JPH04179146A - Semiconductor wafer housing case - Google Patents
Semiconductor wafer housing caseInfo
- Publication number
- JPH04179146A JPH04179146A JP2302467A JP30246790A JPH04179146A JP H04179146 A JPH04179146 A JP H04179146A JP 2302467 A JP2302467 A JP 2302467A JP 30246790 A JP30246790 A JP 30246790A JP H04179146 A JPH04179146 A JP H04179146A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- housing case
- storage case
- main body
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims abstract description 36
- 229920003002 synthetic resin Polymers 0.000 abstract description 7
- 239000000057 synthetic resin Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 241000257465 Echinoidea Species 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハの搬送時に用いられる収納ケース
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a storage case used when transporting semiconductor wafers.
従来、半導体ウェハを出荷する際の搬送方法としては以
下のような方法か用いられている。すなわち、クリーン
ルーム内で半導体ウェハを専用ケースに収納し、この専
用ケースをポリ塩化ビニル製の袋又はアルミニウムと合
成樹脂とを層状に重ねた複合材の袋に入れ袋を溶融封止
して密封した後、クリーンルーム外て段ボールからなる
外装箱に収納して搬送している。アルミニウムと合成樹
脂とを層状に重ねた複合材の袋としては、例えばPET
/PE/AfI/PE/LLDPEという構造を有する
ものか知られている。この複合材の袋は、ポリ塩化ビニ
ル製の袋よりも、強度及び密封性に優れている。Conventionally, the following methods have been used to transport semiconductor wafers when shipping them. That is, the semiconductor wafer was stored in a special case in a clean room, and the special case was placed in a polyvinyl chloride bag or a composite bag made of layers of aluminum and synthetic resin, and the bag was melt-sealed and sealed. After that, they are transported out of the clean room and stored in an exterior box made of cardboard. Examples of composite bags made of layers of aluminum and synthetic resin include PET.
/PE/AfI/PE/LLDPE is known. This composite bag has superior strength and sealing properties to bags made of polyvinyl chloride.
専用ケースを更に袋に入れるのは以下のような理由によ
る。専用ケースを袋に入れないと、外気中の不純物が専
用ケース内に侵入する。また、ケースをじかに外装箱に
収納した場合、ケースの外周に塵埃が付着し、クリーン
ルーム内へ塵埃か持ぢ込まれてしまう。これに対して、
専用ケースを袋に入れることにより、外気中の不純物の
侵入を防止することかできる。また、専用ケースを袋に
入れることにより、ケースへの塵埃の付着を防止でき、
クリーンルーム内へ搬入する前に袋からケースを取り出
すようにすればクリーンルーム内へ塵埃が持ち込まれる
のを防止することかできる。The reasons for putting the special case in the bag are as follows. If the special case is not placed in a bag, impurities from the outside air will enter the special case. Furthermore, if the case is directly stored in an outer box, dust will adhere to the outer periphery of the case and will be carried into the clean room. On the contrary,
By putting the special case in a bag, you can prevent impurities from entering the outside air. In addition, by putting the special case in a bag, you can prevent dust from adhering to the case.
By removing the case from the bag before transporting it into the clean room, it is possible to prevent dust from being brought into the clean room.
しかし、前述した従来の方法では、ウェハの専用ケース
か収納された外装箱を航空機などで搬送する場合、貨物
室の温度の低下に伴ってケース内の水蒸気がウェハ表面
で結露することかあった。However, with the conventional method described above, when a special case for wafers or an outer box containing them is transported by aircraft, the water vapor inside the case may condense on the surface of the wafer as the temperature in the cargo hold drops. .
一方、専用ケースには、クリーンルーム内で使用される
薬品を起源とするNOx 5SOx 1NH3などが付
着している。ウェハ表面で結露が起きると、No工、S
oX、NH3などか水滴に溶解してウェハがエツチング
されるため、いわゆる「くもり現象」 (ウェハ表面が
くもったように見える現象)か発生する。特に、冬季に
おいて、室内と室外との温度差か大きい場合には、以」
二の現象が顕著になっていた。On the other hand, NOx, 5SOx, 1NH3, etc., which originate from chemicals used in clean rooms, are attached to the special case. If condensation occurs on the wafer surface, No.
Since oX, NH3, etc. dissolve in the water droplets and etch the wafer, a so-called "clouding phenomenon" (a phenomenon in which the wafer surface appears cloudy) occurs. Especially in winter, when there is a large temperature difference between indoors and outdoors,
The second phenomenon became noticeable.
本発明は前記問題点を解決するためになされたものであ
り、ウェハのくもり現象を防止することかできる半導体
ウェハ収納ケースを提供することをLI的とする。The present invention has been made to solve the above-mentioned problems, and its primary purpose is to provide a semiconductor wafer storage case that can prevent wafer clouding.
〔課題を解決するだめの手段〕
本発明の゛1毛導体ウェハ収納ケースは、半導体ウェハ
を個別に所定間隔を隔てて立設させるガイドか設けられ
た収納ケース本体と、該収納ケース本体」二に被せられ
る蓋体とを有し、前記収納ケース本体及び蓋体が内部に
断熱層か形成された二重構造となっていることを特徴と
するものである。[Means for Solving the Problems] A conductor wafer storage case of the present invention comprises: a storage case body provided with guides for individually standing semiconductor wafers at predetermined intervals; and a storage case body. The storage case main body and the lid have a double structure with a heat insulating layer formed inside.
本発明において、収納ケース本体及び蓋体のオイ質とし
ては、合成樹脂、例えばポリプロピレン、ボリエヂレン
、PFA (テトラフルオロエチレンパーフルオロアル
ギルビニルエーテル)、FEP(テトラフルオロエチレ
ンへキザフルオロプロピレン)、ポリ塩化ビニル、スチ
レン系樹脂なとか挙げられる。In the present invention, the material of the storage case main body and lid body includes synthetic resins such as polypropylene, polyethylene, PFA (tetrafluoroethylene perfluoroargyl vinyl ether), FEP (tetrafluoroethylene hexafluoropropylene), and polyvinyl chloride. , styrene resins, etc.
本発明において、収納ケース本体及び蓋体は、断熱層が
空気である中空構造でもよいし、断熱層として断熱材か
充填されている充填構造でもよい。In the present invention, the storage case body and the lid may have a hollow structure in which the heat insulating layer is air, or may have a filled structure in which the heat insulating layer is filled with a heat insulating material.
本発明の半導体ウニ’\収納ケースは断熱性を何するの
で、ケース内の温度低下を防止して結露を防止すること
ができる。この結果、半導体ウニ/’tのくもり現象を
防止することができる。また、ケースを袋に入れて密封
するという煩雑な作業か不便となる。Since the semiconductor sea urchin storage case of the present invention has thermal insulation properties, it is possible to prevent the temperature inside the case from decreasing and to prevent dew condensation. As a result, it is possible to prevent the clouding phenomenon of the semiconductor urchin/'t. Moreover, the troublesome work of putting the case into a bag and sealing it becomes inconvenient.
以下、本発明の実施例を図面を参照して説明する。第1
図は本発明に係る収納ケースを一部断面で示す正面図、
第2図は同収納ケースを一部断面で示す側面図、第3図
は同収納ケースを一部破断して示す斜視図である。Embodiments of the present invention will be described below with reference to the drawings. 1st
The figure is a partially sectional front view of the storage case according to the present invention;
FIG. 2 is a partially cutaway side view of the storage case, and FIG. 3 is a partially cutaway perspective view of the storage case.
収納ケース本体1は合成樹脂で作製され、内部が中空で
空気の断熱層2が形成された二重構造をHしている。収
納ケース本体]の内面側には半導体ウェハを個別に所定
間隔を隔てて立設させる多数のガイド3が設けられてい
る。収納ケース本体1の上面には突起4が形成されてい
る。収納ケース本体1の対向する2つの側面には蓋体を
固定するための凹状の係合部5が形成されている。The storage case body 1 is made of synthetic resin and has a double structure with a hollow interior and a heat insulating layer 2 of air. A large number of guides 3 are provided on the inner surface of the storage case body to allow semiconductor wafers to be individually placed upright at predetermined intervals. A projection 4 is formed on the upper surface of the storage case body 1. Concave engaging portions 5 for fixing the lid are formed on two opposing side surfaces of the storage case body 1.
蓋体6も合成樹脂で作製され、内部が中空で空気の断熱
層7か形成された二重構造を有している。The lid body 6 is also made of synthetic resin and has a double structure in which the inside is hollow and a heat insulating layer 7 of air is formed.
蓋体6の下面周縁部には収納ケース本体]上面の突起4
に対応する四部が形成され、その内側にシ一ル祠8が設
けられている。蓋体6の対向する2つの側面には収納ケ
ース本体1の係合部5に対応する係合部9が形成されて
いる。蓋体6の下面中央部には個々のウェハを固定する
ためのウェハおさえ10が形成されている。The lower peripheral edge of the lid body 6 has a protrusion 4 on the upper surface of the storage case body.
Four parts corresponding to the four parts are formed, and a seal shrine 8 is provided inside the four parts. Engagement portions 9 corresponding to the engagement portions 5 of the storage case body 1 are formed on two opposing side surfaces of the lid body 6. A wafer holder 10 for fixing individual wafers is formed at the center of the lower surface of the lid 6.
半導体ウェハ11は、収納ケース本体1のガイド3間に
個別に所定間隔を隔てて立設される。この状態で蓋体6
が被せられ、本体コと蓋体6とが固定されるとともにウ
ェハおさえ10によってウェハ11か固定される。The semiconductor wafers 11 are individually placed upright between the guides 3 of the storage case body 1 at predetermined intervals. In this state, the lid 6
The main body and the lid 6 are fixed together, and the wafer 11 is also fixed by the wafer presser 10.
収納ケースへのウェハ11の収納、及び収納ケースから
のウェハ11のJrマり出しはいずれもクリーンルーム
内において行われる。Both the storage of the wafer 11 in the storage case and the removal of the wafer 11 from the storage case are performed in a clean room.
本発明の半導体ウェハ収納ケースは断熱性を有するので
、ケース内の温度低下を防止して結露を防止することが
でき、搬送時のウエノ1のくもり現象を大幅に減少する
ことができる。また、つj−/\の収納・取り出しをク
リーンルーム内において行うことにより、塵埃の侵入を
防tトすることができるので、従来のようにケースを袋
に入れて密1:Iずるという煩雑な作業か不要となる。Since the semiconductor wafer storage case of the present invention has heat insulation properties, it is possible to prevent the temperature inside the case from decreasing and dew condensation, and it is possible to significantly reduce the clouding phenomenon of the wafer 1 during transportation. In addition, by storing and taking out the case in a clean room, it is possible to prevent dust from entering. No more work required.
以上詳述【7たように本発明の半導体ウェハ収納ケース
を用いれば、搬送時のウェハのくもり現象を大幅に減少
することができ、しかも従来よりもウェハの収納・取り
出し作業が簡単になる。As described in detail above [7], by using the semiconductor wafer storage case of the present invention, it is possible to significantly reduce the clouding phenomenon of wafers during transportation, and moreover, the work of storing and removing wafers becomes easier than before.
第1図は本発明に係る収納ケースを一部断面で示す正面
図、第2図は同収納ケースを一部1析而て示す側面図、
第3図は同収納ケースを一部破断して示す斜視図である
。
1・収納ケース本体、2・・断熱層、3・ガイド、4・
・突起、5・係合部、6・・蓋体、7・断熱層、8 シ
ール4イ、9・係合部、10・ウェハおさえ、11・・
・半導体ウェハ。
出願人代理人 弁理士 鈴江武彦FIG. 1 is a front view partially showing a storage case according to the present invention in cross section, FIG. 2 is a side view partially showing the same storage case in cross section,
FIG. 3 is a partially cutaway perspective view of the storage case. 1. Storage case body, 2. Heat insulation layer, 3. Guide, 4.
・Protrusion, 5・Engaging portion, 6・・Lid body, 7・Insulating layer, 8 Seal 4i, 9・Engaging portion, 10・Wafer holding, 11・・
・Semiconductor wafer. Applicant's agent Patent attorney Takehiko Suzue
Claims (1)
ドが設けられた収納ケース本体と、該収納ケース本体上
に被せられる蓋体とを有し、前記収納ケース本体及び蓋
体が内部に断熱層が形成された二重構造となっているこ
とを特徴とする半導体ウェハ収納ケース。It has a storage case body provided with a guide for individually standing semiconductor wafers at predetermined intervals, and a lid body that is placed over the storage case body, and the storage case body and the lid body have a heat insulating layer inside. A semiconductor wafer storage case characterized by having a double structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2302467A JPH04179146A (en) | 1990-11-09 | 1990-11-09 | Semiconductor wafer housing case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2302467A JPH04179146A (en) | 1990-11-09 | 1990-11-09 | Semiconductor wafer housing case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04179146A true JPH04179146A (en) | 1992-06-25 |
Family
ID=17909299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2302467A Pending JPH04179146A (en) | 1990-11-09 | 1990-11-09 | Semiconductor wafer housing case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04179146A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999028967A1 (en) * | 1997-11-28 | 1999-06-10 | Ebara Corporation | Box for transferring semiconductor wafer |
WO1999028966A1 (en) * | 1997-11-28 | 1999-06-10 | Ebara Corporation | Box for transferring semiconductor wafer |
KR20020009186A (en) * | 2000-07-25 | 2002-02-01 | 윤종용 | Wafer carrier used in a back-end process of a wafer |
EP1480255A2 (en) * | 1995-06-26 | 2004-11-24 | Miraial Co., Ltd. | Thin-plate supporting container |
CN103662452A (en) * | 2012-09-04 | 2014-03-26 | 合肥杰事杰新材料股份有限公司 | Packaging structure of air condition compressor |
-
1990
- 1990-11-09 JP JP2302467A patent/JPH04179146A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1480255A2 (en) * | 1995-06-26 | 2004-11-24 | Miraial Co., Ltd. | Thin-plate supporting container |
EP1480255A3 (en) * | 1995-06-26 | 2004-12-08 | Miraial Co., Ltd. | Thin-plate supporting container |
WO1999028967A1 (en) * | 1997-11-28 | 1999-06-10 | Ebara Corporation | Box for transferring semiconductor wafer |
WO1999028966A1 (en) * | 1997-11-28 | 1999-06-10 | Ebara Corporation | Box for transferring semiconductor wafer |
US6395240B1 (en) * | 1997-11-28 | 2002-05-28 | Ebara Corporation | Carrier box for semiconductor substrate |
KR100576758B1 (en) * | 1997-11-28 | 2006-05-03 | 가부시키가이샤 에바라 세이사꾸쇼 | Box for transferring semiconductor wafer |
KR20020009186A (en) * | 2000-07-25 | 2002-02-01 | 윤종용 | Wafer carrier used in a back-end process of a wafer |
CN103662452A (en) * | 2012-09-04 | 2014-03-26 | 合肥杰事杰新材料股份有限公司 | Packaging structure of air condition compressor |
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