JPH04165096A - Lead wire for electronic parts - Google Patents
Lead wire for electronic partsInfo
- Publication number
- JPH04165096A JPH04165096A JP28986890A JP28986890A JPH04165096A JP H04165096 A JPH04165096 A JP H04165096A JP 28986890 A JP28986890 A JP 28986890A JP 28986890 A JP28986890 A JP 28986890A JP H04165096 A JPH04165096 A JP H04165096A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wire
- tin
- copper
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 110
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052718 tin Inorganic materials 0.000 claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 63
- 229910052759 nickel Inorganic materials 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract 3
- 230000000052 comparative effect Effects 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910000978 Pb alloy Inorganic materials 0.000 description 6
- 239000013256 coordination polymer Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 229910001369 Brass Inorganic materials 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐熱性、密着性、半田付は性などが優れてい
る電子部品用リード線に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead wire for electronic components that has excellent heat resistance, adhesion, solderability, etc.
（従来の技術）
゛電子部品用リード線としては、銅線又は銅覆鋼線（以
下、ＣＰ線と称する）の素線上に、無光沢浴において錫
又は錨−鉛合金の仕上げめっきを施したものが現在では
主流である。ＣＰ線は、直径５〜７ｍｍの鋼線に鋼やつ
き又は銅をクラッドしてから伸線・焼鈍しをして、鋼厚
さを３０％導電率になるよう（こ設定しており、このよ
うに銅層が厚かったり、銅線自体であると、電解コンデ
ンサ。(Prior art) ゛As lead wires for electronic components, finish plating of tin or anchor-lead alloy is applied to copper wire or copper-clad steel wire (hereinafter referred to as CP wire) in a matte bath. are now mainstream. CP wire is made by cladding steel wire or copper with a diameter of 5 to 7 mm, then drawing and annealing it to make the steel thickness 30% conductive. As in electrolytic capacitors, the copper layer is thick or the copper wire itself.
タンタルコンデンサ、抵抗器本体の接続において、アル
ミニウム、タンタル、鉄との溶接に際して銅が阻害要因
となる。ｃｐ＠ｔの製造設備は、通常、大掛かりで素線
コストが高く、仮にこの方法で銅厚さを０．５〜５μｍ
にしても、伸線時に鉄地が露出しやすくなって電子部品
用リード線として使用できない。このため一部では、鉄
又は銅合金の素線に銅やニッケルの下地めっきを形成し
たり、又はニッケル線を素線に用い、これに錫又は錫−
鉛合金の仕上げめっきを施している。When connecting tantalum capacitors and resistor bodies, copper becomes an impediment to welding with aluminum, tantalum, and iron. The production equipment for cp@t is usually large-scale and the cost of strands is high.
However, the iron base is easily exposed during wire drawing, making it impossible to use it as a lead wire for electronic components. For this reason, in some cases, a copper or nickel base plating is formed on the iron or copper alloy wire, or a nickel wire is used as the wire, and then tin or tin-coated wire is used.
Finished with lead alloy finish plating.
（発明が解決しようとする課題）
電子部品用リード線において、鉄素線上に１〜２μｍの
銅の下地めっきを施してから錫又は錫−鉛合金の仕上げ
めっきを形成する。と比較的安価であっても、４０°Ｃ
９９０％ＲＨ以上の恒温・恒温環境で９６時間後、又は
５％塩水を噴霧すると３５℃で４８時間後に鉄錆が発生
する。これを防止するには、鉄素線上に５μｍを超える
銅めっき例えば約１２μｍの銅めっきを施すことを要す
るが、銅めつきを所定値以上に厚くすると、銅が硬くな
って焼鈍しが必要になり、コスト高になってしまう。一
方、ニッケル又はその合金の金属素線上に、錫又は錫−
鉛合金（錫組成５０％以上）の仕上げめっきを施した場
合、１５０°Ｃで加熱処理を行うと１〜２時間でＮｉ−
５ｎ拡散層が形成され、この合金層は硬くて脆いため、
この部分から密着不良となってしまう。この金属素線上
に銅０．５〜２μｍの下地めっきを施してから、錫又は
錫−鉛合金の仕上げめっきを形成するならば、加熱後の
密着性はかなり良くなるけれども未だ十分ではない。(Problems to be Solved by the Invention) In lead wires for electronic components, a copper base plating of 1 to 2 μm is applied to an iron wire, and then a final plating of tin or a tin-lead alloy is formed. Even if it is relatively cheap, 40°C
Iron rust occurs after 96 hours in a constant temperature environment of 990% RH or higher, or after 48 hours at 35°C when sprayed with 5% salt water. To prevent this, it is necessary to apply copper plating of more than 5 μm, for example about 12 μm, on the iron wire, but if the copper plating is thicker than a specified value, the copper becomes hard and requires annealing. This results in high costs. On the other hand, tin or tin-
When finish plating a lead alloy (tin composition of 50% or more), heat treatment at 150°C will remove the Ni-
A 5n diffusion layer is formed, and since this alloy layer is hard and brittle,
Poor adhesion occurs from this part. If a base plating of 0.5 to 2 .mu.m copper is applied to the metal wire and then a final plating of tin or tin-lead alloy is formed, the adhesion after heating will be considerably improved, but it is still not sufficient.
本発明は、従来の電子部品用リード線に関する前記の問
題点を改善するために提案されたものであり、耐熱性、
密着性などが優れた電子部品用リード線を提供すること
を目的としている。The present invention was proposed in order to improve the above-mentioned problems regarding conventional lead wires for electronic components.
The aim is to provide lead wires for electronic components with excellent adhesion.
（課題を解決するための手段）・
上記目的を達成するために、本発明に係る電子部品用リ
ード線１は、第１図に示すように、該当サイズの金属素
線２上に、ニッケル下地めつき３と、銅の中間めっき４
と、錫、錫−鉛合金又は銀の仕上げぬつき５とを順次形
成している。金属素線２が該当サイズであると云うこと
は、所定のめっき後に、線径が減少する線引加工などを
行わないことを意味するが、めっき後のスキンバス程度
は可能である。めっき３，４．５は、金属素線の周面に
比較的薄く均一に設け、全体又は部分的に電解めっき法
、無電解めっき法、真空蒸着法、スパッタリング法、イ
オンめっき法などの方法を利用してもよいが、−ｇに電
解めっき法で形成すると好ましい。(Means for Solving the Problems) In order to achieve the above object, the lead wire 1 for electronic components according to the present invention has a nickel base on a metal wire 2 of the corresponding size, as shown in FIG. Plating 3 and copper intermediate plating 4
and a finishing layer 5 of tin, tin-lead alloy, or silver are sequentially formed. When the metal wire 2 is of the appropriate size, it means that after the predetermined plating, no wire drawing processing that reduces the wire diameter is performed, but it is possible to perform a skin bath after plating. Plating 3, 4.5 is provided relatively thinly and uniformly on the peripheral surface of the metal wire, and is entirely or partially coated with a method such as electrolytic plating, electroless plating, vacuum evaporation, sputtering, or ion plating. Although it may be used, it is preferable to form it on -g by electrolytic plating.
本発明の電子部品用リード線１において、金属素線２が
鉄又はその合金、銅又はその合金、ニッケル又はその合
金であれば、ニッケル０．５〜２μｍの下地めっき３と
、銅０．５〜５μｍの中間めっき４と、錫、錨−鉛合金
又は銀１〜５０μｍの半光沢仕上げぬっき５又は１〜５
μｍの光沢仕上げめっきとを順次形成し、特、にニッケ
ルめっき３は厚さ０．５〜１μｍで銅めっき４が０．５
〜２μｍであると好ましい。金属素線２において、鉄又
はその合金には炭紫鋼、ステンレス鋼などを含み、銅合
金としてはリン青銅、黄銅（真鍮）などが例示できる。In the lead wire 1 for electronic components of the present invention, if the metal wire 2 is iron or its alloy, copper or its alloy, nickel or its alloy, the base plating 3 of 0.5 to 2 μm of nickel and 0.5 μm of copper are used. -5 μm intermediate plating 4 and tin, anchor-lead alloy or silver 1-50 μm semi-gloss finish plating 5 or 1-5
A glossy finish plating with a thickness of 0.5 μm and a thickness of 0.5 μm are formed in particular for nickel plating 3 and a thickness of 0.5 μm for copper plating 4.
It is preferable that it is ~2 μm. In the metal wire 2, examples of iron or its alloy include charcoal steel and stainless steel, and examples of the copper alloy include phosphor bronze and brass.
錫−鉛合金の組成は、鉛０．５〜９９．５％でｇ９９．
５〜０．５％であればよい。The composition of the tin-lead alloy is 0.5 to 99.5% lead and g99.
It is sufficient if it is 5 to 0.5%.
仕上げぬっき５は半光沢又は光沢めっきであるから、従
来の無光沢めっきよりも粒子が微細であり、半田付けの
際の拡散速度がいっそう速くなる。この際に、厚さ５μ
ｍを超える光沢めっきは、相当に硬いために曲げ加工時
にクラックが発生しやすく、これらの粒界から腐食する
恐れがある。また、厚い光沢めっきでは細かい剥離によ
ってカスが多量に発生し、添加剤の使用量が多いので変
色の原因となりやすい。Since the finishing plating 5 is a semi-gloss or bright plating, the particles are finer than that of conventional matte plating, and the diffusion rate during soldering is even faster. At this time, the thickness is 5 μm.
Bright plating exceeding m is considerably hard and therefore tends to crack during bending, and there is a risk of corrosion from these grain boundaries. In addition, thick glossy plating generates a large amount of scum due to fine peeling, and the large amount of additive used tends to cause discoloration.
（作用）
本発明の電子部品用リード線１では、鉄又はその合金の
金属素線２に銅めっきをする際にニッケルの下地めっき
３を形成するので、銅めっき４が約２μｍ Ｒ後の厚み
であっても、４０℃、９０％ＲＨ以上の恒温・恒温環境
及び５％塩水の噴霧後に鉄錆が発生しない。また、リン
青銅や真鍮などの金属素線２上に仕上げぬっき５を施す
場合に、ニッケルの下地めっき３及び銅の中間めっき４
を形成するため、加熱環境下でもリンが仕上げぬっき５
に入り込まないので良好な耐熱性を有し、長期間自然放
置しても亜鉛が仕上げぬっき５に侵入せず、その半田付
は性は殆ど低下しない。更に、金属素４＄２がニッケル
又はその合金であっても、ニッケルの下地めっき３及び
銅の中間めっき４の存在により、仕上げぬっき５が錫を
含んでいても加熱環境下でＮｉ−５ｎ拡散層を形成しな
くなり、密着不良が殆ど発生しない。(Function) In the lead wire 1 for electronic components of the present invention, a nickel base plating 3 is formed when copper plating is applied to the metal wire 2 made of iron or its alloy, so that the copper plating 4 has a thickness of approximately 2 μm after R. However, iron rust does not occur even after being sprayed with 5% salt water and in a constant temperature environment of 40°C and 90% RH or higher. In addition, when finishing plating 5 is applied to metal wire 2 such as phosphor bronze or brass, nickel base plating 3 and copper intermediate plating 4 may be applied.
5. Because of this, the phosphorus can be used even in a heated environment.
Zinc does not penetrate into the finish plating 5, so it has good heat resistance, and even if it is left alone for a long time, zinc does not penetrate into the finishing plating 5, and its soldering properties hardly deteriorate. Furthermore, even if the metal element 4$2 is nickel or its alloy, due to the presence of the nickel base plating 3 and the copper intermediate plating 4, even if the finishing plating 5 contains tin, it will become Ni-5n in a heating environment. No diffusion layer is formed, and adhesion defects hardly occur.
（実施例） 次に本発明を実施例に基づいて説明する。(Example) Next, the present invention will be explained based on examples.
、 実施例１
第１図に示すように、直径０．５ｍｍの鋼＃！２を下記
の浴組成の電解めっき浴に浸漬し、該鋼線上に浴温５０
″Ｃで下地めっき３として厚さ１μｍのニッケルを被覆
する。, Example 1 As shown in Figure 1, steel #! with a diameter of 0.5 mm! 2 is immersed in an electrolytic plating bath having the following bath composition, and the bath temperature is 50°C on the steel wire.
1 μm thick nickel is coated as base plating 3 with “C”.
スルファミン酸ニッケル ３００〜７００ ｇ／ｌホウ
酸 ３０ｇ／ｌ添加剤（ビ
ット防止剤） 適 量次に下記の浴組成
の電解めっき浴において、室温の浴温で中間めっき４と
して厚さ２μｍの銅を被覆する。Nickel sulfamate 300-700 g/l Boric acid 30 g/l Additive (bit inhibitor) Appropriate amount Next, in an electrolytic plating bath with the following bath composition, a 2 μm thick copper layer was applied as intermediate plating 4 at room temperature bath temperature. Cover.
硫＃１銅 ２００〜２５０ ｇ／ｌ硫
酸 ３０〜７５ｇ／ｌ添加剤
適 量更に下記の浴組
成の電解めっき浴において、鉛５％で残部が錫である厚
さ２μｍの光沢仕上げぬっき５を形成する。Sulfur #1 Copper 200-250 g/l Sulfuric acid 30-75 g/l Additives
Further, in an electrolytic plating bath having the bath composition shown below, a glossy finish plating 5 having a thickness of 2 μm is formed with 5% lead and the balance being tin.
ホウフッ化第−錫 ２８０ ｇ／ｌホウ
フッ化鉛 １２ｇ／ｌ遊離ホウフ
ッ酸 １４０ｇ／！ホルマリン
８ ｍ ｌ ／ １光沢剤
２０ ｍ ／ ／ １分散剤
１５ｇ／／この電子部品用リー
ド＃！１では、銅めつき４の厚みが２μｍであっても、
４０’Ｃ，９０％ＲＨ以上の恒温・恒温環境及び５％塩
水の噴霧後に鉄錆が発生しない。また、鋼の中間めつき
４は厚さが２μｍにすぎないから、使用時に焼鈍しを必
要としない。Tin borofluoride 280 g/l Lead borofluoride 12 g/l Free borofluoric acid 140 g/! formalin
8ml/1 brightener
20 m / / 1 dispersant
15g // This lead for electronic parts #! 1, even if the thickness of the copper plating 4 is 2 μm,
No iron rust occurs in a constant temperature environment of 40'C, 90% RH or more and after spraying with 5% salt water. Further, since the intermediate plating 4 of steel has a thickness of only 2 μm, annealing is not required during use.
実施例２
直径０．５ｍｍの銅線２上に、実施例１と同様に厚さ１
μｍのニッケルめつき３及び厚さ２μｍの銅めっき４を
順次被覆し、更に下記の浴組成の電解めっき浴において
、鉛５％以下で残部が錫である厚さ１２μｍの半光沢仕
上げぬつき５を形成する。Example 2 On a copper wire 2 with a diameter of 0.5 mm, a thickness of 1
A nickel plating 3 with a thickness of 12 μm and a copper plating 4 with a thickness of 2 μm are coated sequentially, and a semi-gloss finish 5 with a thickness of 12 μm is coated with 5% lead or less and the balance is tin in an electrolytic plating bath having the bath composition shown below. form.
ホウフッ化第−錫 ３００ ｇ／ｌホウ
フッ化鉛 ２３ｇ／ｌ遊離ホウフ
ッ酸 ２００ ｇ７１半光沢剤
２０ ｍ ｌ ／ １分散剤
１５ｇ／Ｉ！このリード線の半
田付は性を半田濡れ時間で評価する。半田付は性は、従
来、濡れ面積の大小で評価したが、最近では濡れ速度の
遅速で評価するようになっている。この半田濡れ速度は
、例えば、加速劣化試験（プレッシャーカー１．２気圧
、１０５°０１１００％ＲＨ：１６時間）後のゼロクロ
スタイムで測定し、その結果を下記の第１表に示す。Tin borofluoride 300 g/l Lead borofluoride 23 g/l Free borofluoride 200 g 71 Semi-brightener
20 ml/1 dispersant
15g/I! The soldering performance of this lead wire is evaluated by the solder wetting time. Solderability has traditionally been evaluated based on the size of the wetting area, but recently it has been evaluated based on the slowness of the wetting speed. This solder wetting speed was measured, for example, at the zero cross time after an accelerated deterioration test (pressure car 1.2 atm, 105°01100% RH: 16 hours), and the results are shown in Table 1 below.
下記の第１表において、本発明品は鉄線に１μｍのニッ
ケルめっき、３〜４μｍの銅めっき、錫−鉛合金１２μ
ｍの半光沢仕上げめっきを順次形成しており、比較例１
では同直径のＣＰ線に錫−鉛合金１２μｍの半光沢仕上
げめっきのみを形成し、比較例２では同直径の軟鋼線に
錫−鉛合金１２μｍの半光沢仕上げめっきのみを形成す
る。なお、仕上げめっきの錫−鉛合金の比率は、錫：鉛
：９４ ： ６に設定する。In Table 1 below, the products of the present invention are iron wires with 1 μm nickel plating, 3-4 μm copper plating, and 12 μm tin-lead alloy.
Comparative Example 1
In Comparative Example 2, only a 12 μm semi-bright finish plating of a tin-lead alloy is formed on a CP wire of the same diameter, and in Comparative Example 2, only a 12 μm semi-bright finish plating of a tin-lead alloy is formed on a mild steel wire of the same diameter. Note that the ratio of tin-lead alloy in the final plating is set to tin:lead:94:6.
第１表
第１表から、本発明のリード線におけるＰＣＴ処理後の
ゼロクロスタイムは、比較例１及び２のリード線よりも
かなり優れている。この第１の理由は、本発明のリード
線の導電率が１５〜２０％であり、比較例１のＣＰ線が
２７〜３０％及び比較例２の軟鋼線が１００．１％とい
うように熱伝導と同様の関係を示し、第２図から明らか
なように、そのピーク高さが比較的低いからである。第
２の理由として、本発明のリード線、における鋼めっき
表面が、伸線・焼鈍しされたＣＰ線などの表面に比べて
適当に粗いためである。Table 1 From Table 1, the zero cross time after PCT treatment of the lead wire of the present invention is considerably better than that of the lead wires of Comparative Examples 1 and 2. The first reason for this is that the conductivity of the lead wire of the present invention is 15-20%, the CP wire of Comparative Example 1 has a conductivity of 27-30%, and the mild steel wire of Comparative Example 2 has a conductivity of 100.1%. This is because it shows a similar relationship to conduction and, as is clear from FIG. 2, its peak height is relatively low. The second reason is that the steel plating surface of the lead wire of the present invention is appropriately rougher than the surface of drawn and annealed CP wire.
実施例３
直径ｏ、ｓｍｍのリン青銅ｌｓ２上に、実施例１と同様
に、厚さ１μｍのニッケルめつき３と、厚さ２μｍの銅
めつき４とを施し、更に実施例２と同様の厚さ１２μｍ
の半光沢仕上げぬつき５を形成する。Example 3 Nickel plating 3 with a thickness of 1 μm and copper plating 4 with a thickness of 2 μm were applied on a phosphor bronze ls2 having a diameter of o and smm in the same manner as in Example 1, and further plated in the same manner as in Example 2. Thickness 12μm
Forms a semi-gloss finish 5.
実施例３のようなリン青銅の金属素線２では、その上に
錨、錨−鉛合金又は銀の仕上げめっきを施すと、１５０
°Ｃの加熱環境下で４８時間後に剥離し始め、これに厚
さ１〜２μｍの銅の下地めっき層を介在させても、１５
０°Ｃの加熱環境下で約９６時間後にごく軽い剥離が始
まる。これに対し、実施例３のリード線では、１５０°
Ｃの加熱環境下で３〜４倍の耐熱性を有する。これは、
ニッケルの下地めつき３及び銅の中間めつき４を形成す
るため、加熱環境下においてリンが仕上げぬつき５に入
り込まないからである。In the case of the phosphor bronze metal wire 2 as in Example 3, when an anchor, an anchor-lead alloy, or a final plating of silver is applied thereon,
It started peeling after 48 hours in a heating environment of
Very slight peeling begins after about 96 hours in a heated environment of 0°C. On the other hand, in the lead wire of Example 3, the angle is 150°.
It has 3 to 4 times the heat resistance under the heating environment of C. this is,
This is because the nickel base plating 3 and the copper intermediate plating 4 are formed, so that phosphorus does not enter the finishing plating 5 in a heated environment.
実施例４
直径０．５ｍｍの真鍮線２上に、実施例１と同様に厚さ
１μｍのニッケルめつき３と、厚さ２μｍの銅めつき４
とを施し、更に実施例２と同様の厚さ１２μｍの半光沢
仕上げぬつき５を形成する。Example 4 On a brass wire 2 with a diameter of 0.5 mm, nickel plating 3 with a thickness of 1 μm and copper plating 4 with a thickness of 2 μm were applied in the same manner as in Example 1.
Furthermore, a semi-gloss finish 5 with a thickness of 12 μm similar to that in Example 2 was formed.
実施例４のような真鍮の金属素線２では、その上に錫１
ｍ−鉛合金又は銀の仕上げめっきを施すと、自然放置３
力月で亜鉛がこの仕上げめっきに侵入して、半田付は性
の劣化が始り、６力月で半田付は性不良で使用不可能と
なる。また、錫９５〜１００％である仕上げめっきを施
すならば、ウィスカーが発生し、この発生率は光沢めつ
きであるといっそう高くなる。前記の仕上げめっきに厚
さ２μｍの銅の下地めっき層を介在させても、自然放置
１２力月で半田付は性の劣化が始り、１８力月で半田付
は性不良で使用不可能なリード線が出始める。これに対
し、実施例４のリード線では、ニッケルの下地めつき３
及び銅の中間めつき４を形成するため、長期間自然放置
しても亜鉛が仕上げぬつき５に侵入せず、その半田付は
性は殆ど低下しない。In the brass metal wire 2 as in Example 4, tin 1 is placed on it.
m- If you apply lead alloy or silver finish plating, it will not be left unattended 3
Zinc invades this finishing plating after one month, and the soldering properties begin to deteriorate, and after six months, the soldering becomes unusable due to poor properties. Furthermore, if a finish plating of 95 to 100% tin is applied, whiskers will be generated, and this occurrence rate will be even higher in the case of bright plating. Even if a 2 μm thick copper base plating layer was interposed in the above-mentioned finishing plating, the solderability began to deteriorate after 12 months of natural storage, and after 18 months, the solderability became poor and unusable. Lead wires begin to appear. On the other hand, in the lead wire of Example 4, the nickel underplating was 3
Since intermediate plating 4 of copper is formed, zinc will not invade the finishing plating 5 even if left for a long time, and the soldering properties will hardly deteriorate.
実施例５
直径０．５ｍｍのニッケル線２上に、厚さ１μｍのニッ
ケル下地めつき３と、実施例１と同様に厚さ４μｍの銅
めつき４と、厚さ１２μｍの半光沢めっき（錫９７％、
鉛３％）の仕上げぬっき５とを形成する。Example 5 On a nickel wire 2 with a diameter of 0.5 mm, a 1 μm thick nickel underplating 3, a 4 μm thick copper plating 4 as in Example 1, and a 12 μm thick semi-bright plating (tin) 97%,
A finishing plating 5 of lead (3% lead) is formed.
このリード線について、加熱環境下でのＮｉ−３ｎ拡散
層の形成を調べるため、比較例１では同直径のニッケル
線に同厚さの錫めっきを形成し、比較例２では同直径の
ニッケル線に同厚さの半田めっき（錫９７％、船３％）
を形成し、比較例３では同直径のニッケル線に同厚さの
半田めっき（錫６８％、鉛３２％）を形成し、比較例４
では同直径のニッケル線に同厚さのニッケルめっきを施
してから、同厚さで同組成の半田めっきを形成し、比較
例５では同直径のニッケル線に同厚さの銅めっきを施し
てから、同厚さで同組成の半田めっきをそれぞれ形成す
る。次に１５０″Ｃに加熱後の密着性を測定し、その結
果を下記の第２表に示す。In order to investigate the formation of a Ni-3n diffusion layer in a heated environment for this lead wire, in Comparative Example 1, a nickel wire with the same diameter was plated with tin to the same thickness, and in Comparative Example 2, a nickel wire with the same diameter was plated with tin. solder plating with the same thickness (97% tin, 3% tin)
In Comparative Example 3, solder plating of the same thickness (68% tin, 32% lead) was formed on a nickel wire of the same diameter, and in Comparative Example 4
In Comparative Example 5, nickel wires of the same diameter were plated with nickel of the same thickness, and then solder plating of the same thickness and composition was formed. In Comparative Example 5, nickel wires of the same diameter were plated with copper of the same thickness. Then, solder plating with the same thickness and composition is formed. Next, the adhesion after heating to 150''C was measured, and the results are shown in Table 2 below.
第２表
注）Ｏ；密着良好 Δ；一部密着不良 ×；密着不良第
２表から、本発明のリード線における１５０゛Ｃに加熱
後の密着性は、比較例１〜５のリード線よりも優れてい
る。この理由は、本発明のリード線ではニッケルの下地
めつき３及び鋼の中間めつき４の存在により、仕上げぬ
つき５が錫を含んでいても、加熱環境下でＮｉ−３ｎ拡
散層を形成しないからである。Table 2 Note) O: Good adhesion Δ: Partially poor adhesion ×: Poor adhesion From Table 2, the adhesion of the lead wire of the present invention after heating to 150°C is better than that of the lead wires of Comparative Examples 1 to 5. is also excellent. The reason for this is that in the lead wire of the present invention, due to the presence of the nickel underplating 3 and the steel intermediate plating 4, even if the finishing plating 5 contains tin, a Ni-3n diffusion layer is formed in a heated environment. Because they don't.
（発明の効果）
本発明に係る電子部品用リード線は、銅めっきの中間層
の厚さが０．５〜５μｍであケ、ｃｐｓのような焼鈍し
を必要とせず、そのまま使用できるので製造コストが安
い。本発明の電子部品用リード線では、鉄素線に銅めっ
きをする場合に、ニッケルの下地めっきを形成するので
鉄錆が発生せず、リン青銅や真鍮などの金属素線上に仕
上げめっきを施す場合に、ニッケルの下地めっき及び銅
の中間めっきを形成するので良好な耐熱性を有し、長期
間自然放置しても半田付は性は殆ど低下しない。金属素
線がニッケル又はその合金であっても、ニッケルの下地
めっき及び銅の中間めっきの存在により、仕上げめっき
に錫を含んでいても密着不良が殆ど発生しない。これら
により、本発明のリード線は、電子部品製造の熱処理工
程にも十分耐えることができる。(Effects of the Invention) The lead wire for electronic components according to the present invention has a copper plating intermediate layer having a thickness of 0.5 to 5 μm, and does not require annealing like CPS, and can be used as is, so it can be manufactured. Cost is low. In the lead wire for electronic components of the present invention, when copper plating is applied to an iron wire, a nickel base plating is formed, so iron rust does not occur, and finish plating can be applied to metal wires such as phosphor bronze or brass. In this case, since it forms a nickel base plating and a copper intermediate plating, it has good heat resistance, and its solderability hardly deteriorates even if it is left for a long time naturally. Even if the metal wire is nickel or its alloy, due to the presence of the nickel base plating and the copper intermediate plating, poor adhesion will hardly occur even if the final plating contains tin. Due to these, the lead wire of the present invention can sufficiently withstand the heat treatment process of electronic component manufacturing.
また、本発明のリード線について、鋼鉄素線上にニッケ
ル、銅めっき及び半光沢仕上げめっきを順次形成してい
る場合、その半田濡れ速度が速く、電子部品の製造を迅
速に行える利点もある。半光沢又は光沢仕上げめっきは
、無光沢めっきと異なり、めっき表面硬度が３〜５Ｈｖ
程度向上する。Further, regarding the lead wire of the present invention, when nickel plating, copper plating, and semi-bright finish plating are sequentially formed on the steel wire, the solder wetting speed is fast, and there is an advantage that electronic components can be manufactured quickly. Unlike matte plating, semi-gloss or gloss finish plating has a plating surface hardness of 3 to 5 Hv.
The degree of improvement.
このため、半光沢又は光沢仕上げめっきでは、輸送時の
フレッティング、線と線との交差で生じる押え傷に対す
る耐久性が良化し、電子部品加工時のカス発生を防止す
るとともに、リード線の滑り性も向上する。For this reason, semi-gloss or gloss finish plating has improved durability against fretting during transportation and pressure scratches caused by crossing lines, prevents the generation of scum during electronic component processing, and prevents lead wires from slipping. Sexuality also improves.
第１図は本発明に係る電子部品用リード線の拡大断面図
、第２図は本発明のリード線と、同厚さの半光沢半田め
っきを施した同直径のＣＰ線及び軟銅線における半田濡
れ速度を測定するために、加速劣化試験後のゼロクロス
タイムを示しているグラフである。
１・・・電子部品用リード線、２・・・金属素線、３・
・・下地めっき、４・・・中間めっき、５・・・仕上げ
めっき。Fig. 1 is an enlarged cross-sectional view of a lead wire for electronic components according to the present invention, and Fig. 2 is an enlarged sectional view of the lead wire of the present invention, and solder in a CP wire and annealed copper wire of the same diameter and coated with semi-bright solder plating of the same thickness. Figure 3 is a graph showing zero cross time after accelerated aging tests to measure wetting rate. 1... Lead wire for electronic components, 2... Metal wire, 3...
... Base plating, 4... Intermediate plating, 5... Finish plating.
Claims (1)
、銅の中間めっきと、錫、錫−鉛合金又は銀の仕上げめ
っきとを順次形成している電子部品用リード線。 ２、金属素線は鉄又はその合金、銅又はその合金、ニッ
ケル又はその合金であり、ニッケル０．５〜２μｍの下
地めっきと、銅０．５〜５μｍの中間めっきと、錫、錫
−鉛合金又は銀１〜５０μｍの半光沢仕上げめっき又は
１〜５μｍの光沢仕上げめっきとを順次形成している電
子部品用リード線。[Claims] 1. A lead wire for electronic components in which a nickel base plating, a copper intermediate plating, and a final plating of tin, tin-lead alloy, or silver are sequentially formed on a metal wire of a corresponding size. . 2. The metal wire is iron or its alloy, copper or its alloy, nickel or its alloy, and has a base plating of nickel of 0.5 to 2 μm, an intermediate plating of copper of 0.5 to 5 μm, and tin, tin-lead. A lead wire for electronic parts in which alloy or silver is sequentially formed with 1-50 μm semi-gloss finish plating or 1-5 μm gloss finish plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28986890A JPH04165096A (en) | 1990-10-26 | 1990-10-26 | Lead wire for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28986890A JPH04165096A (en) | 1990-10-26 | 1990-10-26 | Lead wire for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04165096A true JPH04165096A (en) | 1992-06-10 |
Family
ID=17748806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28986890A Pending JPH04165096A (en) | 1990-10-26 | 1990-10-26 | Lead wire for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04165096A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020079100A (en) * | 2001-04-13 | 2002-10-19 | 삼아트론 주식회사 | Lead wire for electronic part |
| WO2002103086A1 (en) * | 2001-06-18 | 2002-12-27 | Nippon Shindo Co., Ltd. | Connector wire, and manufacturing method thereof |
| JP2003171790A (en) * | 2001-01-19 | 2003-06-20 | Furukawa Electric Co Ltd:The | Plating material, production method therefor, and electrical and electronic part obtained by using the same |
| JP2004292944A (en) * | 2003-03-26 | 2004-10-21 | Takahide Ono | Metallic material for electronic component prevented from generation of whisker |
| JP2005251762A (en) * | 1995-12-18 | 2005-09-15 | Olin Corp | Tin coated electrical connector |
| JP2007177330A (en) * | 2001-01-19 | 2007-07-12 | Furukawa Electric Co Ltd:The | Plated material, method of producing the same, and electrical/electronic parts using the same |
| JP2007204854A (en) * | 2001-01-19 | 2007-08-16 | Furukawa Electric Co Ltd:The | Plated material, method of producing the same, and electrical/electronic part using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS591666A (en) * | 1982-06-28 | 1984-01-07 | Furukawa Electric Co Ltd:The | Continuous plating method with tin or tin alloy |
-
1990
- 1990-10-26 JP JP28986890A patent/JPH04165096A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS591666A (en) * | 1982-06-28 | 1984-01-07 | Furukawa Electric Co Ltd:The | Continuous plating method with tin or tin alloy |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251762A (en) * | 1995-12-18 | 2005-09-15 | Olin Corp | Tin coated electrical connector |
| JP2003171790A (en) * | 2001-01-19 | 2003-06-20 | Furukawa Electric Co Ltd:The | Plating material, production method therefor, and electrical and electronic part obtained by using the same |
| JP2007177330A (en) * | 2001-01-19 | 2007-07-12 | Furukawa Electric Co Ltd:The | Plated material, method of producing the same, and electrical/electronic parts using the same |
| JP2007204854A (en) * | 2001-01-19 | 2007-08-16 | Furukawa Electric Co Ltd:The | Plated material, method of producing the same, and electrical/electronic part using the same |
| JP4514012B2 (en) * | 2001-01-19 | 2010-07-28 | 古河電気工業株式会社 | Plating material, manufacturing method thereof, and electric / electronic parts using the same |
| KR20020079100A (en) * | 2001-04-13 | 2002-10-19 | 삼아트론 주식회사 | Lead wire for electronic part |
| WO2002103086A1 (en) * | 2001-06-18 | 2002-12-27 | Nippon Shindo Co., Ltd. | Connector wire, and manufacturing method thereof |
| JP2004292944A (en) * | 2003-03-26 | 2004-10-21 | Takahide Ono | Metallic material for electronic component prevented from generation of whisker |
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