JPH04133497A - Cooling structure of electronic device - Google Patents
Cooling structure of electronic deviceInfo
- Publication number
- JPH04133497A JPH04133497A JP2256409A JP25640990A JPH04133497A JP H04133497 A JPH04133497 A JP H04133497A JP 2256409 A JP2256409 A JP 2256409A JP 25640990 A JP25640990 A JP 25640990A JP H04133497 A JPH04133497 A JP H04133497A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- tank
- electronic device
- circulation path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 43
- 239000003507 refrigerant Substances 0.000 claims description 56
- 238000007599 discharging Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims 1
- 239000002826 coolant Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、発熱電子部品を液冷媒を用いて冷却する電子
装置、および、これに搭載する冷却ユニットに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device that cools heat-generating electronic components using a liquid refrigerant, and a cooling unit installed therein.
［従来の技術］ 近年、電子装置は、これに搭載する集積回路のる。[Conventional technology] In recent years, electronic devices are equipped with integrated circuits.
そこで、この様な電子装置では空気の強制対流による空
冷方式に代えて、液冷方式が採用されている。Therefore, in such electronic devices, a liquid cooling method is adopted instead of an air cooling method using forced convection of air.
この様な液体冷媒を用いた一般的な冷却方式を第３図お
よび第４図に示す。A general cooling method using such a liquid refrigerant is shown in FIGS. 3 and 4.
第３図において、電子装置は１台の冷却筐体１１と複数
台の電子回路筐体１２で構成され、冷却筐体と各電子筐
体とは冷媒の供給、回収のため、フレキシブル管１３で
接続される。In FIG. 3, the electronic device is composed of one cooling case 11 and a plurality of electronic circuit cases 12, and the cooling case and each electronic case are connected by flexible tubes 13 for supplying and recovering refrigerant. Connected.
このフレシキブル管１３は、作業性の要請等より床下に
配置される。This flexible pipe 13 is placed under the floor due to demands for workability.
冷却筐体１１は、第４図に示す様に冷媒を冷却する熱交
換器５、冷媒を圧送するポンプ３、冷媒膨張タンク２と
これらの配管路から成り、電子回路筐体１２への冷媒の
供給、回収と冷却を行う。As shown in FIG. 4, the cooling case 11 consists of a heat exchanger 5 that cools the refrigerant, a pump 3 that pumps the refrigerant, a refrigerant expansion tank 2, and these piping lines, and supplies the refrigerant to the electronic circuit case 12. Provides supply, collection and cooling.
電子回路筐体は、第４図に示す様に集積回路を基板に実
装した電子回路モジュール４、このモジュールの発熱を
冷媒へ伝熱するための冷却ジャケット１４、冷却ジャケ
ットへ冷媒を導く配管路１５から成り、集積回路で発生
した熱を冷媒へ伝熱させ電子回路モジュールの冷却が行
なわれる。As shown in FIG. 4, the electronic circuit housing includes an electronic circuit module 4 in which an integrated circuit is mounted on a substrate, a cooling jacket 14 for transferring heat generated by this module to a refrigerant, and a piping path 15 for guiding the refrigerant to the cooling jacket. The electronic circuit module is cooled by transferring the heat generated in the integrated circuit to the refrigerant.
［発明が解決しようとする課題］
このような液冷方式の採用によって、空冷方式に比へ冷
却能力を格段に向上することができる。[Problems to be Solved by the Invention] By adopting such a liquid cooling system, the cooling capacity can be significantly improved compared to that of an air cooling system.
しかし、このような液冷方式を用いた装置においては、
長期間の運転停止の場合、冷媒の劣下により冷却ジャケ
ットや配管の腐食が加速される恐れがあるため、冷媒を
排出する必要がある。However, in devices using such a liquid cooling method,
If the plant is out of operation for a long period of time, it is necessary to drain the refrigerant because corrosion of the cooling jacket and piping may be accelerated due to deterioration of the refrigerant.
しかし、冷媒の排出方法については、特に配慮でいなか
った。However, no particular consideration was given to the method of discharging the refrigerant.
すなわち、従来の構造（第３図、第４図）によれば、床
下に配置されたフレシキブル管１３や配管炉１５等に冷
媒が排出されずに残留してしまうという問題があった。That is, according to the conventional structure (FIGS. 3 and 4), there was a problem in that the refrigerant was not discharged and remained in the flexible pipe 13, pipe furnace 15, etc. located under the floor.
この場合、高圧とした空気を送り込み、冷却ジャケット
の冷媒を除去する方法も考案されているが、この方法に
よれば、圧縮機がメンテナンス設備として必要となり、
また、排出作業が複雑になる等の欠点があった。In this case, a method has been devised to remove the refrigerant from the cooling jacket by sending in high-pressure air, but this method requires a compressor as maintenance equipment.
In addition, there was a drawback that the evacuation work became complicated.
そこで、本発明の目的は、冷媒を容易に排出できる電子
装置の液冷却構造を提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a liquid cooling structure for an electronic device that can easily discharge a refrigerant.
［課題を解決するための手段］
前記目的達成のために、本発明は、同一筐体内に収容さ
れた、電子部品と、電子部品を冷却する冷媒の循環径路
を構成するポンプと冷却ジャケットと熱交換器とタンク
とを有し、
前記循環径路中において抽出されるＵ字径路部の下部に
設けられた冷媒排出用ドレンと、前記循環径路中におい
て抽出される逆Ｕ字径路部の上部に設けられた空気弁と
を有することを特徴とする電子装置を提供する。[Means for Solving the Problems] In order to achieve the above object, the present invention provides electronic components, a pump, a cooling jacket, and a thermal It has an exchanger and a tank, a drain for discharging refrigerant provided at the lower part of the U-shaped path part extracted in the circulation path, and a drain provided at the upper part of the inverted U-shaped path part extracted in the circulation path. An electronic device is provided, characterized in that it has an air valve.
なお、前記空気弁は、冷媒排出時にのみ開放されるもの
であっても、大気開放型タンクの空気口を利用するもの
であってもよい。Note that the air valve may be one that is opened only when the refrigerant is discharged, or may be one that utilizes an air port of a tank that is open to the atmosphere.
また、本発明においては、この電子装置に良好な具体的
実施態様として１発熱電子回路部品の熱を液体冷媒に伝
熱させる冷却ジャケットと、冷媒の冷却および冷却ジャ
ケットへ冷媒を供給する手段としての、ポンプ、熱交換
器、タンクを備えた冷媒冷却部を同一筐体内に収容し、
前記タンクを冷媒配管系の中で最高位に実装するととも
に、他の配管系に液留りのないことを特徴とする電子装
置と、冷却ジャケット、ポンプ、熱交換器、タンクを同
一筐体に収容し、少なくともタンクの取付は高さを熱交
換器より高くするとともに、熱交換器以外の配管系には
液留りのないことを特徴とする電子装置を提供する。In addition, in the present invention, as a preferable specific embodiment of the electronic device, 1 a cooling jacket is provided for transferring the heat of the heat-generating electronic circuit components to a liquid refrigerant, and a cooling jacket is provided as a means for cooling the refrigerant and supplying the refrigerant to the cooling jacket. A refrigerant cooling unit including a pump, a heat exchanger, and a tank is housed in the same housing,
The tank is mounted at the highest position in the refrigerant piping system, and the electronic device, the cooling jacket, the pump, the heat exchanger, and the tank are housed in the same housing, characterized by having no liquid accumulation in other piping systems. To provide an electronic device in which at least a tank is installed at a height higher than a heat exchanger, and there is no liquid accumulation in a piping system other than the heat exchanger.
［作用］
本発明に係る電子装置によれば、電子部品と、電子部品
を冷却する冷媒の循環径路を構成するポンプと冷却ジャ
ケットと熱交換器とタンクとを同一筐体内に収容したた
め、前記従来技術のように床下に冷媒径路を必要とせず
冷媒の排出を容易に行うことができる。[Function] According to the electronic device according to the present invention, the electronic component, the pump, the cooling jacket, the heat exchanger, and the tank constituting the circulation path of the refrigerant for cooling the electronic component are housed in the same housing. The refrigerant can be easily discharged without requiring a refrigerant path under the floor unlike the conventional technology.
また、前記循環径路中において抽出される逆Ｕ字径路部
の上部に設けられた空気弁よりの大気圧によって、前記
循環径路中において抽出されるＵ字径路部の下部に設け
られた冷媒排出用ドレンより全ての冷媒が排出されるた
め、前記従来技術のように圧縮空気等を利用する必要も
ない。Further, a refrigerant discharger provided at a lower part of the U-shaped path section extracted in the circulation path is used by atmospheric pressure from an air valve provided at the upper part of the inverted U-shaped path section extracted in the circulation path. Since all the refrigerant is discharged from the drain, there is no need to use compressed air or the like as in the prior art.
［実施例］ 以下、本発明の第１の実施例を説明する。[Example] A first embodiment of the present invention will be described below.
本第１実施例に係る電子装置は、第１図に示すように、
共に１つの筐体内に収納された電子回路部と冷媒を冷却
する冷媒冷却部で構成さ九る。As shown in FIG. 1, the electronic device according to the first embodiment has the following features:
It consists of an electronic circuit section and a refrigerant cooling section that cools the refrigerant, both of which are housed in one housing.
電子回路部は、集積回路を基板に実装した複数の電子回
路モジュール１６と、電子回路モジュールの発熱を冷媒
へ伝熱させるためモジュール表面へ密着取付した冷却ジ
ャケット４からなる。The electronic circuit section consists of a plurality of electronic circuit modules 16 in which integrated circuits are mounted on a substrate, and a cooling jacket 4 that is closely attached to the module surface in order to transfer heat generated by the electronic circuit modules to a coolant.
冷媒冷却部より供給された冷媒は、順次下側の冷却ジャ
ケットから上側のジャケットを通液し。The refrigerant supplied from the refrigerant cooling section sequentially passes from the lower cooling jacket to the upper jacket.
受熱により温まった冷媒を冷媒冷却部へ排出する。The refrigerant warmed by heat reception is discharged to the refrigerant cooling section.
この電子回路部内の配管はＵ字部等の液留りがないよう
にする。The piping inside this electronic circuit section should be free from liquid accumulation at U-shaped portions and the like.
冷媒冷却部は冷媒を加圧、送液するためのポンプ３．温
まった冷媒を筐体床面より人気したエアーと熱交換させ
て冷媒を冷やすための熱交換器５および送風機６、冷媒
の熱膨張、収縮による容積変化を吸収する大気開放形の
タンク２、これら部品間を接続する配管部品より成る。The refrigerant cooling section includes a pump 3 for pressurizing and feeding the refrigerant. A heat exchanger 5 and a blower 6 for cooling the refrigerant by exchanging heat with air flowing from the floor of the case, a tank 2 open to the atmosphere that absorbs changes in volume due to thermal expansion and contraction of the refrigerant, and these Consists of piping parts that connect parts.
冷却風８は。Cooling air 8.
本第１実施例においては上方より下方へと流れる。In the first embodiment, the flow flows from the top to the bottom.
この配管部品の接続順序は第１図に示すごとくポンプ３
、電子回路部４、熱交換器５、タンク２となり、ポンプ
３に帰る循環経路を形成する。The connection order of these piping parts is as shown in Figure 1.
, electronic circuit section 4, heat exchanger 5, and tank 2, forming a circulation path returning to the pump 3.
また部品の取付は高さはタンク２が最も高い位置にあり
、その他の部品、配管は液留りがないようにする。Also, when installing the parts, make sure that the tank 2 is at the highest position, and that there is no liquid accumulation on other parts or piping.
冷媒を排出するためのドレン７は、配管系の最下部に設
置される。A drain 7 for discharging the refrigerant is installed at the lowest part of the piping system.
以上の構成によれば、冷媒の排出時、ポンプ２にかかる
大気圧により、開放されたドレン７より配管系の冷媒は
全て排出される。According to the above configuration, when the refrigerant is discharged, all the refrigerant in the piping system is discharged from the opened drain 7 due to the atmospheric pressure applied to the pump 2.
第１図心部に示したのは、本第１実施例に係る電子装置
における冷媒径路を示したものであり。What is shown in the center of FIG. 1 is a refrigerant path in the electronic device according to the first embodiment.
図示するように、循環径路中において抽出される逆Ｕ字
径路部の上部にタンク（空気弁の役割をも果たす）を設
け、前記循環径路中において抽出されるＵ字径路部の下
部に冷媒排出用ドレンを設けた構成となっている。As shown in the figure, a tank (also serving as an air valve) is provided at the upper part of the inverted U-shaped path section from which the refrigerant is extracted in the circulation path, and the refrigerant is discharged to the lower part of the U-shaped path section from which the refrigerant is extracted in the circulation path. The structure is equipped with a drain for use.
次に、本発明の第２の実施例について説明する。Next, a second embodiment of the present invention will be described.
水弟２の実施例に係る電子装置は、第２図に示すように
、冷却風８を下方より上方に流す場合の構成であり、タ
ンク２の位置が熱交換器より高いが、電子回路部よりは
低い構成となっている。As shown in FIG. 2, the electronic device according to the embodiment of Suiden 2 has a configuration in which the cooling air 8 flows upward from the downward direction, and although the tank 2 is located higher than the heat exchanger, the electronic circuit section It has a lower configuration.
本第２実施例においては、図示するように、空気弁９が
配管系の最上部に、さらに第２のドレン１７が熱交換器
５に設置される。In the second embodiment, as shown, an air valve 9 is installed at the top of the piping system, and a second drain 17 is installed at the heat exchanger 5.
冷媒の排出は２段階で行なわれる。Refrigerant discharge takes place in two stages.
第１段階として、最上部の空気弁９を開くとともに最下
部のドレン７より、電子回路部４とタンク２、ポンプ３
の冷媒が排出される。As a first step, open the air valve 9 at the top and connect the electronic circuit section 4, tank 2, and pump 3 from the drain 7 at the bottom.
of refrigerant is discharged.
第２段階として、第２のドレン１７を開くと、熱交換器
５の冷媒が排出される。As a second step, when the second drain 17 is opened, the refrigerant in the heat exchanger 5 is discharged.
第２図心部に示したのは５本第２実施例に係る電子装置
における冷媒径路を示したものであり。The second centroid shows five refrigerant paths in the electronic device according to the second embodiment.
図示するように、循環径路中において抽出される２つの
逆Ｕ字径路部の上部にタンク（空気弁の役割をも果たす
）と空気弁を設け、前記循環径路中において抽出される
２つのＵ字径路部の下部に冷媒排出用ドレンを設けた構
成となっている。As shown in the figure, a tank (also serving as an air valve) and an air valve are provided above the two inverted U-shaped path sections extracted in the circulation path, and the two U-shaped paths extracted in the circulation path are provided with a tank (also serving as an air valve). A drain for discharging the refrigerant is provided at the lower part of the path.
以上説明したように、本実施例によれば、外部の加圧を
必要することなく簡単に配管系の冷媒を抜くことができ
、装置のメンテナンス設備が簡素化される。As described above, according to this embodiment, the refrigerant in the piping system can be easily drained without requiring external pressurization, and the maintenance equipment for the apparatus is simplified.
〔発明の効果コ
以上のように１本発明によれば、冷媒を容易に排出でき
る電子装置の液冷却構造を提供することができる。[Effects of the Invention] As described above, according to the present invention, it is possible to provide a liquid cooling structure for an electronic device in which the refrigerant can be easily discharged.
第１図は本発明の第１の実施例に係る電子装置の液冷却
構造を示すブロック図、第２図は第２の実施例に係る電
子装置の液冷却構造を示すブロック図、第３図は従来技
術に係る電子装置の構成を示すブロック図、第４図は従
来技術に係る液冷却構造を示すブロック図の冷媒循環経
路図である。
４・・・電子回路部、５・・・熱交換器、６・・・送風
機、７・・・ドレン、８・・・冷却風の流れ、９・・・
空気弁。FIG. 1 is a block diagram showing a liquid cooling structure of an electronic device according to a first embodiment of the present invention, FIG. 2 is a block diagram showing a liquid cooling structure of an electronic device according to a second embodiment, and FIG. 4 is a block diagram showing the configuration of an electronic device according to the prior art, and FIG. 4 is a refrigerant circulation path diagram in a block diagram showing a liquid cooling structure according to the prior art. 4...Electronic circuit section, 5...Heat exchanger, 6...Blower, 7...Drain, 8...Cooling air flow, 9...
air valve.
Claims (1)
却する冷媒の循環径路を構成するポンプと冷却ジャケッ
トと熱交換器とタンクとを有し、 前記循環径路中において抽出されるＵ字径路部の下部に
設けられた冷媒排出用ドレンと、前記循環径路中におい
て抽出される逆Ｕ字径路部の上部に設けられた空気弁と
を有することを特徴とする電子装置。[Scope of Claims] An electronic component, a pump, a cooling jacket, a heat exchanger, and a tank that constitute a circulation path for a refrigerant that cools the electronic component are housed in the same housing, and in the circulation path. An electronic device comprising: a drain for discharging refrigerant provided at the bottom of the U-shaped path section from which the refrigerant is extracted; and an air valve provided at the top of the inverted U-shaped path section from which the extraction occurs in the circulation path. .
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2256409A JPH04133497A (en) | 1990-09-26 | 1990-09-26 | Cooling structure of electronic device |
| US07/735,890 US5323847A (en) | 1990-08-01 | 1991-07-25 | Electronic apparatus and method of cooling the same |
| KR1019910013068A KR940008382B1 (en) | 1990-08-01 | 1991-07-30 | Electronic apparatus and method of cooling the same |
| DE4125528A DE4125528C2 (en) | 1990-08-01 | 1991-08-01 | Electronic device and its cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2256409A JPH04133497A (en) | 1990-09-26 | 1990-09-26 | Cooling structure of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04133497A true JPH04133497A (en) | 1992-05-07 |
Family
ID=17292282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2256409A Pending JPH04133497A (en) | 1990-08-01 | 1990-09-26 | Cooling structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04133497A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243593A (en) * | 2002-02-22 | 2003-08-29 | Sanyo Electric Co Ltd | Electronic device |
| JP2005038112A (en) * | 2003-07-18 | 2005-02-10 | Hitachi Ltd | Liquid cooling system and radiator |
| JP2009105134A (en) * | 2007-10-22 | 2009-05-14 | Sanyo Electric Co Ltd | Electronic equipment cooling apparatus |
| KR100935142B1 (en) * | 2006-07-25 | 2010-01-06 | 후지쯔 가부시끼가이샤 | Electronic apparatus |
| US7672125B2 (en) | 2006-07-25 | 2010-03-02 | Fujitsu Limited | Electronic apparatus |
| US7701715B2 (en) | 2006-07-25 | 2010-04-20 | Fujitsu Limited | Electronic apparatus |
| US8050036B2 (en) | 2006-07-25 | 2011-11-01 | Fujitsu Limited | Liquid cooling unit and heat receiver therefor |
| US8113009B2 (en) | 2007-10-22 | 2012-02-14 | Sanyo Electric Co., Ltd. | Electronic device cooling system and electronic device cooling apparatus |
| US8289701B2 (en) | 2006-07-25 | 2012-10-16 | Fujistu Limited | Liquid cooling unit and heat receiver therefor |
| JP2014053507A (en) * | 2012-09-07 | 2014-03-20 | Fujitsu Ltd | Cooling unit and electronic device |
| CN111194159A (en) * | 2020-02-19 | 2020-05-22 | 丁宏建 | Server rack for network engineering |
-
1990
- 1990-09-26 JP JP2256409A patent/JPH04133497A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243593A (en) * | 2002-02-22 | 2003-08-29 | Sanyo Electric Co Ltd | Electronic device |
| JP2005038112A (en) * | 2003-07-18 | 2005-02-10 | Hitachi Ltd | Liquid cooling system and radiator |
| KR100935142B1 (en) * | 2006-07-25 | 2010-01-06 | 후지쯔 가부시끼가이샤 | Electronic apparatus |
| US7652884B2 (en) | 2006-07-25 | 2010-01-26 | Fujitsu Limited | Electronic apparatus including liquid cooling unit |
| US7672125B2 (en) | 2006-07-25 | 2010-03-02 | Fujitsu Limited | Electronic apparatus |
| US7701715B2 (en) | 2006-07-25 | 2010-04-20 | Fujitsu Limited | Electronic apparatus |
| US8050036B2 (en) | 2006-07-25 | 2011-11-01 | Fujitsu Limited | Liquid cooling unit and heat receiver therefor |
| US8289701B2 (en) | 2006-07-25 | 2012-10-16 | Fujistu Limited | Liquid cooling unit and heat receiver therefor |
| JP2009105134A (en) * | 2007-10-22 | 2009-05-14 | Sanyo Electric Co Ltd | Electronic equipment cooling apparatus |
| US8113009B2 (en) | 2007-10-22 | 2012-02-14 | Sanyo Electric Co., Ltd. | Electronic device cooling system and electronic device cooling apparatus |
| JP2014053507A (en) * | 2012-09-07 | 2014-03-20 | Fujitsu Ltd | Cooling unit and electronic device |
| CN111194159A (en) * | 2020-02-19 | 2020-05-22 | 丁宏建 | Server rack for network engineering |
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