JPH0414491B2 - - Google Patents

Info

Publication number: JPH0414491B2
Authority: JP; Japan
Prior art keywords: wafer; wafer holder; electron beam; reference member; alignment stage
Prior art date: 1984-05-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP59102277A

Other languages

English (en)

Japanese (ja)

Other versions

JPS60245221A (ja

Inventor

Akira Iwase

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shibaura Machine Co Ltd

Original Assignee

Toshiba Machine Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-05-21

Filing date

1984-05-21

Publication date

1992-03-13

1984-05-21 Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd

1984-05-21 Priority to JP59102277A priority Critical patent/JPS60245221A/ja

1985-12-05 Publication of JPS60245221A publication Critical patent/JPS60245221A/ja

1992-03-13 Publication of JPH0414491B2 publication Critical patent/JPH0414491B2/ja

Status Granted legal-status Critical Current

Links

238000000609 electron-beam lithography Methods 0.000 claims description 6
238000010894 electron beam technology Methods 0.000 description 5
239000000696 magnetic material Substances 0.000 description 5
238000000034 method Methods 0.000 description 5
238000003825 pressing Methods 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 2
239000000758 substrate Substances 0.000 description 2
230000001988 toxicity Effects 0.000 description 2
231100000419 toxicity Toxicity 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000001459 lithography Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000011282 treatment Methods 0.000 description 1

JP59102277A 1984-05-21 1984-05-21 電子ビ−ム描画装置用ウエハホルダ Granted JPS60245221A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP59102277A JPS60245221A (ja)	1984-05-21	1984-05-21	電子ビ−ム描画装置用ウエハホルダ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP59102277A JPS60245221A (ja)	1984-05-21	1984-05-21	電子ビ−ム描画装置用ウエハホルダ

Publications (2)

Publication Number	Publication Date
JPS60245221A JPS60245221A (ja)	1985-12-05
JPH0414491B2 true JPH0414491B2 (es)	1992-03-13

Family

ID=14323103

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP59102277A Granted JPS60245221A (ja)	1984-05-21	1984-05-21	電子ビ−ム描画装置用ウエハホルダ

Country Status (1)

Country	Link
JP (1)	JPS60245221A (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5095300A (en) *	1990-03-28	1992-03-10	Nec Electronics Inc.	Device for sensing side positioning of wafers

1984
- 1984-05-21 JP JP59102277A patent/JPS60245221A/ja active Granted

Also Published As

Publication number	Publication date
JPS60245221A (ja)	1985-12-05

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Legal Events

Date	Code	Title	Description
2004-03-13	LAPS	Cancellation because of no payment of annual fees