JPH04121978A - Surface mounting type connector and mounting method thereof - Google Patents

Surface mounting type connector and mounting method thereof

Info

Publication number
JPH04121978A
JPH04121978A JP2241770A JP24177090A JPH04121978A JP H04121978 A JPH04121978 A JP H04121978A JP 2241770 A JP2241770 A JP 2241770A JP 24177090 A JP24177090 A JP 24177090A JP H04121978 A JPH04121978 A JP H04121978A
Authority
JP
Japan
Prior art keywords
connector
insulator
board
mounting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2241770A
Other languages
Japanese (ja)
Other versions
JPH088123B2 (en
Inventor
Manabu Shimizu
学 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2241770A priority Critical patent/JPH088123B2/en
Publication of JPH04121978A publication Critical patent/JPH04121978A/en
Publication of JPH088123B2 publication Critical patent/JPH088123B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To improve miniaturization and productivity by installing such a means that an insulator for constituting a surface mounting type connector can separate a positioning region by folding-back the positioning region after the surface mounting type connector is mounted on a substrate. CONSTITUTION:The plug connector 21 of a surface mounting type connector is constituted of an U-shaped insulator 22 in a plan view and a plurality of plug terminals 3. In the insulator 22, notches cut in a V-shape 22b-1, 22b-2 are formed so that the projecting portions 22a at both sides of the insulator 22 can be separated by folding-back the whole length of the projection 22a in the length direction thereof. After solder paste is applied to the connection electrode 5a of a substrate 5, one side of the insulator 22 is pressed on the top face of the substrate 5 to position one side so that both of them are soldered to be connected. Next, a tool, etc., whose tip is sharpened is used to pry the projecting portion 22a in the direction of, for example, a1, and return it in the direction of a2; this work is continuously repeated a plurality of times with the result that only the projecting potion 22a is broken and can be separated.

Description

【発明の詳細な説明】 〔概　要〕 基板用の表面実装型コネクタに関し、 実装時の作業性を落とすことなく小型化２小スペース化
を実現して生産性の向上を図ることを目的とし、 一端が基板に接続されるコンタクトに形成されている複
数の端子を該コンタクトが片面側に該面から突出して整
列するように保持する絶縁体が、端子保持領域の外側に
基板に対する位置決め領域を具えて構成されている表面
実装型コネクタであって、該表面実装型コネクタを構成
する上記絶縁体に、該表面実装型コネクタを基板に実装
した後の位置決め領域の折り返し曲げて該位置決め領域
が分離できる手段を具えて構成する。[Detailed Description of the Invention] [Summary] The present invention aims to improve productivity by achieving miniaturization (2) and reduction in space without compromising workability during mounting with respect to surface-mounted connectors for circuit boards. An insulator that holds a plurality of terminals formed on a contact whose one end is connected to a board so that the contacts are aligned on one side with the contacts protruding from the surface has a positioning area with respect to the board outside the terminal holding area. The surface mount type connector is configured with a surface mount type connector, and the positioning area can be separated by folding back and bending the positioning area after the surface mount type connector is mounted on the board, in the insulator constituting the surface mount type connector. Construct with means.

また、一端が基板に接続されるコンタクトに形成されて
いる複数の端子を該コンタクトが片面側に咳面から突出
して整列するように保持する絶縁体が、端子保持領域の
外側に基板に対する位置決め領域を具えて構成されてい
る表面実装型コネクタの実装方法であって、表面実装型
コネクタの各コンタクトに対応する位置に接続電極が形
成されている基板に該表面実装型コネクタを実装した後
、上記位置決め領域を折り返し曲げで分離して構成する
。Further, an insulator that holds a plurality of terminals formed on a contact whose one end is connected to the board so that the contacts are aligned so that they protrude from the surface on one side is provided with a positioning area with respect to the board outside the terminal holding area. A method for mounting a surface mount connector comprising: after mounting the surface mount connector on a substrate on which connection electrodes are formed at positions corresponding to each contact of the surface mount connector; The positioning area is separated by folding and bending.

〔産業上の利用分野］ 本発明は基板用の表面実装型コネクタの絶縁体の構成に
係り、特に実装時の作業性を落とすことなくコネクタと
しての小型化、小スペース化を実現して生産性の向上を
図った表面実装型コネクタに関する。[Industrial Application Field] The present invention relates to the structure of an insulator for a surface-mounted connector for a circuit board, and in particular, it is possible to reduce the size and space of the connector without reducing workability during mounting, thereby increasing productivity. This invention relates to a surface mount type connector with improved performance.

近年の電子機器の小型化、高性能化に伴い基板上に多く
の電子デバイスが搭載されるようになってきている。In recent years, as electronic equipment has become smaller and more sophisticated, many electronic devices have come to be mounted on substrates.

従って基板の各種信号を外部に取り出すために該基板に
装着する表面実装型コネクタはできるだけ基板上のスペ
ースをとらない小型であることが望まれている。Therefore, it is desired that a surface-mounted connector attached to the board for extracting various signals from the board to the outside be small enough to occupy as little space on the board as possible.

〔従来の技術〕[Conventional technology]

第３図は従来の表面実装型コネクタとその実装方法を示
す図であり、第４図は他の例を示す図である。FIG. 3 is a diagram showing a conventional surface mount type connector and its mounting method, and FIG. 4 is a diagram showing another example.

第３図で表面実装型コネクタのプラグコネクタ１は、同
じ厚さの平面視“コ“の字型に形成されている絶縁体２
と該絶縁体２の所定位置に整列して挿入固定されている
複数のプラグ端子３とで構成されており、該プラグ端子
３は一端は破線で示すジャックコネクタ４のジャック端
子に挿入されるプラグ電極３ａに形成されており、また
他端は該絶縁体２の厚さ方向の片面（図では下面）　２
ａから僅かに突出するようにオフセット曲げされたコン
タク１−３ｂに形成されている。In Fig. 3, a plug connector 1 of a surface mount type connector has an insulator 2 formed in a U-shape in plan view with the same thickness.
and a plurality of plug terminals 3 which are aligned and inserted and fixed at predetermined positions in the insulator 2, one end of which is inserted into the jack terminal of a jack connector 4, which is indicated by a broken line. The other end is formed on one side of the insulator 2 in the thickness direction (lower side in the figure) 2
The contacts 1-3b are bent in an offset manner so as to slightly protrude from the contact point 1-3b.

また該プラグコネクタ１を搭載して実装する基板５には
、該プラグコネクタ１の各コンタクト３ｂと対応する位
置に接続電極５ａがパターニング形成されている。Further, on the substrate 5 on which the plug connector 1 is mounted and mounted, connection electrodes 5a are patterned at positions corresponding to the respective contacts 3b of the plug connector 1.

そこで該基板５に上記プラグコネクタ１を実装するには
、例えば基板５の接続電極５ａ上に半田ペーストを塗布
した後、図の矢印Ａのようにプラグコネクタ１を降下さ
せて各コンタクト３ｂと接続電極５ａとを合致させなが
ら絶縁体２の片面２ａを基板５の上面に押圧して位置決
めし、そのまま図示されない治具等で両者を押圧固定し
て所定の加熱工程を経て半田接続するようにしている。Therefore, in order to mount the plug connector 1 on the board 5, for example, after applying solder paste on the connection electrodes 5a of the board 5, the plug connector 1 is lowered as shown by arrow A in the figure and connected to each contact 3b. One side 2a of the insulator 2 is pressed against the upper surface of the substrate 5 to position it while matching the electrode 5a, and then the two are pressed and fixed using a jig or the like (not shown), and the two are connected by soldering through a predetermined heating process. There is.

特にこの場合には、絶縁体２が平面視“コ゛の字型に形
成されているためプラグコネクタ１を安定した状態で基
板５に位置決め固定できるメリ・ノドがある。Particularly in this case, since the insulator 2 is formed in a "C" shape when viewed from above, there is a merit knot that allows the plug connector 1 to be stably positioned and fixed to the board 5.

他の例を示す第４図は第３図で使用した治具等を使うこ
となく半田接続する場合を示したものである。FIG. 4, which shows another example, shows a case where solder connection is made without using the jig used in FIG. 3.

第４図でプラグコネクタ１１は、同じ厚さの平面視“′
コ“の字型で両サイドの突出部に固定用の孔１２ａが設
けられている絶縁体重２と該絶縁体重２の所定位置に整
列して固定されている第３図で説明した複数のプラグ端
子３とで構成されている。In FIG. 4, the plug connector 11 has the same thickness in plan view "'"
An insulating weight 2 that is U-shaped and has fixing holes 12a provided in protrusions on both sides, and a plurality of plugs illustrated in FIG. 3 that are aligned and fixed at predetermined positions on the insulating weight 2. It consists of terminal 3.

また該プラグコネクタ１１を実装する基板１３には、該
プラグコネクタ１１の各プラグ端子３のコンタクト３ｂ
と対応する位置には接続電極１３ａがパターニング形成
されていると共に、該コンタクト３ｂと接続電極１３ａ
とを合致させたときの上記絶縁体１２の孔１２ａと対応
する位置には固定用の孔１３ｂが穿孔されている。Further, the board 13 on which the plug connector 11 is mounted has contacts 3b of each plug terminal 3 of the plug connector 11.
A connection electrode 13a is patterned at a position corresponding to the contact 3b and the connection electrode 13a.
A fixing hole 13b is bored at a position corresponding to the hole 12a of the insulator 12 when the two are aligned.

従って逆に上記孔１２ａと１３ｂとを合わせると、上記
コンタクト３ｂと接続電極１３ａとを対応させることが
できる。Therefore, by conversely aligning the holes 12a and 13b, the contact 3b and the connection electrode 13a can be made to correspond to each other.

そこで第３図で説明したように半田ペースト等を介在さ
せて螺子１４とナツト１５で両者を固定し加熱すること
で両者の半田接続を容易に行うことができる。Therefore, as explained in FIG. 3, by fixing the two with the screw 14 and the nut 15 with a solder paste or the like interposed therebetween and heating them, the solder connection between the two can be easily achieved.

しかし、前記第３図の場合ではプラグコネクタ１を安定
して固定するだめの位置決め領域Ｂが絶縁体２でカバー
されるため他の電子デバイス等を搭載することができず
、同様に第４図では位置決め領域Ｃが基板上の空きスペ
ースとして使用することができない欠点がある。However, in the case of FIG. 3, the positioning area B for stably fixing the plug connector 1 is covered by the insulator 2, so other electronic devices etc. cannot be mounted, and similarly, as shown in FIG. However, there is a drawback that the positioning area C cannot be used as an empty space on the substrate.

特に最近の如くコネクタとしての高密度化が進展し、例
えば各接続電極間のピンチが２．５４ｍｍ→２、Ｏｍｍ
→１　、２７ｍｍ→１　、　Ｏｍｍと狭くなった場合で
も、コネクタとしてのトータル的な大きさを同し比率で
小型化することができないことになる。Especially in recent years, the density of connectors has increased, and for example, the pinch between each connection electrode has increased from 2.54mm to 2.0mm.
→1, 27mm→1,0mm Even if the connector becomes narrower, the total size of the connector cannot be reduced at the same ratio.

［発明が解決しようとした課題］ 従来の絶縁体構成になる表面実装型コネクタでは、コネ
クタとしての小型化に制約が生ずると言う問題があり、
またコネクタの実装スペースを小さくすることにも制約
があるため基板面を有効に利用することができないと言
う問題があった。[Problem to be solved by the invention] Conventional surface mount connectors with an insulating structure have a problem in that there are restrictions on miniaturization of the connector.
There is also a problem in that the board surface cannot be used effectively because there are restrictions on reducing the mounting space for the connector.

〔課題を解決するための手段］ 上記問題点は、一端が基板に接続されるコンタクトに形
成されている複数の端子を該コンタクトが片面側に該面
から突出して整列するように保持する絶縁体が、端子保
持領域の外側に基板に対する位置決め領域を具えて構成
されている表面実装型コネクタであって、該表面実装型
コネクタを構成する上記絶縁体が、該表面実装型コネク
タを基板に実装した後の位置決め領域の折り返し曲げで
該位置決め領域が分離できる手段を具えて形成されてい
る表面実装型コネクタによって解決される。[Means for solving the problem] The above problem is solved by an insulator that holds a plurality of terminals formed on a contact whose one end is connected to a substrate so that the contact protrudes from one side and is aligned. is a surface mount connector configured with a positioning area for the board outside the terminal holding area, and the insulator constituting the surface mount connector is mounted on the board. This is solved by a surface-mounted connector which is formed with means by which the positioning area can be separated by subsequent folding back of the positioning area.

また、一端が基板に接続されるコンタクトに形成されて
いる複数の端子を該コンタクトが片面側に該面から突出
して整列するように保持する絶縁体が、端子保持領域の
外側に基板に対する位置決め領域を具えて構成されてい
る表面実装型コネクタの実装方法であって、表面実装型
コネクタの各コンタクトに対応する位置に接続電極が形
成されている基板に該表面実装型コネクタを実装した後
、上記位置決め領域を折り返し曲げで分離する表面実装
型コネクタの実装方法によって解決される。Further, an insulator that holds a plurality of terminals formed on a contact whose one end is connected to the board so that the contacts are aligned and protrude from one side on one side is provided with a positioning area with respect to the board outside the terminal holding area. A method for mounting a surface mount connector comprising: after mounting the surface mount connector on a substrate on which connection electrodes are formed at positions corresponding to each contact of the surface mount connector; The problem is solved by a mounting method of a surface mount type connector in which the positioning area is separated by folding and bending.

〔作　用〕[For production]

従来同様の形状を持つコネクタを基板に実装した後該コ
ネクタの主要部を除く端部を除去すると、コネクタの小
型化を実現することができる。If a connector having the same shape as a conventional connector is mounted on a board and then the end portions of the connector except for the main portion are removed, the connector can be made smaller.

本発明では絶縁体の主要部すなわち端子保持領域の外側
に、実装後に分離可能な切込みを設けるようにしている
。In the present invention, a notch is provided in the main part of the insulator, that is, outside the terminal holding area, so that the insulator can be separated after mounting.

従って、実装時は従来と同様の作業性が維持できると共
に実装後に絶縁体の主要部外側の位置決め領域を分離す
ることでコネクタの小型化が実現できて基板面を有効に
利用することができる。Therefore, during mounting, the same workability as before can be maintained, and by separating the positioning area outside the main part of the insulator after mounting, the connector can be miniaturized and the board surface can be used effectively.

〔実施例〕 第１図は本発明になる表面実装型コネクタの一例とその
実装方法を説明する図であり、第２図は他の実施例を示
す図である。[Embodiment] FIG. 1 is a diagram illustrating an example of a surface-mounted connector according to the present invention and its mounting method, and FIG. 2 is a diagram showing another embodiment.

第１図で、（Ａ）はコ名りタ実装前の状態を示す図、（
Ｂ）は実装時を示す図、（Ｃ）は実装後の状態を示す図
であり、（Ａ）における（Ａ−１）はコネクタのみを矢
印り方向から見て表わしたものである。In Figure 1, (A) is a diagram showing the state before the connector is installed, (
B) is a diagram showing the state when mounted, (C) is a diagram showing the state after mounting, and (A-1) in (A) shows only the connector viewed from the direction of the arrow.

（Ａ）で表面実装型コネクタのプラグコネクタ２１は、
第３図のプラグコネクタ１と同様に同し厚さの平面視“
′コバの字型の絶縁体２２と該絶縁体２２の所定位置に
整列して挿入固定されている複数のプラグ端子３とで構
成されている。The plug connector 21 of the surface mount type connector in (A) is
Same thickness as plug connector 1 in Fig. 3 in plan view
It is composed of a corner-shaped insulator 22 and a plurality of plug terminals 3 which are aligned and inserted and fixed at predetermined positions on the insulator 22.

特にこの絶縁体２２には、その両サイドの突出部２２ａ
がその長さ方向の全長にわたって折り返し曲げで分離で
きるように、中間部近傍に絶縁体２２の厚さの１１５程
度を残して該絶縁体２２の表裏両面の対応する位置から
Ｖ型に切り込んだノツチ２２ｂＩ、　２２ｂ−２が形成
されている。In particular, this insulator 22 has protrusions 22a on both sides.
V-shaped notches are cut from corresponding positions on both the front and back surfaces of the insulator 22, leaving about 115 mm of the thickness of the insulator 22 near the middle part, so that the insulator 22 can be separated by folding over the entire length of the insulator 22. 22bI and 22b-2 are formed.

なおこのノツチ２２ｂ−＋　、　２２ｂ−ｚは、基板へ
実装した後の分離が容易なように基板面側のノツチ２２
ｂ２が表面（図では上面）側のノツチ２２ｂ−１より深
く切り込まれて形成されている。Note that these notches 22b-+ and 22b-z are located on the board surface side so that they can be easily separated after being mounted on the board.
b2 is formed by being cut deeper than the notch 22b-1 on the surface (upper surface in the figure) side.

また該プラグコネクタ２１を実装する基板５は第３図で
説明したものであり、上記コネクタ２１の各プラグ端子
３のコンタクト３ｂと対応する位置に接続電極５ａがバ
ターニング形成されている。The substrate 5 on which the plug connector 21 is mounted is the one described in FIG. 3, and connection electrodes 5a are patterned at positions corresponding to the contacts 3b of each plug terminal 3 of the connector 21.

そこで第３図で説明した如（、基板５の接続電極５ａ上
に半田ペーストを塗布した後矢印Ａのようにプラグコネ
クタ２１を降下させてコンタクト３ｂと接続電極５ａと
を合致させながら絶縁体２２の片面を基ｔｒＦｉ　５の
上面りこ押圧して位置決めし、治具等で押圧固定して所
定の加熱工程を経ることで両者を半田接続することがで
きる。Therefore, as explained in FIG. The upper surface of the base trFi 5 is positioned by pressing one side of the base trFi 5, and the two can be connected by soldering by pressing and fixing with a jig or the like and going through a predetermined heating process.

（Ｂ）はこの状態を表わしているが、この実装時までは
上記突出部２２ａが存在しているため第３図の場合と同
様に安定した状態で両者を位置決めして半田接続するこ
とができる。(B) shows this state, but since the protruding portion 22a is present until this time of mounting, it is possible to position and solder connect both in a stable state as in the case of Fig. 3. .

次いで、先端が先鋭化された工具等を使用して上記突出
部２２ａを例えばａ、方向にこじり更にａ２方向に戻す
等の作業を複数回継続すると、該突出部２２ａ部分のみ
が折損して分離できるので（Ｃ）に示す状態としたこと
ができる。Next, when the protrusion 22a is repeatedly pried in the direction a and then returned in the direction a2 using a tool with a sharpened tip, only the protrusion 22a is broken and separated. Therefore, the state shown in (C) can be achieved.

従って、プラグコネクタ２１を実装後に小型化すること
ができて第３図で説明した基板５の領域Ｂが両サイド共
露出することから該領域Ｂを有効に利用することができ
る。Therefore, the plug connector 21 can be downsized after being mounted, and since both sides of the region B of the substrate 5 explained in FIG. 3 are exposed, the region B can be effectively utilized.

他の例を示す第２図は第４図のプラグコネクタ１１に第
３回で説明したノツチを形成した場合を示したもので、
第１図同様に（ａ）はコネクタ実装前の状態を示す図、
（ｂ）は実装時を示す図、（Ｃ）は実装後の状態を示す
図である。FIG. 2, which shows another example, shows a case where the plug connector 11 in FIG. 4 is formed with the notch described in Part 3.
Similarly to Figure 1, (a) is a diagram showing the state before connector mounting,
(b) is a diagram showing the state when mounted, and (C) is a diagram showing the state after mounting.

（ａ）でプラグコネクタ３１は、第４図のプラグコネク
タ１１と同様に突出する両サイド突出部３２ａに固定用
の孔３２ｂを具えた同し厚さの平面視“コ”の字型の絶
縁体３２と該絶縁体３２の所定位置に固定されている複
数のプラグ端子３とで構成されている。In (a), the plug connector 31 is a U-shaped insulator having the same thickness and having fixing holes 32b in both side protrusions 32a in a plan view, similar to the plug connector 11 in FIG. It consists of a body 32 and a plurality of plug terminals 3 fixed at predetermined positions on the insulator 32.

そして上記絶縁体３２には、第１図で説明したように上
記突出部３２ａがその長さ方向の全長にわたって分離で
きるようなノツチ３２ｃｍ　、　、　３２ｃｍ　２が該
絶縁体３２の表裏両面の対応する位置にＶ型に形成され
ている。The insulator 32 is provided with notches 32 cm 2 , 32 cm 2 at corresponding positions on both the front and back surfaces of the insulator 32 so that the protrusion 32a can be separated over its entire length in the longitudinal direction. It is formed in a V-shape.

なお該ノツチ３２仁＋　＋　３２ｃｍ　２は、基板面側
のノツチ３２ｃｍｚが表面側のノツチ３２ｃｍ、より深
く形成されていることは第１図の場合と同様である。Note that the notches 32cm2 are formed deeper than the notches 32cmz on the surface side of the substrate, as in the case of FIG. 1.

また該プラグコネクタ３１を実装する基板１３は第４図
で説明したものであり、上記コネクタ３１の各コンタク
ト３ｂと対応する位置に接続電極１３ａがバターニング
形成されている七共に上記絶縁体３２の孔３２ａ　と対
応する位置には固定用の孔１３ｂが穿孔されている。The board 13 on which the plug connector 31 is mounted is as explained in FIG. A fixing hole 13b is bored at a position corresponding to the hole 32a.

そこで第４図同様に半田ペースト等を介在せしめて螺子
１４とナツト１５で両者を固定し加熱して両者を半田接
続した後、該螺子１４とナツト１５を外すと（ｂ）に示
す状態となる。Therefore, as in FIG. 4, after fixing the two with the screw 14 and the nut 15 by interposing solder paste or the like, heating them and soldering them together, and then removing the screw 14 and the nut 15, the state shown in FIG. 4(b) is obtained. .

従って、この実装時までは上記突出部３２ａが存在して
いるので安定した状態で両者を位置決め固定することが
できる。Therefore, since the protruding portion 32a exists until this time of mounting, both can be positioned and fixed in a stable state.

次いで、第１図のように先端が先鋭化された工具等で上
記突出部３２ａをａ、方向にこしり更にａ２方向に戻す
作業を複数回継続することで、該突出部３２ａが分離で
きて（ｃ）に示す状態としたことができる。Next, as shown in FIG. 1, the protruding part 32a can be separated by continuing the operation of scraping the protruding part 32a in the direction a and returning it in the direction a2 using a tool with a sharpened tip or the like several times. The state shown in (c) can be achieved.

従って、プラグコネクタ３１が小型化できると共に第４
図で説明した基板１３の位置決め領域Ｃが両サイド共に
露出することから該領域Ｃを有効に利用することができ
る。Therefore, the plug connector 31 can be made smaller and the fourth
Since the positioning area C of the substrate 13 explained in the figure is exposed on both sides, the area C can be used effectively.

〔発明の効果〕〔Effect of the invention〕

上述の如く本発明により、実装時の作業性を落とすこと
なくコネクタとしての小型化、小スペース化を実現する
ことで生産性の向上を図った表面実装型コネクタを提供
することができる。As described above, according to the present invention, it is possible to provide a surface-mounted connector that improves productivity by realizing a smaller connector and a smaller space without reducing workability during mounting.

なお本発明の説明に当たってはプラグコネクタを基板に
実装する場合について述べているが、プラグコネクタの
代わりにジャックコネクタを基板に実装する場合でも同
等の効果を得ることができる。Although the present invention has been described with reference to a case where a plug connector is mounted on a board, the same effect can be obtained even when a jack connector is mounted on a board instead of a plug connector.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明になる表面実装型コツフタの一例とその
実装方法を説明する図、 第２図は他の実施例を示す図、 第３図は従来の表面実装型コネクタの例とその実装方法
を示す図、 第４図は他の例を示す図、 である。 図において、 ３はプラグ端子、　　　３ｂはコンタクト、５．１３は
基板、　　　　５ａ、１３ａは接続電極、１３ｂ、３２
ｂは孔、　　　　１４は螺子、１５はナンド、 ２Ｌ３１はプラグコネクタ、 ２２．３２は絶縁体、　　　２２ａ　、　３２ａは突出
部、２２ｂ−＋　、　２２ｂ−ｚ　、３２ｃｍ　＋　、
３２ｃｍ　ｚ　　はノツチ、をそれぞれ表わす。 （Ｂ） 本発明ｌこｔよる：Ｓ面夫袈型コネクタの℃の実装方法
を遼明ブる図 第　１　図 伊Ｊと 他の実施例ｇ示す図 第　２　図 従来の表面実装型コネクタとでの実装方法）説明する図
化の例ｙ示す図 第 図Fig. 1 is an example of a surface mount type connector according to the present invention and a diagram explaining its mounting method. Fig. 2 is a diagram showing another embodiment. Fig. 3 is an example of a conventional surface mount type connector and its mounting. FIG. 4 is a diagram showing another example. In the figure, 3 is a plug terminal, 3b is a contact, 5.13 is a substrate, 5a, 13a are connection electrodes, 13b, 32
b is a hole, 14 is a screw, 15 is a NAND, 2L31 is a plug connector, 22.32 is an insulator, 22a, 32a are protrusions, 22b-+, 22b-z, 32cm +,
32cm z represents a notch. (B) According to the present invention: Figure 1 shows the mounting method of the S-face bulge type connector and other embodiments in Liaoming. (Implementation method)Example of diagram to explain

Claims (3)

【特許請求の範囲】[Claims] （１）一端が基板（５）に接続されるコンタクト（３ｂ
）に形成されている複数の端子を該コンタクト（３ｂ）
が片面側に該面から突出して整列するように保持する絶
縁体（２２）が、端子保持領域の外側に基板（５）に対
する位置決め領域を具えて構成されている表面実装型コ
ネクタであって、該表面実装型コネクタを構成する上記
絶縁体（２２）が、該表面実装型コネクタを基板（５）
に実装した後の位置決め領域の折り返し曲げで該位置決
め領域が分離できる手段（２２ｂ＿−＿１、２２ｂ＿−
＿２）を具えて形成されていることを特徴とした表面実
装型コネクタ。(1) A contact (3b) whose one end is connected to the board (5)
) are connected to the contact (3b).
An insulator (22) that protrudes from one side of the terminal and is held in alignment is a surface-mounted connector configured with a positioning area for the board (5) outside the terminal holding area, The insulator (22) constituting the surface mount connector connects the surface mount connector to the substrate (5).
Means (22b_-_1, 22b_-) that can separate the positioning area by folding the positioning area after mounting on the
_2) A surface-mounted connector characterized by being formed. （２）前記の位置決め領域を分離する手段が、絶縁体（
２２）の表裏面の対応する位置に基板（５）と対面する
面側が他面側よりも深くなるように形成されたノッチ（
２２ｂ＿−＿１、２２ｂ＿−＿２）であることを特徴と
した請求項１記載の表面実装型コネクタ。(2) The means for separating the positioning areas is an insulator (
Notches (22) are formed at corresponding positions on the front and back surfaces of the board (5) so that the side facing the substrate (5) is deeper than the other side.
22b_-_1, 22b_-_2) The surface-mounted connector according to claim 1. （３）一端が基板（５）に接続されるコンタクト（３ｂ
）に形成されている複数の端子を該コンタクト（３ｂ）
が片面側に該面から突出して整列するように保持する絶
縁体（２２）が、端子保持領域の外側に基板（５）に対
する位置決め領域を具えて構成されている表面実装型コ
ネクタの実装方法であって、表面実装型コネクタの各コ
ンタクト（３ｂ）に対応する位置に接続電極（５ａ）が
形成されている基板（５）に該表面実装型コネクタを実
装した後、上記位置決め領域を折り返し曲げで分離する
ことを特徴とした表面実装型コネクタの実装方法。(3) A contact (3b) whose one end is connected to the board (5)
) are connected to the contact (3b).
A method for mounting a surface mount type connector, wherein an insulator (22) that is held so that the terminals protrude from one side and are aligned has a positioning area for the board (5) outside the terminal holding area. After mounting the surface mount connector on a substrate (5) on which connection electrodes (5a) are formed at positions corresponding to each contact (3b) of the surface mount connector, the positioning area is folded back and bent. A mounting method for a surface mount type connector characterized by separation.
JP2241770A 1990-09-12 1990-09-12 Surface mount type connector and its mounting method Expired - Fee Related JPH088123B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2241770A JPH088123B2 (en) 1990-09-12 1990-09-12 Surface mount type connector and its mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2241770A JPH088123B2 (en) 1990-09-12 1990-09-12 Surface mount type connector and its mounting method

Publications (2)

Publication Number Publication Date
JPH04121978A true JPH04121978A (en) 1992-04-22
JPH088123B2 JPH088123B2 (en) 1996-01-29

Family

ID=17079268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2241770A Expired - Fee Related JPH088123B2 (en) 1990-09-12 1990-09-12 Surface mount type connector and its mounting method

Country Status (1)

Country Link
JP (1) JPH088123B2 (en)

Also Published As

Publication number Publication date
JPH088123B2 (en) 1996-01-29

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