JPH04199758A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH04199758A JPH04199758A JP2333230A JP33323090A JPH04199758A JP H04199758 A JPH04199758 A JP H04199758A JP 2333230 A JP2333230 A JP 2333230A JP 33323090 A JP33323090 A JP 33323090A JP H04199758 A JPH04199758 A JP H04199758A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connector
- board
- circuit
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 28
- 239000002699 waste material Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000004907 flux Effects 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は各種電子機器に使用される回路基板に係り、特
に回路基板同士を電気的に接続する為のコネクタを有す
る回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a circuit board used in various electronic devices, and particularly to a circuit board having a connector for electrically connecting circuit boards to each other.
電子機器に使用される回路基板には、機器の設計上基板
の大きさや回路の配設位置の制約から回路基板同士、又
は回路基板と接続線を接続する必要があり、この為コネ
クタが使用されている。特に回路基板同士の接続は第4
図に示すように、回路基板1、及び2の側端から突出し
てコネクタ3、又は4を取り付る必要がある。その理由
はコネクタ3と4を接続した時コネクタ3の凸部3′が
コネクタ4の凹部4′へ嵌入する為、コネクタ3.4の
接続後、回路基板1と2がスペースの無駄なく配設され
るようにする為である。For circuit boards used in electronic devices, it is necessary to connect the circuit boards to each other or to the circuit boards and connecting wires due to restrictions on the size of the board and the location of the circuit due to the design of the device, and connectors are used for this purpose. ing. In particular, the connection between circuit boards is the fourth
As shown in the figure, it is necessary to protrude from the side edges of the circuit boards 1 and 2 and attach the connectors 3 or 4. The reason is that when connectors 3 and 4 are connected, the convex part 3' of connector 3 fits into the concave part 4' of connector 4, so after connecting connectors 3 and 4, circuit boards 1 and 2 can be arranged without wasting space. This is to ensure that
しかし、上記回路基板1、又は2の構成とした場合、自
動半田処理を行う為には不都合となる。However, when the circuit board 1 or 2 is configured as described above, it is inconvenient to perform automatic soldering processing.
すなわち、自動半田処理は上記コネクタ3.4、及び他
の回路素子を基板に差し、自動半田層に漬け(浮かせて
)半田付けを行う為、コネクタ3.4が回路基板1.2
の側端から突出しているとコネクタ3.4にフラックス
や半田が付着する。特に、回路基板が自動半田層上を移
動する方向によってはコネクタ3.4内のビンにフラッ
クスが付着し接続不良等の問題をおこす。In other words, in the automatic soldering process, the connector 3.4 and other circuit elements are inserted into the board, immersed (floated) in the automatic solder layer, and soldered. Therefore, the connector 3.4 is connected to the circuit board 1.2.
If the connector 3.4 protrudes from the side edge, flux or solder will adhere to the connector 3.4. In particular, depending on the direction in which the circuit board moves on the automatic solder layer, flux may adhere to the bottle within the connector 3, 4, causing problems such as poor connection.
また、付着した半田や、自動半田層上を移動する時の半
田層からの熱によりコネクタ3.4のハウジイングに焦
げや変形を生じる場合もある。Further, the housing of the connector 3.4 may be scorched or deformed due to the adhered solder or the heat from the solder layer as it moves over the automatic solder layer.
この為、従来コネクタ3.4が突出する構成の回路基板
の作成は、コネクタ3.4を自動半田処理の後手作業で
半田付けしている。この場合、特にコネクタ3.4の端
子ピッチが狭い時には極めて半田付けが困難となり、所
謂半田ブリッヂ等の発生により信顧性の欠ける回路基板
となる。For this reason, conventionally, a circuit board having a structure in which the connector 3.4 protrudes is created by manually soldering the connector 3.4 after an automatic soldering process. In this case, especially when the terminal pitch of the connector 3.4 is narrow, soldering becomes extremely difficult, resulting in a circuit board that lacks reliability due to the occurrence of so-called solder bridges.
〔発明の目的]
本発明は上記従来の問題点に鑑み、コネクタが突出する
回路基板の場合でもコネクタを取り付けたままで自動半
田を行うことを可能とし、信頬性のある回路基板を作成
することを目的とする。[Object of the Invention] In view of the above-mentioned conventional problems, it is an object of the present invention to create a reliable circuit board by making it possible to perform automatic soldering with the connector attached, even in the case of a circuit board with a protruding connector. With the goal.
本発明は上記目的を達成する為に、他の回路基板のコネ
クタと嵌合する嵌合部が使用時回路基板端より外部へ突
出する状態で配設されるコネクタを有する回路基板にお
いて、前記回路基板の端部に少なくとも前記嵌合部と等
しい面積を有し、切断部を介して前記回路基板の端部に
接続された捨て基板を具備することを特徴とすると共に
、特殊形状の切断部を介して捨て基板が設けられた回路
基板において、コネクタを前記切断部を覆って前記回路
基板に取り付ける取り付け処理と、該取り付け処理によ
りコネクタが取り付けられた回路基板を自動半田層によ
り半田付けする自動半田付け処理と、該自動半田付け処
理により前記コネクタが半田付けされた回路基板を前記
切断部で切断し、前記捨て基板を取り除く切断処理とを
順次行うことを特徴とする。In order to achieve the above object, the present invention provides a circuit board having a connector in which a fitting portion for fitting with a connector of another circuit board projects outward from an end of the circuit board during use. The circuit board is characterized in that an end portion thereof is provided with a sacrificial board having an area at least equal to the fitting portion and connected to the end portion of the circuit board via a cutting portion, and a cutting portion having a special shape. an attachment process for attaching a connector to the circuit board by covering the cut portion in a circuit board provided with a waste board through the attachment process; and an automatic soldering process for soldering the circuit board to which the connector is attached by the attachment process using an automatic solder layer. The method is characterized in that a bonding process and a cutting process in which the circuit board to which the connector is soldered by the automatic soldering process is cut at the cutting section and the waste board is removed are sequentially performed.
以下、本発明の一実施例について図面を参照しながら詳
述する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第1図(a)〜(C)は本実施例の回路基板を説明する
図である。ここで、同図(a)は本実施例の回路基板に
回路素子を差した状態を示す図であり、同図(b)は回
路基板に自動半田処理を行う状態を示す図であり、同図
(C)は本実施例の回路基板の完成状態を示す図である
。FIGS. 1(a) to 1(C) are diagrams illustrating the circuit board of this embodiment. Here, FIG. 3A is a diagram showing a state in which a circuit element is inserted into the circuit board of this embodiment, and FIG. Figure (C) is a diagram showing the completed state of the circuit board of this example.
同図(a3において、回路基板5はV溝5′を介して基
板5″と一体として形成され、回路基板5に設けられた
不図示の多数の孔にはコネクタ6の端子6′やIC(集
積回路)、抵抗等の回路素子の端子が差し込まれている
。基板5″はコネクタ6の下面全体を覆うと共に、さら
にコネクタ6の先端6″よりも長く延設されている。こ
こで、基板5″は後述する自動半田処理後■溝5′を割
り(切断し)、捨てられる為、以下この基板5″を捨て
基板5“という。In the same figure (a3), the circuit board 5 is formed integrally with the board 5'' through the V-groove 5', and the terminals 6' of the connector 6 and the IC ( Terminals of circuit elements such as integrated circuits (integrated circuits) and resistors are inserted.The board 5'' covers the entire bottom surface of the connector 6, and also extends longer than the tip 6'' of the connector 6. After the automatic soldering process described later, the groove 5' is split (cut) and the board 5'' is discarded, so hereinafter this board 5'' will be referred to as a discarded board 5''.
上述の回路基板5の如くコネクタ6や不図示のIC等を
取り付け第1図(a)の回路基板5を作成し、さらにこ
の回路基板5に基づいて同図(C)の回路基板を作成す
るには第2図に示す処理を行う必要がある。The circuit board 5 shown in FIG. 1(a) is created by attaching the connector 6 and ICs (not shown) as in the circuit board 5 described above, and then the circuit board shown in FIG. 1(C) is created based on this circuit board 5. It is necessary to perform the processing shown in FIG.
以下回路基板5の作成処理を説明する。先ず先付け手半
田処理を行う(工程■)。この処理は回路素子が差し込
まれた回路基板5に最小限必要な手半田を行うものであ
り、例えば自動半田層を使用する時に端子が短い電子部
品は動き易い為予めこれらの部品を固定する場合などで
ある。The process for creating the circuit board 5 will be described below. First, pre-soldering is performed (step ■). This process involves performing the minimum necessary manual soldering on the circuit board 5 into which the circuit elements are inserted. For example, when using an automatic solder layer, electronic components with short terminals tend to move easily, so if these components are fixed in advance. etc.
次に、ICの自動装入を行い、その後マスキングテープ
の貼着を行う(工程■、■)。尚、ICの自動装入の時
にはIC以外にも所定ピッチの複数の端子を有する回路
素子も同時に自動装入する。Next, the IC is automatically inserted, and then masking tape is applied (steps ① and ①). Incidentally, when automatically loading an IC, in addition to the IC, a circuit element having a plurality of terminals at a predetermined pitch is also automatically loaded at the same time.
次に、上記自動装入が不可能な回路素子の手袋入処理を
行う(工程■)。例えば、抵抗や上述のコネクタ6等の
装入処理である。以上のようにして回路基板5に各種回
路素子が取り付けられた状態が上述の第1図(a)であ
る(但し同図(a)にはコネクタ6以外の回路部品の取
り付け構成は省略している)。Next, the circuit elements that cannot be automatically inserted are subjected to glove-insertion processing (step ①). For example, this is the process of inserting resistors, the above-mentioned connector 6, and the like. The state in which various circuit elements are attached to the circuit board 5 as described above is shown in FIG. ).
次に、自動半田層に上述の如(回路素子が差し込まれた
回路基板5を浮かせ、第1図(b)に示すように半田層
7上を移動する。この自動半田処理(工程V)により回
路基板5に差し込まれた回路素子は回路基板5の例えば
下面に形成された配線パターンのランド部に半田付けさ
れる。この時同図(b)に示す如く、コネクタ6の下面
は捨て基板5″で覆われている為自動半田処理中、従来
のようにコネクタ6ヘフラツクスが付着したり、不用な
半田が付着することが無い。Next, as described above, the circuit board 5 with the circuit elements inserted is floated on the automatic solder layer and moved over the solder layer 7 as shown in FIG. 1(b). The circuit elements inserted into the circuit board 5 are soldered to the lands of the wiring pattern formed on the bottom surface of the circuit board 5. At this time, as shown in FIG. Since the connector 6 is covered with ``, during automatic soldering process, no flux or unnecessary solder adheres to the connector 6 unlike in the conventional case.
その後、回路基板5上に張り付けられたマスキングテー
プを剥がし、回路基板5の下面に長く伸びる回路素子の
リード線をカットする(工程■、■)。そして、回路基
板5を洗浄しく工程■)、回路基板5に付着したフラッ
クス等を洗い流す。Thereafter, the masking tape pasted on the circuit board 5 is peeled off, and the lead wires of the circuit elements extending long on the bottom surface of the circuit board 5 are cut (steps ① and ①). The circuit board 5 is then cleaned in step (2), in which flux and the like adhering to the circuit board 5 are washed away.
次に、後付け手半田処理(工程■)を行う。この工程は
、例えば回路基板5に直接リード線を半田付けするよう
な場合や回路基板5に直接取り付けられるスイッチ等の
半田付け処理である。尚、従来は自動半田処理(工程■
)でコネクタの半田付けができない為、コネクタの取り
付けをこの工程で行っていた。Next, a post-installation manual soldering process (step ①) is performed. This process is, for example, a process for soldering a lead wire directly to the circuit board 5 or a soldering process for a switch or the like that is directly attached to the circuit board 5. In addition, conventionally automatic soldering processing (process ■
), it was not possible to solder the connector, so the connector was installed in this process.
次に、捨て基板5″を■溝5′の部分で割り、捨て基板
5“を回路基板5から取り除く(工程X)。Next, the waste board 5'' is split at the groove 5', and the waste board 5'' is removed from the circuit board 5 (step X).
上記のように捨て基板5″を取り除いた後の回路基板5
の状態が第1図(C)であり、この時点で従来の回路基
板(例えば前述の第4図に示す回路基板2)と同一の形
状となる。Circuit board 5 after removing the waste board 5'' as described above
The state is shown in FIG. 1C, and at this point it has the same shape as a conventional circuit board (for example, the circuit board 2 shown in FIG. 4 described above).
その後、回路基板5に例えば回路チエツク用治具を取り
付け、電源電圧のチエ、ツタや、各回路の動作チエツク
を行う(工程XI)。さらに、半田ブリッヂ等の外観検
査を行い(工程XII) 、その後梱包出荷される(工
程X1ll)。Thereafter, a circuit check jig, for example, is attached to the circuit board 5, and the power supply voltage is checked and the operation of each circuit is checked (Step XI). Furthermore, the appearance of solder bridges, etc. is inspected (Step XII), and then the products are packed and shipped (Step X1ll).
以上のように回路基板5を作成することにより、自動半
田処理を行う時は捨て基板5″によりコネクタ6へのフ
ラックスの付着が防止され、コネクタ6の接続不良や、
ハウジイングの損傷を防止できる。By creating the circuit board 5 as described above, when performing automatic soldering, the waste board 5'' prevents flux from adhering to the connector 6, resulting in poor connection of the connector 6,
Damage to the housing can be prevented.
尚、第3図(a)、(b)に示すように(但し同図(a
)は回路基板5の側面図、同図(b)は回路基板5の平
面図である)、回路基板5に複数のコネクタ6a〜6c
を配設する場合にも同様であり、同図(a)、(b)に
示す如く■溝5′を設け、回路基板5にIC等と共にコ
ネクタ63〜6cを取り付け、その後自動半田処理を行
った後播て基板58″〜50″を割り、回路基板5から
取り除くことにより上述と同様にコネクタ6a〜6cへ
のフラックスの付着等の問題を起こすことなく自動半田
処理ができる。In addition, as shown in Fig. 3 (a) and (b) (however, (a)
) is a side view of the circuit board 5, and (b) is a plan view of the circuit board 5).
The same is true when arranging the IC, as shown in Figures (a) and (b), grooves 5' are provided, connectors 63 to 6c are attached to the circuit board 5 together with ICs, etc., and then automatic soldering is performed. By splitting the spread boards 58'' to 50'' and removing them from the circuit board 5, automatic soldering can be performed without causing problems such as adhesion of flux to the connectors 6a to 6c as described above.
尚、本実施例の回路基板5の作成においては、具体的に
第2図に示す工程I〜X■に従って行ったが、捨て基板
5“をコネクタ6等の下面を覆った構成とし、その状態
で自動半田処理を行い、以後播て基板5″を■溝5′で
カットする工程であれば第2図の工程と異なっても本発
明の実施は可能である。In the production of the circuit board 5 of this example, steps I to X■ shown in FIG. The present invention can be carried out even if the process is different from the process shown in FIG. 2, as long as the process is to perform automatic soldering and then cut the seeded board 5'' with grooves 5'.
また、本実施例では捨て基板5″ (又は5a″〜50
″)はコネクタ6(又は6a〜6c)の下面を充分覆う
ように構成したが、コネクタ6等の先端6″と捨て基板
5″の側端が一致する位置であっても本発明のフラック
ス等の付着防止は可能である。In addition, in this embodiment, the disposable substrate 5'' (or 5a'' to 50
Although the connector 6 (or 6a to 6c) is configured to sufficiently cover the lower surface of the connector 6 (or 6a to 6c), the flux, etc. of the present invention may be applied even if the tip 6'' of the connector 6 etc. and the side edge of the sacrificial board 5'' are in alignment. It is possible to prevent the adhesion of
さらに、本実施例では切断部をV溝5′で構成したが他
の特殊形状、例えば所謂ミシン目等を設ける構成であっ
ても良い。Further, in this embodiment, the cut portion is formed of a V-groove 5', but it may have another special shape, for example, a so-called perforation.
以上詳細に説明したように、本発明によれば自動半田処
理の際回路基板に配設されたコネクタは所謂捨て基板に
より保護されるので、コネクタが突出する回路基板の場
合でもコネクタを取り付けた状態で自動半田を使用する
ことができる。As explained in detail above, according to the present invention, the connectors arranged on the circuit board are protected by a so-called disposable board during automatic soldering, so even if the connector is a protruding circuit board, the connector can be left attached to the circuit board. Can be used with automatic soldering.
第1図(a)は捨て基板が付いた状態の一実施例の回路
基板の構成図、
第1図(b)は一実施例の回路基板を自動半田処理する
時の状態を示す構成図、
第1図(C)は一実施例の回路基板の完成構成図、第2
図は一実施例の回路基板を作成する工程図、第3図(a
)は複数のコネクタを配設した回路基板の側面図、
第3図(b)は同図(a)の平面図、
第4図は従来の回路基板を説明する図である。
5・・・回路基板、
5′ ・・・■溝、
5“、5a“〜5C″・・・捨て基板、6.6a〜6C
・・・コネクタ、
6′ ・・・端子、
7・・・半田層。
特許出願人 カシオ電子工業株式会社
同 上 カシオ計算機株式会社
一39【
第3図
第4図FIG. 1(a) is a configuration diagram of a circuit board according to an embodiment with a discarded board attached; FIG. 1(b) is a configuration diagram showing a state in which the circuit board according to an embodiment is automatically soldered; Figure 1 (C) is a completed configuration diagram of the circuit board of one embodiment;
The figure is a process diagram for creating a circuit board according to one embodiment, and Figure 3 (a)
) is a side view of a circuit board on which a plurality of connectors are arranged, FIG. 3(b) is a plan view of FIG. 3(a), and FIG. 4 is a diagram illustrating a conventional circuit board. 5...Circuit board, 5'...■Groove, 5", 5a" to 5C"...Discarded board, 6.6a to 6C
...Connector, 6'...Terminal, 7...Solder layer. Patent Applicant Casio Electronics Industries Co., Ltd. Same as above Casio Computer Co., Ltd. 139 [Figure 3 Figure 4
Claims (2)
時回路基板端より外部へ突出する状態で配設されるコネ
クタを有する回路基板において、前記回路基板の端部に
少なくとも前記嵌合部と等しい面積を有し、切断部を介
して前記回路基板の端部に接続された捨て基板を具備す
ることを特徴とする回路基板。(1) In a circuit board having a connector disposed in such a manner that a fitting portion that fits with a connector of another circuit board protrudes outside from an end of the circuit board during use, at least the fitting portion is provided at an end of the circuit board. A circuit board comprising a sacrificial board having an area equal to the joint part and connected to an end of the circuit board via a cut part.
回路基板において、 コネクタを前記切断部を覆って前記回路基板に取り付け
る取り付け処理と、 該取り付け処理によりコネクタが取り付けられた回路基
板を自動半田層により半田付けする自動半田付け処理と
、 該自動半田付け処理により前記コネクタが半田付けされ
た回路基板を前記切断部で切断し、前記捨て基板を取り
除く切断処理と、 を順次行うことを特徴とする回路基板の製造方法。(2) In a circuit board on which a sacrificial board is provided through a specially shaped cut section, a mounting process for attaching a connector to the circuit board by covering the cut section, and a circuit board to which the connector is attached by the mounting process. an automatic soldering process for soldering using an automatic solder layer; and a cutting process for cutting the circuit board to which the connector is soldered by the automatic soldering process at the cutting section and removing the waste board. Characteristic circuit board manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2333230A JPH04199758A (en) | 1990-11-29 | 1990-11-29 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2333230A JPH04199758A (en) | 1990-11-29 | 1990-11-29 | Circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04199758A true JPH04199758A (en) | 1992-07-20 |
Family
ID=18263779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2333230A Pending JPH04199758A (en) | 1990-11-29 | 1990-11-29 | Circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04199758A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007150169A (en) * | 2005-11-30 | 2007-06-14 | Kuroi Electric Co Ltd | Circuit board for heat radiation, circuit board body, and heat radiating plate |
JPWO2016129098A1 (en) * | 2015-02-13 | 2017-04-27 | 三菱電機株式会社 | Electronic component mounting board and air conditioner electrical component box |
-
1990
- 1990-11-29 JP JP2333230A patent/JPH04199758A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007150169A (en) * | 2005-11-30 | 2007-06-14 | Kuroi Electric Co Ltd | Circuit board for heat radiation, circuit board body, and heat radiating plate |
JPWO2016129098A1 (en) * | 2015-02-13 | 2017-04-27 | 三菱電機株式会社 | Electronic component mounting board and air conditioner electrical component box |
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