JPH0415866U - - Google Patents
Info
- Publication number
- JPH0415866U JPH0415866U JP5796990U JP5796990U JPH0415866U JP H0415866 U JPH0415866 U JP H0415866U JP 5796990 U JP5796990 U JP 5796990U JP 5796990 U JP5796990 U JP 5796990U JP H0415866 U JPH0415866 U JP H0415866U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- wiring board
- printed wiring
- resist layer
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の実施例の断面図、第２図は従
来の印刷配線板の断面図を示す。 １……金属芯、３……回路、４……はんだレジ
スト層、５……外形加工部分、６……金属芯印刷
配線板。
来の印刷配線板の断面図を示す。 １……金属芯、３……回路、４……はんだレジ
スト層、５……外形加工部分、６……金属芯印刷
配線板。
Claims (1)
- 金属を芯とする基板に回路を形成し、はんだレ
ジスト層を設けた金属芯印刷配線板において、は
んだレジスト層を外形加工部分の内側まで設ける
ことを特徴とする金属芯印刷配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5796990U JPH0415866U (ja) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5796990U JPH0415866U (ja) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415866U true JPH0415866U (ja) | 1992-02-07 |
Family
ID=31583162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5796990U Pending JPH0415866U (ja) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415866U (ja) |
-
1990
- 1990-05-31 JP JP5796990U patent/JPH0415866U/ja active Pending