JPH04186697A - Connection method of flexible printed board - Google Patents
Connection method of flexible printed boardInfo
- Publication number
- JPH04186697A JPH04186697A JP31130190A JP31130190A JPH04186697A JP H04186697 A JPH04186697 A JP H04186697A JP 31130190 A JP31130190 A JP 31130190A JP 31130190 A JP31130190 A JP 31130190A JP H04186697 A JPH04186697 A JP H04186697A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- metal circuit
- fpc
- pattern
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 239000002184 metal Substances 0.000 claims abstract description 59
- 230000013011 mating Effects 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 238000003466 welding Methods 0.000 abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 230000000881 depressing effect Effects 0.000 abstract 1
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フレキシブルプリント基板（以下、ＦＰＣと
略称する）の金属回路パターンを金属製の相手端子と接
続する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for connecting a metal circuit pattern of a flexible printed circuit board (hereinafter abbreviated as FPC) to a metal mating terminal.
ＦＰＣは、薄くて可撓性に冨むという利点を有するため
、フラットケーブルやメンブレンスイッチなどとして、
各種の電子部品に今日広く用いられている。FPC has the advantage of being thin and highly flexible, so it is used as flat cables, membrane switches, etc.
It is widely used in various electronic components today.
かかるＦＰＣは、絶縁性のベースフィルム上に回路パタ
ーンを形成してなるもので、回路パターンとして導電性
ペーストを使用したものと、アルミニウム等の金属箔を
使用したものとに大別できるが、導電粉を絶縁性のバイ
ンダ中に分散させてなる導電性ペーストを印刷して形成
される回路パターンは、固有抵抗値が高く、大きな電流
を流せないという不具合がある。これに対し、金属箔を
エツチング処理して形成される回路パターンは、固有抵
抗値が極めて低く、優れた導電性が期待できる。Such FPCs are made by forming a circuit pattern on an insulating base film, and can be roughly divided into those using conductive paste as the circuit pattern and those using metal foil such as aluminum. Circuit patterns formed by printing conductive paste, which is made by dispersing powder in an insulating binder, have a high specific resistance value and are incapable of passing large currents. On the other hand, circuit patterns formed by etching metal foil have extremely low specific resistance values and can be expected to have excellent conductivity.
ところで、金属回路パターンを有するＦＰＣを、プリン
ト配線板の銅箔パターンや金属端子片などの相手端子と
接続する場合、ＦＰＣの金属回路パターンを相手端子に
はんだ付けする方法と、導電粉を分散させた導電性接着
材料を用いる方法とが−１に採用されている。すなわち
、はんだ付けによる第１の方法は、例えばＦＰＣの金属
回路パターンの接続個所にクリームはんだを塗布し、そ
こに相手端子を載置した後、加熱してクリームはんだを
溶融させるという接続方法である。また、導電性接着材
料を用いる第２の方法は、例えばＦＰＣの金属回路パタ
ーンの接続個所を含む領域に異方性導電シートを重ね合
わせ、そこに相手端子を載置した後、該接続個所を局部
的に加圧・加熱して、異方性導電シート中の導電粉を局
部的に密な状態にするとともにバインダとしてのホット
メルト剤を溶融させるという接続方法である。By the way, when connecting an FPC with a metal circuit pattern to a mating terminal such as a copper foil pattern on a printed wiring board or a metal terminal piece, there are two methods: soldering the FPC's metal circuit pattern to the mating terminal, and dispersing conductive powder. A method using a conductive adhesive material was adopted in -1. That is, the first method using soldering is, for example, a connection method in which cream solder is applied to the connection point of a metal circuit pattern of an FPC, a mating terminal is placed there, and then the cream solder is melted by heating. . A second method using a conductive adhesive material is, for example, to overlap an anisotropic conductive sheet in a region including a connection point of a metal circuit pattern of an FPC, place a mating terminal thereon, and then connect the connection point. This is a connection method that locally applies pressure and heat to make the conductive powder in the anisotropic conductive sheet locally dense, and at the same time melts the hot melt agent as a binder.
しかしながら、ＦＰＣの金属回路パターンを相手端子に
はんだ付けする場合、最低でも２２０”Ｃ以上に加熱し
なければならないので、ＦＰＣのベースフィルムとして
ＰＥＴ （ポリエチレンテレフタレート）等の安価な材
料が使用できず、耐熱性に冨むポリイミド等の高価な材
料を使用せざるを得ぬという、コスト面での不都合があ
った。However, when soldering the metal circuit pattern of an FPC to a mating terminal, it must be heated to at least 220"C or higher, so cheap materials such as PET (polyethylene terephthalate) cannot be used as the base film of the FPC. There is a cost disadvantage in that expensive materials such as polyimide with high heat resistance must be used.
また、導電粉を分散させた導電性接着材料を用いる場合
は、ＦＰＣの金属回路パターンや相手端子の表面の酸化
膜を除去するための工程が必要となり、かつ導電粉どう
しを接触させて導通を図るので低抵抗の接続が行えず、
つまり接続抵抗が大きくなってしまい、しかも金属どう
しが結合されない接続なので機械的接続強度が不十分で
ある等、特に信較性の面で不都合があった。Furthermore, when using a conductive adhesive material in which conductive powder is dispersed, a process is required to remove the oxide film on the surface of the metal circuit pattern of the FPC and the mating terminal, and the conductive powder is brought into contact with each other to ensure continuity. Because of this, it is not possible to make a low-resistance connection.
In other words, the connection resistance becomes large, and since the metals are not bonded together, the mechanical connection strength is insufficient, which is particularly disadvantageous in terms of reliability.
本発明はこのような事情に鑑みてなされたもので、その
目的は、金属回路パターンを存するＦＰＣのベースフィ
ルムとしてＰＥＴ等の安価な材料が使用でき、しかも接
続抵抗が小さくて機械的接続強度が十分大きい、ＦＰＣ
の接続方法を提供することにある。The present invention was made in view of the above circumstances, and its purpose is to enable the use of inexpensive materials such as PET as the base film of an FPC having a metal circuit pattern, and to provide low connection resistance and mechanical connection strength. Large enough FPC
The goal is to provide a connection method.
［課題を解決するための手段〕
上記した本発明の目的は、絶縁性のベースフィルム上に
金属回路パターンを形成してなるＦＰＣの該金属回路パ
ターンを、金属製の相手端子と接続する方法において、
上記金属回路パターンと上記相手端子との間に熱可塑性
樹脂を介設した後、上記ベースフィルムを介して該金属
回路パターンを該相手端子側へ加圧した状態で超音波振
動を与え、該金属回路パターンと該相手端子とを超音波
溶着することによって達成される。[Means for Solving the Problems] The object of the present invention described above is to provide a method for connecting a metal circuit pattern of an FPC formed by forming a metal circuit pattern on an insulating base film to a metal mating terminal. ,
After interposing a thermoplastic resin between the metal circuit pattern and the mating terminal, applying ultrasonic vibration to the metal circuit pattern while pressing the metal circuit pattern toward the mating terminal through the base film, This is achieved by ultrasonic welding the circuit pattern and the mating terminal.
ＦＰＣの金属回路パターンを相手端子側へ加圧した状態
で超音波振動を与えると、金属どうしが激しく摩擦して
溶着（溶接）されるので、接続抵抗が事実上皆無となり
、かつ機械的接続強度が高まり、しかもはんだ付けのよ
うに高温で加熱する必要がないからベースフィルムとし
てＰＥＴ等の安価な材料が使用できる。そして、加圧時
に金属回路パターンの接続個所の周囲へ押しやられる熱
可塑性樹脂が超音波のエネルギーを吸収するので、ベー
スフィルムの破断事故が防止でき、また、この熱可塑性
樹脂は超音波溶着時に金属どうしの摩擦熱によって溶融
するので、金属回路パターンと相手端子との溶着部分の
周囲に充填された接着剤と化し、そのため該溶着部分に
腐食やマイグレーションが発生しにくくなるとともに、
機械的接続強度が一層高まる。When ultrasonic vibration is applied to the FPC metal circuit pattern with pressure applied to the mating terminal side, the metals rub violently and are welded together, resulting in virtually no connection resistance and improved mechanical connection strength. Moreover, since there is no need to heat at high temperatures as in soldering, inexpensive materials such as PET can be used as the base film. The thermoplastic resin that is pushed around the connection points of the metal circuit pattern when pressurized absorbs the energy of the ultrasonic waves, which prevents the base film from breaking. Since it is melted by the frictional heat between the two, it becomes an adhesive that is filled around the welded part between the metal circuit pattern and the mating terminal, which makes it difficult for corrosion and migration to occur in the welded part, and
Mechanical connection strength is further increased.
Ｃ実施例〕 以下、本発明の実施例を図に基づいて説明する。C Example] Embodiments of the present invention will be described below based on the drawings.
第１図ないし第３図は本発明の一実施例を示す工程図で
あり、図中符号１で示すＦＰＣは、ＰＥＴからなるベー
スフィルム２上にアルミニウム箔からなる金属回路パタ
ーン３を形成した公知のもので、この金属回路パターン
３を接続する相手端子は、本実施例の場合、プリント配
線板４０基板５上に形成されている銅箔パターン６の端
部である。なお、ＦＰＣＩの金属回路パターン３は、接
続個所を除いてレジスト層７に被覆されている。1 to 3 are process diagrams showing one embodiment of the present invention, and the FPC indicated by reference numeral 1 in the figures is a conventional FPC in which a metal circuit pattern 3 made of aluminum foil is formed on a base film 2 made of PET. In this embodiment, the mating terminal to which the metal circuit pattern 3 is connected is the end of the copper foil pattern 6 formed on the printed wiring board 40 substrate 5. Note that the metal circuit pattern 3 of the FPCI is covered with a resist layer 7 except for the connection portions.
さて、ＦＰＣＩの金属回路パターン３をプリント配線板
４の銅箔パターン６と接続する際には、まず第１図に示
すように、ＦＰＣＩ上で接続しようとする領域にポリエ
チレン系の熱可塑性樹脂８を塗布し、次いで第２図に示
すように、金属回路パターン３の接続個所と銅箔パター
ン６の端部とを位置合わせし、熱可塑性樹脂８を介して
金属回路パターン３と銅箔パターン６とを重ね合わせる
。Now, when connecting the metal circuit pattern 3 of the FPCI to the copper foil pattern 6 of the printed wiring board 4, first, as shown in FIG. Then, as shown in FIG. and superimpose them.
しかる後、第３図に示すように、超音波ホーン９のチッ
プ１０の突起部をＦＰＣ１に押し当て、ベースフィルム
２を介して金属回路パターン３の接続個所を局部的にプ
リント配線板４側へ加圧することにより、熱可塑性樹脂
８を周囲・＼押しやって対応する金属回路パターン３と
銅箔パターン６とを接触させ、この状態で超音波ホーン
９から超音波を発振して金属回路パターン３とｆｌ箔パ
ターン６とを溶着させる。すなわち、圧接状態の金属回
路パターン３および銅箔パターン６にチップ１０を介し
て超音波振動を与えると、金属どうしが激しく摩擦して
結合されるという超音波溶着（溶接）が行える。そして
、この超音波溶着時に発生する金属どうしの摩擦熱によ
って熱可塑性樹脂８が溶融するので、この熱可塑性樹脂
８は、金属回路パターン３と銅箔パターン６との溶着部
分の周囲に充填された接着剤と化す。Thereafter, as shown in FIG. 3, the protrusion of the chip 10 of the ultrasonic horn 9 is pressed against the FPC 1, and the connection points of the metal circuit pattern 3 are locally moved to the printed wiring board 4 side via the base film 2. By applying pressure, the thermoplastic resin 8 is pushed around and brought into contact with the corresponding metal circuit pattern 3 and the copper foil pattern 6, and in this state, ultrasonic waves are oscillated from the ultrasonic horn 9 to bring the metal circuit pattern 3 and fl foil pattern 6 is welded. That is, when ultrasonic vibration is applied to the metal circuit pattern 3 and the copper foil pattern 6 in a pressure-welded state through the chip 10, ultrasonic welding (welding) can be performed in which the metals are bonded by intense friction. Since the thermoplastic resin 8 is melted by the frictional heat between the metals generated during this ultrasonic welding, the thermoplastic resin 8 is filled around the welded portion between the metal circuit pattern 3 and the copper foil pattern 6. It turns into glue.
このように、金属回路パターン３と銅箔パターン６とを
超音波溶着すると、金属どうしが直接結合されるので、
接続抵抗が事実上皆無となり、かつ機械的接続強度が十
分太き（なって、電気的にも機械的にも信転性の高い接
続が行える。しかも、金属どうしの結合とはいえ、はん
だ付けのように貰温で加熱するわけではないので、ベー
スフィルム２の材料が耐熱性のさほど高くないＰＥＴで
あっても何ら支障をきたさず、つまりポリイミド等の耐
熱性に冨む高価な材料を使用する必要がなく、材料費が
安く済む。In this way, when the metal circuit pattern 3 and the copper foil pattern 6 are ultrasonically welded, the metals are directly bonded to each other.
There is virtually no connection resistance, and the mechanical connection strength is sufficiently strong (this makes it possible to make connections with high reliability both electrically and mechanically.Moreover, although it is a metal-to-metal connection, it is difficult to solder) Since the base film 2 is not heated at low temperatures, there is no problem even if the material of the base film 2 is PET, which does not have very high heat resistance.In other words, expensive materials with high heat resistance such as polyimide are used. There is no need to do this, and the material cost is low.
また、超音波溶着時に熱可塑性樹脂８が超音波のエネル
ギーを１収してベースフィルム２の負担が軽減されると
ともに、超音波ホーン９のチップ１０の形状もベースフ
ィルム２との接触面では丸味を持たせであるので、超音
波溶着時にベースフィルム２が破断を起こす心配はない
。さらにまた、この熱可塑性樹脂８は超音波溶着工程後
、金属回路パターン３と銅箔パターン６との溶着部分の
周囲に充填された状態で固化するので、該溶着部分は熱
可塑性樹脂８に封止されることになって腐食やマイグレ
ーションの発生が防止できるとともに、該溶着部分の周
囲が熱可塑性樹脂８に固着されることになって機械的接
続強度が一層確実なものとなっている。Furthermore, during ultrasonic welding, the thermoplastic resin 8 absorbs ultrasonic energy, reducing the burden on the base film 2, and the shape of the tip 10 of the ultrasonic horn 9 is also rounded at the contact surface with the base film 2. Therefore, there is no fear that the base film 2 will break during ultrasonic welding. Furthermore, after the ultrasonic welding process, the thermoplastic resin 8 solidifies while being filled around the welded part between the metal circuit pattern 3 and the copper foil pattern 6, so the welded part is sealed in the thermoplastic resin 8. As a result, corrosion and migration can be prevented from occurring, and the periphery of the welded portion is fixed to the thermoplastic resin 8, making the mechanical connection strength even more reliable.
なお、ＦＰＣＩのベースフィルム２や金属回路パターン
３の材料はＰＥＴやアルミニウム箔に限定されるもので
はなく、また、熱可塑性樹脂８の材料もポリエチレン系
に限定されるものではない。Note that the materials for the base film 2 and the metal circuit pattern 3 of the FPCI are not limited to PET or aluminum foil, and the material for the thermoplastic resin 8 is not limited to polyethylene.
例えば、ＦＰＣの接続しようとする領域と相手端子との
間にポリ塩化ビニリデン製のフィルムを介設して超音波
溶着を行っても、はぼ同等の効果が得られる。For example, even if a polyvinylidene chloride film is interposed between the region of the FPC to be connected and the mating terminal and ultrasonic welding is performed, almost the same effect can be obtained.
さらにまた、ＦＰＣの相手端子は金属製でありさえすれ
ばよく、例えば単独の金属端子片をＦＰＣに接続する場
合にも本発明は適用可能である。Furthermore, the mating terminal of the FPC only needs to be made of metal, and the present invention is also applicable, for example, when connecting a single metal terminal piece to the FPC.
以上説明したように、本発明は、熱可塑性樹脂を併用し
つつ、ＦＰＣの金属回路パターンと相手端子とを超音波
溶着するというものなので、超音波溶着時に懸念される
ベースフィルムの破断や、超音波溶着後に懸念される溶
着部分の腐食、マイグレーション等が、該熱可塑性樹脂
によって回避でき、そのため超音波溶着による金属どう
しの結合で、接続抵抗が無視できて機械的接続強度も十
分大きい優れた接続が行え、さらに熱可塑性樹脂の接着
力で機械的接続強度が一層高まり、しかもはんだ付けの
ように高温で加熱する必要がないのでベースフィルムと
してＰＥＴ等の安価な材料が使用できる等、顕著な効果
を奏する。As explained above, the present invention involves ultrasonically welding the metal circuit pattern of the FPC and the mating terminal while also using a thermoplastic resin. Corrosion, migration, etc. of the welded part, which are concerns after sonic welding, can be avoided by using this thermoplastic resin. Therefore, by joining metals together by ultrasonic welding, connection resistance can be ignored and mechanical connection strength is sufficiently high. Furthermore, the mechanical connection strength is further increased by the adhesive strength of the thermoplastic resin, and since there is no need to heat at high temperatures like in soldering, inexpensive materials such as PET can be used as the base film, and other remarkable effects are achieved. play.
図面はすべて本発明の一実施例に係る工程図で、第１図
はＦＰＣに熱可塑性樹脂を塗布した状態を示す平面図、
第２図はＦＰＣをプリント配線板と位置合わせして重ね
合わせる工程を示す断面図、第３図はＦＰＣの金属回路
パターンとプリン１〜配線板の銅箔パターンとを超音波
溶着する工程を示す断面図である。
１・・・・・・ＦＰＣ（フレキシブルプリント基板）、
２・・・・・・ベースフィルム、３・・・・・・金属回
路パターン、４・・・・・・プリント配線板、６・・・
・・・銅箔パターン、８・・・・・・熱可塑性樹脂、９
・・・・・・超音波ホーン、１０・・・・・・チップ。The drawings are all process diagrams according to an embodiment of the present invention, and FIG. 1 is a plan view showing a state in which thermoplastic resin is applied to FPC;
Figure 2 is a cross-sectional view showing the process of aligning and overlapping the FPC with the printed wiring board, and Figure 3 is the process of ultrasonically welding the metal circuit pattern of the FPC and the copper foil pattern of Print 1 to the wiring board. FIG. 1...FPC (flexible printed circuit board),
2...Base film, 3...Metal circuit pattern, 4...Printed wiring board, 6...
...Copper foil pattern, 8...Thermoplastic resin, 9
......Ultrasonic horn, 10...Tip.
Claims (1)
てなるフレキシブルプリント基板の該金属回路パターン
を、金属製の相手端子と接続する方法において、上記金
属回路パターンと上記相手端子との間に熱可塑性樹脂を
介設した後、上記ベースフイルムを介して該金属回路パ
ターンを該相手端子側へ加圧した状態で超音波振動を与
え、該金属回路パターンと該相手端子とを超音波溶着す
ることを特徴とするフレキシブルプリント基板の接続方
法。In a method for connecting a metal circuit pattern of a flexible printed circuit board, which is formed by forming a metal circuit pattern on an insulating base film, to a metal mating terminal, a thermoplastic material is bonded between the metal circuit pattern and the mating terminal. After interposing the resin, applying ultrasonic vibration to the metal circuit pattern while applying pressure to the mating terminal side through the base film to ultrasonically weld the metal circuit pattern and the mating terminal. A unique method for connecting flexible printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31130190A JPH04186697A (en) | 1990-11-19 | 1990-11-19 | Connection method of flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31130190A JPH04186697A (en) | 1990-11-19 | 1990-11-19 | Connection method of flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04186697A true JPH04186697A (en) | 1992-07-03 |
Family
ID=18015489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31130190A Pending JPH04186697A (en) | 1990-11-19 | 1990-11-19 | Connection method of flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04186697A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5354392A (en) * | 1992-01-24 | 1994-10-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves |
| US5511719A (en) * | 1993-06-01 | 1996-04-30 | Nippondenso Co., Ltd. | Process of joining metal members |
| WO1997042727A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Process for producing a multilayered composite structure with electroconductive connections |
| JP2000263248A (en) * | 1999-03-16 | 2000-09-26 | Harness Syst Tech Res Ltd | Welding method |
| EP1079677A2 (en) * | 1999-08-26 | 2001-02-28 | Sony Chemicals Corporation | Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| JP2003069216A (en) * | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Method for connecting conductive connectors to each other |
| DE10322840A1 (en) * | 2003-05-19 | 2004-12-16 | Siegfried Muck | Electronic assembly |
| WO2006051885A1 (en) * | 2004-11-12 | 2006-05-18 | Hallys Corporation | Bonding method of interposer, and electronic component manufactured by utilizing such method |
-
1990
- 1990-11-19 JP JP31130190A patent/JPH04186697A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5354392A (en) * | 1992-01-24 | 1994-10-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves |
| US5511719A (en) * | 1993-06-01 | 1996-04-30 | Nippondenso Co., Ltd. | Process of joining metal members |
| WO1997042727A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Process for producing a multilayered composite structure with electroconductive connections |
| JP2000263248A (en) * | 1999-03-16 | 2000-09-26 | Harness Syst Tech Res Ltd | Welding method |
| EP1079677A2 (en) * | 1999-08-26 | 2001-02-28 | Sony Chemicals Corporation | Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| EP1079677A3 (en) * | 1999-08-26 | 2004-01-07 | Sony Chemicals Corporation | Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| JP2003069216A (en) * | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Method for connecting conductive connectors to each other |
| DE10322840A1 (en) * | 2003-05-19 | 2004-12-16 | Siegfried Muck | Electronic assembly |
| WO2006051885A1 (en) * | 2004-11-12 | 2006-05-18 | Hallys Corporation | Bonding method of interposer, and electronic component manufactured by utilizing such method |
| JP2006140359A (en) * | 2004-11-12 | 2006-06-01 | Hallys Corp | Interposer bonding method and electronic component manufactured using the same |
| JP4628067B2 (en) * | 2004-11-12 | 2011-02-09 | 株式会社 ハリーズ | Interposer joining method and electronic component. |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR900008669B1 (en) | Flexible p.c.b. terminal structure | |
| JP2831970B2 (en) | Interlayer connection method for circuit boards | |
| JP2001007511A (en) | Method for joining wiring boards, production of data carrier, and device for mounting module of electronic part | |
| US5511719A (en) | Process of joining metal members | |
| JPH04186697A (en) | Connection method of flexible printed board | |
| JPH07302974A (en) | Method of bonding circuit boards | |
| JP2002290028A (en) | Connection structure and method for printed wiring board | |
| JP2002025740A (en) | Welding method and welding part structure of flat conductor wiring board | |
| JP3826676B2 (en) | Printed wiring board connection method and connection structure | |
| JP2001223465A (en) | Connection method of printed-wiring board and connection structure | |
| JP2002141659A (en) | Method for connecting flexible printed board to each other | |
| JPH09320662A (en) | Terminal structure of flexible printed board and its manufacture | |
| JPH0330494A (en) | Through-hole forming method for flexible circuit board | |
| JP2001237526A (en) | Connecting method of printed wiring board and metal terminal | |
| JPS6041429B2 (en) | Conductive bonding method between metal and metal foil | |
| JP2001127426A (en) | Method and structure for connecting circuit conductor of flat conductor wiring board | |
| JP2002141660A (en) | Method for connecting flexible printed board to each other | |
| JP3853566B2 (en) | Connection method of printed wiring board and metal terminal | |
| JP4755151B2 (en) | Electrical connection device | |
| JPH05160559A (en) | Printed circuit board | |
| JP2003142821A (en) | Method and structure for connecting printed board | |
| JPS63250192A (en) | Method of providing continuity of conductor in double-sided printed circuit | |
| JP2000294332A (en) | Jointed body of flexible wiring body | |
| JPH0821441B2 (en) | Flexible printed circuit board terminal structure | |
| JP2669478B2 (en) | How to connect terminals to a printed wiring board |