a substrate.
【図７】従来の基板凸部切断装置の一例を示す図。FIG. 7 is a diagram showing an example of a conventional substrate protrusion cutting device.
１…基板、２…配線、３…凸部、１１…モ−タ、１３…
ロ−タリテ−ブル、１５、１６…基板受け部材、３１…
押えレバ−、３２…基板押え軸。DESCRIPTION OF SYMBOLS 1... Board, 2... Wiring, 3... Convex part, 11... Motor, 13...
Rotary table, 15, 16... Board receiving member, 31...
Holder lever, 32... Board holding shaft.
Claims (1)
れ基板を下側から着脱自在に受けて支持する基板受け部
材と、この基板受け部材に支持された基板を上側から着
脱自在に押える基板押え部材と、前記搬送体による搬送
動作の途中で前記基板押え部材を基板押え状態に動作さ
せる押え部材駆動機構と、この押え部材駆動機構が前記
基板押え部材を基板押え状態に動作させている範囲に設
けられ前記基板押え部材に押えられた基板に存在する凸
部を切断するカッタとを具備してなる基板凸部切断装置
。1. A transport body, a board support member that is arranged side by side with the transport body and that removably receives and supports a board from below, and a board that removably presses the board supported by the board support member from above. a holding member, a holding member driving mechanism that operates the substrate holding member to a substrate holding state during the transport operation by the transport body, and a range in which the holding member driving mechanism operates the substrate holding member to the substrate holding state. A cutter for cutting a protrusion present on a substrate pressed by the substrate holding member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1355491A JPH04247680A (en) | 1991-02-04 | 1991-02-04 | Substrate projection portion cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1355491A JPH04247680A (en) | 1991-02-04 | 1991-02-04 | Substrate projection portion cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04247680A true JPH04247680A (en) | 1992-09-03 |
Family
ID=11836391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1355491A Pending JPH04247680A (en) | 1991-02-04 | 1991-02-04 | Substrate projection portion cutting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04247680A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2760404A1 (en) | 1997-03-07 | 1998-09-11 | Samsung Electro Mech | DEVICE AND METHOD FOR EJECTING A RECORDING SOLUTION OF A PRINT HEAD |
| US6123414A (en) * | 1997-03-12 | 2000-09-26 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for injecting a recording solution of a print head using phase transformation of thin film shape memory alloy |
| US6130689A (en) * | 1997-11-19 | 2000-10-10 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and actuator for injecting a recording solution of a print head and method for producing the apparatus |
-
1991
- 1991-02-04 JP JP1355491A patent/JPH04247680A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2760404A1 (en) | 1997-03-07 | 1998-09-11 | Samsung Electro Mech | DEVICE AND METHOD FOR EJECTING A RECORDING SOLUTION OF A PRINT HEAD |
| US6123414A (en) * | 1997-03-12 | 2000-09-26 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for injecting a recording solution of a print head using phase transformation of thin film shape memory alloy |
| US6130689A (en) * | 1997-11-19 | 2000-10-10 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and actuator for injecting a recording solution of a print head and method for producing the apparatus |
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