JPH04145697A - Guide structure of electronic circuit package - Google Patents
Guide structure of electronic circuit packageInfo
- Publication number
- JPH04145697A JPH04145697A JP26978290A JP26978290A JPH04145697A JP H04145697 A JPH04145697 A JP H04145697A JP 26978290 A JP26978290 A JP 26978290A JP 26978290 A JP26978290 A JP 26978290A JP H04145697 A JPH04145697 A JP H04145697A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- guide
- guide groove
- circuit package
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子回路のパッケージの案内構造Ｊこ関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a guide structure for a package of an electronic circuit.
近年、電子回路パッケージに搭載される回路素子の高集
積化、高密度実装化に伴ないプリント基板の信号層およ
び電源層の増加が必要となった。In recent years, as circuit elements mounted on electronic circuit packages have become more highly integrated and more densely packaged, it has become necessary to increase the number of signal layers and power supply layers on printed circuit boards.
これに対応してプリント基板も多種類の板厚のものが必
要となっている。また、回路素子の高集積化、高密度実
装化に伴ない電子回路パッケージの接続に用いられるコ
ネクタも高密度化、高微細化が行なわれている。このよ
うな電子回路のパッケージの実装構造として複数枚の電
子回路パッケージと複数個のコネクタを設けたバックパ
ネルとからなるもとのがある。電子回路パッケージはバ
ックパネル面に対し垂直方向にコネクタに挿入にされ接
続される。Correspondingly, printed circuit boards of various thicknesses are required. In addition, as circuit elements become more highly integrated and more densely packaged, connectors used to connect electronic circuit packages are also becoming more densely packed and finer. As a mounting structure for such an electronic circuit package, there is a structure consisting of a plurality of electronic circuit packages and a back panel provided with a plurality of connectors. The electronic circuit package is inserted into the connector in a direction perpendicular to the back panel surface and connected.
第４図は従来の電子回路パッケージの接続構造を示す斜
視図である。図において、回路素子１とソケットコネク
タ２とを搭載したそれぞれ板厚の等しい複数のプリント
基板３ａはコ字型断面の案内溝２５を有するガイド２６
ａおよび２６ｂ４、より案内され、バックパネル７に実
装されたビニコネクタ８に嵌合する構造となっていた。FIG. 4 is a perspective view showing the connection structure of a conventional electronic circuit package. In the figure, a plurality of printed circuit boards 3a on which circuit elements 1 and socket connectors 2 are mounted, each having the same thickness, are connected to a guide 26 having a guide groove 25 with a U-shaped cross section.
a and 26b4, and was structured to fit into the vinyl connector 8 mounted on the back panel 7.
ガイ１２６ａ、２６ｂおよびバックパネル７はフレー１
１０に取り付けられている。The guys 126a, 26b and the back panel 7 are attached to the frame 1.
It is attached to 10.
一方、板厚のそれぞれ異なるプリント基板をヲ装するた
めには、第５図に示すようにガイド２〔の案内溝２５ａ
の溝幅は最大の板厚のプリント１板３ｃに対応するもの
とし、これにより薄いプしント基板３ａ及び３ｂに対し
ては、それぞれのおの厚さに応じたスペーサ９ａ、９ｂ
（折り曲げ終れ、端辺を案内溝２５ａの底辺に設けらら
れたＪ２５ｂおよび案内溝２５ａに隣接して設けられ穴
溝２５ｃに挿入）を適宜取り付は案内溝２５ａと回路基
板３ａ、３ｂの板厚との間のクリアランクの減少させて
、コネクタの位置合せが容易となるようにしている。On the other hand, in order to mount printed circuit boards with different thicknesses, the guide groove 25a of the guide 2 is used as shown in FIG.
The groove width corresponds to the maximum thickness of the printed circuit board 3c. Therefore, for the thin printed circuit boards 3a and 3b, spacers 9a and 9b according to the respective thicknesses are used.
(After bending, insert the end edge into J25b provided at the bottom of the guide groove 25a and the hole groove 25c provided adjacent to the guide groove 25a) as appropriate for installation between the guide groove 25a and the board between the circuit boards 3a and 3b. The clear rank between the thickness and thickness is reduced to facilitate connector alignment.
従来の電子回路のパッケージの案内構造では、プリント
基板の板厚の多様化に対処するには、彷圧に対応した案
内溝を設けたガイドを多種類用意する必要があり、この
ため、標準化がはかれず高価になる。また、標準化をは
かるため、プリント基板の最大の板厚に対応する幅の溝
のガイドを作ると、板厚の小さいプリント基板に対して
は案内溝とのクリアランスが大きくなるので、コネクタ
の嵌合が困難となる。これを防止するために第５図に示
したようにスペーサを設けると作業工数が増大するとい
う問題点がある。In the conventional guide structure of electronic circuit packages, in order to cope with the diversification of printed circuit board thickness, it is necessary to prepare many types of guides with guide grooves corresponding to the rolling pressure. It's not cheap and it's expensive. In addition, for standardization, if a groove guide is made with a width corresponding to the maximum board thickness of the printed circuit board, the clearance between the guide groove and the guide groove will be large for printed boards with small board thickness, making it difficult to mate the connector. becomes difficult. In order to prevent this, if a spacer is provided as shown in FIG. 5, there is a problem that the number of work steps increases.
本発明は、バックパネルに対して固定された一対のガイ
ドの対向する面に電子回路のパッケージのプリント基板
の対向する２辺を案内する案内溝を設け、前記プリント
基板を前記案内溝に沿って移動させて前記バックパネル
に押し付けることにより前記電子回路パッケージが前記
バックパネルに電気的に接続される電子回路パッケージ
の案内構造において、前記案内溝の片側の内側面に設け
たバネにより前記プリント基板の２辺を前記案内溝の他
の内側面に押し付けることを特徴とする。The present invention provides guide grooves for guiding two opposing sides of a printed circuit board of an electronic circuit package on opposing surfaces of a pair of guides fixed to a back panel, and guides the printed circuit board along the guide grooves. In the guide structure for an electronic circuit package in which the electronic circuit package is electrically connected to the back panel by being moved and pressed against the back panel, a spring provided on an inner surface of one side of the guide groove allows the printed circuit board to be moved and pressed against the back panel. It is characterized in that two sides are pressed against the other inner surface of the guide groove.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の部分斜視図、第２図は第１
図のＡ−Ａ断面図、第３図はコネクタ接続部の説明図で
ある。FIG. 1 is a partial perspective view of one embodiment of the present invention, and FIG.
The AA sectional view in the figure and FIG. 3 are explanatory diagrams of the connector connection portion.
回路素子１とソケットコネクタ２を厚さの異なるプリン
ト板３ａ、３ｂ、３ｃに実装して電子回路パッケージ４
を構成している。また、バックパネル７にはピンコネク
タ８が実装されており、バックパネル７は上下に位置す
るクレーム１０に固定され、またフレーム１０にはバッ
クパネル７に対して直角にガイド６ａ、６ｂが取り付け
られ、各電子パッケージ４を支持する案内溝５が設けら
れている。An electronic circuit package 4 is created by mounting the circuit element 1 and socket connector 2 on printed boards 3a, 3b, and 3c having different thicknesses.
It consists of Further, a pin connector 8 is mounted on the back panel 7, and the back panel 7 is fixed to claims 10 located above and below, and guides 6a and 6b are attached to the frame 10 at right angles to the back panel 7. , a guide groove 5 for supporting each electronic package 4 is provided.
案内？１１５は、その−側面にバネ１１が設られており
、厚さの異なるプリント基板３ａ、３ｂ、３ｃが挿入さ
れてもバネ１１により案内溝５のもう一方の側面にプリ
ント基板３ａ、３ｂ、３ｃの基準面１２が押し付けられ
、プリント基板３ａ、３ｂ、３ｃの厚さにががわらず基
準面１２が案内７１４５に対し一定の位置へくるなめコ
ネクタの位置合せができコネクタ２．８の嵌合も容易に
行なえる。guidance? 115 is provided with a spring 11 on its negative side, and even if printed circuit boards 3a, 3b, 3c of different thicknesses are inserted, the spring 11 will cause the printed circuit boards 3a, 3b, 3c to remain on the other side of the guide groove 5. The reference surface 12 of the printed circuit board 3a, 3b, 3c is pressed to a fixed position with respect to the guide 7145 regardless of the thickness of the printed circuit boards 3a, 3b, 3c. Easy to do.
以上説明したように、本発明によれば案内溝に設けたバ
ネによりプリント基板を押し付けることにより板厚の異
なるプリント基板よりなる電子回路パッケージについて
も同一形状の清を有するガイドにて基準面を一定にでき
、安定して実装できコネクタの位置合わせも容易になる
。したがってガイドを標準化でき、スペーサ等の必要も
ないなめ製造作業コストを下げることできるという利点
がある。As explained above, according to the present invention, by pressing the printed circuit board with the spring provided in the guide groove, the reference plane can be kept constant even for electronic circuit packages made of printed circuit boards of different thicknesses using guides having the same shape. This allows for stable mounting and easy connector positioning. Therefore, there is an advantage that the guide can be standardized and that there is no need for spacers or the like, thereby reducing the manufacturing cost.
第１図および第２図はそれぞれ本発明の一実施例の部分
斜視図およびＡ−Ｘ断面図、第３図は第１図に示す実施
例の接続部の部分横断回国、第４図は従来の電子回路パ
ッケージの案内構造の部分斜視図、第５図は他の従来の
電子回路パッケージの案内構造の案内溝部分の正面図で
ある。
１・・・・・・回路素子、２・・・・・・ソケットコネ
クタ、３ａ〜３Ｃ・・・・・・プリント板、４・・・・
・・電子回路パッケージ、５．２５．２５ａ・・・・・
・案内溝、６ａ、６ｂ、２６．２６ａ、２６ｂ・・・・
・・ガイド、７・・・・・・バックパネル、８・・・・
・・ピンコネクタ、９ａ、９ｂ・・・・・・スペーサ、
１０・・・・・・フレーム、１１・・・・・・バネ、１
２・・・・・・基準面。1 and 2 are a partial perspective view and an A-X sectional view of an embodiment of the present invention, respectively, FIG. 3 is a partial cross-sectional view of the connection part of the embodiment shown in FIG. 1, and FIG. 4 is a conventional FIG. 5 is a partial perspective view of the guide structure of another conventional electronic circuit package, and FIG. 5 is a front view of the guide groove portion of the guide structure of another conventional electronic circuit package. 1...Circuit element, 2...Socket connector, 3a to 3C...Printed board, 4...
...Electronic circuit package, 5.25.25a...
・Guide groove, 6a, 6b, 26.26a, 26b...
...Guide, 7...Back panel, 8...
...Pin connector, 9a, 9b...Spacer,
10...Frame, 11...Spring, 1
2...Reference surface.
Claims (1)
する面に電子回路のパッケージのプリント基板の対向す
る２辺を案内する案内溝を設け、前記プリント基板を前
記案内溝に沿って移動させて前記バックパネルに押し付
けることにより前記電子回路パッケージが前記バックパ
ネルに電気的に接続される電子回路パッケージの案内構
造において、前記案内溝の片側の内側面に設けたバネに
より前記プリント基板の２辺を前記案内溝の他の内側面
に押し付けることを特徴とする電子回路のパッケージの
案内構造。Guide grooves for guiding two opposing sides of a printed circuit board of an electronic circuit package are provided on opposing surfaces of a pair of guides fixed to the back panel, and the printed circuit board is moved along the guide grooves to In a guide structure for an electronic circuit package in which the electronic circuit package is electrically connected to the back panel by pressing against the back panel, two sides of the printed circuit board are connected to the A guide structure for an electronic circuit package, characterized in that it is pressed against another inner surface of a guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26978290A JPH04145697A (en) | 1990-10-08 | 1990-10-08 | Guide structure of electronic circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26978290A JPH04145697A (en) | 1990-10-08 | 1990-10-08 | Guide structure of electronic circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04145697A true JPH04145697A (en) | 1992-05-19 |
Family
ID=17477084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26978290A Pending JPH04145697A (en) | 1990-10-08 | 1990-10-08 | Guide structure of electronic circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04145697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103540A (en) * | 2006-10-19 | 2008-05-01 | Omron Corp | Fitting structure for substrate in electronic equipment |
-
1990
- 1990-10-08 JP JP26978290A patent/JPH04145697A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103540A (en) * | 2006-10-19 | 2008-05-01 | Omron Corp | Fitting structure for substrate in electronic equipment |
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