JPH04155884A - Electrodeposition type uv resist forming method and device - Google Patents
Electrodeposition type uv resist forming method and deviceInfo
- Publication number
- JPH04155884A JPH04155884A JP27898190A JP27898190A JPH04155884A JP H04155884 A JPH04155884 A JP H04155884A JP 27898190 A JP27898190 A JP 27898190A JP 27898190 A JP27898190 A JP 27898190A JP H04155884 A JPH04155884 A JP H04155884A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- resist
- electrodeposition
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 22
- 230000005611 electricity Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 239000011889 copper foil Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、高密度プリント配線板に係り、特に、回路形
成工程における電着型ＵＶレジスト形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a high-density printed wiring board, and particularly to a method for forming an electrodeposition type UV resist in a circuit forming process.
［従来の技術］
従来技術は、特開昭６３−３２９９４に記載のように、
基板を一枚ずつ搬送帯に吊下保持させて、電着液槽に基
板を浸漬させて通電を行ない電着型ＵＶレジスト形成を
行なっている。[Prior art] As described in Japanese Patent Application Laid-Open No. 63-32994, the conventional technology is
The substrates are held suspended one by one on a conveyor belt, and the substrates are immersed in an electrodeposition liquid tank and energized to form an electrodeposition type UV resist.
［発明が解決しようとする課題］
上記従来技術は、電着液槽の中に基板を浸漬するもので
あり、Ｗｉ送方式がデイツプ方式となるため、基板着脱
の自動化および量産化が難しいという問題があった。[Problems to be Solved by the Invention] The above-mentioned conventional technology involves immersing the substrate in an electrodeposition liquid tank, and the Wi feeding method is a dip method, so there is a problem that it is difficult to automate the attachment and detachment of the substrate and mass-produce it. was there.
本発明の目的は、基板を水平搬送したまま電着型ＵＶレ
ジストが形成可能なため、電着型ＵＶレジスト形成ライ
ンの自動化・量産化が容易に行なえることにある。An object of the present invention is to facilitate automation and mass production of an electrodeposition type UV resist forming line, since an electrodeposition type UV resist can be formed while the substrate is being transported horizontally.
［課題を解決するための手段］
上記目的を達成するために、電着液を含んだローラを上
下に配し、プリント配線板に回転接触させることにより
、プリント配線板に水平搬送を可能にしたものである。[Means for solving the problem] In order to achieve the above objective, rollers containing electrodeposition liquid are arranged above and below and brought into rotational contact with the printed wiring board, thereby making it possible to horizontally transport the printed wiring board. It is something.
また、プリント配線板の両端部にレジスト未着部分を設
け、その部分にガイドローラを接触させてプリント配線
板に通電を行うことにより、搬送時の通電を可能にした
ものである。In addition, by providing resist-unattached portions at both ends of the printed wiring board and energizing the printed wiring board by bringing guide rollers into contact with these portions, electricity can be applied during transportation.
［作用コ
本発明は、プリント配線板に電着液を含んだローラを接
触させて、プリント配線板とローラ軸との間に電圧を印
加することにより、水平搬送による電着型ＵＶレジスト
形成が可能となる。[Function] The present invention enables electrodeposition type UV resist to be formed by horizontal conveyance by bringing a roller containing an electrodeposition liquid into contact with a printed wiring board and applying a voltage between the printed wiring board and the roller shaft. It becomes possible.
また、前記プリント配線板にレジスト未着部を設け、そ
の部分にガイドローラを接触させて通電することにより
、搬送時の通電を可能にすることができる。Further, by providing a resist-unattached portion on the printed wiring board and applying electricity by bringing a guide roller into contact with the portion, it is possible to conduct electricity during transportation.
［実施例コ
以下１本発明におけるプリント配線板の電着型ＵＶレジ
スト形成装置の構成等を図に示す実施例によって詳細に
説明する。[Embodiment 1] The structure of an electrodeposition type UV resist forming apparatus for a printed wiring board according to the present invention will be explained in detail by referring to an embodiment shown in the drawings.
第１図および第２図にプリント配Ｉ！板の電着型ＵＶレ
ジスト形形成誼の斜視図および側面図を示す。Print layout on Figures 1 and 2! Figure 3 shows a perspective view and a side view of the electrodeposited UV resist molding of the plate.
上下ローラ３，３′は、ノズル４，４′から供給された
電着液を十分に吸収できるスポンジ状になっており、ま
た、ローラの＠２１２′は電着時の極板になるため、導
電性の材質のものを用いる。The upper and lower rollers 3, 3' have a sponge-like shape that can sufficiently absorb the electrodeposition liquid supplied from the nozzles 4, 4', and the rollers @212' serve as electrode plates during electrodeposition. Use a conductive material.
また、ガイトローラ５，５′についても、プリント配線
板に通電を行なうため、導電性の材質のものを用いる。Further, the guide rollers 5 and 5' are also made of conductive material in order to supply electricity to the printed wiring board.
このローラ軸２，２′とガイドローラ５，５′に電源部
６より電圧を印加し、プリント配線板１に通電を行なう
、このガイトローラ５゜５′は上下に一組となっており
、ローラ３，３′の前後左右に四組配し、プリント配線
板１の表裏鋼箔面上に左右の端部に設けられたレジスト
未着部１′に回転接触し、配線板に通電される。ローラ
３，３′はプリント配線板１の報より小さくなっている
ため、プリント配線板の左右の電着液が付かない部分（
レジスト未着部）１′が形成さ九る。Voltage is applied from the power source 6 to the roller shafts 2, 2' and the guide rollers 5, 5' to energize the printed wiring board 1. The guide rollers 5, 5' are arranged in upper and lower pairs. 3, 3' are arranged in four sets on the front, rear, left and right sides of the printed wiring board 1, and are brought into rotational contact with the resist-unattached portions 1' provided at the left and right ends on the front and back steel foil surfaces of the printed wiring board 1, thereby energizing the wiring board. Since the rollers 3 and 3' are smaller than those on the printed wiring board 1, the parts on the left and right sides of the printed wiring board that are not covered by the electrodeposition liquid (
A resist-unattached area) 1' is formed.
プリント配線板１が電着液を含んだローラ３゜３′部の
間を通過する際、ガイドローラ５，５′とローラ軸２，
２′の間に電圧が印加される。二の時ガイドローラ５，
５′はプリント配線板１のレジスト末肩部１′と接触し
ているため、ローラ軸２，２′とプリント配線板１の表
裏鋼箔面との間に電圧が印加されることになる。ローラ
軸２゜２′とプリント配線板１の表裏鋼箔面との間に電
着液がしみこんだローラ３，３′が接触しており。When the printed wiring board 1 passes between the roller 3°3' portion containing the electrodeposition liquid, the guide rollers 5, 5' and the roller shaft 2,
A voltage is applied between 2'. Second time guide roller 5,
5' is in contact with the resist end shoulder 1' of the printed wiring board 1, so that a voltage is applied between the roller shafts 2, 2' and the front and back steel foil surfaces of the printed wiring board 1. Rollers 3, 3' soaked with electrodeposition liquid are in contact between the roller shaft 2° 2' and the front and back steel foil surfaces of the printed wiring board 1.
この電着液を通して通電されプリント配線板の表裏鋼箔
面上に電着型ＵＶレジスト７が形成される。Electricity is applied through this electrodeposition liquid to form an electrodeposition type UV resist 7 on the front and back steel foil surfaces of the printed wiring board.
次に、第３図にローラ３の新面図を示す、電着液供給ノ
ズル４によりローラ軸２の内部９に電着液１１が補給さ
れ、ローラ軸にある無数の穴１０より、電着液１１がロ
ーラ３に吸収される。この時、ローラ３およびローラ軸
２は駆動用モータ１２により回転しているため、ローラ
３にむらなく電着液を供給することができる。Next, the electrodeposition liquid 11 is supplied to the inside 9 of the roller shaft 2 by the electrodeposition liquid supply nozzle 4, which is shown in a new view of the roller 3 in FIG. Liquid 11 is absorbed by roller 3. At this time, since the roller 3 and the roller shaft 2 are rotated by the drive motor 12, the electrodeposition liquid can be evenly supplied to the roller 3.
第４図は、従来技術での電着型ＵＶレジスト形成方法を
示す。電着液槽１４に入った電着液１１中に極板８を配
し、プリント配線板１を保持具１３により保持し電着液
中に浸漬する。電源部６よりＩＥＦｉ８および保持具［
３に電圧を印加する。保持具１３により通電されている
プリント配ＩＩ阪１と電喝８との間に電流が流れ電着型
ＵＶレジスト７が形成される。FIG. 4 shows a conventional method of forming an electrodeposition type UV resist. The electrode plate 8 is placed in the electrodeposition liquid 11 in the electrodeposition liquid tank 14, and the printed wiring board 1 is held by the holder 13 and immersed in the electrodeposition liquid. IEFi8 and the holder [
Apply voltage to 3. A current flows between the printed circuit board 1 and the electric wire 8, which are energized by the holder 13, and an electrodeposition type UV resist 7 is formed.
本発明の装置において、電［ｉ８はローラ軸２に通電用
保持具１３にはガイドローラ５、電着液槽１４はローラ
３にそれぞれ対応している。In the apparatus of the present invention, the electric current i8 corresponds to the roller shaft 2, the current-carrying holder 13 corresponds to the guide roller 5, and the electrodeposition liquid tank 14 corresponds to the roller 3, respectively.
［発明の効果］
本発明によ九ば、プリント配ａ板を水平搬送したまま電
着型ＵＶレジスト形成が行なえるので、電着前処理およ
び後処理への連続化や自動化を容易に行なうことができ
る。[Effects of the Invention] According to the present invention, since electrodeposition type UV resist formation can be performed while the printed circuit board is being conveyed horizontally, continuity and automation of electrodeposition pre-treatment and post-treatment can be easily performed. I can do it.
第１図は、本発明の電着型ＵＶレジスト形成装置の一実
施例の斜視図、第２図は第１図の側面図。
第３図は第１図のローラの新面図、第４図は、従来技術
のプリント配線板の電着型Ｕｖレジスト形成装置を示す
説明図である。
符号の説明
１・・・プリント配線板、２・・・ローラ軸、３・・ロ
ーラ、４・・・電着液補給ノズル、５・・・ガイドロー
ラ、６・・・電源、７・・・電着型ＵＶレジスト、８・
・極板、９・・・ローラ軸内部、１０・・・電着液供給
穴、１１・・・電着液、１２・・・駆動用モータ、１３
・・・通電用保持具、１４・・・電着槽。
一′−一
一９三
一一、／FIG. 1 is a perspective view of an embodiment of the electrodeposition type UV resist forming apparatus of the present invention, and FIG. 2 is a side view of FIG. 1. FIG. 3 is a new view of the roller shown in FIG. 1, and FIG. 4 is an explanatory diagram showing a conventional electrodeposition type UV resist forming apparatus for a printed wiring board. Explanation of symbols 1...Printed wiring board, 2...Roller shaft, 3...Roller, 4...Electrodeposition liquid replenishment nozzle, 5...Guide roller, 6...Power supply, 7... Electrodeposition type UV resist, 8.
- Electrode plate, 9... Inside of roller shaft, 10... Electrodeposition liquid supply hole, 11... Electrodeposition liquid, 12... Drive motor, 13
... Holder for energizing, 14... Electrodeposition tank. 1'-119311, /
Claims (3)
いて、前記プリント配線板に対して電着液を含んだロー
ラを接触回転させ電着液を前記プリント配線板の表面に
しみ出させ、ローラ軸と前記プリント配線板の間に通電
を行ない、前記電着型ＵＶレジストを前記プリント配線
板の表面に形成することを特徴とする電着型ＵＶレジス
ト形成方法。1. In a method for forming an electrodeposited UV resist on a printed wiring board, a roller containing an electrodeposition liquid is rotated in contact with the printed wiring board to cause the electrodeposition liquid to seep out onto the surface of the printed wiring board, and the roller shaft and the A method for forming an electrodeposition type UV resist, characterized in that the electrodeposition type UV resist is formed on the surface of the printed wiring board by applying electricity between the printed wiring boards.
未着部を設け、その部分に導電性のガイドローラを接触
させ、プリント配線板に通電する通電方式。2. 2. The energization method according to claim 1, wherein the printed wiring board is provided with a non-resist part, a conductive guide roller is brought into contact with the part, and the printed wiring board is energized.
Ｖレジスト形成装置。3. Electrodeposition type U which also has the mechanism part according to claim 1 or 2.
V resist forming equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27898190A JPH04155884A (en) | 1990-10-19 | 1990-10-19 | Electrodeposition type uv resist forming method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27898190A JPH04155884A (en) | 1990-10-19 | 1990-10-19 | Electrodeposition type uv resist forming method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04155884A true JPH04155884A (en) | 1992-05-28 |
Family
ID=17604764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27898190A Pending JPH04155884A (en) | 1990-10-19 | 1990-10-19 | Electrodeposition type uv resist forming method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04155884A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0633716A1 (en) * | 1993-01-28 | 1995-01-11 | Nippon Paint Co., Ltd. | Method for drying resist film formed by electrodeposition |
| US5674659A (en) * | 1993-01-28 | 1997-10-07 | Nippon Paint Co., Ltd. | Electrodeposition resist film drying method |
-
1990
- 1990-10-19 JP JP27898190A patent/JPH04155884A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0633716A1 (en) * | 1993-01-28 | 1995-01-11 | Nippon Paint Co., Ltd. | Method for drying resist film formed by electrodeposition |
| EP0633716A4 (en) * | 1993-01-28 | 1996-02-28 | Nippon Paint Co Ltd | Method for drying resist film formed by electrodeposition. |
| US5674659A (en) * | 1993-01-28 | 1997-10-07 | Nippon Paint Co., Ltd. | Electrodeposition resist film drying method |
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