JPH0423326U - - Google Patents
Info
- Publication number
- JPH0423326U JPH0423326U JP1990064359U JP6435990U JPH0423326U JP H0423326 U JPH0423326 U JP H0423326U JP 1990064359 U JP1990064359 U JP 1990064359U JP 6435990 U JP6435990 U JP 6435990U JP H0423326 U JPH0423326 U JP H0423326U
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- piezoelectric
- lid
- sealing member
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図は本考案にかかる圧電振動子収納用パツ
ケージの一実施例を示す断面図、第2図は従来の
圧電振動子収納用パツケージの断面図である。 1……絶縁基体、2……蓋体、4……圧電振動
子、5……接着材、7……封止部材、7a……内
部材、7b……外部材。
ケージの一実施例を示す断面図、第2図は従来の
圧電振動子収納用パツケージの断面図である。 1……絶縁基体、2……蓋体、4……圧電振動
子、5……接着材、7……封止部材、7a……内
部材、7b……外部材。
Claims (1)
- 圧電振動子を収容するための凹部を有する絶縁
基体と蓋体とから成り、絶縁基体に蓋体を封止部
材を介し接合させることによつて内部に圧電振動
子を封入するようになした圧電振動子収納用パツ
ケージにおいて、前記封止部材を内外材から成る
二重構造とし、内材を融点300℃以下の低融点
ロウ材で、外材を有機樹脂接着材で形成したこと
を特徴とする圧電振動子収納用パツケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064359U JPH0423326U (ja) | 1990-06-18 | 1990-06-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064359U JPH0423326U (ja) | 1990-06-18 | 1990-06-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0423326U true JPH0423326U (ja) | 1992-02-26 |
Family
ID=31595233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990064359U Pending JPH0423326U (ja) | 1990-06-18 | 1990-06-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0423326U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011250227A (ja) * | 2010-05-28 | 2011-12-08 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598845A (en) * | 1979-01-19 | 1980-07-28 | Hascoe Norman | Cover unit for airtightly sealing container for semiconductor device |
JPS5718372A (en) * | 1980-07-08 | 1982-01-30 | Fujitsu Ltd | Semiconductor photoreceiving element |
JPS6053054A (ja) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | 半導体装置 |
JPS60241236A (ja) * | 1984-05-16 | 1985-11-30 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS636741B2 (ja) * | 1981-10-02 | 1988-02-12 | Nissan Motor |
-
1990
- 1990-06-18 JP JP1990064359U patent/JPH0423326U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598845A (en) * | 1979-01-19 | 1980-07-28 | Hascoe Norman | Cover unit for airtightly sealing container for semiconductor device |
JPS5718372A (en) * | 1980-07-08 | 1982-01-30 | Fujitsu Ltd | Semiconductor photoreceiving element |
JPS636741B2 (ja) * | 1981-10-02 | 1988-02-12 | Nissan Motor | |
JPS6053054A (ja) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | 半導体装置 |
JPS60241236A (ja) * | 1984-05-16 | 1985-11-30 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011250227A (ja) * | 2010-05-28 | 2011-12-08 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
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