JPH042155A - Immersion cooling device of boiling type - Google Patents
Immersion cooling device of boiling typeInfo
- Publication number
- JPH042155A JPH042155A JP10239490A JP10239490A JPH042155A JP H042155 A JPH042155 A JP H042155A JP 10239490 A JP10239490 A JP 10239490A JP 10239490 A JP10239490 A JP 10239490A JP H042155 A JPH042155 A JP H042155A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- heating element
- condenser
- immersed
- refrigerant liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 238000009835 boiling Methods 0.000 title claims abstract description 19
- 238000007654 immersion Methods 0.000 title claims description 9
- 239000007788 liquid Substances 0.000 claims description 32
- 239000003507 refrigerant Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000002826 coolant Substances 0.000 abstract 2
- 239000000110 cooling liquid Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電気装置、特に半導体装置などの発熱体の冷
却に使用する浸漬形沸騰冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an immersion boiling cooling device used for cooling a heat generating element such as an electrical device, particularly a semiconductor device.
従来の浸漬形沸騰冷却装置の三種類の構造例を第７図〜
第１２図に示す。Figure 7 shows three types of structural examples of conventional immersion type boiling cooling equipment.
It is shown in FIG.
第７図および第８図は第１の従来例を示す内部構造図お
よび側面図、第９図および第１Ｏ図は第２の従来例を示
す内部構造図および側面図、第１１ｒＡおよび第１２図
は第３の従来例を示す内部構造図および側面図である。7 and 8 are internal structure diagrams and side views showing the first conventional example, FIGS. 9 and 1O are internal structure diagrams and side views showing the second conventional example, and FIGS. 11rA and 12. FIG. 2 is an internal structure diagram and a side view showing a third conventional example.
第７図および第８図において、例えば半導体変換装置な
どの発熱体３は冷却タンク６に収納した冷媒液４に浸漬
されている。冷却タンク６の上部には凝縮器５が蒸気管
８を介して接続され、冷却タンク６、凝縮器５および蒸
気管８は外部と気密が保たれている。２は発熱体３と外
部とを電気接続するための気密端子である。7 and 8, a heating element 3 such as a semiconductor converter is immersed in a refrigerant liquid 4 contained in a cooling tank 6. In FIGS. A condenser 5 is connected to the upper part of the cooling tank 6 via a steam pipe 8, and the cooling tank 6, the condenser 5, and the steam pipe 8 are kept airtight from the outside. 2 is an airtight terminal for electrically connecting the heating element 3 to the outside.
冷媒液は沸点の低い液体を使用しているので、発熱体３
の発生熱によって冷媒液は低い温度で沸騰して激しい乱
流を起こす。この乱流熱伝達を利用して発熱体は効率よ
く冷却される。沸騰して気化した冷媒は蒸気となって蒸
気管８をとおって上昇し、凝縮器５に運ばれ冷却されて
液化し、戻し管７をとおって冷却タンク６に戻る。Since the refrigerant liquid uses a liquid with a low boiling point, the heating element 3
The heat generated causes the refrigerant liquid to boil at a low temperature, causing severe turbulence. The heating element is efficiently cooled by utilizing this turbulent heat transfer. The boiled and vaporized refrigerant becomes vapor and rises through the steam pipe 8, is carried to the condenser 5, is cooled and liquefied, and returns to the cooling tank 6 through the return pipe 7.
第９図および第１０図は第２の従来例を示すものであり
、第７図で説明した第１の従来例と異なるところは蒸気
管８と液戻し管７が無いことである。9 and 10 show a second conventional example, which differs from the first conventional example explained in FIG. 7 in that the steam pipe 8 and liquid return pipe 7 are not provided.
また発熱体３の発生熱によって沸騰気化した冷媒蒸気は
冷媒の液面から直接上昇して凝縮器で冷却され、液化し
て滴下するようになっている。Further, the refrigerant vapor boiled and vaporized by the heat generated by the heating element 3 rises directly from the liquid level of the refrigerant, is cooled by the condenser, and is liquefied and dripped.
第１１図および第１２図に示す第３の従来例は、冷却タ
ンクと凝縮器とが一体の気密容器ｌとなっていることが
第９図に示す第２の従来例と異なるところで、それ以外
の構造は第２の実施例と基本的に同一である。The third conventional example shown in FIGS. 11 and 12 differs from the second conventional example shown in FIG. 9 in that the cooling tank and the condenser are integrated into an airtight container l. The structure of is basically the same as the second embodiment.
従来の構成の浸漬形沸騰冷却装置では以上の例のように
、いずれも冷却タンク１つに対して凝縮器１つの組合せ
単位になっていて、発熱体の容量に応じてこの単位を複
数個組み合わせて冷却装置を構成している。As shown in the examples above, conventional immersion boiling cooling systems have a combination unit of one cooling tank and one condenser, and multiple units can be combined depending on the capacity of the heating element. A cooling device is constructed using the following.
また凝縮器の冷却は、図示を省略しであるが外部に送風
機を設け、この送風機と凝縮器とを接続風洞で接続し凝
縮器に冷却風を流して行うようになっている。第８図、
第１Ｏ図および第１２図に示す矢印Ａはこの冷却風の流
れを示す。The condenser is cooled by providing an external blower (not shown), connecting the blower and the condenser through a connecting wind tunnel, and flowing cooling air through the condenser. Figure 8,
Arrow A shown in FIGS. 1O and 12 indicates the flow of this cooling air.
従来の構造の浸漬形沸騰冷却装置を複数個組み合わせて
使用する場合は、凝縮器を冷却するための送風機、およ
び送風機と凝縮器とを接続する接続風洞が凝縮器と同数
だけ必要となって、送風機と接続風洞を含めた装置全体
の小型軽量化が困難であった。When using a combination of multiple immersion type boiling coolers with a conventional structure, the same number of blowers as the number of condensers are required, as are blowers to cool the condensers, and connecting air tunnels to connect the blowers and the condensers. It was difficult to reduce the size and weight of the entire device, including the blower and connected wind tunnel.
そこでこの発明の目的は、送風機および接続風洞を含め
た装置全体を小型軽量化できる浸漬形沸騰冷却装置の構
造を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a structure of an immersion type boiling cooling device that can reduce the size and weight of the entire device including a blower and a connected wind tunnel.
〔課題を解決するための手段］
上記の目的を達成するためにこの発明は、発熱体を沸点
の低い冷媒液に浸漬し、この発熱体の発生熱により冷媒
液を沸騰させ、その際行われる熱伝達により前記発熱体
を冷却する浸漬形沸騰冷却装置において、沸騰して気化
した冷媒を液化させる一組の凝縮器と発熱体を冷媒液に
浸漬して収納した複数の冷却タンクとを一つの気密室と
して構成する。さらに、冷却タンク相互間をタンク接続
管により接続し、このタンク接続管に凝縮器で液化した
冷媒を冷却タンクに戻すための一本または複数本の液戻
し管を接続する。さらにまた、−組の凝縮器の内部を複
数の気密室に分割し、この分割された気密室のそれぞれ
に発熱体を冷媒液に浸漬して収納した冷却タンクを気密
に接続する。また、長方形の気密容器の内部を複数個の
気密室に分割し、このそれぞれの気密室の上部に凝縮器
を、下部に冷媒液に浸漬した発熱体を収納する。[Means for Solving the Problems] In order to achieve the above object, the present invention immerses a heating element in a refrigerant liquid with a low boiling point, boils the refrigerant liquid with the heat generated by the heating element, and performs the following steps: In an immersion-type evaporative cooling device that cools the heating element by heat transfer, a set of condensers that liquefy the boiled and vaporized refrigerant and a plurality of cooling tanks that house the heating element immersed in the refrigerant liquid are combined into one. Configure as an airtight room. Further, the cooling tanks are connected to each other by a tank connecting pipe, and one or more liquid return pipes for returning the refrigerant liquefied in the condenser to the cooling tank are connected to the tank connecting pipe. Furthermore, the inside of the - group of condensers is divided into a plurality of airtight chambers, and a cooling tank containing a heating element immersed in a refrigerant liquid is airtightly connected to each of the divided airtight chambers. Further, the inside of the rectangular airtight container is divided into a plurality of airtight chambers, and each of the airtight chambers houses a condenser in the upper part and a heating element immersed in the refrigerant liquid in the lower part.
〔作用］
この発明の構成では、複数の冷却タンクに対して凝縮器
が一個あるいは一体となるので、凝縮器を冷却するため
の送風機および送風機と凝縮器とを接続する接続風洞の
個数を削減でき、装置全体を小型軽量化できる。[Function] In the configuration of the present invention, since a single condenser or an integrated condenser are provided for a plurality of cooling tanks, the number of blowers for cooling the condensers and connecting wind tunnels for connecting the blowers and the condensers can be reduced. , the entire device can be made smaller and lighter.
第１図〜第６図に本発明の実施例を示す。第１図および
第２図は第１の実施例を示す内部構造図およびその側面
図、第３図および第４図は第２の実施例を示す内部構造
図およびその側面図、第５図および第６図は第３の実施
例を示す内部構造図およびその側面図である。Embodiments of the present invention are shown in FIGS. 1 to 6. 1 and 2 are internal structure diagrams and side views thereof showing the first embodiment, FIGS. 3 and 4 are internal structure diagrams and side views thereof showing the second embodiment, and FIGS. FIG. 6 is an internal structural diagram and a side view of the third embodiment.
第１の実施例を示す第１図および第２図は、凝縮器−組
に対して冷却タンク二組を接続して一つの気密室とした
ものである。第１図および第２図において、発熱体３を
冷媒液４にンｉ漬して収納した二組の冷却タンク６の上
部に一組の凝縮器５を配置し、その間を蒸気管８で接続
している。さらに二組の冷却タンク６をタンク接続管９
で接続し、このタンク接続管９と凝縮器５とを液戻し管
７で接続している。２は発熱体３と外部とを電気接続す
るための気密端子である。FIGS. 1 and 2 show a first embodiment in which two sets of cooling tanks are connected to a set of condensers to form one airtight chamber. In FIGS. 1 and 2, a pair of condensers 5 are arranged above two sets of cooling tanks 6 in which heating elements 3 are immersed in refrigerant liquid 4, and a steam pipe 8 is connected between them. are doing. Furthermore, two sets of cooling tanks 6 are connected to the tank connecting pipe 9.
The tank connecting pipe 9 and the condenser 5 are connected by a liquid return pipe 7. 2 is an airtight terminal for electrically connecting the heating element 3 to the outside.
冷却の作用は第７図で説明した第１の従来例と基本的に
同一である。即ち冷媒液は沸点の低い液体を使用してい
るので、発熱体３の発生熱によって冷媒液は低い温度で
沸騰し、激しい乱流を起こすことにより発熱体は効率よ
く冷却される。沸騰気化した冷媒は蒸気となって蒸気管
８をとおって上昇し、凝縮器５に運ばれ冷却されて液化
し、戻し管７、タンク接続管９をとおって冷却タンク６
に戻る。The cooling effect is basically the same as that of the first conventional example explained in FIG. That is, since a liquid with a low boiling point is used as the refrigerant liquid, the refrigerant liquid boils at a low temperature due to the heat generated by the heating element 3, and the heating element is efficiently cooled by causing intense turbulence. The boiled and vaporized refrigerant becomes vapor and rises through the steam pipe 8, is transported to the condenser 5, is cooled and liquefied, and passes through the return pipe 7 and tank connection pipe 9 to the cooling tank 6.
Return to
第２の実施例を示す第３図および第４図は、組の凝縮器
の内部を二つの気密室に分割し、それぞれの気密室に分
割数と同数の二個の冷却タンクを接続したものである。Figures 3 and 4 show the second embodiment, in which the inside of a set of condensers is divided into two airtight chambers, and two cooling tanks of the same number as the number of divisions are connected to each airtight chamber. It is.
この第３図および第４図の構成において、凝縮器５の内
部が気密に二分割されていることと、第１図に示すタン
ク接続管９が無いこと、および液戻し管７が凝縮器５の
二分割されたそれぞれの気密室から冷却タンクに接続。In the configurations shown in FIGS. 3 and 4, the inside of the condenser 5 is airtightly divided into two parts, there is no tank connection pipe 9 shown in FIG. 1, and the liquid return pipe 7 is connected to the condenser 5. Each airtight chamber divided into two is connected to a cooling tank.
されていること以外は第１図と同一である。冷却の作用
も第１の実施例と基本的に同一であるので説明は省略す
る。It is the same as FIG. 1 except that it is marked. The cooling effect is also basically the same as in the first embodiment, so a description thereof will be omitted.
第３の実施例を示す第５図は、長方形の気密容器１の内
部を二個の気密室に分割し、それぞれの気密室の上部に
凝縮器を備え、下部に冷媒液４に浸漬した発熱体３を収
納するようにしたものである。第１および第２の実施例
と異なるところは蒸気管および液戻し管が無いことであ
り、それ以外の構造は第１および第２の実施例と基本的
に同一・である。冷却の作用については蒸気管および液
戻し管が無いので、沸騰気化した冷媒の蒸気は冷媒の液
面から直接上昇して凝縮器で冷却され、液化して滴下す
るようになっている。第２図、第４図および第６図に示
す矢印Ａは凝縮器を冷却する冷却風の流れを示す。FIG. 5 showing the third embodiment shows a system in which the inside of a rectangular airtight container 1 is divided into two airtight chambers, a condenser is provided in the upper part of each airtight chamber, and a heat generating unit is immersed in a refrigerant liquid 4 in the lower part. It is designed to house the body 3. The difference from the first and second embodiments is that there is no steam pipe and liquid return pipe, and the other structures are basically the same as the first and second embodiments. As for the cooling effect, since there is no steam pipe or liquid return pipe, the vapor of the boiling vaporized refrigerant rises directly from the liquid level of the refrigerant, is cooled in the condenser, liquefies, and drips. Arrows A shown in FIGS. 2, 4, and 6 indicate the flow of cooling air that cools the condenser.
この発明の構成によれば、複数の冷却タンクに対して凝
縮器が一個あるいは一体となるので凝縮器は従来例に比
して大型になるが、凝縮器を冷却するための送風機、お
よび送風機と凝縮器とを接続する接続風胴の個数を削減
できる。従って送風機、風胴を含めた冷却装置全体を小
型軽量化できる。According to the configuration of the present invention, the condenser is larger than the conventional example because a single condenser or an integrated condenser is provided for a plurality of cooling tanks. The number of connection wind cylinders connected to the condenser can be reduced. Therefore, the entire cooling device including the blower and wind cylinder can be made smaller and lighter.
第１図および第２図は第１の実施例を示す内部構造図お
よびその側面図、第３図および第４図は第２の実施例を
示す内部構造図およびその側面図、第５図および第６図
は第３の実施例を示す内部構造図およびその側面図であ
る。
第７図および第８図は第１の従来例を示す内部構造図お
よび側面図、第９図および第１０図は第２の従来例を示
す内部構造図および側面図、第１１図および第１２図は
第３の従来例を示す内部構造図および側面図である。
１・・・気密容器、２・・・気密端子、３・・・発熱体
、４・・・冷媒液、５・・・凝縮器、６・・・冷却タン
ク、７・・・液戻し管、８・・・蒸気管、９・・・タン
ク接続管。
！
図
第
怪
２図
１４瑠
第
図
纂
図1 and 2 are internal structure diagrams and side views thereof showing the first embodiment, FIGS. 3 and 4 are internal structure diagrams and side views thereof showing the second embodiment, and FIGS. FIG. 6 is an internal structural diagram and a side view of the third embodiment. 7 and 8 are internal structure diagrams and side views showing the first conventional example, FIGS. 9 and 10 are internal structure diagrams and side views showing the second conventional example, and FIGS. 11 and 12. The figures are an internal structure diagram and a side view showing a third conventional example. DESCRIPTION OF SYMBOLS 1... Airtight container, 2... Airtight terminal, 3... Heating element, 4... Refrigerant liquid, 5... Condenser, 6... Cooling tank, 7... Liquid return pipe, 8... Steam pipe, 9... Tank connection pipe. ! Figure No. 2 Figure 14 Rui Illustrated Compilation
Claims (1)
発生熱により冷媒液を沸騰させ、その際行われる熱伝達
により前記発熱体を冷却する浸漬形沸騰冷却装置におい
て、沸騰して気化した冷媒を液化させる一組の凝縮器と
発熱体を冷媒液に浸漬して収納した複数の冷却タンクと
を一つの気密室として構成することを特徴とする浸漬形
沸騰冷却装置。 ２）冷却タンク相互間をタンク接続管により接続し、こ
のタンク接続管に凝縮器で液化した冷媒を冷却タンクに
戻すための一本または複数本の液戻し管を接続してなる
ことを特徴とする請求項１）記載の浸漬形沸騰冷却装置
。 ３）発熱体を沸点の低い冷媒液に浸漬し、この発熱体の
発生熱により冷媒液を沸騰させ、その際行われる熱伝達
により前記発熱体を冷却する浸漬形沸騰冷却装置におい
て、沸騰して気化した冷媒を液化させる一組の凝縮器の
内部を複数の気密室に分割し、この分割された気密室の
それぞれに発熱体を冷媒液に浸漬して収納した冷却タン
クを気密に接続することを特徴とする浸漬形沸騰冷却装
置。 ４）長方形の気密容器の内部を複数個の気密室に分割し
、このそれぞれの気密室の上部に凝縮器を、下部に冷媒
液に浸漬した発熱体を収納することを特徴とする浸漬形
沸騰冷却装置。[Scope of Claims] 1) Immersion-type boiling cooling in which a heating element is immersed in a refrigerant liquid with a low boiling point, the refrigerant liquid is boiled by the heat generated by the heating element, and the heating element is cooled by the heat transfer that occurs at that time. An immersion boiling device characterized in that a set of condensers that liquefy boiled and vaporized refrigerant and a plurality of cooling tanks that store heating elements immersed in refrigerant liquid are configured as one airtight chamber. Cooling system. 2) The cooling tanks are connected to each other by a tank connecting pipe, and one or more liquid return pipes are connected to the tank connecting pipe for returning the refrigerant liquefied in the condenser to the cooling tank. The immersion boiling cooling device according to claim 1). 3) In an immersion-type boiling cooling device in which a heating element is immersed in a refrigerant liquid with a low boiling point, the refrigerant liquid is boiled by the heat generated by the heating element, and the heating element is cooled by the heat transfer performed at that time. The inside of a set of condensers that liquefy vaporized refrigerant is divided into a plurality of airtight chambers, and a cooling tank containing a heating element immersed in refrigerant liquid is airtightly connected to each of the divided airtight chambers. An immersion boiling cooling device featuring: 4) Immersed type boiling characterized by dividing the inside of a rectangular airtight container into a plurality of airtight chambers, and storing a condenser in the upper part of each airtight chamber and a heating element immersed in refrigerant liquid in the lower part. Cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239490A JPH042155A (en) | 1990-04-18 | 1990-04-18 | Immersion cooling device of boiling type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239490A JPH042155A (en) | 1990-04-18 | 1990-04-18 | Immersion cooling device of boiling type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042155A true JPH042155A (en) | 1992-01-07 |
Family
ID=14326234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10239490A Pending JPH042155A (en) | 1990-04-18 | 1990-04-18 | Immersion cooling device of boiling type |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042155A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013179104A (en) * | 2012-02-28 | 2013-09-09 | Hitachi Automotive Systems Ltd | Power conversion device |
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|---|---|---|---|---|
| JPS52156581A (en) * | 1976-06-23 | 1977-12-27 | Toshiba Corp | Semiconductor device |
| JPS58177208A (en) * | 1982-04-03 | 1983-10-17 | Fujimori Seisakusho:Kk | Single-spindle n/c drilling machine and control circuit thereof |
-
1990
- 1990-04-18 JP JP10239490A patent/JPH042155A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156581A (en) * | 1976-06-23 | 1977-12-27 | Toshiba Corp | Semiconductor device |
| JPS58177208A (en) * | 1982-04-03 | 1983-10-17 | Fujimori Seisakusho:Kk | Single-spindle n/c drilling machine and control circuit thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013179104A (en) * | 2012-02-28 | 2013-09-09 | Hitachi Automotive Systems Ltd | Power conversion device |
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