JPH04223362A - Component lead forming jig - Google Patents
Component lead forming jigInfo
- Publication number
- JPH04223362A JPH04223362A JP2405711A JP40571190A JPH04223362A JP H04223362 A JPH04223362 A JP H04223362A JP 2405711 A JP2405711 A JP 2405711A JP 40571190 A JP40571190 A JP 40571190A JP H04223362 A JPH04223362 A JP H04223362A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- transistor
- forming
- lower mold
- forming jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 27
- 238000007747 plating Methods 0.000 abstract description 5
- 230000037303 wrinkles Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、部品のリードフォーミ
ング治具に関し、特にトランジスタのリードフォーミン
グ治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead forming jig for components, and more particularly to a lead forming jig for transistors.
【0002】0002
【従来の技術】従来、部品、特にトランジスタをプリン
ト配線板に実装する場合、プリント配線板に形成したリ
ード挿入孔の配置に対応して、例えば図4(a)に示す
ように、ラジオペンチRを使用して、トランジスタ10
の本体10aから直線状に導出した3本のリード1(1
a・1b・1c)のうち中央のリード1bの中間部ない
し先端部をクランク状に折り曲げる場合がある。BACKGROUND OF THE INVENTION Conventionally, when mounting components, especially transistors, on a printed wiring board, it has been necessary to use radio pliers R as shown in FIG. Using transistor 10
Three leads 1 (1
A, 1b, 1c), the middle part or the tip of the central lead 1b may be bent into a crank shape.
【0003】0003
【発明が解決しようとする課題】このように手作業でト
ランジスタのリードを成形する場合、作業者によって図
5に示す折り曲げ長さL、曲げ半径r、折り曲げ角度θ
等にばらつきが生じるうえ、図6(a)に示すようなメ
ッキ割れc、欠け、傷d、図6(b)に示すようなしわ
s等の障害が発生することが少なくない。また、3本の
リード1a・1b・1cのうちの中央の1本のリード1
bだけを成形するので、作業がやりづらい。しかも、1
個ずつ成形するので、作業時間が長くなり、非能率であ
るという問題もある。[Problems to be Solved by the Invention] When shaping transistor leads manually as described above, the operator must determine the bending length L, bending radius r, and bending angle θ as shown in FIG.
In addition, problems such as plating cracks c, chips, and scratches d as shown in FIG. 6(a), and wrinkles s as shown in FIG. 6(b) often occur. Also, one lead 1 in the center among the three leads 1a, 1b, and 1c.
Since only part b is molded, the work is difficult. Moreover, 1
Since each piece is molded, there is a problem in that it takes a long time and is inefficient.
【0004】本発明は、上記の事情を鑑みてなされたも
のであり、成形されるリードにメッキ割れ、欠け、傷、
しわ等の障害を発生させることなく、短時間で正確に中
央リードをクランク状に成形できるようにした、トラン
ジスタ等の部品のリードフォーミング治具を提供するこ
とを目的とするものである。The present invention was made in view of the above-mentioned circumstances, and prevents plating cracks, chips, scratches, and
It is an object of the present invention to provide a lead forming jig for components such as transistors, which can accurately form a central lead into a crank shape in a short period of time without causing problems such as wrinkles.
【0005】[0005]
【課題を解決するための手段】上記の目的を達成するた
め、本発明に係る部品のリードフォーミング治具は、例
えば図1に示すように、 部品10が横に寝かせて載
置される下型2と、下型2に載置した部品10のリード
1の基端部を押さえる押さえ具3と、上記リード1のう
ち、少なくともいずれか1本のリード1bの中間部及び
先端部を下型2に押さえつける成形具4と、上記下型2
に上記部品10のリード1bの中間部及び先端部が上記
成形具4によって押し込まれる、段落ち状に形成された
成形溝5とを備え、また、上記下型2の上面2aと成形
溝5の溝底5aとの段差が傾斜面5bとその両端の円弧
状のコーナ5c,5dで連続する構成とする。[Means for Solving the Problems] In order to achieve the above object, the component lead forming jig according to the present invention has a lower die on which a component 10 is placed lying down, as shown in FIG. 1, for example. 2, a presser 3 for pressing the base end of the lead 1 of the component 10 placed on the lower mold 2, and a presser 3 for pressing the base end of the lead 1b of the component 10 placed on the lower mold 2; a molding tool 4 that presses the lower mold 2
The middle part and the tip of the lead 1b of the component 10 are provided with a molding groove 5 formed in a stepped shape into which the molding tool 4 pushes, and the upper surface 2a of the lower mold 2 and the molding groove 5 are The groove bottom 5a has a continuous step between the inclined surface 5b and the arcuate corners 5c and 5d at both ends thereof.
【0006】この発明に係る部品のリードフォーミング
治具はトランジスタの中央リードの成形に利用されると
有効であり、また、上記成形溝5を形成した下型2と、
押さえ具3と、成形具4とを成形溝5に直角に複数配列
すると、複数の部品の成形に対応できる。The component lead forming jig according to the present invention is effective when used for forming the center lead of a transistor, and also includes a lower mold 2 in which the forming groove 5 is formed,
By arranging a plurality of pressers 3 and forming tools 4 at right angles to the forming groove 5, it is possible to mold a plurality of parts.
【0007】[0007]
【作用】本発明においては、部品10を横に寝かせて下
型2上の所定の位置に載置した後、押さえ具3で部品1
0の各リード1a・1b・1cの基端部を押さえてから
、成形具4で少なくとも1本のリード1bを押さえると
、該リード1bのみが成形溝5に押さえ込まれる。ここ
で、成形溝5は段落ち状に形成され、上記下型2の上面
2aと成形溝5の溝底5aとの段差が傾斜面5bとその
両端の円弧状のコーナ5c,5dで連続する構成とする
ことによってリード1bは上記傾斜面5bと円弧状のコ
ーナ5c,5dでに沿って円滑に曲げられる。[Operation] In the present invention, after the part 10 is laid down and placed in a predetermined position on the lower mold 2, the part 10 is
When the base ends of the leads 1a, 1b, and 1c of 0 are pressed, and at least one lead 1b is pressed with the molding tool 4, only the lead 1b is pressed into the molding groove 5. Here, the forming groove 5 is formed in a stepped shape, and the step difference between the upper surface 2a of the lower mold 2 and the groove bottom 5a of the forming groove 5 is continuous at the inclined surface 5b and the arc-shaped corners 5c and 5d at both ends thereof. With this structure, the lead 1b can be smoothly bent along the inclined surface 5b and the arcuate corners 5c and 5d.
【0008】[0008]
【実施例】以下、部品がトランジスタである場合を例に
本発明の一実施例に係る部品のリードフォーミング治具
を図1ないし図3に基づき説明する。この部品の中央リ
ードフォーミング治具は下型2と、押さえ具3と、成形
具4とを備えている。これら下型2、押さえ具3及び成
形具4は互いに独立して設けてもよいが、ここでは、下
型2の一端部にピン6と平行な他のピン7を介して成形
具4が開閉揺動可能に枢支される。また、押さえ具3や
成形具4は手動または油圧、空気圧あるいは電動のアク
チュエータで駆動されるようにしている。DESCRIPTION OF THE PREFERRED EMBODIMENTS A lead forming jig for a component according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 3, taking the case where the component is a transistor as an example. The central lead forming jig for this part includes a lower die 2, a presser 3, and a forming tool 4. The lower die 2, the presser 3, and the forming tool 4 may be provided independently from each other, but here, the forming tool 4 is opened and closed via another pin 7 parallel to the pin 6 at one end of the lower die 2. Pivoted so that it can swing. Further, the holding tool 3 and the forming tool 4 are driven manually or by hydraulic, pneumatic, or electric actuators.
【0009】上記下型2、押さえ具3及び成形具4の素
材は、特に限定はされず、金属、合成樹脂等を使用する
ことが可能である。しかしながら、トランジスタ10の
リード1(1a・1b・1c)の表面を傷つけることを
確実に防止するため、金属よりも表面硬度が低い合成樹
脂等の素材を使用することが好ましい。上記下型2の上
面2aには、複数(例えば10個)のトランジスタ10
の本体10aを同じ横方向に寝かせて嵌め込む凹部2b
がピン6の軸心方向に適当な間隔を置いて形成される。
また、下型2の他側部には、各凹部2bに嵌め込んだト
ランジスタ10の各リード1a・1b・1cに対応する
位置に、ピン7の軸心方向の全長にわたって成形溝5が
段落ち状に形成される。[0009] The materials of the lower die 2, the presser 3, and the molding tool 4 are not particularly limited, and metals, synthetic resins, and the like can be used. However, in order to reliably prevent the surfaces of the leads 1 (1a, 1b, 1c) of the transistor 10 from being damaged, it is preferable to use a material such as a synthetic resin whose surface hardness is lower than that of metal. A plurality of (for example, 10) transistors 10 are provided on the upper surface 2a of the lower mold 2.
A recess 2b into which the main body 10a is fitted while lying in the same lateral direction.
are formed at appropriate intervals in the axial direction of the pin 6. Further, on the other side of the lower mold 2, a molding groove 5 is formed in a stepped manner over the entire length of the pin 7 in the axial direction at a position corresponding to each lead 1a, 1b, 1c of the transistor 10 fitted in each recess 2b. formed into a shape.
【0010】この成形溝5の溝底5aは下型2の上面2
aとほぼ平行に形成され、下型2の上面2aと溝底5a
とはこれらに対して中央リード1bの曲げ角に対応する
傾斜角だけ傾斜する傾斜面5bを介して連続させてある
。また、下型2の上面2aとこの傾斜面5bとは円弧状
のコーナ5cで連続させてあり、上記傾斜面5bと溝底
5aとは円弧状のコーナ5dで連続させてある。The groove bottom 5a of this molding groove 5 is the upper surface 2 of the lower mold 2.
a, the upper surface 2a of the lower mold 2 and the groove bottom 5a.
and are connected to these via an inclined surface 5b which is inclined by an inclination angle corresponding to the bending angle of the central lead 1b. Further, the upper surface 2a of the lower mold 2 and the inclined surface 5b are connected to each other at an arc-shaped corner 5c, and the inclined surface 5b and the groove bottom 5a are connected to each other at an arc-shaped corner 5d.
【0011】押さえ具3は、凹部2bに嵌め込んだトラ
ンジスタ10の各リード1a・1b・1cの基端部を凹
部1bと成形溝5との間で下型2の上面2aに押さえ付
けられるように形成してあればよい。成形具4は櫛歯形
に形成され、各櫛歯の先端には、成形溝5の傾斜面5b
に対応する傾斜面4aと、成形溝5のコーナ5dに対応
したコーナ4cとが形成される。The presser 3 is arranged so that the base ends of the leads 1a, 1b, and 1c of the transistor 10 fitted in the recess 2b are pressed against the upper surface 2a of the lower mold 2 between the recess 1b and the molding groove 5. It is sufficient if it is formed as follows. The forming tool 4 is formed into a comb-teeth shape, and the tip of each comb-teeth has an inclined surface 5b of the forming groove 5.
An inclined surface 4a corresponding to the corner 5d of the forming groove 5 and a corner 4c corresponding to the corner 5d of the forming groove 5 are formed.
【0012】この部品のリードフォーミング治具におい
て、下型2の各凹部2bにトランジスタ10の本体10
aをはめ込み、押さえ具3で各トランジスタ10のリー
ド1a・1b・1cの基端部を押さえた後、成形具4で
各トランジスタ10の中央のリード1bを成形溝5に押
し込めると、各トランジスタ10の中央のリード1bの
みが塑性変形されてクランク状に曲げられる。この時、
中央のリード1bの基端部側の屈曲部は成形具5のコー
ナ5cに沿って曲げられ、また、中央のリード1bの先
端側の屈曲部は成形具5のコーナ5cに沿って曲げられ
るので、中央のリード1bが無理なく曲げられ、中央の
リード1bのメッキの割れ、欠け、リード1bの傷やし
わ等の障害を発生することなく曲げることができる。ま
た、リード1bを曲げる位置、曲げる角度、曲げる曲率
半径などを均一に形成することができる。In the lead forming jig for this component, the main body 10 of the transistor 10 is placed in each recess 2b of the lower die 2.
a, press the base ends of the leads 1a, 1b, and 1c of each transistor 10 with the presser 3, and then press the center lead 1b of each transistor 10 into the molding groove 5 with the molding tool 4, and each transistor 10 Only the central lead 1b is plastically deformed and bent into a crank shape. At this time,
The bent portion on the base end side of the central lead 1b is bent along the corner 5c of the forming tool 5, and the bent portion on the distal end side of the central lead 1b is bent along the corner 5c of the forming tool 5. , the center lead 1b can be bent without strain, and can be bent without causing problems such as cracks or chips in the plating of the center lead 1b, or scratches or wrinkles on the lead 1b. Further, the bending position, bending angle, bending radius of curvature, etc. of the lead 1b can be made uniform.
【0013】上記の一実施例では、成形溝5がトランジ
スタ10のリード1a・1b・1cが並ぶ方向に下型2
の全長に渡って一様に形成されているが、各トランジス
タ10の中央のリード1bに対応する部分のみを段落ち
状に凹入させて各トランジスタ10ごとに独立した成形
溝5を形成するようにしてもよい。また、下型2に載置
するトランジスタ10の個数は特に限定されず、1個以
上であればよい。したがって、下型2の凹部2aの数も
特に限定されず、1個以上であればよい。In the above-mentioned embodiment, the molding groove 5 is aligned with the lower die 2 in the direction in which the leads 1a, 1b, and 1c of the transistor 10 are lined up.
However, only the part corresponding to the central lead 1b of each transistor 10 is recessed in a step-like manner to form an independent molding groove 5 for each transistor 10. You can also do this. Further, the number of transistors 10 placed on the lower die 2 is not particularly limited, and may be one or more. Therefore, the number of recesses 2a of the lower mold 2 is not particularly limited, as long as it is one or more.
【0014】[0014]
【発明の効果】以上のように、本発明の部品のリードフ
ォーミング治具によれば、下型に載置した部品、特にト
ランジスタのリードの基端部を押さえ具で押さえ、成形
具で中央のリードを成形溝に押さえ込むという簡単な操
作で、メッキ割れ、欠け、傷、しわ等の障害を発生させ
ることなく、短時間で、正確に中央リードをクランク状
に成形できる。As described above, according to the component lead forming jig of the present invention, the base end of the component placed on the lower mold, especially the transistor lead, is held down by the presser, and the center part is held down by the forming tool. By simply pressing the lead into the forming groove, the center lead can be formed into a crank shape in a short time and accurately without causing problems such as cracks, chips, scratches, or wrinkles in the plating.
【0015】本発明において、特に、複数のトランジス
タを下型に載せて同時にそれらのリードの基端部を押さ
え具で押さえて、同時に各トランジスタの中央のリード
のみを成形具で成形溝に押さえ込めるように構成する場
合には、多数のトランジスタのリードフォーミングを一
挙に行うことができ、一層作業能率を高めることができ
る。In the present invention, in particular, it is possible to place a plurality of transistors on a lower mold and simultaneously press the base ends of their leads with a presser, and at the same time press only the center lead of each transistor into the molding groove with a molding tool. In the case of such a configuration, lead forming of a large number of transistors can be performed at once, and work efficiency can be further improved.
【0016】また、特に、下型の成形溝をトランジスタ
のリードが並ぶ方向に下型の全長にわたって形成される
場合には、下型の形状を単純化でき、下型の製造コスト
の削減を図ることが可能になるので有利である。[0016] In addition, especially when the molding groove of the lower mold is formed over the entire length of the lower mold in the direction in which the leads of the transistor are lined up, the shape of the lower mold can be simplified and the manufacturing cost of the lower mold can be reduced. This is advantageous because it makes it possible to
【図1】本発明の一実施例に係る部品のリードフォーミ
ング治具の原理を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing the principle of a component lead forming jig according to an embodiment of the present invention.
【図2】本発明の一実施例に係る部品のリードフォーミ
ング治具の側面図である。FIG. 2 is a side view of a component lead forming jig according to an embodiment of the present invention.
【図3】本発明の一実施例に係る部品のリードフォーミ
ング治具の斜視図である。FIG. 3 is a perspective view of a lead forming jig for a component according to an embodiment of the present invention.
【図4】従来のリード成形作業の説明図である。FIG. 4 is an explanatory diagram of a conventional lead forming operation.
【図5】リードの成形形状を示す側面図である。FIG. 5 is a side view showing the molded shape of the lead.
【図6】リード成形により生じる障害を例示する説明図
である。FIG. 6 is an explanatory diagram illustrating a failure caused by lead forming.
1(1a,1b,1c) リード 2 下型 2a 上面 3 押さえ具 4 成形具 5 成形溝 5a 溝底 5b 傾斜面 5c,5d コーナ 10 部品(トランジスタ) 1 (1a, 1b, 1c) lead 2 Lower mold 2a Top surface 3 Holder 4 Molding tool 5 Molding groove 5a Groove bottom 5b Inclined surface 5c, 5d corner 10 Parts (transistor)
Claims (4)
る下型(2) と、下型(2) に載置した部品(10
)のリード(1) の基端部を押さえる押さえ具(3)
と、上記リード(1) のうち、少なくともいずれか
1本のリード(1b)の中間部及び先端部を下型(2)
に押さえつける成形具(4) と、上記下型(2)
に上記部品(10)のリード(1b)の中間部及び先端
部が上記成形具(4) によって押し込まれる、段落ち
状に形成された成形溝(5) とを備えたことを特徴と
する、部品のリードフォーミング治具。Claim 1: A lower die (2) on which the part (10) is placed lying down, and a part (10) placed on the lower die (2).
) Holder (3) that holds down the base end of the lead (1)
Then, the middle part and the tip of at least one lead (1b) among the leads (1) are molded into a lower mold (2).
The molding tool (4) to be pressed against the mold and the lower mold (2)
and a molding groove (5) formed in a stepped shape into which the middle part and the tip of the lead (1b) of the part (10) are pushed by the molding tool (4). Lead forming jig for parts.
形溝(5) の溝底(5a)との段差が傾斜面(5b)
とその両端の円弧状のコーナ(5c),(5d) で連
続している請求項1に記載の部品のリードフォーミング
治具。2. The step between the upper surface (2a) of the lower mold (2) and the groove bottom (5a) of the molding groove (5) is an inclined surface (5b).
2. The lead forming jig for a component according to claim 1, wherein the lead forming jig is continuous at arc-shaped corners (5c) and (5d) at both ends thereof.
り、成形されるリード(1) が中央のリード(1b)
である請求項1に記載の部品のリードフォーミング治具
。3. The component (10) is a transistor, and the molded lead (1) is the central lead (1b).
The lead forming jig for parts according to claim 1.
上記成形溝(5) を形成した下型(2) と、押さえ
具(3) と、成形具(4) とを成形溝(5) に直
角に複数配列した請求項1に記載の部品のリードフォー
ミング治具。4. A lower mold (2) in which the molding groove (5) is formed so as to be able to handle molding of a plurality of parts, a presser (3), and a molding tool (4) are connected to the molding groove (5). 2. The component lead forming jig according to claim 1, wherein a plurality of lead forming jigs are arranged at right angles to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2405711A JP2580389B2 (en) | 1990-12-25 | 1990-12-25 | Component lead forming jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2405711A JP2580389B2 (en) | 1990-12-25 | 1990-12-25 | Component lead forming jig |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04223362A true JPH04223362A (en) | 1992-08-13 |
JP2580389B2 JP2580389B2 (en) | 1997-02-12 |
Family
ID=18515321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2405711A Expired - Lifetime JP2580389B2 (en) | 1990-12-25 | 1990-12-25 | Component lead forming jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2580389B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0662597U (en) * | 1993-01-29 | 1994-09-02 | 安藤電気株式会社 | LED lead bending jig |
JP2009176789A (en) * | 2008-01-22 | 2009-08-06 | Hitachi Ltd | Lead forming jig for discrete component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681936A (en) * | 1979-12-07 | 1981-07-04 | Nichiden Mach Ltd | Lead wire forming device |
JPH02148739U (en) * | 1989-05-19 | 1990-12-18 |
-
1990
- 1990-12-25 JP JP2405711A patent/JP2580389B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681936A (en) * | 1979-12-07 | 1981-07-04 | Nichiden Mach Ltd | Lead wire forming device |
JPH02148739U (en) * | 1989-05-19 | 1990-12-18 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0662597U (en) * | 1993-01-29 | 1994-09-02 | 安藤電気株式会社 | LED lead bending jig |
JP2009176789A (en) * | 2008-01-22 | 2009-08-06 | Hitachi Ltd | Lead forming jig for discrete component |
Also Published As
Publication number | Publication date |
---|---|
JP2580389B2 (en) | 1997-02-12 |
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