JPH0415822U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示し、ａは正面断面
図、ｂは平面図であり、第２図はその等価回路図
である。第３図は従来のコンデンサ基板の正面断
面図、第４図はその等価回路図である。 １０……誘電体基板、１１，１２，１３，１６
，１７……電極、１４……スルーホール。 FIG. 1 shows an embodiment of the present invention, in which a is a front sectional view, b is a plan view, and FIG. 2 is an equivalent circuit diagram thereof. FIG. 3 is a front sectional view of a conventional capacitor board, and FIG. 4 is an equivalent circuit diagram thereof. 10...Dielectric substrate, 11, 12, 13, 16
, 17...electrode, 14...through hole.

Claims (1)

【実用新案登録請求の範囲】 (1) 誘電体基板の少なくとも一表面に複数の電
極を具えるとともに、その裏面にもそれらの電極
に対向する電極を具えて、複数のコンデンサが配
置されたコンデンサ基板において、表面の電極間
に、その表面の電極と絶縁され、裏面の電極と導
通された電極を具えたことを特徴とするコンデン
サ基板。 (2) 表面の電極間の電極が、誘電体基板のスル
ーホールを介して裏面の電極と導通された請求項
第１項記載のコンデンサ基板。 (3) 表面の電極間の電極が、誘電体基板の側面
に形成された導体を介して裏面の電極と導通され
た請求項第１項記載のコンデンサ基板。[Claims for Utility Model Registration] (1) A capacitor having a plurality of electrodes on at least one surface of a dielectric substrate, and an electrode facing the electrodes on the back surface thereof, in which a plurality of capacitors are arranged. What is claimed is: 1. A capacitor substrate comprising an electrode between electrodes on the front surface, the electrode being insulated from the electrode on the front surface and electrically connected to the electrode on the back surface. (2) The capacitor substrate according to claim 1, wherein the electrodes between the electrodes on the front surface are electrically connected to the electrodes on the back surface via through holes in the dielectric substrate. (3) The capacitor substrate according to claim 1, wherein the electrodes between the electrodes on the front surface are electrically connected to the electrodes on the back surface via a conductor formed on the side surface of the dielectric substrate.