JPH04123475A - Thermoelectric conversion module - Google Patents
Thermoelectric conversion moduleInfo
- Publication number
- JPH04123475A JPH04123475A JP2242384A JP24238490A JPH04123475A JP H04123475 A JPH04123475 A JP H04123475A JP 2242384 A JP2242384 A JP 2242384A JP 24238490 A JP24238490 A JP 24238490A JP H04123475 A JPH04123475 A JP H04123475A
- Authority
- JP
- Japan
- Prior art keywords
- conversion module
- thermoelectric
- thermoelectric conversion
- elements
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract description 4
- 230000009545 invasion Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 210000000941 bile Anatomy 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は熱を直接電気に変換する熱電変換モジュールの
構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a thermoelectric conversion module that directly converts heat into electricity.
本発明に最も近い公知例は、「直接エネルギ変換」好学
社 ｐ１５７に記載の熱電変換モジュールがある。これ
は、第２図に示す様に、ｐ型およびｎ型の両者を高温接
点電極、および、低温接点電極を介して直列に接続し、
リード線を低温側の電極から取り出す構造である。The known example closest to the present invention is a thermoelectric conversion module described in "Direct Energy Conversion", Kogakusha, p. 157. As shown in Figure 2, this connects both p-type and n-type in series via a high temperature contact electrode and a low temperature contact electrode,
The structure is such that the lead wire is taken out from the electrode on the low temperature side.
上記の熱電変換モジュールを実際に使用すると、熱電変
換モジュールの内部に位置する熱電素子と周辺部に位置
する熱電素子の放熱条件が異なるため、内部の素子と周
辺部の素子の出力特性に差が生じる。一般に、熱電変換
モジュールは多数の素子を高密度に実装した構成をとる
が、内部の熱電素子の間隔は極めて狭いため、熱電素子
の側面は、はとんど断熱に近い状態になる。一方、熱電
変換モジュールの周辺部の熱電素子は、空気などの冷却
媒体の流れに曝されるため、モジュール内部の熱電素子
とは異なる温度分布が生じる。第３図はその解析結果で
ある。これは、熱電素子１の左側に強制的な空気の流れ
を生じた場合の、熱電素子１の温度分布を等混線で示し
た図である。When the above thermoelectric conversion module is actually used, the heat dissipation conditions of the thermoelectric elements located inside the thermoelectric conversion module and the thermoelectric elements located in the peripheral area are different, so there is a difference in the output characteristics of the internal element and the peripheral element. arise. Generally, a thermoelectric conversion module has a configuration in which a large number of elements are mounted at high density, but because the intervals between the thermoelectric elements inside are extremely narrow, the sides of the thermoelectric elements are almost in a state of insulation. On the other hand, the thermoelectric elements in the periphery of the thermoelectric conversion module are exposed to the flow of a cooling medium such as air, and therefore have a different temperature distribution than the thermoelectric elements inside the module. Figure 3 shows the analysis results. This is a diagram showing the temperature distribution of the thermoelectric element 1 using equimixture lines when a forced air flow is generated on the left side of the thermoelectric element 1.
一般に、第３図の様な温度分布になると、温度差が増す
ため、開放電圧は増加する。しかし、低温となる領域が
増すため、素子の内部抵抗も増加する。一般に、この場
合は熱電素子単体の出力はわずかに増加するが、熱電変
換モジュールの出力は、はとんどの場合低下する。−例
として、出力０．２５Ｗ （開放電圧１ｖ、短絡電流
ＩＡ）（７）熱電素子を子側直列に接続し、その内の一
個の熱電素子の８力が０．２７Ｗ（開放電圧２ｖ、短絡
電流０．５４Ａ）に増加した場合を考える。全ての熱電
素子の出力が等しい場合は、熱電変換モジュールとして
の出力は第４図の実線になり、最大出力は２．５Ｗであ
る。一方、−個の熱電素子の出力が０．２７Ｗになった
場合は、モジュール出力は第４図の点線となり、最大出
力は２．３６Ｗ となる。Generally, when the temperature distribution becomes as shown in FIG. 3, the open circuit voltage increases because the temperature difference increases. However, since the area where the temperature becomes low increases, the internal resistance of the element also increases. Generally, in this case, the output of the thermoelectric element itself increases slightly, but the output of the thermoelectric conversion module decreases in most cases. - As an example, output 0.25W (open circuit voltage 1V, short circuit current IA) (7) Thermoelectric elements are connected in series on the child side, and the 8 power of one thermoelectric element is 0.27W (open circuit voltage 2V, short circuit current IA). Consider the case where the current increases to 0.54 A). When the outputs of all thermoelectric elements are equal, the output of the thermoelectric conversion module is shown by the solid line in FIG. 4, and the maximum output is 2.5W. On the other hand, when the output of - thermoelectric elements becomes 0.27W, the module output becomes the dotted line in FIG. 4, and the maximum output becomes 2.36W.
このことは、熱電素子単体の出力が増加したにもかかわ
らず、モジュールとしては約６％出力が低下することを
意味する。This means that even though the output of the thermoelectric element itself has increased, the output of the module will decrease by about 6%.
本発明の目的は、損失要因を除き、モジュール化によっ
て起こる放熱条件の違いに起因する電力の損失要因を排
除する構造を提供することにある。An object of the present invention is to provide a structure that eliminates power loss factors caused by differences in heat dissipation conditions caused by modularization.
上記の目的を達成する第一の手段は、冷却熱媒体が熱電
素子に接触しないように、熱媒体の流れを遮へいする構
造物を熱電素子の周囲に装着することである。A first means for achieving the above object is to install a structure around the thermoelectric element that blocks the flow of the heat transfer medium so that the cooling heat transfer medium does not come into contact with the thermoelectric element.
上記の目的を達成する第二の手段は、断熱材を熱電素子
の側面に装着することである。A second means of achieving the above objective is to apply thermal insulation to the sides of the thermoelectric element.
第一の手段によれば、熱媒体による熱雷素子の側面から
の放熱を低減できるため、上記の目的を達成できる。According to the first means, it is possible to reduce the heat radiation from the side surface of the thermal lightning element due to the heat medium, so that the above object can be achieved.
第二の手段によっても、熱電素子側面からの放熱量を低
減できるため、上記の目的を達成できる。The second means can also reduce the amount of heat dissipated from the side surface of the thermoelectric element, so that the above object can be achieved.
第５図は、第３図に示した熱電素子に断熱材８を装着し
、第３図と同一条件にした時の５熱電素子１に生じる温
度分布を等混線で示した図である。FIG. 5 is a diagram showing the temperature distribution generated in the thermoelectric elements 1 shown in FIG. 3 using equal crosstalk lines when the thermoelectric elements shown in FIG. 3 are equipped with a heat insulating material 8 and the same conditions as in FIG.
第３図と比べると、温度分布が平坦化されていることが
わかる。これは、断熱材８を装着することにより、熱電
対１の側面からの放熱量を低減したことによる。When compared with FIG. 3, it can be seen that the temperature distribution is flattened. This is because the heat radiation amount from the side surface of the thermocouple 1 is reduced by installing the heat insulating material 8.
以下、本発明の詳細な説明する。第１図は、熱電素子１
．熱電素子１を電気的に接続する電極２、熱電素子１を
固定する基板３．熱電素子１の出力を取り出すリード線
４．遮蔽板５からなる熱電変換モジュールの基本構成を
示す。本実施例によれば、遮蔽板５によって、熱電変換
モジュールの周囲の熱媒体（空気等）の流れから熱電素
子１を隔離できるため、放熱条件の違いに起因する熱電
素子の出力のばらつきを押さえることができる。The present invention will be explained in detail below. Figure 1 shows a thermoelectric element 1
．． an electrode 2 for electrically connecting the thermoelectric element 1; a substrate 3 for fixing the thermoelectric element 1; Lead wire 4 for taking out the output of the thermoelectric element 1. The basic configuration of a thermoelectric conversion module consisting of a shielding plate 5 is shown. According to this embodiment, the shielding plate 5 can isolate the thermoelectric element 1 from the flow of heat medium (air, etc.) around the thermoelectric conversion module, thereby suppressing variations in the output of the thermoelectric element due to differences in heat dissipation conditions. be able to.
第６図は、第１図の遮蔽板５の熱電素子の上側の基板３
とを一体物とした実施例である。第１図の実施例の場合
、高温で使用する熱電変換モジュールは、材料の熱膨張
率の違いから異種材料の界面では熱応力が発生しやすい
が、第６図の実施例では、遮蔽板と基板３とを一体物と
しており、遮蔽板や基板が破損する可能性は小さい。FIG. 6 shows the substrate 3 above the thermoelectric element of the shielding plate 5 of FIG.
This is an example in which these are integrated. In the case of the embodiment shown in Fig. 1, thermal stress is likely to occur at the interface of different materials in the thermoelectric conversion module used at high temperatures due to the difference in the coefficient of thermal expansion of the materials, but in the embodiment shown in Fig. 6, thermal stress is likely to occur at the interface between different materials. Since it is integrated with the substrate 3, there is little possibility that the shielding plate or the substrate will be damaged.
第７図は第６図の変形例で、上側の基板３に同一材質の
遮蔽板７を接着する構造を示す。この実施例の場合、第
６図の実施例に比べ、製造が容易である。FIG. 7 is a modification of FIG. 6, showing a structure in which a shielding plate 7 made of the same material is adhered to the upper substrate 3. This embodiment is easier to manufacture than the embodiment shown in FIG.
第８図は、熱電素子１に断熱材８を装着した実施例で、
作用でも述べたように、熱電素子の側面からの放熱量を
低減することができ、熱電素子の出力のばらつきを押さ
えることができる。FIG. 8 shows an example in which a heat insulating material 8 is attached to the thermoelectric element 1.
As described in the operation, the amount of heat dissipated from the side surface of the thermoelectric element can be reduced, and variations in the output of the thermoelectric element can be suppressed.
［発明の効果〕
本発明によれば、放熱条件の違いに起因する熱電素子の
出力のばらつきを押さえることができるため、モジュー
ル化に伴う出力、あるいは、効率の低下を防ぐことがで
きる。[Effects of the Invention] According to the present invention, it is possible to suppress variations in the output of thermoelectric elements due to differences in heat dissipation conditions, so it is possible to prevent a decrease in output or efficiency due to modularization.
【図面の簡単な説明】
第１図は本発明の一実施例の断面図、第２図は従来例の
説明図、第３図は熱電素子内部の温度分布図、第４図は
熱電変換モジュールの出力特性図、第５図は熱電素子内
部の温度分布図、第６図ないし第８図は本発明の他の実
施例の断面図を示す。
１・・・熱電素子、２・・・電極、３・・・基板、４・
・・リード線、５・・・遮蔽板、６・・・基板、７・・
・遮蔽板、８・・・断熱材。
第
口
Ｒ１ｍノ
都３
図
（ｉｔＩ＄４’Ｊ）
第４図
電
ＣＶ）
茶
図
ゲ
３−基線
４−−クー１゛兼
７−４へ・・胆[Brief Description of the Drawings] Figure 1 is a sectional view of an embodiment of the present invention, Figure 2 is an explanatory diagram of a conventional example, Figure 3 is a temperature distribution diagram inside a thermoelectric element, and Figure 4 is a thermoelectric conversion module. FIG. 5 is a temperature distribution diagram inside the thermoelectric element, and FIGS. 6 to 8 are sectional views of other embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Thermoelectric element, 2... Electrode, 3... Substrate, 4...
... Lead wire, 5... Shielding plate, 6... Board, 7...
- Shielding plate, 8...insulation material. 3rd exit R1m no capital 3 figure (itI$4'J) 4th figure electric CV) Brown figure game 3 - base line 4 - Ku 1゛ and 7-4... bile
Claims (1)
一端を加熱し、他端を冷却することにより熱エネルギを
電気エネルギに変換して発電する熱電変換モジュールに
おいて、 前記熱電変換モジュールの端面に熱媒体の侵入を妨害す
る構造物を設けたことを特徴とする熱電変換モジュール
。 ２、請求項１において、前記熱媒体の侵入を妨害する構
造物として前記熱電素子よりも熱伝導度の低い材料を用
いた熱電変換モジュール。[Claims] 1. In a thermoelectric conversion module that connects a plurality of thermoelectric elements to each other, heats one end of each thermoelectric element, and cools the other end to convert thermal energy into electrical energy and generate electricity. . A thermoelectric conversion module, characterized in that a structure is provided on an end face of the thermoelectric conversion module to prevent a heat medium from entering. 2. The thermoelectric conversion module according to claim 1, wherein a material having lower thermal conductivity than the thermoelectric element is used as the structure for blocking the intrusion of the heat medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242384A JPH04123475A (en) | 1990-09-14 | 1990-09-14 | Thermoelectric conversion module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242384A JPH04123475A (en) | 1990-09-14 | 1990-09-14 | Thermoelectric conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04123475A true JPH04123475A (en) | 1992-04-23 |
Family
ID=17088364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2242384A Pending JPH04123475A (en) | 1990-09-14 | 1990-09-14 | Thermoelectric conversion module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04123475A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996037918A1 (en) * | 1995-05-26 | 1996-11-28 | Matsushita Electric Works, Ltd. | Peltier module |
| JP2016164947A (en) * | 2015-03-06 | 2016-09-08 | 株式会社Kelk | Electrothermal power generation unit |
-
1990
- 1990-09-14 JP JP2242384A patent/JPH04123475A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996037918A1 (en) * | 1995-05-26 | 1996-11-28 | Matsushita Electric Works, Ltd. | Peltier module |
| US5841064A (en) * | 1995-05-26 | 1998-11-24 | Matsushita Electric Works, Ltd. | Peltier module |
| JP2016164947A (en) * | 2015-03-06 | 2016-09-08 | 株式会社Kelk | Electrothermal power generation unit |
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