JPH04180699A - Manufacture of enclosure for electromagnetic shielding use - Google Patents
Manufacture of enclosure for electromagnetic shielding useInfo
- Publication number
- JPH04180699A JPH04180699A JP31003790A JP31003790A JPH04180699A JP H04180699 A JPH04180699 A JP H04180699A JP 31003790 A JP31003790 A JP 31003790A JP 31003790 A JP31003790 A JP 31003790A JP H04180699 A JPH04180699 A JP H04180699A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plastic
- molded body
- plated
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004033 plastic Substances 0.000 claims abstract description 60
- 229920003023 plastic Polymers 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 239000000843 powder Substances 0.000 claims abstract description 27
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 12
- 238000010422 painting Methods 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 9
- 238000004299 exfoliation Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000004698 Polyethylene Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- -1 whiskers Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電磁シールド用筺体の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing an electromagnetic shielding case.
電子、電気機器の小型化、軽量化の傾向が著しく、それ
に伴って誤操作を招く電磁波の影響をいかにして除くか
が大きな問題となってきている。BACKGROUND OF THE INVENTION There is a remarkable trend toward miniaturization and weight reduction of electronic and electrical equipment, and as a result, how to eliminate the influence of electromagnetic waves that can lead to erroneous operation has become a major problem.
この目的のため金属製の筺体を用い、この中に電子機器
を納め解決しているが、ｅ？化、美観あるいは耐食性か
ら電子機器を納める筺体としてはプラスチック製品を望
む声が高い。しかしプラスチックは電磁波に対し、これ
を遮蔽する能力を有しておらず、種々の方法でプラスチ
ックを導電化して電磁波を遮蔽する試みがなされている
。For this purpose, a metal casing is used and the electronic equipment is housed inside it, but e? There is a high demand for plastic products as housings for electronic devices due to their durability, aesthetics, and corrosion resistance. However, plastic does not have the ability to shield electromagnetic waves, and attempts have been made to shield electromagnetic waves by making plastic conductive using various methods.
その方法としては、プラスチックを必要な形状に成形し
た後、金属溶射法を用いて低融点の金属を溶射し、プラ
スチック表面に金属の皮膜を形成したり、成形品に金属
めっきや導電性塗料を塗布する方法、プラスチック中に
金属粉や金属短繊維あるいはカーボン等の導電性光＃Ｉ
ｌ剤を混入したものを用いて筺体を成形する方法により
プラスチック成形品に導電性をもたせ電磁波の遮蔽体と
して用いられている。This method involves molding the plastic into the required shape and then spraying a low-melting point metal using metal spraying to form a metal film on the plastic surface, or applying metal plating or conductive paint to the molded product. How to apply conductive light such as metal powder, short metal fibers or carbon in plastic #I
The plastic molded product is made conductive by molding the housing using a material mixed with L agent, and is used as a shield for electromagnetic waves.
溶射やめっき、導電性塗料による成形品表面への導電層
の形成は導電層が成形品から剥離し易く、剥離した導電
層片が機器の回路を短絡させる結果になりかねないとこ
ろから大きく問題視されている。また導電性充填剤を混
入したものは多量に充填しないと導電性が付与されず、
多量に充填すると成形品表面の外観が悪くなったり機械
特性を損ないがちであった。さらに最近の電子機器の軽
量化、小型化、多品種化の流れの中で電磁シールド性に
優れ軽量で、しかも多品種の機器の中でも共通に使用で
きる部品が望まれるようになってきたが、それに適した
成形方法が見当たらず、現在試みられている電磁シール
ド用筺体の製造方法は何らかの問題点を有していた。The formation of a conductive layer on the surface of a molded product using thermal spraying, plating, or conductive paint is viewed as a major problem because the conductive layer tends to peel off from the molded product, and peeled pieces of the conductive layer can cause short circuits in equipment circuits. has been done. Also, if a conductive filler is mixed in, the conductivity will not be imparted unless it is filled in a large amount.
When filled in a large amount, the appearance of the molded product surface tends to deteriorate and the mechanical properties tend to be impaired. Furthermore, with the recent trend toward lighter weight, smaller size, and greater variety of electronic devices, there has been a desire for parts that are lightweight, have excellent electromagnetic shielding properties, and can be used commonly in a wide variety of devices. No suitable molding method has been found, and the currently attempted manufacturing methods for electromagnetic shielding casings have some problems.
本発明者等は種々検討した結果、電磁波を遮蔽する目的
で用いられる筺体の製造において、該筺体を成形するの
に用いる成形用金型でプラスチック粉末又はプラスチッ
ク粉末と強化剤の混合物を融着して得られる多孔質プラ
スチック成形体に金属めっきを施した後、金属めっき露
出が必要な部分をシールして塗装することにより導電層
の剥離や成形品の外観、機械特性を損なうことなく軽量
で共通部品として使用可能な電磁シールド用筺体を製造
できることを見い出し本発明に至った。As a result of various studies, the inventors of the present invention discovered that in the manufacture of a housing used for the purpose of shielding electromagnetic waves, plastic powder or a mixture of plastic powder and reinforcing agent is fused in a mold used to mold the housing. After metal plating is applied to the porous plastic molded product obtained by the process, the areas where the metal plating needs to be exposed are sealed and painted, making it lightweight and common without peeling off the conductive layer or impairing the appearance or mechanical properties of the molded product. The inventors have discovered that it is possible to manufacture an electromagnetic shielding casing that can be used as a component, leading to the present invention.
第１図により電磁シールド用筺体の製造方法を説明する
。成形用金型（ｉにプラスチック粉末又はプラスチック
粉末と強化剤の混合物（２）を充填し、金型を加熱して
プラスチック粉末同士又はプラスチック粉末と強化剤を
融着させ、多孔質プラスチック成形体（３）を作製する
。次に多孔質プラスチック成形体に金属めつき（４）を
施し金属めっき露出が必要な部分をシール（５）して塗
装（６）した後、シールを剥がし電磁シールド用筺体を
製造する。A method of manufacturing an electromagnetic shielding casing will be explained with reference to FIG. The molding mold (i) is filled with plastic powder or a mixture of plastic powder and reinforcing agent (2), and the mold is heated to fuse the plastic powders together or the plastic powder and the reinforcing agent to form a porous plastic molded body ( 3). Next, metal plating (4) is applied to the porous plastic molded body, and after sealing (5) and painting (6) the parts where the metal plating needs to be exposed, the seal is peeled off to form the electromagnetic shielding casing. Manufacture.
プラスチック粉末は熱可塑性ないし熱硬化性樹脂の粉末
であり、プラスチック粉末又はこれと強化剤を混合し成
形用金型に充填する。金型中に均一に充填するためには
成形用金型を傾けたり振動を加えると良い。そして成形
用金型を加熱しプラスチック粉末同士又はプラスチック
粉末と強化剤を融着させ多孔質プラスチック成形体を作
成する。この多孔質プラスチック成形体は一部に独立気
泡を含んでいてもよいが、連続気泡となっているのが好
ましい。加熱温度が高し〒箸、また加熱時間が長いほど
融着が進行し独立気泡が多（なるので、加熱温度や加熱
時間を調節し融着の程度を変化させ適当な条件を選び、
多孔質プラスチック成形体の密度はプラスチック粉末の
真の密度の１０〜８０％とするのが良い。プラスチック
粉末は２種漿以上混合しても良い。The plastic powder is a thermoplastic or thermosetting resin powder, and the plastic powder or the plastic powder is mixed with a reinforcing agent and filled into a mold. In order to fill the mold uniformly, it is best to tilt the mold or apply vibration. Then, the molding die is heated to fuse the plastic powders together or the plastic powder and the reinforcing agent to create a porous plastic molded body. This porous plastic molded article may partially contain closed cells, but preferably has open cells. The higher the heating temperature and the longer the heating time, the more the fusion progresses and the number of closed cells. Therefore, adjust the heating temperature and heating time to change the degree of fusion and choose appropriate conditions.
The density of the porous plastic molded body is preferably 10 to 80% of the true density of the plastic powder. Two or more types of plastic powder may be mixed.
強化剤はガラス繊維、有機繊維、炭素繊維、セラミック
繊維、ウィスカ、無機粒子などが用いられ、これは主に
多孔質プラスチック成形体の強度を出すために添加する
。プラスチック粉末との混合は粉末と強化剤をＶブレン
ダ、リボンブレンダ、ヘンシェルミキサー等を用いて均
一になるよう混合する。Glass fibers, organic fibers, carbon fibers, ceramic fibers, whiskers, inorganic particles, etc. are used as reinforcing agents, and these are added mainly to increase the strength of the porous plastic molded body. For mixing with plastic powder, the powder and reinforcing agent are mixed uniformly using a V blender, ribbon blender, Henschel mixer, etc.
多孔質プラスチック成形体への金属めっきは、常法によ
り行われている無電解めっきを用い、必要に応じ電気め
っきと併用し、めっき厚さを調整し必要とする電磁波を
遮蔽する能力を有するようにする。めっきする金属は銅
、ニッケル、クロム、金、銀、錫、銅−亜鉛合金、ニッ
ケルーリン合金などである。For metal plating on porous plastic molded bodies, we use conventional electroless plating, and if necessary, we use electroplating in combination to adjust the plating thickness and ensure that it has the ability to shield the necessary electromagnetic waves. Make it. Metals to be plated include copper, nickel, chromium, gold, silver, tin, copper-zinc alloy, nickel-phosphorus alloy, etc.
次に金属めっきした多孔質プラスチック城形体の金属め
っき露出が必要な部分をシールする。このシール場所は
（１）電磁シールド筺体の導電層と電子機器との接続を
要する部分や筺体から同軸線等の伝送線が出るときの伝
送線のシールド外被と接続する部分、（２）通風孔や可
動機構の軸の引き出しなどに金網又は穴あき金属板を取
り付ける部分、（３）導波管をはんだやネジなどを用い
て接続するための部分などである。シールは粘接着テー
プを用いて行うのが一般的であり、この他に離型剤やワ
ックスなどを塗布する方法もある。The portions of the metal-plated porous plastic castle that require exposed metal plating are then sealed. The locations of this seal are (1) the part where the conductive layer of the electromagnetic shielding case needs to be connected to the electronic device, or the part where the transmission line such as a coaxial line exits from the case and connects to the shield jacket of the transmission line, (2) ventilation These include a part for attaching a wire mesh or a perforated metal plate to a hole or a drawer of a shaft of a movable mechanism, and (3) a part for connecting a waveguide using solder, screws, etc. Sealing is generally done using adhesive tape, but there are also methods of applying a release agent, wax, etc.
塗装は塗料を用い一般的に行われている方法、例えば刷
毛、ローラ、デイツプ、吹付、静電、粉体塗装などで行
う。好ましくはデイツプ、吹付塗装などが簡単に行えて
良い。塗料は塗膜形成要素、溶剤、顔料などからなるも
のであり、塗膜形成要素としてアルキッド樹脂系、アミ
ノアルキッド樹脂系、ビニル樹脂系、アクリル樹脂系、
エポキシ樹脂系、ウレタン樹脂系、不飽和ポリエステル
樹脂系、塩化ゴム系、エマルジ５ン系、水溶性樹脂系、
無溶剤系などがあり、エポキシ樹脂系、ウレタン樹脂系
が耐熱性、耐久性、電気的特性に優れているので良い。The coating is carried out by a commonly used method using paint, such as brush, roller, dip, spraying, electrostatic, powder coating, etc. Preferably, dip painting, spray painting, etc. can be easily performed. Paints consist of film-forming elements, solvents, pigments, etc.The film-forming elements include alkyd resins, aminoalkyd resins, vinyl resins, acrylic resins,
Epoxy resin system, urethane resin system, unsaturated polyester resin system, chlorinated rubber system, emulsion resin system, water-soluble resin system,
There are solvent-free types, and epoxy resin types and urethane resin types are good because they have excellent heat resistance, durability, and electrical properties.
多孔質プラスチック成形体はプラスチック粒子同士がお
互いに融着し、粒子と粒子の間の空隙が成形体の表面か
ら内部まで続いており表面積が大きい。これに金属めっ
ぎを施すと平滑な平面に比べ、接触面積が大きくさらに
多孔質プラスチック成形体の内層までめっきされること
から、それらのアンカー効果によりプラスチックと金属
めっきの接着性が増す。例えばＰＥに無電解金属めっき
を施すと、ＰＥの平滑な面を持つ平板ではブリスター（
ふくれ）が発生し、めっき金属とＰＥの接着性は無い。In a porous plastic molded body, plastic particles are fused to each other, and voids between the particles continue from the surface to the inside of the molded body, so the surface area is large. When metal plating is applied to this, the contact area is larger than that of a smooth flat surface, and the inner layer of the porous plastic molded body is plated, so their anchoring effect increases the adhesion between the plastic and metal plating. For example, when electroless metal plating is applied to PE, blisters (
blistering) occurs, and there is no adhesion between the plated metal and PE.
これを改良するためにＰＥに可溶性の物質を添加し成形
した後、成形品表面の可溶性物を溶解させる方法や硫酸
−クロム酸混液によりＰＥの無定形部分を溶解する方法
により、表面に凹凸を形成させたり、酸化反応によりＰ
Ｆに極性基を導入し、めっきを行うのが常法とな′つて
いる。To improve this, after adding a soluble substance to PE and molding it, the surface is made uneven by dissolving the soluble substances on the surface of the molded product or by dissolving the amorphous portion of the PE with a sulfuric acid-chromic acid mixture. P by forming or by oxidation reaction.
It has become common practice to introduce a polar group into F and perform plating.
ところがＰＥ粉末を融着させた多孔質ンーＦ・を用いて
めっきを行うと、上記のような処理を行わな（でもブリ
スターの発生は無く、表面積の増大及びアンカー効果に
より接着性は良好となる。多孔質プラスチック成形体の
表面形状を反映した金属めっき上に、さらに塗装を施す
と多孔質プラスチック成形体と金属めっきの接着性が良
いのと同様の理由でめっき金属と塗料の接着性が良く塗
料がめつき金属を封止するため、多孔質プラスチック成
形体から金属めっきされた導電層や塗料が剥がれること
はない。従って従来のように射出成形品表面に溶射やめ
っき及び導電性塗料により導電層を形成する方法では、
導電層片が剥離し機器の回路を短絡させる恐れがあった
が、本発明の製造方法によるとこの可能性はない。もち
ろん塗装をしなくてもプラスチックとめつき金属の接着
性が良いので、その効果は十分ある。しかし、感電及び
さび防止のため導電層を塗装皮膜により被覆する必要が
ある。一方金属短繊維等の導電性充填剤を混入したもの
は成形品表面の外観が悪く４つたり、機械特性が低下し
がちであったが、本発明では金属めっきした多孔質プラ
スチック成形体に塗装を施すので、塗装により金属めっ
きされた多孔質プラスチック成形体表面が平滑化され外
観が良好となり、また金属めっきは多孔質プラスチック
成形体の表面を被覆するのみであるので機械特性の劣化
もない。さらに塗料によりメタリック、キャンプ−トー
ン、ハンマートーン、フレークトーン、パールトーン、
虹彩バール、クラッキングなどの外観を有する塗面を作
ることができ商品価値を高めることができる。However, when plating is performed using a porous material with PE powder fused to it, the above treatment is not performed (but no blisters occur, and the adhesion is good due to the increased surface area and anchoring effect). If a coating is applied on top of the metal plating that reflects the surface shape of the porous plastic molded body, the adhesion between the plated metal and the paint will be good for the same reason that the adhesion between the porous plastic molded body and the metal plating is good. Since the paint is plated and seals the metal, the metal-plated conductive layer and paint will not peel off from the porous plastic molded body.Therefore, unlike conventional methods, the conductive layer is coated on the surface of the injection molded product by thermal spraying, plating, or conductive paint. In the method of forming
Although there was a risk that the conductive layer pieces would peel off and short-circuit the circuit of the device, the manufacturing method of the present invention eliminates this possibility. Of course, even without painting, the adhesiveness between the plastic and the metal plate is good, so the effect is sufficient. However, it is necessary to cover the conductive layer with a paint film to prevent electric shock and rust. On the other hand, when a conductive filler such as short metal fibers is mixed, the surface appearance of the molded product is poor and the mechanical properties tend to deteriorate. As a result, the surface of the metal-plated porous plastic molded body is smoothed by painting, resulting in a good appearance. Also, since the metal plating only covers the surface of the porous plastic molded body, there is no deterioration in mechanical properties. Furthermore, depending on the paint, metallic, camp-tone, hammer tone, flake tone, pearl tone, etc.
It is possible to create a painted surface with an appearance such as iris burl or cracking, thereby increasing the commercial value.
さらに材料が多孔質プラスチックであるため、貫通孔の
大きさや位置、数などをドリルやパンチなどにより容易
に２次加工することができるので、１つの型で筺体を作
成し、これを後加工することにより多品種機器などの共
通部品として使用できる。この時塗装により色や外観を
変えておけば部品を誤って使用することが避けられる。Furthermore, since the material is porous plastic, the size, position, number, etc. of the through holes can be easily secondary-processed using drills, punches, etc., so the casing can be created using one mold and then processed later. This allows it to be used as a common component in a wide variety of equipment. At this time, if you change the color or appearance by painting, you can avoid using the parts incorrectly.
縦１０ａｎ、横５ＣＩ１１、高さ３ｃｍ、Ｒ厚０．３■
で底部が開放し、随所にリブを有する箱の成形用金型に
プラスチック粉末として超高分子量ＰＥミペロンＸＭ−
２２０（平均粒径０．０３ｍｍ、融点１３６℃、三井石
油化学工業株式会社）と強化剤としてガラス短繊維ＦＥ
ＳＳ−０１０（平均繊維長１゜０ｍｍ、富士ファイバー
グラス株式会社〉を３０重量部ヘンシェルミキサーで混
合したものをバイブレータにより振動させ、成形用の空
間が十分埋まるよう充填した。そして成形用金型を１８
０℃で１５分間加熱しＰＥ粉末とガラス短繊維を融着さ
せた多孔質プラスチック成形体を得た。次にこの多孔質
プラスチック成形体を次の方法により無電解銅めっきと
電気銅めっきを行った。多孔質プラスチック成形体をコ
ンディショナー日立コンディショナーＣ０ＮＤ−２０１
（日立化成工業株式会社）に常温（１０〜３５℃）で４
分間浸漬した後、プリデイツプＰＤ−２０１（日立化成
工業株式会社）浴に常温で２分間浸漬し、さらに増感剤
Ｈ３−２０１（日立化成工業株式会社）浴に常温で１０
分間浸漬した。そして密着促進剤Ａ）Ｄｐ −３０１（
日立化成工業株式会社）浴に常温で３分間浸漬後、無電
解鋼めっき液ＣＵＳＴ−２０１（日立化成工業株式会社
）浴に２４℃で１５分間浸漬し、銅めっき厚み約０．３
μｍを形成した。次に硫酸銅２００ ｇ／Ｊ、硫酸５０
ｇ ／ Ａ 、添加剤を適量加えた電気銅めっき浴で
２ 、８ Ａ ／ｄｍ”＝の条件で電気鋼めっきを行い
、銅めっき厚み２０μｍの導電層を形成した。これを水
洗後８０℃で２時間乾燥させた。そしてシールが必要な
部分として底部が開放されている側の４つの側面の底辺
と底辺から高さ５ｍｍの両倒面をポリエチレンテレフタ
レート基板の粘着テープによりシールした。次にこれを
エポキシ樹脂系塗料アトム＃８０００の主剤と硬化剤（
アトム化学塗料株式会社）を混合した塗料にデイツプし
て８０℃で４時間硬化させ外観良好な塗面を得た。そし
てシール上に付着した塗料とともにシールを剥がし、厚
さ１．６ｍｍの両面銅張エポキシ積層基板上にシールし
金属めフきが露出した底部を置き、はんだごてを用いて
２６０〜２８０℃で筺体の４辺と基板め銅箔をはんだ付
けした。Length 10an, width 5CI11, height 3cm, R thickness 0.3■
Ultra high molecular weight PE Miperon XM-
220 (average particle size 0.03 mm, melting point 136°C, Mitsui Petrochemical Industries, Ltd.) and short glass fiber FE as a reinforcing agent.
A mixture of 30 parts by weight of SS-010 (average fiber length 1°0 mm, Fuji Fiberglass Co., Ltd.) in a Henschel mixer was vibrated with a vibrator and filled so that the molding space was sufficiently filled. 18
A porous plastic molded body was obtained by heating at 0° C. for 15 minutes to fuse PE powder and short glass fibers. Next, this porous plastic molded body was subjected to electroless copper plating and electrolytic copper plating by the following method. Conditioner for porous plastic molded bodiesHitachi Conditioner C0ND-201
(Hitachi Chemical Co., Ltd.) at room temperature (10-35℃)
After immersing for 2 minutes in a pre-dip PD-201 (Hitachi Chemical Co., Ltd.) bath at room temperature, it was further immersed in a sensitizer H3-201 (Hitachi Chemical Co., Ltd.) bath for 10 minutes at room temperature.
Soaked for minutes. and adhesion promoter A) Dp-301 (
Hitachi Chemical Co., Ltd.) bath for 3 minutes at room temperature, then immersed in an electroless steel plating solution CUST-201 (Hitachi Chemical Co., Ltd.) bath for 15 minutes at 24°C, resulting in a copper plating thickness of approximately 0.3
μm was formed. Next, 200 g/J of copper sulfate, 50 g/J of sulfuric acid
Electrical steel plating was performed under the conditions of 2.8 A/dm'' in an electrolytic copper plating bath containing an appropriate amount of additives to form a conductive layer with a copper plating thickness of 20 μm. After washing with water, this was heated at 80°C. It was left to dry for 2 hours.Then, the bottom of the four side surfaces on the side where the bottom was open and both inclined surfaces at a height of 5 mm from the bottom were sealed with adhesive tape of a polyethylene terephthalate substrate.Next, this was done. The main agent and curing agent of epoxy resin paint Atom #8000 (
Atom Chemical Paint Co., Ltd.) was poured into a paint mixture and cured at 80° C. for 4 hours to obtain a coated surface with a good appearance. Then, peel off the seal along with the paint adhered to the seal, place the seal on a double-sided copper-clad epoxy laminate board with a thickness of 1.6 mm, and place the exposed bottom part of the metal foil on a 1.6 mm thick double-sided copper-clad epoxy laminated board. I soldered the copper foil to the four sides of the casing and the board.
比較例
実施例と同じ成形用金型にＰＨの粉末ハイゼックス３３
００ＦＰ （三井石油化学工業株式会社）に強化剤とし
てガラス短縁ｍＦＥｓｓ−０１０を３０重量部ヘンシェ
ルミキサーで混合し、圧縮成形プレスにより１８０℃で
１５分間加熱加圧して、縦Ｌｏａｍ、横５ｃｍ、高さ３
ｃｍ、肉厚０．３ｃｍで底部が開放し随所にリブを有す
る箱を成形した。Comparative Example PH powder HIZEX 33 was placed in the same mold as in the example.
00FP (Mitsui Petrochemical Industries, Ltd.) was mixed with 30 parts by weight of glass short edge mFEss-010 as a reinforcing agent in a Henschel mixer, and heated and pressed at 180°C for 15 minutes with a compression molding press to form a shape with vertical loam, width of 5 cm, and height. Sa3
A box with a wall thickness of 0.3 cm and an open bottom and ribs everywhere was molded.
これを実施例と同様に無電解銅めっきを行ったがブリス
ターが発生した。そこで銅めっきを除去した後、８００
番の研磨紙で表面を粗化し無電解銅めっき、そして電気
めっきを行った。研磨紙により表面を粗化した場合ブリ
スターの発生が見られず実施例と同様に銅めっきするこ
とができた。そして実施例と同様にシールした後塗装を
行った。This was subjected to electroless copper plating in the same manner as in the example, but blisters occurred. After removing the copper plating, 800
The surface was roughened with abrasive paper, electroless copper plating was performed, and then electroplating was performed. When the surface was roughened with abrasive paper, no blisters were observed and copper plating could be performed in the same manner as in the example. Then, it was sealed and then painted in the same manner as in the example.
プラスチックと導電層の接着性を簡単に比較するため、
実施例と比較例で得られた電磁シールド用筺体を１ｍの
高さからコンクリート上に１００回落下させたところ、
実施例では剥離はλつたくみられなかったのに対し、比
較例では塗膜で支えられており欠落している部分はなか
ったが、ＰＥ表面とめつき金属との界面剥離が見られた
。To easily compare the adhesion between plastic and conductive layer,
When the electromagnetic shielding casings obtained in Examples and Comparative Examples were dropped onto concrete from a height of 1 m 100 times,
In the example, no significant peeling was observed, whereas in the comparative example, although there was no missing part as the coating was supported, peeling at the interface between the PE surface and the plated metal was observed.
本発明によれば、導電層であるめっき金属とプラスチッ
クの接着性が高いため使用中の導電層の欠落は防止され
る。さらにめっき金属の表面が塗装されている構成であ
るため導電層欠落の防止効果が大きくなり、欠落した場
合に生じる機器の回路の短絡の恐れがなく信頼性が向上
する。さらに多孔質プラスチック成形体であるので軽量
であり、筺体の金属めっきが必要な部分がマスクされ、
この部分が塗装されないので他の構成部品との接続が容
易となりシールド性が高まる。そして筺体を２次加工す
ることにより共通部品として使用でき、塗装により色や
外観を変えることにより筺体を誤って違う機器に取り付
けることを避けることが可能となる。According to the present invention, since the plating metal that is the conductive layer has high adhesion to the plastic, the conductive layer is prevented from being chipped during use. Furthermore, since the surface of the plated metal is coated, the effect of preventing the conductive layer from missing is greater, and there is no risk of short-circuiting of the device's circuit that would occur if the conductive layer is missing, improving reliability. Furthermore, since it is a porous plastic molded body, it is lightweight, and the parts of the housing that require metal plating are masked.
Since this part is not painted, connection with other components is easy and shielding performance is improved. By performing secondary processing on the housing, it can be used as a common component, and by changing the color and appearance through painting, it is possible to avoid accidentally attaching the housing to a different device.
第１図（ａ）〜（ｆ）は電磁シールド用筺体の製造工程
を示す概念図である。
符号の説明
（１）成形用金型
（２）プラスチック粉末
（３）多孔質プラスチック成形体
（４）金属めっき
（５）シール
（６）塗装により形成される塗膜
（ａ）
（ｂ）
（ｃ）
第１図
（ｄ）
（ｅ）
（ｆ）
第１図FIGS. 1(a) to 1(f) are conceptual diagrams showing the manufacturing process of the electromagnetic shielding case. Explanation of symbols (1) Molding mold (2) Plastic powder (3) Porous plastic molded body (4) Metal plating (5) Seal (6) Coating film formed by painting (a) (b) (c ) Figure 1 (d) (e) (f) Figure 1
Claims (1)
いて、該筺体を成形するのに用いる成形用金型でプラス
チック粉末又はプラスチック粉末と強化剤の混合物を融
着して得られる多孔質プラスチック成形体に金属めっき
を施した後、金属めっき露出が必要な部分をシールして
塗装することを特徴とする電磁シールド用筺体の製造方
法。1. In manufacturing a housing used for the purpose of shielding electromagnetic waves, metal is added to a porous plastic molded body obtained by fusing plastic powder or a mixture of plastic powder and a reinforcing agent in a mold used to mold the housing. A method for producing an electromagnetic shielding casing, which comprises plating and then sealing and painting the parts where the metal plating needs to be exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31003790A JPH04180699A (en) | 1990-11-15 | 1990-11-15 | Manufacture of enclosure for electromagnetic shielding use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31003790A JPH04180699A (en) | 1990-11-15 | 1990-11-15 | Manufacture of enclosure for electromagnetic shielding use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04180699A true JPH04180699A (en) | 1992-06-26 |
Family
ID=18000402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31003790A Pending JPH04180699A (en) | 1990-11-15 | 1990-11-15 | Manufacture of enclosure for electromagnetic shielding use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04180699A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552115A (en) * | 1986-02-06 | 1996-09-03 | Steris Corporation | Microbial decontamination system with components porous to anti-microbial fluids |
-
1990
- 1990-11-15 JP JP31003790A patent/JPH04180699A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552115A (en) * | 1986-02-06 | 1996-09-03 | Steris Corporation | Microbial decontamination system with components porous to anti-microbial fluids |
| US5833935A (en) * | 1994-01-28 | 1998-11-10 | Steris Corporation | Microbial decontamination system with components porous to anti-microbial fluids |
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