JPH04192491A - Block-shaped active circuit component - Google Patents
Block-shaped active circuit componentInfo
- Publication number
- JPH04192491A JPH04192491A JP32077390A JP32077390A JPH04192491A JP H04192491 A JPH04192491 A JP H04192491A JP 32077390 A JP32077390 A JP 32077390A JP 32077390 A JP32077390 A JP 32077390A JP H04192491 A JPH04192491 A JP H04192491A
- Authority
- JP
- Japan
- Prior art keywords
- active circuit
- holes
- conductor patterns
- block
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Abstract
Description
【発明の詳細な説明】
概要
ブロック状アクティブ回路部品に関し、アクティブ回路
の小型化を図ることのできるブロック状アクティブ回路
部品を提供することを目的とし、
基板の表裏両面に複数の導体パターンを設けるとともに
、該複数の導体パターンを接続する位置に少なくとも中
間部分に銅メッキ層を有しない複数のスルーホールを設
け、基板表面に少なくとも１個のアクティブ素子を実装
し、円筒型抵抗素子を選択的に前記スルーホールに挿入
することにより、基板表裏の導体パターンを接続すると
ともに抵抗値を調整可能として構成する。[Detailed Description of the Invention] Overview Regarding block-shaped active circuit components, an object of the present invention is to provide a block-shaped active circuit component that can reduce the size of the active circuit. , a plurality of through holes having no copper plating layer are provided at least in the intermediate portions at positions connecting the plurality of conductor patterns, at least one active element is mounted on the surface of the substrate, and a cylindrical resistance element is selectively mounted on the substrate surface. By inserting it into the through hole, it is possible to connect the conductor patterns on the front and back sides of the board and to adjust the resistance value.
産業上の利用分野 本発明はブロック状アクティブ回路部品に関する。Industrial applications The present invention relates to block-shaped active circuit components.
近年、部品の装着作業若しくは半田付は作業を自動化す
るたｔ、或いは実装密度を高するために、部品の表面実
装化が推進され、種々のチップ部品や膜印刷素子等が平
面配置されている。表面実装は、配線パターンの所定位
置に付着したクリーム半田の粘着外により表面実装部品
をプリント配線板に装着し、クリーム半田を例えば加熱
炉内で再溶融させることによって、表面実装部品の配線
パターンへの電気的な接続及び機械的な固定をなすよう
にしたものである。In recent years, surface mounting of components has been promoted in order to automate the mounting or soldering work of components or to increase the mounting density, and various chip components, film-printed elements, etc. are arranged on a flat surface. . In surface mounting, a surface mount component is attached to a printed wiring board by the adhesiveness of cream solder attached to a predetermined position of the wiring pattern, and the cream solder is remelted in a heating furnace, for example, to attach the surface mount component to the wiring pattern of the surface mount component. electrical connection and mechanical fixation.
部品の表面実装化により高密度実装が実現されつつある
が、特にアクティブ回路（能動回路）に多く用いろれる
チップ抵抗や膜抵抗は占有面積が大きいため、アクティ
ブ回路の小型化が阻まれている。High-density mounting is becoming possible through surface mounting of components, but chip resistors and film resistors, which are often used in active circuits, occupy a large area, which is hindering the miniaturization of active circuits. .
従来の技術
第７図は従来のハイブリッドＩＣの実装状態を示す概略
図であり、プリント配線板２上にＩＣ４、チップコンデ
ンサ６及び膜抵抗８等を表面実装して、例えば第８図に
示されたようなバンドパスフィルタが構成される。第９
図は第８図の回路の特性図である。BACKGROUND ART FIG. 7 is a schematic diagram showing a mounting state of a conventional hybrid IC, in which an IC 4, a chip capacitor 6, a film resistor 8, etc. are surface mounted on a printed wiring board 2, as shown in FIG. 8, for example. A bandpass filter like this is constructed. 9th
The figure is a characteristic diagram of the circuit of FIG. 8.
発明が解決しようとする課題
第８図に示したバンドパスフィルタ等のアクティブ回路
に用いられるチップ抵抗や膜抵抗は占有面積が大きいた
め、これがアクティブ回路の小型化を阻止する一つの原
因となっていた。Problems to be Solved by the Invention Chip resistors and film resistors used in active circuits such as the bandpass filter shown in Figure 8 occupy a large area, and this is one of the reasons that prevents the miniaturization of active circuits. Ta.
本発明はこのような点に鑑みてなされたものであり、そ
の目的とするところは、アクティブ回路の小型化を図る
ことのできるブロック状アクティブ回路部品を提供する
ことである。The present invention has been made in view of these points, and an object of the present invention is to provide a block-shaped active circuit component that can reduce the size of an active circuit.
課題を解決するための手段
例えば第８図のバンドパスフィルタの構成部品に着目す
ると、特にオペアンプ（差動増幅器）１０と抵抗Ｒ１，
Ｒ２て構成される回路部分１２ａや１２ｂはアクティブ
回路の共通回路構成部分てあり、これらの共通回路構成
部分１２ａや１２ｂに抵抗及びコンデンサを異なる配置
で接続することにより、ローパスフィルタ又はバイパス
フィルタも提供可能である。Means for Solving the Problem For example, if we pay attention to the components of the bandpass filter shown in FIG.
The circuit parts 12a and 12b constituted by R2 are common circuit parts of the active circuit, and by connecting resistors and capacitors in different arrangements to these common circuit parts 12a and 12b, a low-pass filter or a bypass filter can also be provided. It is possible.
本発明はこのような共通回路構成部分に着目し、これを
ブロック状にすることによりアクティブ回路の小型化を
図るようにしたものである。即ち本発明では、基板の表
裏両面に複数の導体パターンを設けるとともに、該複数
の導体パターンを接続する位置に少なくとも中間部分に
銅メッキ層を有しない複数のスルーホールを設け、基板
表面に少なくとも１個のアクティブ素子を実装する。そ
して、円筒型抵抗素子を選択的に前記スルーホールに挿
入することにより、基板表裏の導体パターンを接続する
とともに抵抗値を調整可能に構成する。The present invention focuses on such common circuit components and makes the active circuit smaller by forming them into blocks. That is, in the present invention, a plurality of conductor patterns are provided on both the front and back surfaces of the substrate, and a plurality of through holes that do not have a copper plating layer are provided at least in the intermediate portions at the positions where the plurality of conductor patterns are connected, and at least one through hole is provided on the surface of the substrate. implement active elements. By selectively inserting a cylindrical resistance element into the through hole, the conductor patterns on the front and back sides of the substrate can be connected and the resistance value can be adjusted.
作 用
円筒型抵抗素子を基板に挿入することによりアクティブ
回路を実現できるため、抵抗実装面積を小さくすること
ができ、アクティブ回路の小型化を図ることができる。Since an active circuit can be realized by inserting a working cylindrical resistance element into a substrate, the area for mounting the resistor can be reduced, and the size of the active circuit can be reduced.
また、抵抗に接続される導体パターンを基板の表裏両面
に複数設けておき、円筒型抵抗素子を選択的にスルーホ
ールに挿入することにより、アクティブ回路の抵抗値の
調整が可能である。Furthermore, by providing a plurality of conductor patterns connected to the resistors on both the front and back surfaces of the substrate and selectively inserting cylindrical resistive elements into the through holes, it is possible to adjust the resistance value of the active circuit.
実 施 例
以下、本発明の実施例を図面を参照して詳細に説明する
。Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の実施例に係るブロック状アクティブ回
路部品の斜視図を示している。基板１６の表裏両面には
複数の導体パターン１８が形成されており、これら表裏
の導体パターンを接続する位置に複数個（本実施例では
６個）のスルーホール２２が設けられている。これらの
スルーホール２２はその表裏にランド部分のみを有し、
大円には銅メッキ層を有しないスルーホールである。基
板１６表面にはＩＣパッケージ２０が表面実装されてお
り、このＩＣパッケージ２０は２個のオペアンプを内蔵
している。ＩＣパッケージ２０の片側に設けられた３個
のスルーホール２２内に円筒型抵抗素子２４を挿入し、
半田付けすることによりブロック状アクティブ回路部品
１４が完成する。FIG. 1 shows a perspective view of a block-shaped active circuit component according to an embodiment of the invention. A plurality of conductor patterns 18 are formed on both the front and back surfaces of the substrate 16, and a plurality of (six in this embodiment) through holes 22 are provided at positions where these conductor patterns on the front and back are connected. These through holes 22 have only land portions on the front and back sides,
The large circle is a through hole without a copper plating layer. An IC package 20 is surface-mounted on the surface of the substrate 16, and this IC package 20 contains two operational amplifiers. A cylindrical resistance element 24 is inserted into three through holes 22 provided on one side of the IC package 20,
By soldering, the block-shaped active circuit component 14 is completed.
この回路図が第２図に示されている。６個のスルーホー
ル２２内に円筒型抵抗素子２４を挿入することにより、
第２図の回路を２個実現できる。This circuit diagram is shown in FIG. By inserting the cylindrical resistance elements 24 into the six through holes 22,
Two circuits of FIG. 2 can be realized.
第３図は本発明の他の実施例の平面図を示しており、こ
の実施例においては、３個のスルーホール２２ａ、２２
ｂ、２２Ｃからなる第１組のスルーホールと、３個のス
ルーホール２２ａ’、２２ｂ’、２２ｃ’からなる第２
組のスルーホールとが設けられている。また基板１６の
裏面に形成された導体パターン１８と１８′との幅は異
なっている。FIG. 3 shows a plan view of another embodiment of the present invention, in which three through holes 22a, 22
A first set of through holes 22a', 22c', and 22c';
A pair of through holes are provided. Furthermore, the widths of the conductive patterns 18 and 18' formed on the back surface of the substrate 16 are different.
このようにその幅が異なる導体パターンを２種類設けた
場合、第１組目のスルーホール２２ａ。When two types of conductor patterns with different widths are provided in this way, the first set of through holes 22a.
２２ｂ、２２Ｃに円筒型抵抗素子を挿入して回路を完成
する場合と、第２組目のスルーホール２２ａ’ 、
２２ ｂ’ 、 ２２ ｃ’ ｉ、：Ｐ’［型！抗素
子ヲ挿入して回路を完成する場合とでは、それぞれの回
路における導体パターンの幅が異なるので、同一抵抗値
の円筒型抵抗素子をスルーホール内に挿入した場合にも
、回路の抵抗値を容易に調整することができる。In the case where a cylindrical resistance element is inserted into 22b and 22C to complete the circuit, and when the second set of through holes 22a',
22 b', 22 c' i, :P' [type! When completing a circuit by inserting a resistance element, the width of the conductor pattern in each circuit is different, so even if a cylindrical resistance element with the same resistance value is inserted into a through hole, the resistance value of the circuit will be different. Can be easily adjusted.
回路の抵抗値の変更は、スルーホール内に挿入する円筒
型抵抗素子の抵抗値を変更する二とによっても可能であ
る。さらに、導体パターン幅の変更と円筒型抵抗素子の
抵抗値の変更とを組み合わせることにより、抵抗値の調
整範囲を広げることができる。The resistance value of the circuit can also be changed by changing the resistance value of a cylindrical resistance element inserted into the through hole. Furthermore, by combining changing the width of the conductor pattern and changing the resistance value of the cylindrical resistance element, it is possible to widen the adjustment range of the resistance value.
第４図−及び第５図はブロック状アクティブ回路１４を
基板３０に実装した状態を示しており、ブロック状アク
ティブ回路１４の他にチップコンデンサ３２を表面実装
し、膜抵抗３４を設けることにより、第６図に示すよう
な２段に接続されたローパスフィルタ回路を構成するこ
とができる。■Ｃパッケージ２０内に２個のオペアンプ
が内蔵されているたＺ、１個のブロック状アクティブ回
路部品１４を使用して、２段に接続された第６図のロー
パスフィルタ回路を実現することができる。4 and 5 show the state in which the block-shaped active circuit 14 is mounted on the substrate 30. In addition to the block-shaped active circuit 14, a chip capacitor 32 is surface-mounted and a film resistor 34 is provided. A low-pass filter circuit connected in two stages as shown in FIG. 6 can be constructed. ■Two operational amplifiers are built into the C package 20, and the low-pass filter circuit shown in FIG. 6 connected in two stages can be realized using one block-shaped active circuit component 14. can.
発明の効果
本発明は以上詳述したように構成したので、円筒型抵抗
素子を基板に挿入実装することにより、アクティブ回路
の小型化を実現できる。また、アクティブ回路の共通回
路構成部分をブロック状とすることにより、アクティブ
回路実装時の効率化を図ることができる。さらに、スル
ーホール内に挿入される円筒型抵抗素子の抵抗値を変更
したり、抵抗に接続される導体パターンを複数種類設け
ておくことにより、アクティブ回路の抵抗値の調整が容
易に達成できる。Effects of the Invention Since the present invention is constructed as described in detail above, the active circuit can be miniaturized by inserting and mounting the cylindrical resistance element on the substrate. Further, by forming the common circuit component of the active circuit into a block shape, it is possible to improve the efficiency of mounting the active circuit. Furthermore, the resistance value of the active circuit can be easily adjusted by changing the resistance value of the cylindrical resistance element inserted into the through hole or by providing a plurality of types of conductor patterns connected to the resistor.
第１図は本発明実施例の斜視図、
第２図は第１図に示した実施例の回路図、第３図は本発
明の他の実施例平面図、
第４図はブロック状アクティブ回路の実装状態を示す平
面図、
第５図は第４図のＶ−Ｖ線断面図、
第６図はブロック状アクティブ回路を使用して実現した
ローパスフィルタ回路図、
第７図は従来の表面実装状態を示す概略図、第８図はバ
ンドパスフィルタを２段接続した回路図、
第９図は第８図の回路の特性図である。
１６・・・基板、
１８・・・導体パターン、
２０・・・ＩＣパッケージ、
２２・・・スルーホール、
２４・・・円筒型抵抗素子。Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a circuit diagram of the embodiment shown in Fig. 1, Fig. 3 is a plan view of another embodiment of the invention, and Fig. 4 is a block-shaped active circuit. Fig. 5 is a cross-sectional view taken along the line V-V in Fig. 4, Fig. 6 is a low-pass filter circuit diagram realized using a block-shaped active circuit, and Fig. 7 is a conventional surface mount filter. A schematic diagram showing the state, FIG. 8 is a circuit diagram in which two stages of bandpass filters are connected, and FIG. 9 is a characteristic diagram of the circuit of FIG. 8. 16... Board, 18... Conductor pattern, 20... IC package, 22... Through hole, 24... Cylindrical resistance element.
Claims (1)
を設けるとともに、該複数の導体パターン（１８）を接
続する位置に少なくとも中間部分に銅メッキ層を有しな
い複数のスルーホール（２２）を設け、基板表面に少な
くとも１個のアクティブ素子（２０）を実装し、 円筒型抵抗素子（２４）を選択的に前記スルーホール（
２２）に挿入することにより、基板表裏の導体パターン
（１８）を接続するとともに抵抗値を調整可能としたこ
とを特徴とするブロック状アクティブ回路部品。[Claims] A plurality of conductor patterns (18) on both the front and back surfaces of the substrate (16).
At the same time, a plurality of through holes (22) having no copper plating layer are provided at least in the intermediate portions at positions connecting the plurality of conductor patterns (18), and at least one active element (20) is provided on the surface of the substrate. mount and selectively insert the cylindrical resistance element (24) into the through hole (
22) A block-shaped active circuit component characterized in that the conductor patterns (18) on the front and back sides of the board can be connected and the resistance value can be adjusted by inserting the component into the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32077390A JPH04192491A (en) | 1990-11-27 | 1990-11-27 | Block-shaped active circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32077390A JPH04192491A (en) | 1990-11-27 | 1990-11-27 | Block-shaped active circuit component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04192491A true JPH04192491A (en) | 1992-07-10 |
Family
ID=18125096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32077390A Pending JPH04192491A (en) | 1990-11-27 | 1990-11-27 | Block-shaped active circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04192491A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08228064A (en) * | 1994-12-22 | 1996-09-03 | Kanto Kasei Kogyo Kk | Printed circuit board |
-
1990
- 1990-11-27 JP JP32077390A patent/JPH04192491A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08228064A (en) * | 1994-12-22 | 1996-09-03 | Kanto Kasei Kogyo Kk | Printed circuit board |
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