JPH04153267A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPH04153267A JPH04153267A JP27724290A JP27724290A JPH04153267A JP H04153267 A JPH04153267 A JP H04153267A JP 27724290 A JP27724290 A JP 27724290A JP 27724290 A JP27724290 A JP 27724290A JP H04153267 A JPH04153267 A JP H04153267A
- Authority
- JP
- Japan
- Prior art keywords
- polymer particles
- weight
- thermosetting resin
- hollow polymer
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 29
- 239000011342 resin composition Substances 0.000 title claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 64
- 229920000642 polymer Polymers 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 abstract description 41
- 229920006037 cross link polymer Polymers 0.000 abstract description 8
- 239000005011 phenolic resin Substances 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 7
- 229920000647 polyepoxide Polymers 0.000 abstract description 7
- 238000004132 cross linking Methods 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000013585 weight reducing agent Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 229920003146 methacrylic ester copolymer Polymers 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- -1 2-ethyl Chemical group 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- 239000004604 Blowing Agent Substances 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical class CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、架橋中空ポリマー粒子を配合してなる軽量か
つ機械的強度に優れた熱硬化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a thermosetting resin composition that is lightweight and has excellent mechanical strength, which is made by blending crosslinked hollow polymer particles.
[従来の技術]
一般に熱硬化性樹脂、中でもフェノール樹脂、エポキシ
樹脂は、古くからその優れた接着性、絶縁性、耐熱性か
ら各種成形材用途、接着剤用途に広く用いられてきた。[Prior Art] Generally, thermosetting resins, especially phenolic resins and epoxy resins, have been widely used for various molding materials and adhesives since ancient times due to their excellent adhesive properties, insulation properties, and heat resistance.
近年の急激な自動車産業、電気・電子産業の成長下にお
いても、その特性を生かして各種部品用途を中心にその
需要を伸ばしている。Even with the rapid growth of the automobile industry and electrical/electronic industry in recent years, demand for it is increasing mainly for use in various parts by taking advantage of its characteristics.
最近、注目されている1つに軽量化かある。例えは、こ
れらの成形品を多用する自動車において、自動車の性能
、燃費の向上のために自動車の軽量化か大きな技術課題
としてクローズアップされてきている。また、その他の
用途においても、運搬のしやすさ、性能の向上などから
軽量化が注目されている。One of the things that has been attracting attention recently is weight reduction. For example, in automobiles that use many of these molded products, reducing the weight of automobiles in order to improve their performance and fuel efficiency has become a major technical issue. In addition, weight reduction is attracting attention in other applications as well, for reasons such as ease of transportation and improved performance.
従来の成形品の軽量化の方法として、下記が挙げられる
。Conventional methods for reducing the weight of molded products include the following.
(1)成形品の肉厚を薄くし、過剰品質にしない方法。(1) A method to reduce the thickness of the molded product and avoid excessive quality.
(2)発泡剤含有成形材料を用いることで成形品内部を
発泡させる方法。(2) A method of foaming the inside of a molded product by using a molding material containing a foaming agent.
(3)微細な中空ガラス球含有成形材料を用いて、成形
品に中空ガラス球を含有させる方法。(3) A method of incorporating hollow glass spheres into a molded product using a molding material containing fine hollow glass spheres.
方法(1)は最も容易に実施できる方法であり、すでに
実施され、限界に達している。Method (1) is the easiest method to implement and has already been implemented to its limits.
方法(2)は軽量化に最も効果のある方法であるが、発
泡させることで成形品の機械的強度を著しく低下し、機
械的強度を必要とする成形品の和量化の方法として全〈
実施できない。Method (2) is the most effective method for weight reduction, but foaming significantly reduces the mechanical strength of the molded product, and it is not recommended as a method for weight reduction of molded products that require mechanical strength.
It cannot be implemented.
方法(3)は機械的強度が著しく低下することと、また
中空ガラス球が混合あるいは成形加エキにこわれ、軽量
化が期待できない。In method (3), the mechanical strength is significantly reduced and the hollow glass bulbs are broken by the mixing or molding exhaust, so that weight reduction cannot be expected.
従って、従来の技術では、熱硬化性樹脂の軽量化は機械
的強度が著しく低下するという大きな部属があった。Therefore, in the conventional technology, reducing the weight of thermosetting resins has had a major effect in that the mechanical strength is significantly reduced.
[発明が解決しようとする課題]
軽量かつ機械的強度の優れた熱硬化性樹脂について種々
研究を重ねた結果、架橋中空ポリマー粒子を含有させた
熱硬化性樹脂組成物は従来の方法に比べ、機械的強度を
低下させずに、あるいは低下を最少限におさえて軽量化
が可能であることを見い出し、本発明に到達した。[Problems to be Solved by the Invention] As a result of various studies on thermosetting resins that are lightweight and have excellent mechanical strength, it has been found that thermosetting resin compositions containing crosslinked hollow polymer particles have lower performance compared to conventional methods. The present invention was achieved by discovering that it is possible to reduce the weight without reducing the mechanical strength or minimizing the decrease.
し課題を解決するための手段]
本発明は、熱硬化性樹脂10〜99重量%および架橋中
空ポリマー粒子1〜90重量%からなることを特徴とす
る熱硬化性樹脂組成物を提供するものである。Means for Solving the Problem] The present invention provides a thermosetting resin composition characterized by comprising 10 to 99% by weight of a thermosetting resin and 1 to 90% by weight of crosslinked hollow polymer particles. be.
以下、本発明について詳細に述べる。The present invention will be described in detail below.
本発明の熱硬化性樹脂としては、フェノール樹脂、エポ
キシ樹脂、メラミン樹脂、不飽和ポリエステル樹脂、ア
ルキド樹脂などが挙げられるが、混合作業の容易性から
フェノール樹脂、エポキシ樹脂、不飽和ポリエステル樹
脂が好ましく、さらに好ましくはフェノール樹脂、エポ
キシ樹脂が挙げられる。Examples of the thermosetting resin of the present invention include phenol resins, epoxy resins, melamine resins, unsaturated polyester resins, and alkyd resins, but phenol resins, epoxy resins, and unsaturated polyester resins are preferred for ease of mixing. More preferred are phenol resins and epoxy resins.
本発明で使用する架橋中空ポリマー粒子は、種々の方法
で製造することができる。すなわち、(I)架橋ポリマ
ー粒子中に発泡剤を含有させ、後にこの発泡剤を発泡さ
せる方法。The crosslinked hollow polymer particles used in the present invention can be produced in a variety of ways. That is, (I) a method in which a blowing agent is contained in crosslinked polymer particles and the blowing agent is then foamed.
(n)架橋ポリマーにブタンなどの揮発性物質を封入し
、後にこの揮発性物質をガス化膨潤させる方法。(n) A method in which a volatile substance such as butane is encapsulated in a crosslinked polymer, and the volatile substance is then gasified and swollen.
(III)架橋ポリマーを溶融させ、これに空気などの
気体ジェットを吹付け、気泡を封入する方法。(III) A method in which a crosslinked polymer is melted and a jet of gas such as air is blown thereto to seal in air bubbles.
(TV)架橋ポリマー粒子の内部にアルカリ膨潤性の物
質を浸透させて、アルカリ膨潤性の物質を膨潤させる方
法。(TV) A method of infiltrating an alkali-swellable substance into the inside of crosslinked polymer particles to swell the alkali-swellable substance.
(V)w10/w型モノマーエマルジョンを作成し、重
合を行なう方法。(V) A method of preparing a w10/w type monomer emulsion and conducting polymerization.
(VI)不飽和ポリエステル溶液中に顔料を懸濁させた
溶液中でモノマーを重合する方法。(VI) A method in which monomers are polymerized in a solution in which a pigment is suspended in an unsaturated polyester solution.
(■)架橋ポリマー粒子をシードとして、相溶性の異な
るポリマーをそのシード上に重合、架橋する二段階架橋
方法。(■) A two-step crosslinking method in which crosslinked polymer particles are used as seeds and polymers with different compatibility are polymerized and crosslinked onto the seeds.
(■)ポリマーの重合収縮により製造する方法(IX)
架橋ポリマー粒子を噴霧乾燥させる方法3などがあり、
好ましい方法としては■であり、■の方法における最も
好ましい態様としては、架橋性モノマー(a)1〜50
重量%、不飽和カルボン酸1〜40重量%および/また
はその他の親木性モノマー5〜99重量%からなる親水
性モノマー(b)(以下、「親水性モノマー(b)」と
いう)1〜99重量%、および前記架橋性モノマー(a
)あるいは親水性モノマー(b)と共重合が可能なその
他の重合性モノマー(C)(以下、「他の重合性モノマ
ー(C)」という)0〜85重量%よりなる重合性モノ
マー成分100重量部を、重合性モノマー成分のポリマ
ーとは異なる組成の異種ポリマー1〜100重量部の存
在下において水中に分散し、次いで前記重合性モノマー
成分を重合させることを特徴とする製造方法が挙げられ
る(特開昭61−127336号公報)。さらに、該架
橋中空ポリマー粒子をシーポリマーとして、架橋性モノ
マー、親水性モノマーおよび重合性モノマーから選ばれ
た少なくとも一種をシード重合することにより、製造す
ることもできる(特開平2−140271号公報、同2
−140272号公報)。(■) Method of manufacturing by polymerization shrinkage of polymer (IX)
Method 3 includes spray-drying crosslinked polymer particles.
A preferred method is method (2), and the most preferred embodiment of method (2) is a method in which crosslinking monomer (a) 1 to 50
Hydrophilic monomer (b) (hereinafter referred to as "hydrophilic monomer (b)") consisting of 1 to 40% by weight of unsaturated carboxylic acid and/or 5 to 99% by weight of other wood-philic monomers (hereinafter referred to as "hydrophilic monomer (b)") 1 to 99% by weight % by weight, and the crosslinking monomer (a
) or other polymerizable monomer (C) that can be copolymerized with the hydrophilic monomer (b) (hereinafter referred to as "other polymerizable monomer (C)") 100 weight% of a polymerizable monomer component consisting of 0 to 85% by weight 1 part by weight of a different polymer having a composition different from that of the polymer of the polymerizable monomer component in water, and then polymerizing the polymerizable monomer component. (Japanese Unexamined Patent Publication No. 61-127336). Furthermore, the crosslinked hollow polymer particles can be produced as a sea polymer by seed polymerizing at least one selected from crosslinkable monomers, hydrophilic monomers, and polymerizable monomers (Japanese Unexamined Patent Publication No. 2-140271, Same 2
-140272).
前記、架橋性モノマー(a)としては、ジビニルベンゼ
ン、エチレングリコールジメタクリレート、1.3−ブ
チレングリコールジメタクリレート、トリメチロールプ
ロパントリメタクリレート、アリルメタクリレートなど
のジビニル系モノマーあるいはトリビニル系モノマーを
例示することができ、特にジビニルベンゼン、エチレン
クリコールジメタクリレートおよびトリメチロールプロ
パントリメタクリレートが好ましい。Examples of the crosslinkable monomer (a) include divinyl-based monomers or trivinyl-based monomers such as divinylbenzene, ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and allyl methacrylate. Divinylbenzene, ethylene glycol dimethacrylate and trimethylolpropane trimethacrylate are particularly preferred.
前記、親木性モノマー(b)としては、ビニルピリジン
、グリシジルアクリレート、グリシジルメタクリレート
、メチルアクリレート、メチルメタクリレート、アクリ
ロニトリル、アクリルアミド、メタクリルアミド、N−
メチロールアクリルアミド、N−メチロールメタクリル
アミド、アクリル酸、メタクリル酸、イタコン酸、フマ
ル酸、スチレンスルホン酸ナトリウム、酢酸ビニル、ジ
メチルアミノエチルメタクリレート、ジエチルアミノエ
チルメタクリレート、2−ヒドロキシエチルメタクリレ
ート、2−ヒドロキシプロピルメタクリレートなどのビ
ニル系モノマーを例示することができる。このうちメタ
クリル酸、イタコン酸、アクリル酸が好ましい。As the wood-philic monomer (b), vinylpyridine, glycidyl acrylate, glycidyl methacrylate, methyl acrylate, methyl methacrylate, acrylonitrile, acrylamide, methacrylamide, N-
Methylol acrylamide, N-methylolmethacrylamide, acrylic acid, methacrylic acid, itaconic acid, fumaric acid, sodium styrene sulfonate, vinyl acetate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, etc. Examples include vinyl monomers. Among these, methacrylic acid, itaconic acid, and acrylic acid are preferred.
前記、他の重合性モノマー(C)としては、ラジカル重
合性を有するものであれば特に制限されず、スチレン、
α−メチルスチレン、p−メチルスチレン、ハロゲン化
スチレンなどの芳香族ビニル単量体、プロピオン酸ビニ
ルなどのビニルエステル類、エチルメタクリレート、ブ
チルアクリレート、ブチルメタクリレート、2−エチル
へキシルアクリレート、2−エチルへキシルメタクリレ
ート、ラウリルアクリレート、ラウリルメタクリレート
などのエチレン性不飽和カルボン酸アルキルエステル、
フェニルマレイミド、シクロヘキシルマレイミドなどの
マレイイミド化合物、ブタジェン、イソプレンなどの共
役ジオレフィンなどを例示することができ、特にスチレ
ンか好ましくへ〇異種ポリマーは、少な(とも上記重合
性モノマー(a)〜(C)が重合されて得られるポリマ
ーとは、異なる種類あるいは組成のポリマーであること
、および重合性モノマーに溶解しやすいものであること
が必要とされる。The other polymerizable monomer (C) is not particularly limited as long as it has radical polymerizability, and includes styrene,
Aromatic vinyl monomers such as α-methylstyrene, p-methylstyrene, halogenated styrene, vinyl esters such as vinyl propionate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, 2-ethyl ethylenically unsaturated carboxylic acid alkyl esters such as hexyl methacrylate, lauryl acrylate, and lauryl methacrylate;
Examples include maleimide compounds such as phenylmaleimide and cyclohexylmaleimide, conjugated diolefins such as butadiene and isoprene, and styrene is particularly preferred. The polymer obtained by polymerizing is required to be of a different type or composition and to be easily soluble in the polymerizable monomer.
このような異種ポリマーとしては、具体的にはポリスチ
レン、カルボキシ変性ポリスチレン、カルボキシ変性ス
チレン−ブタジェンコポリマースチレン−ブタジェンコ
ポリマー、スチレンアクリルエステルコポリマー、スチ
レンメタクリルエステルコポリマー、アクリルエステル
コポリマーメタクリルエステルコポリマー、カルボキシ
変性スチレンアクリルエステルコポリマー、カルボキシ
変性スチレンメタクリルエステルコポリマーカルボキシ
変性アクリルエステルコポリマー、カルホキシ変性メタ
クリルエステルコポリマーなどが例示される。これらの
うち、特にポリスチレンまたはスチレン成分を50重量
%以上含むスチレンコポリマーが好ましい。Examples of such different polymers include polystyrene, carboxy-modified polystyrene, carboxy-modified styrene-butadiene copolymer, styrene-butadiene copolymer, styrene acrylic ester copolymer, styrene methacrylic ester copolymer, acrylic ester copolymer, methacrylic ester copolymer, and carboxy-modified styrene-butadiene copolymer. Examples include styrene acrylic ester copolymer, carboxy-modified styrene methacrylic ester copolymer, carboxy-modified acrylic ester copolymer, and carboxy-modified methacrylic ester copolymer. Among these, polystyrene or a styrene copolymer containing 50% by weight or more of a styrene component is particularly preferred.
本発明の架橋中空ポリマー粒子の架橋の程度は、架橋中
空ポリマー粒子が配合される熱硬化性樹脂の硬化温度で
粒子の形態を保つ程度に三次元的に架橋したものをいう
。The degree of crosslinking of the crosslinked hollow polymer particles of the present invention refers to three-dimensional crosslinking to such an extent that the shape of the particles is maintained at the curing temperature of the thermosetting resin in which the crosslinked hollow polymer particles are blended.
本発明の架橋中空ポリマー粒子のガラス転移温度(T
g)は、好ましくは100℃以上、さらに好ましくは1
20〜200℃である。Tgが上記の範囲にあると、本
発明の目的とする一段と優れた効果が得られる。The glass transition temperature (T
g) is preferably 100°C or higher, more preferably 1
The temperature is 20-200°C. When Tg is within the above range, even better effects aimed at by the present invention can be obtained.
本発明の架橋中空ポリマー粒子の平均外径は、好ましく
は5μ以下、さらに好ましくは1μ以下、特に好ましく
は0.1〜1μである。この範囲の粒子を用いると、機
械的強度が一段と優れるので好ましい。The average outer diameter of the crosslinked hollow polymer particles of the present invention is preferably 5 microns or less, more preferably 1 micron or less, particularly preferably 0.1 to 1 micron. It is preferable to use particles in this range because the mechanical strength is even better.
本発明の架橋中空ポリマー粒子の内径は、軽量化と機械
的強度のバランスを考慮すると、内径が外径の0.2〜
0.9倍の範囲にあることが好ましい。Considering the balance between weight reduction and mechanical strength, the inner diameter of the crosslinked hollow polymer particles of the present invention is 0.2 to 0.2 to the outer diameter.
Preferably, it is in the range of 0.9 times.
本発明の熱硬性性樹脂と架橋中空ポリマー粒子からなる
組成物の組成割合は、熱硬化性樹脂10〜99重量%、
好ましくは30〜95重量%、さらに好ましくは60〜
95重量%であり、一方、架橋中空ポリマー粒子は1〜
90重量%、好ましくは5〜70重量%、さらに好まし
くは5〜40重量%である。熱硬化性樹脂が10重量%
未満(架橋中空ポリマー粒子が90重量%を超える)の
場合には、機械的強度および熱硬化性樹脂の優れた性能
などが低下するので好ましくなく、また熱硬化性樹脂が
99重量%を超える(架橋中空ポリマー粒子が1重量%
未満)場合には、目的とする軽量化ができない。The composition ratio of the thermosetting resin and crosslinked hollow polymer particles of the present invention is 10 to 99% by weight of the thermosetting resin,
Preferably 30 to 95% by weight, more preferably 60 to 95% by weight
95% by weight, while the crosslinked hollow polymer particles
It is 90% by weight, preferably 5 to 70% by weight, more preferably 5 to 40% by weight. 10% by weight thermosetting resin
If the content of the crosslinked hollow polymer particles exceeds 90% by weight, the mechanical strength and excellent performance of the thermosetting resin will deteriorate, which is undesirable. 1% by weight of crosslinked hollow polymer particles
(less than), the desired weight reduction cannot be achieved.
本発明において、架橋中空ポリマー粒子を用いることが
重要であり、架橋中空ポリマー粒子を用いることで、本
発明の目的が達成できる。In the present invention, it is important to use crosslinked hollow polymer particles, and the purpose of the present invention can be achieved by using crosslinked hollow polymer particles.
本発明の目的とする効果を具体的に示すと、軽量化によ
って同一比重にしたとき、従来の軽量化方法に比べ、本
発明の軽量化方法による材料の方が機械的強度に優れて
いるということである。To specifically demonstrate the desired effect of the present invention, when the specific gravity is the same through weight reduction, the material produced by the weight reduction method of the present invention has superior mechanical strength compared to the conventional weight reduction method. That's true.
熱硬化性樹脂と架橋中空ポリマー粒子との混合方法は、
好ましくは加熱混合する方法である。The method of mixing the thermosetting resin and crosslinked hollow polymer particles is as follows:
Preferably, the method involves heating and mixing.
混合には、目的に応じてバンバリーミキサ−などの密閉
型混合機、ロール、押出機などを用いることができる。For mixing, a closed mixer such as a Banbury mixer, a roll, an extruder, etc. can be used depending on the purpose.
また本発明の組成物には、必要に応じて老化防止剤、安
定剤、可塑剤、軟化剤、無機または有機の各種充填剤、
補強剤、架橋剤、ガラス繊維、金属繊維、炭素繊維など
を配合して用いることができる。In addition, the composition of the present invention may contain anti-aging agents, stabilizers, plasticizers, softeners, various inorganic or organic fillers, as necessary.
Reinforcing agents, crosslinking agents, glass fibers, metal fibers, carbon fibers, etc. can be used in combination.
本発明の組成物は、“プラスチック入門(工業調査会発
行)”第80.81頁に記載されている成形方法、例え
ばハンドレイフップ法、スプレアツブ法、FW法、SM
C法、連続引抜法、8MC法、プリミックス法、プリフ
ォーム法、FRP法などを用いて目的の成形品を得るこ
とができる。The composition of the present invention can be applied to molding methods described in "Introduction to Plastics (published by Kogyo Research Association)", pages 80 and 81, such as the hand lay-flop method, the spray stub method, the FW method, and the SM method.
The desired molded product can be obtained using the C method, continuous pultrusion method, 8MC method, premix method, preform method, FRP method, etc.
本発明の組成物は、電気・電子部品用、自動車用、建築
材料を中心とした被覆剤、電気・電子部品、車両部品、
建築材料、注型剤、成形材、接着剤、塗料などに広く用
いることができる。The composition of the present invention is suitable for electrical/electronic parts, automobiles, coatings mainly for building materials, electrical/electronic parts, vehicle parts,
It can be widely used in building materials, casting agents, molding materials, adhesives, paints, etc.
次に、本発明を実施例によりさらに詳しく説明する。Next, the present invention will be explained in more detail with reference to Examples.
なお、実施例中、部および%は特に断わらない限り、重
量部および重量%を示す。In the examples, unless otherwise specified, parts and % indicate parts by weight and % by weight.
(1)架橋中空ポリマー粒子
く架橋中空ポリマー粒子A〉
スチレン70部、ブタジェン27部、イタコン酸3部お
よびt−ドデシルメルカプタン12部に、水200部に
ラウリル硫酸ナトリウム0.5部および過硫酸カリウム
1.0部を溶かした水溶液をを撹拌しながら、70°C
で8時間重合してポリマー粒子を得た。このポリマー粒
子は、平均粒子系0.24μm、トルエン不溶解骨6%
、GPCによる数平均分子量が5.000.重量平均分
子量と数平均分子量との比、Mw/Mn=2.6であっ
た。(1) Crosslinked hollow polymer particles A> 70 parts of styrene, 27 parts of butadiene, 3 parts of itaconic acid and 12 parts of t-dodecyl mercaptan, 200 parts of water, 0.5 part of sodium lauryl sulfate and potassium persulfate While stirring an aqueous solution containing 1.0 part of
Polymer particles were obtained by polymerization for 8 hours. This polymer particle has an average particle size of 0.24 μm and 6% of toluene-insoluble bone.
, the number average molecular weight by GPC is 5.000. The ratio of weight average molecular weight to number average molecular weight, Mw/Mn, was 2.6.
次に、このポリマー粒子を種ポリマー粒子として用い、
このポリマー粒子を固型分で10部、ポリオキシエチレ
ンノニルフェニルエーテル0. 1部、ラウリル硫酸ナ
トリウム0.4部および過硫酸カリウム0.5部を水9
00部に分散した。これにメチルメタクリレート30部
、ジビニルヘンセン50部、α−メチルスチレン20部
およびトルエン20部の混合物を加えて70°Cで5時
間重合したところ、重合収率98%でトルエンを粒子内
部に含むカプセル粒子の分散液か得られた。Next, using this polymer particle as a seed polymer particle,
This polymer particle was mixed with 10 parts of solids and 0.0 parts of polyoxyethylene nonylphenyl ether. 1 part, 0.4 parts of sodium lauryl sulfate, and 0.5 parts of potassium persulfate to 9 parts of water.
00 parts. When a mixture of 30 parts of methyl methacrylate, 50 parts of divinylhensen, 20 parts of α-methylstyrene, and 20 parts of toluene was added to this and polymerized at 70°C for 5 hours, the polymerization yield was 98% and toluene was contained inside the particles. A dispersion of capsule particles was obtained.
この分散液に対してスチームストリップ処理を行なった
後、ポリマー粒子を透過型電子顕微鏡で観察したところ
、このポリマー粒子は中央部が透けており、完全な球形
の架橋中空ポリマー粒子であった。この粒子の外径が0
,44μm1内径が0.3μm、Tgが150℃以上、
比重が0. 72であった。After this dispersion was subjected to a steam strip treatment, the polymer particles were observed using a transmission electron microscope, and the polymer particles were transparent at the center and were completely spherical crosslinked hollow polymer particles. The outer diameter of this particle is 0
, 44μm1 inner diameter 0.3μm, Tg 150℃ or more,
Specific gravity is 0. It was 72.
く架橋中空ポリマー粒子B〉
架橋中空ポリマー粒子Aで用いるメチルメタクリレート
の使用量を50部に、ジビニルベンゼンの使用量を30
部に代えた以外はAと同様の方法で外径か0.72μm
、内径が0.48μm、、Tgか150°C以上、比重
か0.73の架橋中空ポリマー粒子を得た。Crosslinked hollow polymer particles B> The amount of methyl methacrylate used in crosslinked hollow polymer particles A was 50 parts, and the amount of divinylbenzene was 30 parts.
The outer diameter is 0.72μm in the same way as A except that
Crosslinked hollow polymer particles with an inner diameter of 0.48 μm, a Tg of 150° C. or more, and a specific gravity of 0.73 were obtained.
〈ガラス中空ビーズ〉
旭硝子■製
平均粒径 56μm
密 度 0.36g/crtl実施例1
上記の架橋中空ポリマー粒子Aを用いて、次の手順に従
って熱硬化性樹脂組成物(エポキシ樹脂組成物)を得た
。<Glass hollow beads> Manufactured by Asahi Glass Average particle size 56 μm Density 0.36 g/crtl Example 1 Using the above crosslinked hollow polymer particles A, a thermosetting resin composition (epoxy resin composition) was prepared according to the following procedure. Obtained.
クレゾールノホラック型エポキシ樹脂
(エポキシ当量200) 100重量部フェノ
ール樹脂(ノボラックタイプ)
50重量部
硬化剤(2−メチルイミダゾール)5重量部架橋中空ポ
リマー粒子A 37.5重量部これらを密閉型ミキ
サーを用い、約80℃で十分混練りし、160℃でプラ
ス成形を行ない、得られた成形板をフライス盤にて加工
することにより、物性評価用サンプルを作製した。評価
結果を表−1に示した。Cresol nophorac type epoxy resin (epoxy equivalent: 200) 100 parts by weight Phenol resin (novolac type) 50 parts by weight Curing agent (2-methylimidazole) 5 parts by weight Crosslinked hollow polymer particles A 37.5 parts by weight These were mixed in a closed mixer. Samples for physical property evaluation were prepared by thoroughly kneading the mixture at about 80° C., performing plus molding at 160° C., and processing the obtained molded plate with a milling machine. The evaluation results are shown in Table-1.
実施例2
実施例1の架橋中空ポリマー粒子Aに代えて、架橋ポリ
マー粒子Bを用いた例である。評価結果を表−1に示し
た。Example 2 This is an example in which crosslinked polymer particles B were used in place of the crosslinked hollow polymer particles A of Example 1. The evaluation results are shown in Table-1.
比較例1 実施例1で架橋中空ポリマー粒子を用いない例である。Comparative example 1 This is an example in which crosslinked hollow polymer particles are not used in Example 1.
評価結果を表−1に示した。The evaluation results are shown in Table-1.
比較例2
実施例1の架橋中空ポリマー粒子Aにかえて、ガラス中
空ビーズを用いた例である。評価結果を表−1に示す。Comparative Example 2 This is an example in which glass hollow beads were used instead of the crosslinked hollow polymer particles A of Example 1. The evaluation results are shown in Table-1.
実施例3
実施例1で使用した(A)を用い、次の手順にてフェノ
ール樹脂組成物を得た。Example 3 Using (A) used in Example 1, a phenol resin composition was obtained in the following procedure.
フェノール樹脂(ノボラックタイプ)
100重量部
ヘキサメチレンテトラミン 10重量部架橋中空ポリ
マー粒子A 25重量部上記処方に従って、電熱
ロールにて130°Cで5分間混練りしたのち粉砕し、
160℃で10分間プレス成形することにより、厚さ4
Mの成形板を得た。これをJIS K−6911に順
じてフライス盤で加工を行ない、試験片を作製した。試
験結果を表−1にまとめた。Phenol resin (novolac type) 100 parts by weight Hexamethylenetetramine 10 parts by weight Crosslinked hollow polymer particles A 25 parts by weight According to the above recipe, kneaded with an electric heated roll at 130°C for 5 minutes and then crushed.
By press molding at 160℃ for 10 minutes, the thickness of 4
A molded plate of M was obtained. This was processed using a milling machine according to JIS K-6911 to prepare a test piece. The test results are summarized in Table-1.
実施例4
実施例3の架橋中空ポリマー粒子Aに代えて、架橋中空
ポリマー粒子Bを用いた例である。評価結果を表−1に
示した。Example 4 This is an example in which crosslinked hollow polymer particles B were used in place of crosslinked hollow polymer particles A in Example 3. The evaluation results are shown in Table-1.
実施例5
実施例3の架橋中空ポリマー粒子Aの使用量を25部か
ら66.6部に変量した例である。評価結果を表−1に
示した。Example 5 This is an example in which the amount of crosslinked hollow polymer particles A used in Example 3 was changed from 25 parts to 66.6 parts. The evaluation results are shown in Table-1.
比較例3
実施例3て架橋中空ポリマー粒子Aを用いない例である
。評価結果を表−1に示す。Comparative Example 3 This is an example in which the crosslinked hollow polymer particles A of Example 3 were not used. The evaluation results are shown in Table-1.
比較例4
実施例3の架橋中空ポリマー粒子Aに代えて、ガラス中
空ビーズ25部を用いた例である。評価結果を表−1に
示す。Comparative Example 4 This is an example in which 25 parts of glass hollow beads were used in place of the crosslinked hollow polymer particles A of Example 3. The evaluation results are shown in Table-1.
比較例5
実施例3の架橋中空ポリマー粒子Aに代えて、ガラス中
空ビーズ66.6部を用いた例である。Comparative Example 5 This is an example in which 66.6 parts of glass hollow beads were used in place of the crosslinked hollow polymer particles A of Example 3.
評価結果を表−1に示す。The evaluation results are shown in Table-1.
実施例1.2および比較例1.2について架橋中空ポリ
マー粒子未添加の比較例1およびガラス中空ビーズを添
加した比較例2と実施例1.2とから本発明の架橋中空
ポリマー粒子を配合した熱硬化性樹脂組成物は、熱硬化
性樹脂の機械的強度を損なうことなく軽量化されている
ことがわかる。Regarding Example 1.2 and Comparative Example 1.2, the crosslinked hollow polymer particles of the present invention were blended from Comparative Example 1 without the addition of crosslinked hollow polymer particles, Comparative Example 2 with the addition of glass hollow beads, and Example 1.2. It can be seen that the weight of the thermosetting resin composition is reduced without impairing the mechanical strength of the thermosetting resin.
実施例3.4.5および比較例3.4.5について
架橋中空ポリマー粒子未添加の比較例3およびガラス中
空ビーズを添加した比較例4.5と実施例3.4.5と
から本発明の架橋中空ポリマー粒子を配合した熱硬化性
樹脂組成物は、熱硬化性樹脂の機械的強度を損なうこと
なく軽量化されて(Xることかわかる。なお、ガラス中
空ビーズを添加した例である比較例2.4.5の熱硬化
性樹脂組成物は、軽量化されていないかこれは混合ある
し為は成形中に中空か破壊されたことによる。Regarding Example 3.4.5 and Comparative Example 3.4.5 From Comparative Example 3 without the addition of crosslinked hollow polymer particles and Comparative Example 4.5 and Example 3.4.5 with the addition of glass hollow beads, the present invention The thermosetting resin composition blended with crosslinked hollow polymer particles can be made lighter without impairing the mechanical strength of the thermosetting resin. The thermosetting resin compositions of Comparative Examples 2.4.5 were not light weighted or were hollow or destroyed during mixing or molding.
以下余白
[発明の効果]
従来の熱硬化性樹脂の軽量化方法としては、発泡剤を用
いて発泡させる方法あるいはカラス中空ビーズを添加す
る方法か知られているか、これらの方法は熱硬化性樹脂
の機械的強度を著しく低下させるので、機械的強度か要
求される用途には実用性か全くなかった。Below are blank spaces [Effects of the invention] Are there any known conventional methods for reducing the weight of thermosetting resins, such as foaming using a foaming agent or adding glass hollow beads? This significantly lowers the mechanical strength of the material, making it completely impractical for applications that require high mechanical strength.
しかし、本発明の架橋中空ポリマー粒子を添加する方法
は熱硬化性樹脂の機械的強度を損なうことなく、あるい
は低下を最少限におさえて軽量化か可能である。However, the method of adding the crosslinked hollow polymer particles of the present invention makes it possible to reduce the weight of the thermosetting resin without impairing the mechanical strength or minimizing the decrease.
このような優れた効果か達成できたのは、架橋中空ポリ
マー粒子を用いることで初めて達成されたものである。Such excellent effects were achieved for the first time using crosslinked hollow polymer particles.
特許出願人 日本合成ゴム株式会社Patent applicant: Japan Synthetic Rubber Co., Ltd.
Claims (1)
リマー粒子1〜90重量%からなることを特徴とする熱
硬化性樹脂組成物。(1) A thermosetting resin composition comprising 10 to 99% by weight of a thermosetting resin and 1 to 90% by weight of crosslinked hollow polymer particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27724290A JP2861355B2 (en) | 1990-10-16 | 1990-10-16 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27724290A JP2861355B2 (en) | 1990-10-16 | 1990-10-16 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04153267A true JPH04153267A (en) | 1992-05-26 |
JP2861355B2 JP2861355B2 (en) | 1999-02-24 |
Family
ID=17580803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27724290A Expired - Lifetime JP2861355B2 (en) | 1990-10-16 | 1990-10-16 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2861355B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002266463A (en) * | 2001-03-08 | 2002-09-18 | Japan U-Pica Co Ltd | Wall material |
JP2007099803A (en) * | 2005-09-30 | 2007-04-19 | Jsr Corp | Resin composition and its cured product |
JP2019172741A (en) * | 2018-03-27 | 2019-10-10 | 住友ベークライト株式会社 | Phenolic resin molding material and structure |
-
1990
- 1990-10-16 JP JP27724290A patent/JP2861355B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002266463A (en) * | 2001-03-08 | 2002-09-18 | Japan U-Pica Co Ltd | Wall material |
JP2007099803A (en) * | 2005-09-30 | 2007-04-19 | Jsr Corp | Resin composition and its cured product |
JP2019172741A (en) * | 2018-03-27 | 2019-10-10 | 住友ベークライト株式会社 | Phenolic resin molding material and structure |
Also Published As
Publication number | Publication date |
---|---|
JP2861355B2 (en) | 1999-02-24 |
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