JPH04146975A - Conductive paste composition - Google Patents
Conductive paste compositionInfo
- Publication number
- JPH04146975A JPH04146975A JP26994490A JP26994490A JPH04146975A JP H04146975 A JPH04146975 A JP H04146975A JP 26994490 A JP26994490 A JP 26994490A JP 26994490 A JP26994490 A JP 26994490A JP H04146975 A JPH04146975 A JP H04146975A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- copper powder
- paste composition
- acid
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims abstract description 10
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 7
- 239000000194 fatty acid Substances 0.000 claims abstract description 7
- 229930195729 fatty acid Natural products 0.000 claims abstract description 7
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 7
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-Hydroxyoctadecanoic acid Natural products CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229960003656 ricinoleic acid Drugs 0.000 claims abstract description 5
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 5
- 239000000057 synthetic resin Substances 0.000 claims abstract description 5
- 239000000654 additive Substances 0.000 claims description 26
- 230000000996 additive effect Effects 0.000 claims description 17
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 claims description 10
- 229920006395 saturated elastomer Polymers 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- -1 nitrogen-containing heterocyclic compound Chemical class 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 5
- GVNHOISKXMSMPX-UHFFFAOYSA-N 2-[butyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCN(CCO)CCO GVNHOISKXMSMPX-UHFFFAOYSA-N 0.000 claims description 4
- HHPDFYDITNAMAM-UHFFFAOYSA-N 2-[cyclohexyl(2-hydroxyethyl)amino]ethanol Chemical compound OCCN(CCO)C1CCCCC1 HHPDFYDITNAMAM-UHFFFAOYSA-N 0.000 claims description 4
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N 2-propanol Substances CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 1
- WBHHMMIMDMUBKC-QJWNTBNXSA-N ricinoleic acid Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(O)=O WBHHMMIMDMUBKC-QJWNTBNXSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000002253 acid Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000007376 cm-medium Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- WOFDVDFSGLBFAC-UHFFFAOYSA-N lactonitrile Chemical compound CC(O)C#N WOFDVDFSGLBFAC-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は導電性ペースト組成物に関し、特に銅粉末入り
導電性ペースト組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a conductive paste composition, and particularly to a conductive paste composition containing copper powder.
近年電子機器の発展にともない、従来銅箔等のエツチン
グにより導体沖］路を形成していたものが導電性ペース
ト組成物を用いたスクリーン印刷による導体回路の形成
へ、また導体同志の接続のためのハンダ付けが導電性ペ
ースト組成物による接着へと移行しでいる７
また、コンピュータ等電子機器に発生する電磁波が電波
障害となり問題になっているが、電磁波シ−ルド材料に
導電性ペースト組成物を塗布することによってその問題
が解決されている。In recent years, with the development of electronic equipment, the conventional method of forming conductor circuits by etching copper foil, etc. has changed to the formation of conductor circuits by screen printing using conductive paste compositions, and the connection of conductors. 7 In addition, electromagnetic waves generated by electronic devices such as computers are causing radio interference, which has become a problem. The problem was solved by applying .
（従来の技術）
導電性ペースト組成物は導電性のフィラー、主に金属粉
末と合成樹脂から成るバインダー、必要に応じて溶剤、
添加剤から成る複合材料であり、組成物の性能はこれら
の素材の特性および組み合わせで決まる、
従来金属粉末としては、銀、銅、ニッケル粉末は用いら
れたが、その導電性においては銀、銅粉末が優れている
が、銀粉末は貴金属であり、価格が最も高い。コスト的
には銅粉末が最も有利であるが、表面酸化膜の生成速度
が早く、本来の導電性を接続することが難しい。ニッケ
ル粉末は本来の導電性は銅粉末よりも落ちる。また、価
格も一般的には銅粉末よりも高いが、銀粉末よりも安（
、表面酸化膜の生成速度は銅粉末より遅く、導電性が持
続しやすい。(Prior art) A conductive paste composition is made of a conductive filler, a binder mainly composed of metal powder and a synthetic resin, and optionally a solvent.
It is a composite material consisting of additives, and the performance of the composition is determined by the characteristics and combination of these materials. Conventionally, silver, copper, and nickel powders have been used as metal powders, but in terms of conductivity, silver and copper Powder is better, but silver powder is a precious metal and has the highest price. Copper powder is the most advantageous in terms of cost, but it forms a surface oxide film quickly, making it difficult to connect the original conductivity. Nickel powder has lower inherent conductivity than copper powder. Also, the price is generally higher than copper powder, but cheaper than silver powder (
, the formation rate of surface oxide film is slower than that of copper powder, and the conductivity is easily maintained.
Ｆ記に示したように、銅粉末は本来の導電性においても
価格的にも、導電性組成物材料として非常に有利である
が、非導電性の酸化膜の生成が非常に速く、空気中での
取扱が難しいばかりでなく、−時的に還元銅粉を用いて
導電性組成物を製造してもそのままでは再び酸化が始ま
り電気伝導性を持ちえない。これを解決するために種々
の提案がなされてきた。As shown in Section F, copper powder is very advantageous as a material for conductive compositions, both in terms of its inherent conductivity and cost, but it forms a non-conductive oxide film very quickly and is difficult to use in the air. Not only is it difficult to handle the copper powder, but even if a conductive composition is produced using reduced copper powder, oxidation will start again and it will not have electrical conductivity. Various proposals have been made to solve this problem.
その方法としては、各種の添加剤を使用する方法がある
。As a method for this, there is a method of using various additives.
添加剤としては、高級飽和脂肪酸および高級不飽和脂肪
酸がある。例えば、特開昭５８−６１１４４号公報、
５８−７４７５９号公報、 ５８−１４５７６９号公報
、 ６１−２１１３７８号公報、６２−２３０８６９号
公報、 ６２−２５２９８８号公報、６３−８３１７８
号公報に記載されたバルミチン酸、ステアリン酸、オレ
イン酸、リノール酸等がある。上記公報に記載された還
元剤としては脂肪族アミンおよび脂肪族のリン酸エステ
ル類および金属キレート剤がある。そして、それらとし
ては、トリエタノールアミン、ジメチルアミン、ステア
リルアミン等がある。そしてこれらは併用して使用され
る方法が種々提案されている。Additives include higher saturated fatty acids and higher unsaturated fatty acids. For example, Japanese Patent Application Laid-open No. 58-61144,
58-74759, 58-145769, 61-211378, 62-230869, 62-252988, 63-83178
Examples include valmitic acid, stearic acid, oleic acid, linoleic acid, etc., which are described in the above publication. The reducing agents described in the above publication include aliphatic amines, aliphatic phosphoric acid esters, and metal chelating agents. These include triethanolamine, dimethylamine, stearylamine, and the like. Various methods have been proposed in which these methods are used in combination.
（発明が解決するための課題）
しかしながら、銅粉末の酸化を防止する満足する添加剤
は見られなかった。(Problems to be Solved by the Invention) However, no additive has been found that satisfies the oxidation of copper powder.
本発明は各種の添加剤の中から、添加剤の組み合わせか
ら銅の酸化を防止する添加剤を提供することを目的とす
る。An object of the present invention is to provide an additive that prevents copper oxidation from a combination of additives among various additives.
（課題を解決するための手段）
本発明者らは、これらについて種々検討の結果１）銅粉
末と合成樹脂から成る導電性ペースト組成物において添
加剤として水酸基を有する飽和あるいは不飽和高級脂肪
酸と、塩基性高級脂肪族アミンおよび／または窒素含有
異節環状化合物とを含有することを特徴とする導電性ペ
ースト組成物。(Means for Solving the Problems) As a result of various studies, the present inventors found that 1) a saturated or unsaturated higher fatty acid having a hydroxyl group as an additive in a conductive paste composition consisting of copper powder and a synthetic resin; A conductive paste composition comprising a basic higher aliphatic amine and/or a nitrogen-containing heterocyclic compound.
２）請求項１の添加剤として、水酸基を有する飽和ある
いは不飽和高級脂肪酸としては、ヒドロキシステアリン
酸、リシノール酸であることを特徴とする導電性ペース
ト組成物。2) A conductive paste composition as claimed in claim 1, wherein the saturated or unsaturated higher fatty acid having a hydroxyl group is hydroxystearic acid or ricinoleic acid.
３）請求項１の添加剤として塩基性高級脂肪族アミンお
よび異部環状化合物としては、トリエタノールアミン、
Ｎ−シクロヘキシルジエタノールアミン、ジ−ｎ−オク
チルアミン、アルキルトリオキシエチレンアンモニウム
ハイドロオキサイド、Ｎ−ｎ−ブチルジエタノールアミ
ン、１．１’、１°°−ニトリロ−２−プロパノール、
キノリンおよびイソキノリンであることを特徴とする導
電性ペースト組成物により解決した。3) The basic higher aliphatic amine and heterocyclic compound used as the additive in claim 1 include triethanolamine,
N-cyclohexyldiethanolamine, di-n-octylamine, alkyltrioxyethylene ammonium hydroxide, N-n-butyldiethanolamine, 1.1',1°°-nitrilo-2-propanol,
The problem was solved by a conductive paste composition characterized by quinoline and isoquinoline.
本発明に使用する銅粉末は、通常の電解法で製造された
市販品で十分であり、その粉末の形状も樹枝状、憐片状
、球状いずれでも使用できる。また、その粒度は０．１
乃至２００ミクロンが望ましいが用途の応じて使い分け
られるものであり、限定されるものではない。As the copper powder used in the present invention, a commercially available product produced by a normal electrolytic method is sufficient, and the shape of the powder can be any of dendritic, flaky, and spherical. In addition, the particle size is 0.1
A range of 200 to 200 microns is desirable, but it can be used depending on the purpose and is not limited.
本発明で使用する樹脂は、フェノール樹脂、メラミン樹
脂、キシし・ン樹脂である。フェノール樹脂は例えば、
市販されている三菱ガス化学（株）製ＰＣ−１、群末化
学（株）製ＰＬ ４３４８Ｂであり。The resins used in the present invention are phenol resins, melamine resins, and xylene resins. For example, phenolic resin is
These are commercially available PC-1 manufactured by Mitsubishi Gas Chemical Co., Ltd. and PL 4348B manufactured by Gunsue Chemical Co., Ltd.
メラミン樹脂は例えば三相ケミカル（株）製二カラツク
ＭＸ−７０８，ＭＳ−００１であり、キシレン樹脂は例
えば三菱ガス化学（株）製ＰＲ−１５４０である。The melamine resin is, for example, Nikaratsuku MX-708, MS-001 manufactured by Sanso Chemical Co., Ltd., and the xylene resin is, for example, PR-1540 manufactured by Mitsubishi Gas Chemical Co., Ltd.
本発明に使用する水酸基を有する飽和あるいは不飽和高
級脂肪酸の例としては、ヒドロキシステアリン酸、リシ
ノール酸であるｃ以下、添加剤Ａと総称する）６
本発明に使用する塩基性高級脂肪族アミンおよび異部環
状化合物としては、トリエタノールアミン、Ｎ−シクロ
ヘキシルジエタノールアミン、ジ−ｎ−オクチルアミン
、アルキルトリオキシエチレンアンモニウムハイドロオ
キサイド、Ｎ−ｎ−ブチルジエタノールアミン、１．１
．１’“−ニトリロ−２−プロパノール、キノリンおよ
びイソキノリンであるＣ以下、添加剤Ｂと総称する）。Examples of the saturated or unsaturated higher fatty acids having a hydroxyl group used in the present invention include hydroxystearic acid and ricinoleic acid. Examples of heterocyclic compounds include triethanolamine, N-cyclohexyldiethanolamine, di-n-octylamine, alkyltrioxyethylene ammonium hydroxide, N-n-butyldiethanolamine, 1.1
．． 1'"-nitrilo-2-propanol, quinoline and isoquinoline (hereinafter collectively referred to as additive B).
これらの銅ペースト組成物の配合比率は銅粉は、７５〜
９５ｗｔ％好ましくは８５〜９０ｗｔ％であり、残りは
バインターである樹脂と添加剤である。The blending ratio of these copper paste compositions is 75 to 75.
The content is 95 wt%, preferably 85 to 90 wt%, with the remainder being binder resin and additives.
この範囲以下、以上でも抵抗値が大きくなる。Below or above this range, the resistance value increases.
添加剤は銅粉１００重量部に対し酸０，５〜１［］重量
部好ましくは１〜３重量部であり、塩基０．５〜ＩＯ重
量部好ましくは１〜５重量部である。The additives are 0.5 to 1[] parts by weight of acid, preferably 1 to 3 parts by weight, and 0.5 to IO parts by weight, preferably 1 to 5 parts by weight of base, per 100 parts by weight of copper powder.
添加量が少ないと抵抗値が大きくなる。添加量が多いと
抵抗値を下げる効果が飽和してきて、多く入れる必要が
なくなるし、場合によっては塗膜強度の低下をもたらす
。If the amount added is small, the resistance value becomes large. If the amount added is large, the effect of lowering the resistance value becomes saturated, and there is no need to add a large amount, which may lead to a decrease in coating film strength.
（実施例） 本発明を実施例に基づいて詳細に説明する。(Example) The present invention will be explained in detail based on examples.
実施例１
添加剤Ａとしてリシノール酸、添加剤Ｂとしてトリエタ
ノールアミンを用い簡略法により試験した。Example 1 A test was conducted using a simplified method using ricinoleic acid as additive A and triethanolamine as additive B.
１）
以下の配合で添加剤Ａを含む銅ペースト（Ａペースト）
を作製した。1) Copper paste containing additive A in the following formulation (A paste)
was created.
ついで添加剤Ｂを下記の配合比で添加した。Additive B was then added in the following mixing ratio.
銅ペースト／添加剤Ｂ ＝１００／ ３ （重量比）第
１図に示すように、プラスチック板（ガラス繊維補強エ
ポキシ樹脂積層板）に銅箔を張り付けた幅３ｃｎ＋ Ｘ
長さ６ｃＩＴｌの銅張り積層板の中央部４の銅箔をエツ
チングして除き、プラスチック板１の両端部に１．５ｃ
ｍ幅の銅箔部２および２を残した基板Ａ（基板Ａの両銅
箔部２および２間の距離３ｃａ＋である）を用意し、第
２図に示すように基板Ａに、導電性塗料をＬｃｍ幅にセ
ロテープ−枚分の厚さでガラス棒により塗布し、得られ
た塗膜３ （硬化後はぼ５０μ１Ｔ１）を１５０°Ｃ１
５分間硬化した後、マイクロメータで、電気抵抗を測定
し、それを３で割って面積抵抗値を求めた。その結果は
下記の通りである。Copper paste/additive B = 100/3 (weight ratio) As shown in Figure 1, a plastic plate (glass fiber reinforced epoxy resin laminate) with copper foil pasted on it has a width of 3cn+X.
The copper foil on the center part 4 of the copper-clad laminate with a length of 6c ITl is etched away, and the copper foil of 1.5c is etched on both ends of the plastic plate 1.
Prepare a board A with m-width copper foil parts 2 and 2 left (distance between both copper foil parts 2 and 2 of board A is 3ca+), and apply conductive paint to board A as shown in Figure 2. was applied to a Lcm width with a glass rod to a thickness equivalent to a sheet of cellophane tape, and the resulting coating film 3 (approximately 50μ1T1 after curing) was heated at 150°C1.
After curing for 5 minutes, the electrical resistance was measured with a micrometer and divided by 3 to obtain the sheet resistance value. The results are as follows.
Ｊシノール酸とトリエタノールアミンとの併用が効果が
ある。A combination of J-sinoleic acid and triethanolamine is effective.
実施例２ 各種の添加剤について次の方法で試験した。Example 2 Various additives were tested using the following method.
添加剤Ａとしては、ヒドロキシステアリン酸、Ｊシノー
ル酸を用い、添加剤Ｂとしてトリエタノルアミン、Ｎ−
シクロヘキシルジエタノールアミン、Ｎ−ｎ−ブチルジ
エタノールアミン、ｉ、ｔ 、ｔ１ニトリロ−２−プロ
パノール、キノリンおよびイソキノリンを用い試験した
。As additive A, hydroxystearic acid and J sinoleic acid were used, and as additive B, triethanolamine and N-
Cyclohexyldiethanolamine, N-n-butyldiethanolamine, i,t,t1 nitrilo-2-propanol, quinoline and isoquinoline were tested.
配合 Ａぺ一又ト５０ｇに添加剤Ｂを１５ｇ混ぜていく。combination Mix 15g of Additive B with 50g of A Pematata.
添加剤
Ａ−１ヒドロキシステアリン酸 Ｂ−１）すＪタ
ノールアミンＡ−２リノノール 酸 Ｂ
−２ニトリロプロパツール （ＮＴＰＢ−３Ｎ−シクロ
ヘキシルジエタノールアミンＢ−４ブチルジェタノール
アミン１ＢＤＥＡ）Ｂ−５４７リン
Ｂ−６イソキノリン
例として
なお、ＢＯは添加剤としてＢ成分を含まないことを示す
比較例である。Additive A-1 Hydroxystearic acid B-1) Tanolamine A-2 Linonol acid B
-2 Nitrilopropatol (NTPB-3N-Cyclohexyldiethanolamine B-4 Butylgetanolamine 1BDEA) B-547 Phosphorus B-6 Isoquinoline As an example, BO is a comparative example showing that it does not contain component B as an additive. .
印刷条件
テトロン１８０メツシユ乳材厚１５ｕ
スクリーン印刷で紙フエノールＩＦＲ−２１およびガラ
エポ基板上（ＦＲ−４１に（第３図）塗布面積が、以下
の三つのサイズになるように塗布し。Printing conditions Tetron 180 mesh Emulsion thickness 15u Screen printing was applied to paper phenol IFR-21 and glass epoxy substrate (FR-41 (Fig. 3) so that the coating area was the following three sizes.
試料 大 ２Ｘ２ｃｍ
中 ｌＸ１ｃｍ
小 ０．５ Ｘ Ｏ，５ｃｍ
硬化条件
１５０℃ＸｌＳ分、１７０℃ＸｌＳ分
確認項目
初期の面積抵抗値および硬化塗膜（膜厚１５〜２０μ）
を更に６０分煮沸した後の面積抵抗値（煮沸後）と、硬
化後型に２６０℃で５分間熱処理した場合のデーターを
加熱後とを求めた。Sample Large 2 x 2 cm Medium 1 x 1 cm Small 0.5
The area resistance value (after boiling) after boiling for an additional 60 minutes and the data after heating when the cured mold was heat treated at 260° C. for 5 minutes were determined.
結果は第１〜２表に示す。The results are shown in Tables 1 and 2.
水酸基を有する飽和あるいは不飽和高級脂肪酸と塩基性
高級脂肪族アミンおよび／または窒素含有異部環状化合
物の併用効果がある。There is a combined effect of a saturated or unsaturated higher fatty acid having a hydroxyl group, a basic higher aliphatic amine and/or a nitrogen-containing heterocyclic compound.
（発明の効果）
本発明の添加剤は導電性が良く、溢加剤としての効果が
あり各種の基板に利用できる。(Effects of the Invention) The additive of the present invention has good conductivity and is effective as a flooding agent, and can be used for various substrates.
第１区、第２図は、本発明の導電性ペーストの簡略テス
トを試験するブラ又チック扱の平面図である。
第３区は、本発明の４電性ペーストの本試験を試験する
紙フエノールおよびガラエボ基板の北の導電性ペースト
の塗布の平面図である。
図面の浄書（内容に変更なし）
第 １ 図
第
図
第
図
手
続
補
正
平成３年２月８日Section 1 and FIG. 2 are plan views of a bra or tick used to conduct a simple test of the conductive paste of the present invention. Section 3 is a plan view of the application of the conductive paste on the north of the paper phenol and Galevo substrates testing the present test of the tetraconductive paste of the present invention. Engraving of the drawings (no changes to the contents) Figure 1 Figure Procedures Amendment February 8, 1991
Claims (1)
において添加剤として水酸基を有する飽和あるいは不飽
和高級脂肪酸と、塩基性高級脂肪族アミンおよび／また
は窒素含有異節環状化合物とを含有することを特徴とす
る導電性ペースト組成物。 ２） 請求項１の添加剤として、水酸基を有する飽和あ
るいは不飽和高級脂肪酸としては、ヒドロキシステアリ
ン酸、リシノール酸であることを特徴とする導電性ペー
スト組成物。 ３） 請求項１の添加剤として塩基性高級脂肪族アミン
および窒素含有異節環状化合物としては、トリエタノー
ルアミン、Ｎ−シクロヘキシルジエタノールアミン、シ
−ｎ−オクチルアミン、アルキルトリオキシエチレンア
ンモニウムハイドロオキサイド、Ｎ−ｎ−ブチルジエタ
ノールアミン、１，１′，１′′−ニトリロ−２−プロ
パノール、キノリンおよびイソキノリンであることを特
徴とする導電性ペースト組成物。[Scope of Claims] 1) A conductive paste composition consisting of copper powder and a synthetic resin, in which a saturated or unsaturated higher fatty acid having a hydroxyl group, a basic higher aliphatic amine and/or a nitrogen-containing heterocyclic compound are used as additives. A conductive paste composition comprising: 2) A conductive paste composition as claimed in claim 1, wherein the saturated or unsaturated higher fatty acid having a hydroxyl group is hydroxystearic acid or ricinoleic acid. 3) Examples of the basic higher aliphatic amine and nitrogen-containing heterocyclic compound as the additive of claim 1 include triethanolamine, N-cyclohexyldiethanolamine, C-n-octylamine, alkyltrioxyethylene ammonium hydroxide, N - An electrically conductive paste composition characterized by comprising n-butyldiethanolamine, 1,1',1''-nitrilo-2-propanol, quinoline and isoquinoline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26994490A JP2963518B2 (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26994490A JP2963518B2 (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04146975A true JPH04146975A (en) | 1992-05-20 |
| JP2963518B2 JP2963518B2 (en) | 1999-10-18 |
Family
ID=17479384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26994490A Expired - Lifetime JP2963518B2 (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2963518B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120048426A1 (en) * | 2010-08-25 | 2012-03-01 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Surface-coated metal nanoparticles, method for producing the same, and metal nanoparticle paste comprising the same |
| WO2014057633A1 (en) * | 2012-10-12 | 2014-04-17 | バンドー化学株式会社 | Bonding composition |
-
1990
- 1990-10-08 JP JP26994490A patent/JP2963518B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120048426A1 (en) * | 2010-08-25 | 2012-03-01 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Surface-coated metal nanoparticles, method for producing the same, and metal nanoparticle paste comprising the same |
| JP2012046779A (en) * | 2010-08-25 | 2012-03-08 | Toyota Central R&D Labs Inc | Surface-coated metal nanoparticle, method for producing the same, and metal nanoparticle paste containing the same |
| US8764913B2 (en) | 2010-08-25 | 2014-07-01 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Surface-coated metal nanoparticles, method for producing the same, and metal nanoparticle paste comprising the same |
| WO2014057633A1 (en) * | 2012-10-12 | 2014-04-17 | バンドー化学株式会社 | Bonding composition |
| EP2907602A1 (en) * | 2012-10-12 | 2015-08-19 | Bando Chemical Industries, Ltd. | Bonding composition |
| EP2907602A4 (en) * | 2012-10-12 | 2016-06-01 | Bando Chemical Ind | Bonding composition |
| US9365592B2 (en) | 2012-10-12 | 2016-06-14 | Bando Chemical Industries, Ltd. | Bonding composition |
| JPWO2014057633A1 (en) * | 2012-10-12 | 2016-08-25 | バンドー化学株式会社 | Bonding composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2963518B2 (en) | 1999-10-18 |
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