JPH04175393A - Preparation of adhesive for electronic part and electronic circuit - Google Patents
Preparation of adhesive for electronic part and electronic circuitInfo
- Publication number
- JPH04175393A JPH04175393A JP30362990A JP30362990A JPH04175393A JP H04175393 A JPH04175393 A JP H04175393A JP 30362990 A JP30362990 A JP 30362990A JP 30362990 A JP30362990 A JP 30362990A JP H04175393 A JPH04175393 A JP H04175393A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic
- electronic circuit
- silicone resin
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 229920002050 silicone resin Polymers 0.000 claims abstract description 11
- 150000001408 amides Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 abstract description 3
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 229940037312 stearamide Drugs 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000002862 amidating effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 150000004671 saturated fatty acids Chemical class 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009435 amidation Effects 0.000 description 1
- 238000007112 amidation reaction Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical group 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品の電子回路基板への仮固定に用いら
れる電子部品用接着剤および、その接着剤を用いた電子
回路の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an adhesive for electronic components used for temporarily fixing electronic components to an electronic circuit board, and a method of manufacturing an electronic circuit using the adhesive.
従来の技術
一般に、リード付き電子部品を電子回路に挿入し、電子
回路基板に固定する場合、第２図に示すように、挿入孔
から出たリードを機械的にかしめている。しかしこの場
合、電子部品のリードの数および形状に対して、それに
対応するリートのかしめ機構が必要と−なり、非常に複
雑な機械となるとともに、多品種の電子部品を電子回路
基板に挿入する場合、多（の機械が必要となる。2. Description of the Related Art Generally, when an electronic component with leads is inserted into an electronic circuit and fixed to an electronic circuit board, the leads coming out of the insertion hole are mechanically caulked, as shown in FIG. However, in this case, a lead caulking mechanism corresponding to the number and shape of the leads of the electronic component is required, resulting in a very complicated machine and the need to insert a wide variety of electronic components into the electronic circuit board. In this case, multiple machines are required.
また、特開昭５８−１８００９０号公報に示されるよう
に光硬化性と熱硬化性の両方の性質を持つ粘接着剤を用
いて、リード付き電子部品を仮固定する方法もある。し
かし、その仮固定する強度が弱い、また、電子部品を電
子回路基板に半田付けする際の加熱だけでは、完全に硬
化せず、そのままでは電気絶縁性に問題があり、電子部
品を電子回路基板に半田付けする前に加熱硬化して完全
硬化させてお（必要があるなどの不具合がある。There is also a method of temporarily fixing leaded electronic components using an adhesive having both photocurable and thermosetting properties, as disclosed in Japanese Patent Application Laid-Open No. 58-180090. However, the strength for temporary fixing is weak, and heating alone when soldering electronic components to electronic circuit boards does not completely cure them, and there is a problem with electrical insulation when soldering electronic components to electronic circuit boards. There are some drawbacks such as the need to heat and cure the product completely before soldering.
発明が解決しようとする課題
上述したような機械的なかしめ機構が不要であり、また
、仮固定強度が強（、電子部品の仮固定後の熱硬化が不
要かつ電気絶縁性のよい接着剤およびそれを用いた電子
回路基板の製造方法が求められている。Problems to be Solved by the Invention The above-mentioned mechanical caulking mechanism is unnecessary, and the temporary fixing strength is strong (no need for heat curing after temporary fixing of electronic components, and adhesives and adhesives with good electrical insulation properties are used. There is a need for a method of manufacturing an electronic circuit board using the same.
課題を解決するための手段
上記課題を解決するため、本発明において用いられる接
着剤は、一般式（Ａ）に示されるシリコーン樹脂を５０
〜９５ ｗ ｔ％、一般式（Ｂ）に示されるシリコーン
樹脂を０．１〜５ｗｔ％、酸アミドを０．３〜５０ｗｔ
％から構成されている。さらに好ましくは、一般式（Ａ
）のシリコーン樹脂が７５〜９０ｗｔ％、一般式（Ｂ）
のシリコーン樹脂が０．５〜３ｗｔ％、酸アミドが５〜
２０ｗｔ％である。Means for Solving the Problems In order to solve the above problems, the adhesive used in the present invention contains 50% of the silicone resin represented by the general formula (A).
~95 wt%, 0.1 to 5 wt% of silicone resin represented by general formula (B), and 0.3 to 50 wt% of acid amide
It consists of %. More preferably, the general formula (A
) silicone resin is 75 to 90 wt%, general formula (B)
0.5 to 3 wt% of silicone resin, 5 to 3 wt% of acid amide
It is 20wt%.
Ｒ，Ｒ’＝アルキル基
ｅ＝１〜２０
（Ｂ ） Ｎｈ（ＣｈＣｈ）、ＮＨ（ＣｈＣＨ２ＣＨ
２）ｎＳｉ（ＯＣＨ３ｈｍ＝１〜３
ｎ＝１〜３
これに用いられる酸アミドは、下記の１および２のもの
が挙げられるが、特にこれらに限定されるものではない
。R, R' = alkyl group e = 1 to 20 (B) Nh(ChCh), NH(ChCHCH
2) nSi (OCH3hm=1-3 n=1-3 The acid amides used here include those in 1 and 2 below, but are not particularly limited to these.
（１） ＣｏＨ２ｎ＋Ｉ Ｃ００Ｈで表わされる飽和
脂肪酸をアミド化した酸アミド。(1) CoH2n+I An acid amide obtained by amidating a saturated fatty acid represented by C00H.
（２） ＣｏＨ２ｎ＋＋Ｃ０ＯＨで表わされる飽和脂
肪酸をアミド化した酸アミドを脂肪族アルコール。(2) An acid amide obtained by amidating a saturated fatty acid represented by CoH2n++C0OH is an aliphatic alcohol.
芳香族溶剤、あるいは、それらの混合溶剤により膨潤さ
せたもの。Swelled with aromatic solvents or mixed solvents.
上記において、好ましくは、ｎ＝９〜２１であり、具体
的には、カプリン酸、ラウリン酸、ミリスチン酸、パル
ミチン酸、ステアリン酸、アラキン酸、ヘヘン酸等であ
る。アミド化に用いられるアミンは、いずれのアミンで
もよいが、好ましくは、第三級アミンである。脂肪族ア
ルコールとしては、メチルアルコール、エチルアルコー
ル、プロピルアルコール、イソプロピルアルコール、ブ
チルアルコール等である。芳香族溶剤としては、ベンゼ
ン、トルエン、キシレン等である。In the above, preferably n=9 to 21, and specific examples include capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, and hehenic acid. The amine used for amidation may be any amine, but is preferably a tertiary amine. Examples of the aliphatic alcohol include methyl alcohol, ethyl alcohol, propyl alcohol, isopropyl alcohol, and butyl alcohol. Examples of aromatic solvents include benzene, toluene, and xylene.
前記の接着剤には、必要に応じて、その性能を変えない
範囲において、前記以外に、充填材、顔料１分散剤、老
化防止剤、界面活性剤、有機金属酸化物等を加えること
ができる。In addition to the above, fillers, pigment 1 dispersants, anti-aging agents, surfactants, organometallic oxides, etc. can be added to the adhesive as necessary, within a range that does not change its performance. .
作用
本発明に用いられる一般式（Ａ）および（Ｂ）のシリコ
ーン樹脂は、お互いに反応し重合することにより、接着
剤の粘着性を発現させることにより、電子部品の仮固定
を行なう。また酸アミドは、接着剤に適度な粘度を与え
、接着剤のダレを防止する。Function: The silicone resins of general formulas (A) and (B) used in the present invention react with each other and polymerize to develop adhesive properties, thereby temporarily fixing electronic components. In addition, the acid amide imparts appropriate viscosity to the adhesive and prevents the adhesive from dripping.
実施例
以下に本発明の一実施例について図面を参照して説明す
る。EXAMPLE An example of the present invention will be described below with reference to the drawings.
下記のシリコーン樹脂を８０ ｗ ｔ％、Ｎ−β−（ア
ミノエチル−γ−アミノプロピルトリメトキシシラン）
を３ ｗ ｔ％、ステアリン酸アミドを１７ｗｔ％とを
混練して、電子部品接着剤を得た。80 wt% of the following silicone resin, N-β-(aminoethyl-γ-aminopropyltrimethoxysilane)
and 17 wt% of stearic acid amide were kneaded to obtain an electronic component adhesive.
次に、電子回路の製造は下記のように行なう。Next, the electronic circuit is manufactured as follows.
まず電子回路上の所定の位置に、前記の構成において製
造された接着剤を塗布しく第１図（ａ））、１５０℃に
て２分間加熱して、粘着性を発現させた。次に、粘着性
の発現した接着剤と接触するように、リード付き電子部
品を挿入し、電子部品を仮固定した（第１図（ｂ））。First, the adhesive produced in the above configuration was applied to a predetermined position on an electronic circuit (FIG. 1(a)) and heated at 150° C. for 2 minutes to develop adhesive properties. Next, an electronic component with leads was inserted so as to be in contact with the adhesive that had developed tackiness, and the electronic component was temporarily fixed (FIG. 1(b)).
ついで、この電子部品の挿入された基板を噴流半田槽に
て半田付を行なった（第１図（Ｃ））。Next, the board into which the electronic component was inserted was soldered in a jet soldering tank (FIG. 1(C)).
このようにしてサンプルを５０個作製し、下記の試験を
行なった。また、光硬化性と熱硬化性の両方の性質を持
つ粘接着剤を用いて、実施例と同様にサンプルを５０個
作製し、比較例とした。Fifty samples were produced in this way and the following tests were conducted. In addition, using an adhesive having both photocurable and thermosetting properties, 50 samples were prepared in the same manner as in the examples and used as comparative examples.
（１） 半田付は性試験
上記のサンプルの噴流半田付けを行い、電子部品のはず
れや浮きの有無を確認し、その数を計測した。(1) Soldering performance test The above sample was jet soldered, and the presence or absence of detachment or lifting of electronic components was checked, and the number thereof was counted.
（２）耐湿性試験
噴流半田付けされた基板を、１２１℃、２気圧の槽中に
置き、部品の腐食の有無を調べた。(2) Moisture resistance test The jet-soldered board was placed in a tank at 121° C. and 2 atm, and the presence or absence of corrosion of the components was examined.
試験の結果を第１表および第２表に示す。The results of the test are shown in Tables 1 and 2.
第１表 半田付は性試験の結果
第２表 耐湿性試験の結果
発明の効果
以上の説明から明らかなように、本発明による電子部品
用接着剤とそれを用いた電子回路の製造方法は、製造設
備の大幅な簡略化と信頼性の高い電子回路の製造を可能
とさせるものである。Table 1 Result of Solderability Test Table 2 Result of Moisture Resistance Test Effects of the Invention As is clear from the above explanation, the adhesive for electronic parts according to the present invention and the method for manufacturing electronic circuits using the same are as follows: This makes it possible to significantly simplify manufacturing equipment and manufacture highly reliable electronic circuits.
第１図は本発明の一実施例における電子回路の製造方法
を示す工程図、第２図は従来の方法により製造された電
子回路基板の断面図である。
１・・・・・・電子回路基板、２・・・・・・接着剤、
３・・・・・・電子部品、４・・・・・・半田、５・・
・・・・挿入孔、６・・・・・・電極。FIG. 1 is a process diagram showing a method for manufacturing an electronic circuit according to an embodiment of the present invention, and FIG. 2 is a sectional view of an electronic circuit board manufactured by a conventional method. 1...Electronic circuit board, 2...Adhesive,
3...Electronic parts, 4...Solder, 5...
...insertion hole, 6...electrode.
Claims (2)
脂５０〜９５ｗｔ％と下記の一般式（Ｂ）により示され
るシリコーン樹脂０．１〜５ｗｔ％と酸アミド０．３〜
５０ｗｔ％からなる電子部品用接着剤。 ▲数式、化学式、表等があります▼ Ｒ，Ｒ’＝アルキル基 ｌ＝１〜２０ （Ｂ）ＮＨ＿２（ＣＨ＿２ＣＨ＿２）＿ｍＮＨ（ＣＨ＿
２ＣＨ＿２ＣＨ＿２）＿ｎＳｉ（ＯＣＨ＿３）＿３ｍ＝
１〜３ ｎ＝１〜３(1) 50 to 95 wt% of a silicone resin represented by the following general formula (A), 0.1 to 5 wt% of a silicone resin represented by the following general formula (B), and 0.3 to 0.3 to 5 wt% of an acid amide.
Adhesive for electronic parts consisting of 50wt%. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ R, R' = alkyl group l = 1 ~ 20 (B) NH_2(CH_2CH_2)_mNH(CH_
2CH_2CH_2)_nSi(OCH_3)_3m=
1~3 n=1~3
電子部品用接着剤を塗布し、加熱して粘着性を発現させ
、その上からリード付き電子部品を挿入仮止めしたのち
、電子回路基板と電子部品を半田付けする電子回路の製
造方法。(2) After applying the adhesive for electronic components according to claim 1 to a predetermined position on an electronic circuit board, heating it to develop adhesiveness, and inserting and temporarily fixing an electronic component with a lead thereon, A method of manufacturing electronic circuits that involves soldering electronic circuit boards and electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30362990A JPH04175393A (en) | 1990-11-07 | 1990-11-07 | Preparation of adhesive for electronic part and electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30362990A JPH04175393A (en) | 1990-11-07 | 1990-11-07 | Preparation of adhesive for electronic part and electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04175393A true JPH04175393A (en) | 1992-06-23 |
Family
ID=17923290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30362990A Pending JPH04175393A (en) | 1990-11-07 | 1990-11-07 | Preparation of adhesive for electronic part and electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04175393A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016021646A1 (en) * | 2014-08-08 | 2016-02-11 | 東レ株式会社 | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| CN108138013A (en) * | 2015-10-29 | 2018-06-08 | 东丽株式会社 | Temporary adhesion laminate film uses the substrate processome of temporary adhesion laminate film and the manufacturing method of multilayer board processome and the manufacturing method using their semiconductor devices |
-
1990
- 1990-11-07 JP JP30362990A patent/JPH04175393A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016021646A1 (en) * | 2014-08-08 | 2016-02-11 | 東レ株式会社 | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| KR20170042609A (en) * | 2014-08-08 | 2017-04-19 | 도레이 카부시키가이샤 | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| CN106574163A (en) * | 2014-08-08 | 2017-04-19 | 东丽株式会社 | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| JPWO2016021646A1 (en) * | 2014-08-08 | 2017-05-25 | 東レ株式会社 | Temporary sticking adhesive, adhesive layer, wafer processed body and semiconductor device manufacturing method using the same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| US10177022B2 (en) | 2014-08-08 | 2019-01-08 | Toray Industries, Inc. | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| JP2020077876A (en) * | 2014-08-08 | 2020-05-21 | 東レ株式会社 | Adhesive agent for temporary adhesion, adhesive agent layer, wafer processed body, manufacturing method of semiconductor apparatus using the same, rework solvent, polyimide copolymer, polyimide mixture resin, and resin composition |
| US10941320B2 (en) | 2014-08-08 | 2021-03-09 | Toray Industries, Inc. | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion |
| CN108138013A (en) * | 2015-10-29 | 2018-06-08 | 东丽株式会社 | Temporary adhesion laminate film uses the substrate processome of temporary adhesion laminate film and the manufacturing method of multilayer board processome and the manufacturing method using their semiconductor devices |
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