JPH0414773A - Electric connecting member and device - Google Patents
Electric connecting member and deviceInfo
- Publication number
- JPH0414773A JPH0414773A JP2115865A JP11586590A JPH0414773A JP H0414773 A JPH0414773 A JP H0414773A JP 2115865 A JP2115865 A JP 2115865A JP 11586590 A JP11586590 A JP 11586590A JP H0414773 A JPH0414773 A JP H0414773A
- Authority
- JP
- Japan
- Prior art keywords
- electrical connection
- liquid metal
- contact
- hollow tube
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000008018 melting Effects 0.000 abstract description 7
- 238000002844 melting Methods 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 5
- 229910052733 gallium Inorganic materials 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 230000037431 insertion Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- 229910000807 Ga alloy Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
［概 要］
特に半導体技術において有用な電気的接続部材、および
電気的接続装置に関し、
挿入力および抜去力を必要とせずに高密度の接続が可能
であり、かつ接続抵抗が小さい電気的接続部材およびこ
のような特徴を有する電気的接続装置を目的とし、接続
部材は、他の部材の電気的接点に対向する開口を有する
中空管からなり、この中空管が毛細管現象および表面張
力によって液体金属を保持するように構成し、
回路基板の接点に接続する多数のアースピンを含む信号
伝播用ピンを接続ボードに取り付けた電気的接続装置は
、アースピンが回路基板の接点に対向して開口する中空
管からなり、この中空管が毛細管現象および表面張力に
よって液体金属を保持するのに十分な細管であり、接続
ボードがその内部に延在する中空領域を有し、この中空
領域が各アースピンの中空管と連通し、この中空領域お
よび中空管に液体金属が充填されているように構成する
。[Detailed Description of the Invention] [Summary] This invention relates to electrical connection members and electrical connection devices that are particularly useful in semiconductor technology, and which enable high-density connections without requiring insertion and removal forces, and Aiming at an electrical connection member with low resistance and an electrical connection device having such characteristics, the connection member consists of a hollow tube having an opening facing an electrical contact point of another member, and this hollow tube has a An electrical connection device in which a connection board is fitted with signal propagation pins configured to retain liquid metal by capillary action and surface tension, and includes a number of ground pins that connect to circuit board contacts. consisting of a hollow tube opening opposite the tube, the hollow tube being sufficiently thin to retain the liquid metal by capillary action and surface tension, and having a hollow region within which the connecting board extends. , the hollow region communicates with the hollow tube of each earth pin, and the hollow region and the hollow tube are filled with liquid metal.
本発明は、特に半導体技術において有用な電気的接続部
材、および電気的接続装置に関する。The present invention relates to an electrical connection member and an electrical connection device particularly useful in semiconductor technology.
〔従来の技術）
副型接点に相当する接点ピンと、雌型接点に相当するジ
ャックとによって構成される機械的な電気的接続装置は
、接点数の増加に伴なう着脱時における負荷を軽減する
ために、零挿入力または軽挿入力の接続が試みられてい
るが、これによると機構が複雑となり、それに伴なって
接続密度が低下する欠点を有する。[Prior art] A mechanical electrical connection device composed of a contact pin corresponding to a sub-type contact and a jack corresponding to a female-type contact reduces the load when connecting and disconnecting as the number of contacts increases. Therefore, attempts have been made to connect with zero insertion force or light insertion force, but this has the disadvantage of complicating the mechanism and resulting in a reduction in connection density.
これを解決するために、たとえば特開昭５８１６９９９
６号は、接点金属として、接続装置の着脱時に加熱され
て融解するが、回路使用中は固体である易融合金を使用
する電気的接続装置を提案する。In order to solve this problem, for example, Japanese Patent Application Laid-Open No. 5816999
No. 6 proposes an electrical connection device that uses, as a contact metal, an easily fusible metal that melts when heated when the connection device is connected or removed, but remains solid during circuit use.
一般に半導体素子の許容温度は１２０°Ｃ程度であるの
で、回路使用中に発熱しても融解しないようにする場合
は、融点が素子の許容温度より高い金属または合金を使
用しなければならない。また半導体素子の接点ピンは接
続ボードに穿たれた合金溜めに挿入することを開示して
いる。接続ボードに多数の合金溜めを設けることによっ
て、相当な面積を占めるので、接続密度が小さい欠点が
ある。Generally, the permissible temperature of a semiconductor element is about 120°C, so if you want to prevent it from melting even if it generates heat during circuit use, you must use a metal or alloy whose melting point is higher than the permissible temperature of the element. It is also disclosed that the contact pins of the semiconductor device are inserted into alloy reservoirs bored in the connection board. The provision of a large number of alloy reservoirs on the connection board occupies a considerable area and therefore has the disadvantage of a low connection density.
本発明は、挿入力および抜去力を必要とせずに高密度の
接続が可能であり、かつ接続抵抗が小さい電気的接続部
材および電気的接続装置を提供することを目的とする。An object of the present invention is to provide an electrical connection member and an electrical connection device that enable high-density connection without requiring insertion or removal force, and have low connection resistance.
上記課題は、他の部材の電気的接点に対向する開口を有
し、液体金属を充填した中空管からなり、この中空管が
毛細管現象および表面張力によって液体金属を保持する
のに十分な細管であることを特徴とする電気的接続部材
、および多数のアースピンが回路基板の接点に対向する
開口を有する中空管からなり、この中空管が毛細管現象
および表面張力によって液体金属を保持するのに十分な
細管であり、かつ接続ボードがその内部に延在する中空
領域を有し、この中空領域が各アースピンの中空管と連
通し、この中空領域およびアースピンの中空管に液体金
属が充填されていることを特徴とする電気的接続装置に
よって解決することができる。The above problem consists of a hollow tube filled with liquid metal and having an opening facing an electrical contact of another member, and the hollow tube has a sufficient amount of water to retain the liquid metal by capillary action and surface tension. The electrical connection member is characterized by being a thin tube, and the hollow tube has a plurality of ground pins with openings facing the contacts of the circuit board, and the hollow tube holds the liquid metal by capillary action and surface tension. and the connection board has a hollow region extending therein, the hollow region communicating with the hollow tube of each ground pin, and the hollow region and the hollow tube of the ground pin having a liquid metal This can be solved by an electrical connection device characterized by being filled with.
［作 用］
本発明の電気的接続部材は微細な中空管であるので、毛
細管現象によって液体金属を導入して保持し、しかも表
面張力によって開口部より広い面積で接続することがで
きるばかりでなく、安定した接続を得ることができる。[Function] Since the electrical connection member of the present invention is a fine hollow tube, it is possible to introduce and hold liquid metal through capillary action, and also to connect over a wider area than the opening due to surface tension. You can get a stable connection without any problems.
また単純な構造であるので、中空管相互の間隔を狭めで
、接続を高密度化することができる。Furthermore, since the structure is simple, the spacing between the hollow tubes can be narrowed and connections can be made at a high density.
また本発明の接続装置は、多数のアースピンを微細な中
空管として形成するので、上記接続部材と同様に接続を
高密度化することができ、さらに接続ボードの内部に中
空領域を設けてアースピンの中空管と連通させるので、
アースを等電位とすることができる。Furthermore, since the connection device of the present invention forms a large number of ground pins as fine hollow tubes, it is possible to increase the connection density in the same manner as the connection member described above. Because it communicates with the hollow tube of
Earth can be made equipotential.
液体金属は、融点４０°Ｃ以下が適当である。たとえば
２４．５〜３５．０重量％Ｉ ｎ −７５，５〜６５．
０重量％Ｇａ合金、または５〜２５重量％Ｓｎ −７５
〜９５重量％Ｇａ合金は、融点が２０〜４０°Ｃであり
、またＨｇは融点が−３８，９°Ｃであるので、これら
を液体金属として使用することが便宜である。The liquid metal suitably has a melting point of 40°C or less. For example, 24.5 to 35.0% by weight I n -75,5 to 65.
0 wt% Ga alloy, or 5-25 wt% Sn-75
~95% by weight Ga alloys have a melting point of 20-40°C, and Hg has a melting point of -38,9°C, so it is convenient to use them as liquid metals.
また本発明の接続装置は、半導体集積回路基板、実装回
路基板などと接続することができる。Further, the connection device of the present invention can be connected to a semiconductor integrated circuit board, a mounted circuit board, and the like.
［実施例］ 第１図は、本発明の電気的接続部材１を示す。[Example] FIG. 1 shows an electrical connection member 1 of the present invention.
これは外径０．５ｍｍ内径０．３躯の微細な中空管であ
って、他の部材の接点４に対向する開口２を有する。こ
の中空管内に、融点２０°Ｃの２４．５重量％Ｉｎ７５
．５重量％Ｇａ合金３を充填する。This is a fine hollow tube with an outer diameter of 0.5 mm and an inner diameter of 0.3 mm, and has an opening 2 facing a contact point 4 of another member. In this hollow tube, 24.5% by weight of In75 with a melting point of 20°C was added.
．． Fill with 5% by weight Ga alloy 3.
本発明の接続部材ｌを他の部材の接点４に接触させると
、第２図に示すように液体合金３は表面張力によって接
点４との接触面を広げ、しかも散失しない。When the connecting member 1 of the present invention is brought into contact with the contact 4 of another member, the liquid alloy 3 expands the contact surface with the contact 4 due to surface tension as shown in FIG. 2, and does not scatter.
第３図は１個の接続部材の抵抗と荷重との関係を示す。FIG. 3 shows the relationship between the resistance and load of one connecting member.
本発明の液体接続の場合は、荷重が零である場合にも、
荷重を加えた場合とほぼ同様に抵抗が小さい。これに対
して、通常の固体接続では、荷重を加えない場合は抵抗
が極めて大きく、荷重を加えて始めて抵抗を小さくする
ことができる。In the case of the liquid connection of the present invention, even when the load is zero,
The resistance is almost the same as when a load is applied. In contrast, with ordinary solid connections, the resistance is extremely high when no load is applied, and the resistance can only be reduced by applying a load.
第４図は本発明の電気的接続装置の要部を示す。FIG. 4 shows the main parts of the electrical connection device of the present invention.
接続ボード５に延在する中空領域８を設け、これがアー
スピン７の中空管と連通している。なお、この場合は接
続すべき部品は回路基板６であり、接点４を有する。ア
ースピン７の中空管の開口２がこの接点４に対向し、中
空管内の液体金属が接点４と接触する。アースピンでな
い信号ピン８は、接続ボード２の配線９に接続し、回路
基板６の接点４とは任意の手段で接触する。A hollow region 8 extending through the connecting board 5 is provided, which communicates with the hollow tube of the ground pin 7. In this case, the component to be connected is the circuit board 6, which has the contacts 4. The opening 2 of the hollow tube of the earth pin 7 faces this contact 4 and the liquid metal in the hollow tube comes into contact with the contact 4. The signal pin 8, which is not a ground pin, is connected to the wiring 9 of the connection board 2, and contacts the contact point 4 of the circuit board 6 by any means.
第５図は本発明の電気的接続装置の実施態様と、これに
接続する回路基板を例示する。第５図（ａ）は本発明の
装置および回路基板の斜視図であって、接続ボード５に
設けたアースピン７は中空管である。アースピン７は接
続ボード５内部の中空領域８に連通している。信号ピン
９は配線１０に連結している。回路基板６は、アレイ状
に配置されたアースピン７または信号ピン９に接続する
接点４を有する。第５図（ｂ）および（Ｃ）は本発明の
装置およびこれに接続する回路基板の断面図であって、
分離状態（ｂ）および接続状態（Ｃ）をそれぞれ示す。FIG. 5 illustrates an embodiment of the electrical connection device of the present invention and a circuit board connected thereto. FIG. 5(a) is a perspective view of the device and circuit board of the present invention, and the ground pin 7 provided on the connection board 5 is a hollow tube. The ground pin 7 communicates with a hollow area 8 inside the connection board 5. The signal pin 9 is connected to a wiring 10. The circuit board 6 has contacts 4 connected to ground pins 7 or signal pins 9 arranged in an array. 5(b) and (C) are cross-sectional views of the device of the present invention and the circuit board connected thereto,
A separated state (b) and a connected state (C) are shown, respectively.
アースピン９および中空領域８には液体金属３が充填さ
れている。そのため、多数のアースピン７は中空領域８
を介して相互に連通しているので、アースを等電位とす
ることができる。The earth pin 9 and hollow region 8 are filled with liquid metal 3. Therefore, a large number of ground pins 7 are connected to the hollow area 8.
Since they communicate with each other via the ground, the ground can be made to have an equal potential.
本発明の接続装置は、さきに接続部材について説明した
ように、接点との抵抗が小さく、かつ安定している利点
を有するばかりでなく、アースを等電位とすることがで
きる。As described above with respect to the connecting member, the connecting device of the present invention not only has the advantage that the resistance with the contact point is low and stable, but also can make the ground equal potential.
本発明によれば、液体金属を使用して、挿入力および抜
去力を必要とせずに接続・切断することができ、かつ接
続荷重をほとんど加えずに低抵抗で高密度の電気的接続
を行なうことができ、さらに接続装置は、接続ボード内
に延在する中空領域を介して各アースピン内の液体金属
が連通しているので、アースを等電位とすることができ
る。According to the present invention, liquid metal can be used to connect and disconnect without the need for insertion and withdrawal forces, and to make low-resistance, high-density electrical connections with little connection load. Furthermore, the connection device allows the earth to be equipotential, since the liquid metal in each earth pin communicates via a hollow region extending within the connection board.
第１図は本発明の電気的接続部材の要部断面図であり、
第２図は本発明の接続部材を接続したときの液体金属形
状を示す断面図であり、
第３図は接続の抵抗と荷重との関係を本発明の液体接続
と、通常の固体接続と比較して示すグラフであり、
第４図は本発明の接続装置の要部断面図であり、第５図
は本発明の電気的装置の実施態様を示し、図（ａ）は斜
視図であり、図（ｂ）は基板と分離した状態の断面図で
あり、図（Ｃ）は基板と接続した状態の断面図である。
１・・・接続部材の中空管、
２・・・中空管の開口、 ３・・・液体金属、４・・・
接点、 ５・・・接続ボード、６・・・回路
基板、 ７・・・アースピン、８・・・中空領域
、 ９・・・信号ピン、１０・・・配線、
Ａ・・・液体接続、Ｂ・・・固体接続。
本発明の接続装置の要部の断面図
′＄４図Fig. 1 is a cross-sectional view of the main part of the electrical connection member of the present invention, Fig. 2 is a cross-sectional view showing the shape of the liquid metal when the connection member of the present invention is connected, and Fig. 3 is the resistance of the connection. FIG. 4 is a graph showing the relationship between the liquid connection of the present invention and a normal solid connection, and FIG. 4 is a sectional view of the main part of the connection device of the present invention, and FIG. Figure (a) is a perspective view, figure (b) is a sectional view of the electrical device separated from the board, and figure (C) is a sectional view of the electrical device connected to the board. . DESCRIPTION OF SYMBOLS 1... Hollow tube of connecting member, 2... Opening of hollow tube, 3... Liquid metal, 4...
Contact, 5... Connection board, 6... Circuit board, 7... Earth pin, 8... Hollow area, 9... Signal pin, 10... Wiring,
A...liquid connection, B...solid connection. Cross-sectional view of the main parts of the connecting device of the present invention '$4 figure
Claims (1)
あって、接点に対向する開口を有し、液体金属を充填し
た中空管からなり、この中空管が毛細管現象および表面
張力によって液体金属を保持するのに十分な細管である
ことを特徴とする電気的接続部材。 ２、回路基板の接点に接続する多数のアースピンを含む
信号伝播用ピンを接続ボードに取り付けた電気的接続装
置であって、アースピンが、回路基板の接点に対向する
開口を有する中空管からなり、この中空管が毛細管現象
および表面張力によって液体金属を保持するのに十分な
細管であり、接続ボードがその内部に延在する中空領域
を有し、この中空領域が各アースピンの中空管と連通し
、この中空領域およびアースピンの中空管に液体金属が
充填されていることを特徴とする電気的接続装置。 ３、液体金属が２４．５〜３５．０重量％Ｉｎ−６５．
０〜７５．５重量％Ｇａの合金である、請求項１記載の
電気的接続部材、または請求項２記載の電気的接続装置
。 ４、液体金属が５〜２５重量％Ｓｎ−７５〜９５重量％
Ｇａの合金である、請求項１記載の電気的接続部材、ま
たは請求項２記載の電気的接続装置。 ５、液体金属がＨｇである、請求項１記載の電気的接続
部材、または請求項２記載の電気的接続装置。 ６、上記回路基板が半導体集積回路基板、実装回路基板
である、請求項２記載の電気的接続装置。[Scope of Claims] 1. An electrical connection member that connects to an electrical contact of another member, comprising a hollow tube having an opening facing the contact and filled with liquid metal; is a capillary tube sufficient to retain liquid metal by capillary action and surface tension. 2. An electrical connection device in which a signal propagation pin including a number of ground pins connected to contacts on a circuit board is attached to a connection board, wherein the ground pin is made of a hollow tube having an opening facing the contacts on the circuit board. , this hollow tube is sufficiently thin to hold the liquid metal by capillary action and surface tension, and the connecting board has a hollow region extending inside it, and this hollow region is the hollow tube of each ground pin. An electrical connection device characterized in that the hollow region and the hollow tube of the earth pin are filled with liquid metal. 3. Liquid metal is 24.5-35.0% by weight In-65.
The electrical connection member according to claim 1 or the electrical connection device according to claim 2, which is an alloy containing 0 to 75.5% by weight of Ga. 4. Liquid metal is 5-25% by weight Sn-75-95% by weight
The electrical connection member according to claim 1 or the electrical connection device according to claim 2, which is an alloy of Ga. 5. The electrical connection member according to claim 1 or the electrical connection device according to claim 2, wherein the liquid metal is Hg. 6. The electrical connection device according to claim 2, wherein the circuit board is a semiconductor integrated circuit board or a mounted circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2115865A JPH0414773A (en) | 1990-05-07 | 1990-05-07 | Electric connecting member and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2115865A JPH0414773A (en) | 1990-05-07 | 1990-05-07 | Electric connecting member and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0414773A true JPH0414773A (en) | 1992-01-20 |
Family
ID=14673066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2115865A Pending JPH0414773A (en) | 1990-05-07 | 1990-05-07 | Electric connecting member and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414773A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224533A (en) * | 1993-01-27 | 1994-08-12 | Ibiden Co Ltd | Printed wiring board assembly |
| US10215768B2 (en) | 2007-02-20 | 2019-02-26 | Oxford Nanopore Technologies Ltd. | Lipid bilayer sensor system |
| US10338056B2 (en) | 2012-02-13 | 2019-07-02 | Oxford Nanopore Technologies Ltd. | Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules |
| US10416117B2 (en) | 2007-12-19 | 2019-09-17 | Oxford Nanopore Technologies Ltd. | Formation of layers of amphiphilic molecules |
| US10549274B2 (en) | 2014-10-17 | 2020-02-04 | Oxford Nanopore Technologies Ltd. | Electrical device with detachable components |
| US10814298B2 (en) | 2012-10-26 | 2020-10-27 | Oxford Nanopore Technologies Ltd. | Formation of array of membranes and apparatus therefor |
-
1990
- 1990-05-07 JP JP2115865A patent/JPH0414773A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224533A (en) * | 1993-01-27 | 1994-08-12 | Ibiden Co Ltd | Printed wiring board assembly |
| US10215768B2 (en) | 2007-02-20 | 2019-02-26 | Oxford Nanopore Technologies Ltd. | Lipid bilayer sensor system |
| US10416117B2 (en) | 2007-12-19 | 2019-09-17 | Oxford Nanopore Technologies Ltd. | Formation of layers of amphiphilic molecules |
| US10338056B2 (en) | 2012-02-13 | 2019-07-02 | Oxford Nanopore Technologies Ltd. | Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules |
| US10814298B2 (en) | 2012-10-26 | 2020-10-27 | Oxford Nanopore Technologies Ltd. | Formation of array of membranes and apparatus therefor |
| US10549274B2 (en) | 2014-10-17 | 2020-02-04 | Oxford Nanopore Technologies Ltd. | Electrical device with detachable components |
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