JPH0412405A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH0412405A JPH0412405A JP2115468A JP11546890A JPH0412405A JP H0412405 A JPH0412405 A JP H0412405A JP 2115468 A JP2115468 A JP 2115468A JP 11546890 A JP11546890 A JP 11546890A JP H0412405 A JPH0412405 A JP H0412405A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- insulating layer
- weight
- insulated wire
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 239000004640 Melamine resin Substances 0.000 claims abstract description 9
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 9
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000004962 Polyamide-imide Substances 0.000 claims description 11
- 229920002312 polyamide-imide Polymers 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 230000001588 bifunctional effect Effects 0.000 claims 1
- 229920001515 polyalkylene glycol Polymers 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000000805 composite resin Substances 0.000 abstract 2
- 239000002826 coolant Substances 0.000 abstract 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 14
- 239000003921 oil Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000010721 machine oil Substances 0.000 description 4
- 229920003055 poly(ester-imide) Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- WXGNWUVNYMJENI-UHFFFAOYSA-N 1,1,2,2-tetrafluoroethane Chemical compound FC(F)C(F)F WXGNWUVNYMJENI-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 2
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 1
- 235000003363 Cornus mas Nutrition 0.000 description 1
- 240000006766 Cornus mas Species 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- AFYPFACVUDMOHA-UHFFFAOYSA-N chlorotrifluoromethane Chemical compound FC(F)(F)Cl AFYPFACVUDMOHA-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- -1 n-butyl modified melamine Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 210000004417 patella Anatomy 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/80—Technologies aiming to reduce greenhouse gasses emissions common to all road transportation technologies
- Y02T10/82—Elements for improving aerodynamics
Landscapes
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、特に耐湿熱性、耐冷媒性に優れた絶縁電線
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an insulated wire particularly having excellent heat and humidity resistance and refrigerant resistance.
冷蔵庫、冷凍機等の冷媒圧縮機用モータは、フロン−１
１、フロン−１２、フロン−２２なとの冷媒の雰囲気下
で運転される。このため、このモータの巻線には、耐冷
媒性が要求されるとともに冷媒と併用される冷凍機油に
対する耐久性も要求される。Motors for refrigerant compressors such as refrigerators and freezers use Freon-1
It is operated in an atmosphere of refrigerants such as 1, Freon-12, and Freon-22. Therefore, the windings of this motor are required to be resistant to refrigerants as well as to be resistant to refrigerating machine oil that is used together with the refrigerant.
このような要求を満す絶縁電線としては、従来ポリイミ
ド線、ポリアミドイミド線、ポリエステルイミド線、ポ
リエステルアミドイミド線などが用いられる。Conventionally, polyimide wires, polyamide-imide wires, polyester-imide wires, polyester-amide-imide wires, and the like have been used as insulated wires that meet these requirements.
ところで、近時地球環境保全の点からフロン１１、フロ
ン−１２の使用か削減、廃止の方向で進んでおり、その
代替の冷媒としてフロン−１３４ａが有力とされている
。このフロン−１３／Ｉａと併用される冷凍機油として
は、ポリアルキレングリコール系油が候補となってるが
、ポリアルキレンゲリコール系油は吸水性が大きく、約
１〜２％の水分を吸収する。Incidentally, in recent years, there has been a trend towards reducing or abolishing the use of Freon-11 and Freon-12 in order to preserve the global environment, and Freon-134a is considered to be a promising alternative refrigerant. Polyalkylene glycol oil is a candidate for refrigerating machine oil to be used in combination with Freon-13/Ia, but polyalkylene glycol oil has high water absorption and absorbs about 1 to 2% of water.
よって、代替冷媒フロン−１３４ａとポリアルキレング
リコール系油との併用系における絶縁電線には、耐冷媒
性と耐湿熱性が併せて、要求されることになる。Therefore, an insulated wire in a system in which the alternative refrigerant Freon-134a and polyalkylene glycol oil are used together is required to have both refrigerant resistance and moist heat resistance.
このような観点から、ポリイミド線、ポリアミドイミド
線は耐冷媒性、ｉ、ｌ湿熱性はともに優れているが、高
価である難点がある。また、ポリエステルイミド線、ポ
リエステルアミドイミド線は、ともに分子内にエステル
結合を有するため加水分解されやすく、耐湿熱性に劣る
欠点がある。From this point of view, polyimide wires and polyamide-imide wires have excellent refrigerant resistance and both I and I heat and humidity properties, but have the disadvantage of being expensive. Further, since both polyesterimide wires and polyesteramideimide wires have ester bonds in their molecules, they are easily hydrolyzed and have the disadvantage of poor moist heat resistance.
一方、従来耐湿熱性が良好とされているポリアミドイミ
ド／ポリエステルイミド線も、ポリエステルイミドが上
述のように加水分解性を有しているため、含有水分量が
多くなるフロン−１３４ａ／ポリアルキレングリコール
系油系では、やはり耐湿熱性が不足する問題がある。On the other hand, polyamideimide/polyesterimide wires, which are conventionally considered to have good moisture and heat resistance, are also based on Freon-134a/polyalkylene glycol wires, which have a high water content because polyesterimide has hydrolyzability as described above. Oil-based materials also have the problem of insufficient moist heat resistance.
よって、この発明の課題は、新しいフロン−１３４ａ／
ポリアルキレングリコ一ル系冷凍機油系においても十分
な耐冷媒性、耐湿熱性を発揮する絶縁電線を提供するこ
とにある。Therefore, the problem of this invention is to develop a new Freon-134a/
An object of the present invention is to provide an insulated wire that exhibits sufficient refrigerant resistance and moist heat resistance even in a polyalkylene glycolic refrigeration machine oil system.
かかる課題は、エポキシ樹脂】００重量部にアルキルエ
ーテル化メラミン樹脂５〜１０重ｆｆｉ部、三官能イン
シアネート３〜１０重量部、フェノール樹脂５〜ＩＯ重
量部を配合した樹脂組成物からなる絶縁層を設けること
で解決される。Such a problem was solved by an insulating layer made of a resin composition in which 00 parts by weight of an epoxy resin was blended with 5 to 10 parts by weight of an alkyl etherified melamine resin, 3 to 10 parts by weight of a trifunctional incyanate, and 5 to IO parts by weight of a phenolic resin. This can be solved by providing .
以下、この発明の詳細な説明する。The present invention will be described in detail below.
第１図は、この発明の絶縁電線の例を示すもので、図中
符号ｌは導体である。この導体ｌの外周には、絶縁層２
が被覆され、この絶縁層２上には保護層３がさらに被覆
されて、絶縁電線とされている。FIG. 1 shows an example of the insulated wire of the present invention, and the reference numeral l in the figure represents a conductor. An insulating layer 2 is placed around the outer periphery of the conductor l.
This insulating layer 2 is further covered with a protective layer 3 to form an insulated wire.
絶縁層２は、エポキシ樹脂１００重量部にアルキルエー
テル化メラミン樹脂５〜１０重量部、三官能イソシアネ
ート３〜ｌＯ重量部、フェノール樹脂５〜１０重量部を
配合した樹脂組成物から構成されている。The insulating layer 2 is composed of a resin composition in which 100 parts by weight of an epoxy resin is blended with 5 to 10 parts by weight of an alkyl etherified melamine resin, 3 to 10 parts by weight of a trifunctional isocyanate, and 5 to 10 parts by weight of a phenolic resin.
ここでのエポキシ樹脂は、第２図で示される構造式（但
し、式中Ｒ３は、−ＯＨまたはＣＩＩＨ、ｎＯＨを表し
、ｍは整数である。）を有するもので、ビスフェノール
Ａとエピクロルヒドリンとの反応生成物であり、分子内
にエステル結合を持たず、平均分子量が６万以上、好ま
しくは７万前後のものが用いられる。平均分子量が６万
未満では絶縁層２の可撓性が不足して実用性に欠ける。The epoxy resin here has the structural formula shown in Figure 2 (wherein R3 represents -OH, CIIH, or nOH, and m is an integer), and is a combination of bisphenol A and epichlorohydrin. It is a reaction product, does not have an ester bond in its molecule, and has an average molecular weight of 60,000 or more, preferably around 70,000. If the average molecular weight is less than 60,000, the flexibility of the insulating layer 2 will be insufficient and it will lack practicality.
また、アルキルエーテル化メラミン樹脂としては、第３
図に示される構造式（但し、式中Ｒ２は、−Ｈ，−ＣＨ
，ＯＨ，−ＣＨ，ＯＣＨ，、−ＣＨ，ＯＣ，Ｈ，、−Ｃ
Ｈ，ＯＣ，Ｈ，、−ＣＨ，ＯＣ，Ｈ，のいずれかである
。）を有するアル牛ルエーテル化メラミンとホルムアル
デヒドとの縮合生成物で、平均分子量が４５０〜５００
程度のものが用いられる。このアルキルエーテル化メラ
ミン樹脂は、エポキシ樹脂の架橋剤として機能するもの
で、エポキシ樹脂１００重量部に対して５〜１０重量部
の範囲で添加される。添加量が５重量部未満では絶縁層
２の耐熱性、耐湿熱性が十分に得られず、１０重量部を
越えると可撓性が低下する。In addition, as the alkyl etherified melamine resin, tertiary
The structural formula shown in the figure (in the formula, R2 is -H, -CH
,OH,-CH,OCH,,-CH,OC,H,,-C
It is either H, OC, H, -CH, OC, H,. ) with an average molecular weight of 450 to 500.
A certain degree is used. This alkyl etherified melamine resin functions as a crosslinking agent for the epoxy resin, and is added in an amount of 5 to 10 parts by weight per 100 parts by weight of the epoxy resin. If the amount added is less than 5 parts by weight, the insulating layer 2 will not have sufficient heat resistance and heat-moisture resistance, and if it exceeds 10 parts by weight, the flexibility will decrease.
三官能イソシアネートとしては、分子内にイソンアネ−
１−Ｍを２個以上もつ化合物、例えばトリレンジイソシ
アネート（ＴＤ＋）、ジフェニルメタン４，４′−ジイ
ソシアネート（ＭＤＩ）、１゜５−ナフタレンジイソシ
アネートや、これらのジイソ／アネートをフェノールや
アミドなどで安定化した安定化ジイソシアネートなどが
用いられる。As a trifunctional isocyanate, isoneane is present in the molecule.
Compounds with two or more 1-M units, such as tolylene diisocyanate (TD+), diphenylmethane 4,4'-diisocyanate (MDI), 1°5-naphthalene diisocyanate, and these diiso/anates can be stabilized with phenol, amide, etc. Stabilized diisocyanates and the like are used.
この三官能インシアネートは、エポキシ樹脂の架橋剤と
して機能し、エポキシ樹脂１００ｆｆｌｆｆｔ部に対し
て３〜１０重量部添加される。添加量が３重量部未満で
は、絶縁層２の耐熱性、耐湿熱性が不足し、１０重量部
を越えると可撓性を失って不都合となる。This trifunctional incyanate functions as a crosslinking agent for the epoxy resin, and is added in an amount of 3 to 10 parts by weight per 100 fflfft parts of the epoxy resin. If the amount added is less than 3 parts by weight, the heat resistance and moist heat resistance of the insulating layer 2 will be insufficient, and if it exceeds 10 parts by weight, flexibility will be lost, resulting in disadvantages.
さらに、ここでのフェノール樹脂としては、通常のフェ
ノールとホルムアルデヒドとの縮合生成物が用いられる
。フェノール樹脂は、絶縁層２の耐熱性を高めるための
もので、エポキシ樹脂１゜０重量部に対して５〜１０重
量部添加される。添加量が５重量部未満では耐熱性向上
効果かはとんど得られず、１０重量部を越えると、可撓
性か低下して好ましくない。Furthermore, as the phenol resin here, a common condensation product of phenol and formaldehyde is used. The phenol resin is used to improve the heat resistance of the insulating layer 2, and is added in an amount of 5 to 10 parts by weight per 1.0 parts by weight of the epoxy resin. If the amount added is less than 5 parts by weight, the effect of improving heat resistance will hardly be obtained, and if it exceeds 10 parts by weight, flexibility will deteriorate, which is undesirable.
このようなエポキシ樹脂、アルキルエーテル化メラミン
樹脂、三官能イソンア不一トおよびフェノール樹脂から
なる樹脂組成物は、シクロヘキサノン、ツルヘントナフ
サなとの溶剤に溶解されて樹脂分１０〜４０重量％のワ
ニスとされ、導体ｌ上に常法により塗布、焼付けされて
絶縁層２とされる。A resin composition consisting of such an epoxy resin, an alkyl etherified melamine resin, a trifunctional isomer, and a phenolic resin is dissolved in a solvent such as cyclohexanone or turgent naphtha to form a varnish with a resin content of 10 to 40% by weight. , and is coated and baked on the conductor l by a conventional method to form the insulating layer 2.
絶縁層２の厚さは、通常１０〜１００μｍの範囲とされ
るが、特にこの範囲に限定されるものではない。The thickness of the insulating layer 2 is usually in the range of 10 to 100 μm, but is not particularly limited to this range.
また、保護層３としては、種々の樹脂を用いることがで
きるが、なかでも熱硬化ホルマール樹脂あるいはポリア
ミドイミドからなるものが好ましい。Furthermore, various resins can be used for the protective layer 3, and among them, those made of thermosetting formal resin or polyamideimide are preferable.
ここでの熱硬化ホルマール樹脂とは、ポリビニルホルマ
ール樹脂をペースポリマーとし、これに硬化剤としてメ
ラミン樹脂、イソシアネート樹脂、フェノール樹脂を配
合した樹脂組成物からなるものである。The thermosetting formal resin herein is a resin composition in which a polyvinyl formal resin is used as a pace polymer, and a melamine resin, an isocyanate resin, or a phenol resin is blended with this as a curing agent.
このような熱硬化ホルマール樹脂あるいはポリアミドイ
ミドからなる保護層３は、これらの樹脂組成物をシクロ
ヘキサノン、ソルベレトナフサなとの溶剤に溶解して樹
脂分１０〜４０重量％のワニスとし、絶縁層２上に常法
により塗布、焼き付けすることによって形成される。こ
の保護層３の厚さは、１ｆｆ４常ｌＯ〜１００μｍ程度
とされる。The protective layer 3 made of such a thermosetting formal resin or polyamideimide is prepared by dissolving these resin compositions in a solvent such as cyclohexanone or sorbet naphtha to form a varnish with a resin content of 10 to 40% by weight, and then applying the resulting varnish to the insulating layer 2. It is formed by coating and baking using a conventional method. The thickness of the protective layer 3 is approximately 1ff4 to 100 μm.
保護層３として、熱硬化ホルマール樹脂を用いたもので
は、耐摩耗性が良好となり、機械的強度も高いものとな
る。またポリアミドイミドを用いたものでは、耐熱性が
より高いものとなる。When a thermosetting formal resin is used as the protective layer 3, the abrasion resistance is good and the mechanical strength is also high. Moreover, those using polyamideimide have higher heat resistance.
また、絶縁層２と保護層３の膜厚の比を０．５１〜２０
：１とすることが好ましい。保護層３の膜厚がこれより
も薄いと保護機能が不足し、これよりも厚いとコスト高
となって不都合となる。In addition, the ratio of the film thickness of the insulating layer 2 and the protective layer 3 is set to 0.51 to 20.
: It is preferable to set it as 1. If the thickness of the protective layer 3 is thinner than this, the protective function will be insufficient, and if it is thicker than this, the cost will increase, which is disadvantageous.
このような絶縁電線にあっては、耐熱性、耐湿熱性、耐
冷媒性、耐油性に富むものとなり、特にフロン−１３４
８／ポリアルキレングリコ一ル系冷凍機油混合系におい
ても、すぐれた耐冷媒性、耐湿熱性を発揮する。Such insulated wires have high heat resistance, heat and humidity resistance, refrigerant resistance, and oil resistance, and are particularly resistant to Freon-134.
8/Excellent refrigerant resistance and heat-and-moisture resistance even in polyalkylene glycol-based refrigerating machine oil mixture systems.
以下、具体例を示して、本発明の作用効果を明確にする
。Hereinafter, specific examples will be shown to clarify the effects of the present invention.
（実施例）
第１表に示す配合の組成物を７クロヘ牛サノンに溶解し
、樹脂分２０重量％のワニスを作成し、これを径１ｍｍ
の導体上に塗布、焼き付けし、厚さ４０μｍの絶縁層を
形成した。(Example) A varnish with a resin content of 20% by weight was prepared by dissolving the composition shown in Table 1 in 7-kurohe beef sanon.
This was applied and baked onto the conductor to form an insulating layer with a thickness of 40 μm.
第１表
配合比二 重量部
＊１．「エピコート０Ｌ−５３Ｊ 、高分子型エポキシ
樹脂、（油化／エル（株）製）
＊２．「ニーパン２０Ｊ、ｎ−ブチル変性メラミン樹脂
、（三井東圧化学（株）製）
＊３・ 「コロネートＡＰステーブル」、安定化ジイソ
／アネート、（日本ポリウレタン工業（株）製）＊４
［ブライオーフェン５０１０Ｊ、アルコール溶性フェノ
ール樹脂、（大日本インキ化学工業（株）製）
この絶縁電線について、可撓性、往復摩耗、熱軟化温度
、Ｔ ２００００ Ｈｒ 、耐湿熱性について試験し、
その絶縁層の特性を検討した。その結果を第２表に示す
。Table 1 Mixing ratio 2 Part by weight *1. "Epicote 0L-53J, polymeric epoxy resin, (manufactured by Yuka/L Co., Ltd.) *2."Kneepan 20J, n-butyl modified melamine resin, (manufactured by Mitsui Toatsu Chemical Co., Ltd.) *3. "Coronate AP Stable", stabilized diiso/anate, (manufactured by Nippon Polyurethane Industries Co., Ltd.) *4
[Bleiofen 5010J, alcohol-soluble phenolic resin, (manufactured by Dainippon Ink and Chemicals Co., Ltd.) This insulated wire was tested for flexibility, reciprocating wear, thermal softening temperature, T 20000 Hr, and moist heat resistance,
The characteristics of the insulating layer were investigated. The results are shown in Table 2.
可撓性、往復摩耗、熱軟化温度の測定は、ＪＩＳ −Ｃ
−３００３１ｍ基づイテ行い、Ｔ２Ｏ０００Ｈｒの測定
はＩＥｃ Ｐｕｂ１７２に基いて行った。また、耐湿
熱性は、水分１．０体積％の雰囲気下、温度１５０°Ｃ
で過熱劣化させたのち、絶縁破壊電圧（ＢＤＶ）を測定
し、初期値の５０％となる日数で表わした。Measurement of flexibility, reciprocating wear, and thermal softening temperature is based on JIS-C
-30031m was used, and T2O000Hr was measured based on IEc Pub172. In addition, the heat and humidity resistance is measured at a temperature of 150°C in an atmosphere containing 1.0% moisture by volume.
After overheating and deterioration, the dielectric breakdown voltage (BDV) was measured and expressed as the number of days at which the breakdown voltage (BDV) reached 50% of the initial value.
第２表
第２表の結果から明らかなように、この絶縁電線の絶縁
層は、耐熱性、耐湿熱性、耐摩耗性、可撓性にすぐれて
いることがわかる。As is clear from the results in Table 2, the insulating layer of this insulated wire has excellent heat resistance, moist heat resistance, abrasion resistance, and flexibility.
（実施例２）
実施例１におけるＮｏｌ〜５の絶縁電線の絶縁層（ただ
し、厚さは１１μｍとした。）上にさらに熱硬化ホルマ
ール樹脂からなる厚さ９μｍの保護層を形成したものと
、同じくＮｏ１〜５の絶縁電線の絶縁層（厚さ１１μｍ
）上にさらにポリアミドイミドからなる厚さ９μｍの保
護層を形成したものをそれぞれ製造し、これら絶縁電線
について耐冷媒試験、湿熱劣化試験を行った。結果を第
３表（保護層が熱硬化ホルマール樹脂からなるもの）お
よび第４表（保護層かポリアミドイミドからなるもの）
に示す。(Example 2) A protective layer having a thickness of 9 μm made of thermosetting formal resin was further formed on the insulating layer (however, the thickness was 11 μm) of the insulated wires No. 1 to 5 in Example 1, and Similarly, the insulation layer of the insulated wires No. 1 to 5 (thickness: 11 μm)
) on which a protective layer of polyamideimide with a thickness of 9 μm was further formed, and these insulated wires were subjected to a refrigerant resistance test and a moist heat deterioration test. The results are shown in Table 3 (protective layer made of thermosetting formal resin) and Table 4 (protective layer made of polyamideimide)
Shown below.
なお、ここでの熱硬化ホルマール樹脂からなる保護層の
形成は、市販のホルマールワニス、［ＴＶＥ〜５４５２
Ｊ （東芝ケミカル（株）製）を塗布、焼付して行っ
た。また、ポリアミドイミドからなる保護層の形成は、
市販のポリアミドイミドワニス（ｒＨＩ−４０５−２８
Ｊ日立化成（株）製）を塗布、焼付して行った。Note that the protective layer made of thermosetting formal resin is formed using a commercially available formal varnish, [TVE~5452
J (manufactured by Toshiba Chemical Corporation) was applied and baked. In addition, the formation of a protective layer made of polyamideimide
Commercially available polyamide imide varnish (rHI-405-28
J Hitachi Chemical Co., Ltd.) was coated and baked.
また、耐冷媒試験は、フロン−１３４’ａに１５０°Ｃ
で７日間浸漬するもの（１）およびフロン１３４ａ／ポ
リアルキレングリコール系冷凍機油の混合物に水分を１
．６重量％混合させた混合液中に１５０°Ｃで７日間浸
漬するもの（ＩＩ）の２種で行い、湿熱劣化試験は、１
体積％の水分量においてｌ ５０ ’Ｃ１２４時気中劣
化後の絶縁破壊電圧で表わした。In addition, the refrigerant resistance test was conducted on Freon-134'a at 150°C.
(1) and a mixture of Freon 134a/polyalkylene glycol refrigeration oil for 7 days.
．． The wet heat deterioration test was conducted using two types (II), which were immersed in a mixed solution of 6% by weight at 150°C for 7 days.
It is expressed as dielectric breakdown voltage after aging in air at 124 hours at 150'C in terms of water content in volume %.
また、可撓性は、絶縁電線を自己径巻き付けし、得られ
たヘリカルコイル９個に対する破膜にクラックが発生し
たヘリカルコイルの個数の比で表した。Further, the flexibility was expressed as the ratio of the number of helical coils in which cracks occurred in the ruptured membrane to nine helical coils obtained by winding an insulated wire around its own diameter.
Ｊ ｌ５−Ｃ−３００３８，１（２）に準する。According to J 5-C-30038, 1(2).
第３表 以 下 余 白 第４ ミンの構造を示す化学構造式である。Table 3 Below, remaining white Fourth This is a chemical structural formula showing the structure of amine.
Claims (4)
メラミン樹脂５〜１０重量部、二官能イソシアネート３
〜１０重量部、フェノール樹脂５〜１０重量部を配合し
た樹脂組成物からなる絶縁層を有する絶縁電線。(1) 100 parts by weight of epoxy resin, 5 to 10 parts by weight of alkyl etherified melamine resin, 3 parts by weight of bifunctional isocyanate
An insulated wire having an insulating layer made of a resin composition containing ~10 parts by weight and 5 to 10 parts by weight of a phenolic resin.
護層が設けられた請求項（１）記載の絶縁電線。(2) The insulated wire according to claim 1, wherein a protective layer made of thermosetting formal resin is provided on the insulating layer.
が設けられた請求項（１）記載の絶縁電線。(3) The insulated wire according to claim 1, wherein a protective layer made of polyamideimide is provided on the insulating layer.
〜２０：１である請求項（２）または（３）記載の絶縁
電線。(4) The film thickness ratio of the insulating layer and the protective layer is 0.5:1
The insulated wire according to claim (2) or (3), wherein the ratio is 20:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02115468A JP3077991B2 (en) | 1990-05-01 | 1990-05-01 | Insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02115468A JP3077991B2 (en) | 1990-05-01 | 1990-05-01 | Insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412405A true JPH0412405A (en) | 1992-01-17 |
| JP3077991B2 JP3077991B2 (en) | 2000-08-21 |
Family
ID=14663288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02115468A Expired - Lifetime JP3077991B2 (en) | 1990-05-01 | 1990-05-01 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3077991B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009048102A1 (en) * | 2007-10-12 | 2009-04-16 | Sumitomo Electric Wintec, Inc. | Insulated wire, electrical coil using the insulated wire, and motor |
| JP2009164037A (en) * | 2008-01-09 | 2009-07-23 | Sumitomo Electric Wintec Inc | Insulated electric wire |
| WO2009123279A1 (en) * | 2008-04-03 | 2009-10-08 | 住友電工ウインテック株式会社 | Insulated wire, coil using the same, and motor |
| JP2010102890A (en) * | 2008-10-22 | 2010-05-06 | Sumitomo Electric Wintec Inc | Insulating varnish and insulation wire using this |
| JP2010108758A (en) * | 2008-10-30 | 2010-05-13 | Sumitomo Electric Wintec Inc | Phenoxy resin insulating varnish and insulation wire using it |
| JP2010153099A (en) * | 2008-12-24 | 2010-07-08 | Sumitomo Electric Wintec Inc | Insulated wire |
| US20120043109A1 (en) * | 2009-03-13 | 2012-02-23 | Hitachi Magnet Wire Corp. | Insulating coating composition and an insulated wire, and a coil formed using the same |
| WO2015011759A1 (en) * | 2013-07-22 | 2015-01-29 | 株式会社日立製作所 | Insulated wire and rotary electrical machine using same |
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1990
- 1990-05-01 JP JP02115468A patent/JP3077991B2/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009048102A1 (en) * | 2007-10-12 | 2009-04-16 | Sumitomo Electric Wintec, Inc. | Insulated wire, electrical coil using the insulated wire, and motor |
| JPWO2009048102A1 (en) * | 2007-10-12 | 2011-02-24 | 住友電工ウインテック株式会社 | Insulated wire, electric coil using the insulated wire, and motor |
| JP2009164037A (en) * | 2008-01-09 | 2009-07-23 | Sumitomo Electric Wintec Inc | Insulated electric wire |
| WO2009123279A1 (en) * | 2008-04-03 | 2009-10-08 | 住友電工ウインテック株式会社 | Insulated wire, coil using the same, and motor |
| JP2009266797A (en) * | 2008-04-03 | 2009-11-12 | Sumitomo Electric Wintec Inc | Insulated wire |
| JP2010102890A (en) * | 2008-10-22 | 2010-05-06 | Sumitomo Electric Wintec Inc | Insulating varnish and insulation wire using this |
| JP2010108758A (en) * | 2008-10-30 | 2010-05-13 | Sumitomo Electric Wintec Inc | Phenoxy resin insulating varnish and insulation wire using it |
| JP2010153099A (en) * | 2008-12-24 | 2010-07-08 | Sumitomo Electric Wintec Inc | Insulated wire |
| US20120043109A1 (en) * | 2009-03-13 | 2012-02-23 | Hitachi Magnet Wire Corp. | Insulating coating composition and an insulated wire, and a coil formed using the same |
| US8247071B2 (en) | 2009-03-13 | 2012-08-21 | Hitachi Magnet Wire Corp. | Insulating coating composition and an insulated wire, and a coil formed using the same |
| US8367934B2 (en) * | 2009-03-13 | 2013-02-05 | Hitachi Magnet Wire Corp. | Insulating coating composition and an insulated wire, and a coil formed using the same |
| WO2015011759A1 (en) * | 2013-07-22 | 2015-01-29 | 株式会社日立製作所 | Insulated wire and rotary electrical machine using same |
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| Publication number | Publication date |
|---|---|
| JP3077991B2 (en) | 2000-08-21 |
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