JPH0423309A - Laminated ceramic capacitor - Google Patents

Laminated ceramic capacitor

Info

Publication number
JPH0423309A
JPH0423309A JP2123567A JP12356790A JPH0423309A JP H0423309 A JPH0423309 A JP H0423309A JP 2123567 A JP2123567 A JP 2123567A JP 12356790 A JP12356790 A JP 12356790A JP H0423309 A JPH0423309 A JP H0423309A
Authority
JP
Japan
Prior art keywords
ceramic
dielectric
paste
powder
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2123567A
Other languages
Japanese (ja)
Inventor
Seiji Honma
本間 政治
Tomiro Yasuda
安田 冨郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP2123567A priority Critical patent/JPH0423309A/en
Publication of JPH0423309A publication Critical patent/JPH0423309A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a delamination from being caused by a method wherein a paste in which a ceramic pulverulent body coated with a copper layer has been kneaded in an organic vehicle is used as an internal electrode. CONSTITUTION:A ceramic composed of 95% or more BaTiO3 is used as a ceramic dielectric powder; and a ceramic dielectric 12 is produced. A paste is printed and coated on its surface; and a dielectric sheet 14 in which an internal electrode 13 is formed is obtained. A ceramic dielectric powder 15 whose average particle size is 1mum is used as the paste. The following are used as the internal electrode 13: a copper-layer coating ceramic powder 7 coated with a copper layer 16 having an average thickness of about 0.05mum; and a paste 18 whose viscosity is adjusted by adding a solvent after it is kneaded well with an organic vehicle. When the dielectric ceramic powder coated with the copper layer is used, the relative volume of copper is reduced. As a result, it is possible to suppress a molten expansion amount and to prevent a delamination defect from being caused.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は高周波特性の優れた積層セラミックコンデンサ
に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multilayer ceramic capacitor with excellent high frequency characteristics.

従来の技術 従来の積層セラミックコンデンサは、セラミックグリー
ンシート2の表面に内部電極3を印刷塗布して誘電体シ
ート4となし、この誘電体シート4を複数枚重ね合わせ
て積層し、熱圧着を行い、切断加工して単体のセラミッ
クコンデンサ素子5を形成し、所定温度で焼成した後、
コンテ〕/す素子50両端部に外部電極6を形成してコ
ンデンサを製作している。
Conventional technology A conventional multilayer ceramic capacitor is manufactured by printing and coating internal electrodes 3 on the surface of a ceramic green sheet 2 to form a dielectric sheet 4, stacking a plurality of dielectric sheets 4, and bonding them by thermocompression. After cutting to form a single ceramic capacitor element 5 and firing at a predetermined temperature,
A capacitor is manufactured by forming external electrodes 6 on both ends of a condenser element 50.

この内部電極3を形成するための印刷用インク状ペース
トは、ニッケル粉や銀/パラジウム合金粉にガラスフリ
ットを添加したものが用いられているが、高周波特性を
高めるために、銅の粉末、有機ビヒクル及び溶剤とから
なるペーストを用いることがある。しかし銅の融点が1
083℃であるため、この温度以下で焼成するセラミッ
ク誘電体粉にしか適用することができなかった。
The ink-like paste for printing used to form the internal electrodes 3 is made of nickel powder or silver/palladium alloy powder with glass frit added. A paste consisting of a vehicle and a solvent may be used. However, the melting point of copper is 1
Since the temperature is 083°C, it could only be applied to ceramic dielectric powders that are fired at temperatures below this temperature.

発明が解決しようとする課題 従来、内部電極のペーストとして銅粉ペーストを使用す
る場合は、銅の融点以上の焼成温度が必要なセラミック
誘電体粉に適用すると、焼成中に銅粉が溶融して膨部し
、積層するセラミック誘電体層間を剥離させる力を生じ
、層間剥離(デラミネーション)不良を発生する要因と
なっていた。
Problems to be Solved by the Invention Conventionally, when copper powder paste is used as a paste for internal electrodes, when applied to ceramic dielectric powder, which requires a firing temperature higher than the melting point of copper, the copper powder melts during firing. This bulges and generates a force that causes the laminated ceramic dielectric layers to peel off, causing delamination defects.

課題を解決するための手段 本発明は1200℃までの焼成温度を有するセラミック
誘電体に適用でき、かつ高周波特性に優れた積層セラミ
ックコンデンサ用の内部電極に使用するペーストを提供
する。
Means for Solving the Problems The present invention provides a paste for use in internal electrodes for multilayer ceramic capacitors that is applicable to ceramic dielectrics having a firing temperature of up to 1200° C. and has excellent high frequency characteristics.

本発明の積層セラミックコンデンサは、チタン酸系バリ
ウム系のセラミック誘電体層上に内部電極を形成する誘
電体シートにおいて、この内部電極として銅層を被覆し
た誘電体セラミック粉、有機ビヒクル及び有機溶剤を混
練して製作した印刷用インク状ペーストを用いることを
特徴とする。
The multilayer ceramic capacitor of the present invention has a dielectric sheet that forms internal electrodes on a barium titanate-based ceramic dielectric layer. It is characterized by using an ink-like paste for printing produced by kneading.

作用 従来銅粉を用いていたものに対し、銅層を被覆した誘電
セラミック粉を使用することにより、銅の相対的体積が
減少するので、溶融膨張量を抑えることができ、デラミ
ネーション不良の発生を防止することができる。銅の総
量が減少しても、高周波電流は表面層に集中して流れる
性質を有しているので、高周波領域におけるインピーダ
ンスを小さく保つことができる。
Function: Compared to conventional copper powder, using dielectric ceramic powder coated with a copper layer reduces the relative volume of copper, which reduces the amount of melt expansion and reduces the occurrence of delamination defects. can be prevented. Even if the total amount of copper decreases, the impedance in the high frequency region can be kept low because the high frequency current has the property of flowing concentratedly in the surface layer.

実施例 本発明の詳細な説明する。Example The present invention will be described in detail.

セラミック誘電体粉として3aTi0395%以上から
なるセラミックを用い厚さ30μ汎のセラミック誘電体
12を製作する。このセラミック誘電体シート12の表
面にペーストを印刷塗布して内部電極13を形成した誘
電体シート14をうる。このペーストとして、平均粒径
0.1μmの上記のセラミック誘電体粉15を用い、平
均的0゜05μmの銅層16を被覆した銅層被覆セラミ
ック粉17を52重量%と有機ビヒクル48重量%とを
良く混練した後、溶剤を添加して粘度120ボイスに調
整したペースト18を内部電極13として用いる。
A ceramic dielectric material 12 having a thickness of 30 .mu.m is manufactured using a ceramic made of 3aTi0395% or more as the ceramic dielectric powder. A paste is printed and coated on the surface of this ceramic dielectric sheet 12 to obtain a dielectric sheet 14 on which internal electrodes 13 are formed. As this paste, the above-mentioned ceramic dielectric powder 15 with an average particle size of 0.1 μm was used, 52% by weight of copper layer-coated ceramic powder 17 coated with a copper layer 16 of 0.05 μm in average, and 48% by weight of an organic vehicle. After thoroughly kneading the paste 18, a solvent was added to adjust the viscosity to 120 voices, and the paste 18 was used as the internal electrode 13.

この誘電体シート14を複数枚積層して定格50V、0
.1μFの積層セラミックコンデンサ素子を作製し、3
00℃で脱脂後焼成温度1150”C,1200℃、1
250℃の3種類のものを作った。
A plurality of these dielectric sheets 14 are laminated to give a rating of 50V and 0.
.. A 1 μF multilayer ceramic capacitor element was fabricated, and 3
After degreasing at 00℃, firing temperature 1150"C, 1200℃, 1
Three types were made at 250°C.

1250℃で焼成したものにはデラミネーションが一部
に発生するものがあったが、1150℃及び1200℃
で焼成したものにはデラミネーションの発生は認められ
なかった。
Some of the products fired at 1250°C had delamination, but those fired at 1150°C and 1200°C
No delamination was observed in the products fired.

同時に、ニッケル粉及び銀/パラジウム合金粉ペースト
で内部電極を形成した同一定格の積層セラミックコンデ
ンサのインピーダンスにつき比較してみた。銀/パラジ
ウムを用いたものはインピーダンスを100としたとき
、500MHzではニッケル粉ペースト品は90、本発
明品の銅被覆のものは85と最も低い値が得られた。
At the same time, we compared the impedance of multilayer ceramic capacitors of the same rating whose internal electrodes were formed using nickel powder and silver/palladium alloy powder paste. When the impedance of the product using silver/palladium was set to 100, the lowest value was obtained at 500 MHz, 90 for the nickel powder paste product and 85 for the copper-coated product of the present invention.

発明の効果 従来の銅粉とセラミック粉体を有機ビヒクル中に混在分
散させたものは、銅粉とセラミック誘電体粉とで比重及
び表面性状が異なるので、銅粉同志又はセラミック粉同
志が偏析凝集してしまうので、銅粉が溶融したとき銅の
厚い層が形成され、膨張作用が1箇所に集中してデラミ
ネーション発生及び局所的な断線手釣につながっていた
Effects of the Invention In conventional products in which copper powder and ceramic powder are mixed and dispersed in an organic vehicle, the specific gravity and surface properties of the copper powder and ceramic dielectric powder are different, so the copper powder or ceramic powder tends to segregate and agglomerate together. As a result, when the copper powder melts, a thick layer of copper is formed, and the expansion action is concentrated in one location, leading to delamination and local wire breakage.

本発明は銅層を被覆したセラミック粉体を有機ビヒクル
中で混練したペーストを内部電極として用いることによ
り、デラミネーションの発生がなくなり、周知の銀/パ
ラジウムペースト品と対比して、500MHzの高周波
領域でインピーダンスだ85%低いものが得られ、12
00℃までの焼成温度を有する誘電体粉に適用できるも
のを提供することができた。
The present invention eliminates the occurrence of delamination by using a paste made by kneading ceramic powder coated with a copper layer in an organic vehicle as an internal electrode. 85% lower impedance was obtained, 12
It was possible to provide a product that can be applied to dielectric powder having a firing temperature of up to 00°C.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の断面斜視図、第2図は内部電極用ペー
ストの断面図、第3図は同焼成後の断面図、第4図は従
来の断面図である。 12・・・セラミック誘電体、 13・・・内部電極、
14・・・誘電体シート、 15・・・セラミック粉、
16・・・銅層、 17・・・銅被覆セラミック粉18
・・・ペースト。 特許出願人 日立コンデンサ株式会社 条1(2) 奪Z・圓 争4図
FIG. 1 is a cross-sectional perspective view of the present invention, FIG. 2 is a cross-sectional view of the internal electrode paste, FIG. 3 is a cross-sectional view after firing, and FIG. 4 is a conventional cross-sectional view. 12... Ceramic dielectric, 13... Internal electrode,
14... Dielectric sheet, 15... Ceramic powder,
16...Copper layer, 17...Copper coated ceramic powder 18
···paste. Patent Applicant: Hitachi Capacitor Co., Ltd. Article 1 (2) Uzumaki Z/Enterprise Figure 4

Claims (1)

【特許請求の範囲】[Claims] (1)セラミック誘電体層上に内部電極を形成する誘電
体シートを用い、この誘電体シートを複数枚積層してな
る積層セラミックコンデンサにおいて、この内部電極と
して銅層を被覆した誘電体セラミック粉、有機ビヒクル
及び有機溶剤を混練して作製した印刷用インク状ペース
トを用いることを特徴とする積層セラミックコンデンサ
(1) In a multilayer ceramic capacitor formed by laminating a plurality of dielectric sheets using a dielectric sheet forming an internal electrode on a ceramic dielectric layer, a dielectric ceramic powder coated with a copper layer as the internal electrode, A multilayer ceramic capacitor characterized by using a printing ink-like paste prepared by kneading an organic vehicle and an organic solvent.
JP2123567A 1990-05-14 1990-05-14 Laminated ceramic capacitor Pending JPH0423309A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2123567A JPH0423309A (en) 1990-05-14 1990-05-14 Laminated ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2123567A JPH0423309A (en) 1990-05-14 1990-05-14 Laminated ceramic capacitor

Publications (1)

Publication Number Publication Date
JPH0423309A true JPH0423309A (en) 1992-01-27

Family

ID=14863778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2123567A Pending JPH0423309A (en) 1990-05-14 1990-05-14 Laminated ceramic capacitor

Country Status (1)

Country Link
JP (1) JPH0423309A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7131174B2 (en) * 2002-03-07 2006-11-07 Tdk Corporation Ceramic electronic device and method of production of same
CN100466120C (en) * 1999-07-21 2009-03-04 太阳诱电株式会社 Stacking ceramic capacitor
CN103474237A (en) * 2012-06-05 2013-12-25 三星电机株式会社 Multilayered ceramic component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868918A (en) * 1981-10-20 1983-04-25 三菱鉱業セメント株式会社 Electronic part with electrode layer and method of producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868918A (en) * 1981-10-20 1983-04-25 三菱鉱業セメント株式会社 Electronic part with electrode layer and method of producing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100466120C (en) * 1999-07-21 2009-03-04 太阳诱电株式会社 Stacking ceramic capacitor
US7131174B2 (en) * 2002-03-07 2006-11-07 Tdk Corporation Ceramic electronic device and method of production of same
CN103474237A (en) * 2012-06-05 2013-12-25 三星电机株式会社 Multilayered ceramic component
US9183987B2 (en) 2012-06-05 2015-11-10 Samsung Electro-Mechanics Co., Ltd. Multilayered ceramic component

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