JPH0420558B2 - - Google Patents
Info
- Publication number
- JPH0420558B2 JPH0420558B2 JP1012985A JP1012985A JPH0420558B2 JP H0420558 B2 JPH0420558 B2 JP H0420558B2 JP 1012985 A JP1012985 A JP 1012985A JP 1012985 A JP1012985 A JP 1012985A JP H0420558 B2 JPH0420558 B2 JP H0420558B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- terminal
- receptacle
- board
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001012 protector Effects 0.000 claims description 19
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 102100028680 Protein patched homolog 1 Human genes 0.000 description 1
- 101710161390 Protein patched homolog 1 Proteins 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structure Of Telephone Exchanges (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1012985A JPS61170196A (ja) | 1985-01-23 | 1985-01-23 | 本配線盤用ボ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1012985A JPS61170196A (ja) | 1985-01-23 | 1985-01-23 | 本配線盤用ボ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61170196A JPS61170196A (ja) | 1986-07-31 |
JPH0420558B2 true JPH0420558B2 (ru) | 1992-04-03 |
Family
ID=11741673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1012985A Granted JPS61170196A (ja) | 1985-01-23 | 1985-01-23 | 本配線盤用ボ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61170196A (ru) |
-
1985
- 1985-01-23 JP JP1012985A patent/JPS61170196A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61170196A (ja) | 1986-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |