JPH0418455U - - Google Patents
Info
- Publication number
- JPH0418455U JPH0418455U JP6030990U JP6030990U JPH0418455U JP H0418455 U JPH0418455 U JP H0418455U JP 6030990 U JP6030990 U JP 6030990U JP 6030990 U JP6030990 U JP 6030990U JP H0418455 U JPH0418455 U JP H0418455U
- Authority
- JP
- Japan
- Prior art keywords
- element body
- resin
- attaching
- heat sink
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6030990U JPH0418455U (es) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6030990U JPH0418455U (es) | 1990-06-07 | 1990-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0418455U true JPH0418455U (es) | 1992-02-17 |
Family
ID=31587563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6030990U Pending JPH0418455U (es) | 1990-06-07 | 1990-06-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0418455U (es) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09121008A (ja) * | 1995-10-25 | 1997-05-06 | Nec Corp | 半導体装置のパッケージ |
US11667812B2 (en) | 2015-06-22 | 2023-06-06 | Awi Licensing Llc | Soil and dirt repellent powder coatings |
-
1990
- 1990-06-07 JP JP6030990U patent/JPH0418455U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09121008A (ja) * | 1995-10-25 | 1997-05-06 | Nec Corp | 半導体装置のパッケージ |
US11667812B2 (en) | 2015-06-22 | 2023-06-06 | Awi Licensing Llc | Soil and dirt repellent powder coatings |