JPH04116855A - Integrated circuit - Google Patents
Integrated circuitInfo
- Publication number
- JPH04116855A JPH04116855A JP23620290A JP23620290A JPH04116855A JP H04116855 A JPH04116855 A JP H04116855A JP 23620290 A JP23620290 A JP 23620290A JP 23620290 A JP23620290 A JP 23620290A JP H04116855 A JPH04116855 A JP H04116855A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- arms
- heat dissipating
- heat
- dissipating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
本発明は集積回路に関し、特に放熱器（ヒートシンク）
を有する集積回路に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to integrated circuits, and in particular to heat sinks.
The present invention relates to an integrated circuit having an integrated circuit.
従来技術
一般に、半導体素子を有する集積回路においては、その
発熱が問題となるため、外部ケースにヒートシンクが設
けられている。従来、そのヒートシンクは、半田付は等
により外部ケースに固着されていた。BACKGROUND ART In general, in integrated circuits having semiconductor elements, heat generation is a problem, so a heat sink is provided in the external case. Conventionally, the heat sink has been fixed to the external case by soldering or the like.
しかし、かかる従来の集積回路は、プリント基板上に高
密度実装されると、集積回路のリード部分の保守等の際
、半田ゴテを使用する場合には、付近に実装されている
他の集積回路のヒートシンクが邪魔となり、作業性が悪
いという欠点があった。However, when such conventional integrated circuits are mounted at high density on a printed circuit board, when a soldering iron is used to maintain the leads of the integrated circuit, other integrated circuits mounted nearby cannot be used. The disadvantage was that the heat sink was a nuisance and workability was poor.
発明の目的
本発明は上述した従来の欠点を解決するためになされた
ものであり、その目的はプリント基板上に高密度実装さ
れた場合であっても保守作業性の良い集積回路を提供す
ることである。OBJECT OF THE INVENTION The present invention has been made to solve the above-mentioned conventional drawbacks, and its purpose is to provide an integrated circuit with good maintainability even when mounted on a printed circuit board at high density. It is.
発明の構成
本発明による集積回路は、放熱部材を有する集積回路で
あって、前記放熱部材を脱着自在としたことを特徴とす
る。Structure of the Invention An integrated circuit according to the present invention is an integrated circuit having a heat radiating member, and is characterized in that the heat radiating member is detachable.
実施例 次に、本発明について図面を参照して説明する。Example Next, the present invention will be explained with reference to the drawings.
第１図は本発明による集積回路の一実施例の構成を示す
外観図である。図において、本発明の一実施例による集
積回路は、集積回路のケース１上に接合されている平板
の固定用部材５と、その両端の回転軸４ａ及び４ｂによ
り回転し、かつ先端部が内側に折り曲げられたアーム７
ａ及び７ｂと、固定用部材５の上に接着された弾性を有
する伝熱シートと、上面に平行な２本の満８ａ及び８ｂ
が設けられた放熱用部材３とを有し、アーム７ａ及び７
ｂで両側から放熱用部材３をはさみ込み、アームの先端
の折り曲った部分が放熱用部材の溝に引っかかり、伝熱
シート６の弾性力で放熱用部材３が固定される構造とな
っている。なお、２はリード、９はプリント基板である
。FIG. 1 is an external view showing the structure of an embodiment of an integrated circuit according to the present invention. In the figure, an integrated circuit according to an embodiment of the present invention is rotated by a flat plate fixing member 5 joined to a case 1 of the integrated circuit, and rotating shafts 4a and 4b at both ends thereof, and the tip thereof is inside. Arm 7 bent to
a and 7b, an elastic heat transfer sheet adhered onto the fixing member 5, and two sheets 8a and 8b parallel to the upper surface.
and a heat dissipation member 3 provided with arms 7a and 7.
The structure is such that the heat dissipation member 3 is sandwiched from both sides at b, the bent portion of the tip of the arm is caught in the groove of the heat dissipation member, and the heat dissipation member 3 is fixed by the elastic force of the heat transfer sheet 6. . Note that 2 is a lead and 9 is a printed circuit board.
かかる構成によれば、固定用部材５の向かい合う２辺に
設けられた回転軸４ａ及び４ｂを中心に、アーム７ｇ、
７ｂは夫々矢印Ｙａ、Ｙｂの方向に回動できる。プリン
ト基板９上に集積回路が実装され、実使用の状態におい
ては、アーム７ａ及び７ｂによりはさみ込まれ、さらに
伝熱シート６の弾性によってアーム７ａ、７ｂの折り曲
がった部分が溝８ｇ、８ｂに引っかかることにより、放
熱用部材３が固定される。According to this configuration, the arms 7g,
7b can rotate in the directions of arrows Ya and Yb, respectively. An integrated circuit is mounted on a printed circuit board 9, and in actual use, it is sandwiched between arms 7a and 7b, and the elasticity of heat transfer sheet 6 causes the bent portions of arms 7a and 7b to fit into grooves 8g and 8b. By being caught, the heat radiation member 3 is fixed.
一方、保守作業等を行う際にはアーム７ａ、７ｂを矢印
Ｙａ、Ｙｂの方向に回動させた後、放熱用部材３を取り
はずせば良い。これにより、半田ゴテを用いる場合の作
業性が向上するのである。On the other hand, when performing maintenance work or the like, the heat radiation member 3 may be removed after rotating the arms 7a and 7b in the directions of arrows Ya and Yb. This improves workability when using a soldering iron.
なお、アーム及び固定用部材には、アルミニウム等の金
属材料を用いれば良い。また、伝熱シトは、シリコーン
ゴム等の弾性を有する材料を用いて成形すれば良い。た
だし、アームの材質に弾性があれば、伝熱シートは弾性
のないものでも良い。Note that a metal material such as aluminum may be used for the arm and the fixing member. Further, the heat transfer sheet may be formed using an elastic material such as silicone rubber. However, if the material of the arm is elastic, the heat transfer sheet may be non-elastic.
さらに、本実施例ではアームによって放熱用部材をはさ
み込む方式を採用しているが、周知のプラグ及びジャッ
クを用いる方式でも同様の効果が得られる。この場合に
は、集積回路側にプラグ、放熱用部材側にジャックを設
けておけば良い。また、集積回路については、ＤＩＰ型
、ＰＧＡ型等、一般のＩＣに限らず、Ｈ−ＩＣ（ハイブ
リッドＩＣ）についても本発明が適用できることは明ら
かである。Furthermore, although this embodiment adopts a method in which the heat dissipation member is sandwiched between arms, the same effect can be obtained by using a method using a well-known plug and jack. In this case, a plug may be provided on the integrated circuit side and a jack may be provided on the heat dissipation member side. Furthermore, regarding integrated circuits, it is clear that the present invention is applicable not only to general ICs such as DIP type and PGA type, but also to H-ICs (hybrid ICs).
発明の詳細
な説明したように本発明は、放熱部材を脱着自在とした
ことにより、保守作業性か向上するという効果がある。As described in detail, the present invention has the effect of improving maintenance workability by making the heat radiating member detachable.
第１図は本発明の実施例による集積回路の構成を示す外
観図である。
主要部分の符号の説明
３・・・・・・放熱用部材
４ａ、４ｂ・・・・・・回転軸
５・・・・・・固定用部材
６・・・・・・電熱シート
７ｇ、７ｂ・・・・・・アーム
８ｇ、８ｂ・・・・・・溝FIG. 1 is an external view showing the configuration of an integrated circuit according to an embodiment of the present invention. Explanation of symbols of main parts 3...Heat radiation members 4a, 4b...Rotating shaft 5...Fixing member 6...Electric heating sheets 7g, 7b. ...Arm 8g, 8b...Groove
Claims (1)
材を脱着自在としたことを特徴とする集積回路。(1) An integrated circuit having a heat dissipating member, characterized in that the heat dissipating member is detachable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23620290A JPH04116855A (en) | 1990-09-06 | 1990-09-06 | Integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23620290A JPH04116855A (en) | 1990-09-06 | 1990-09-06 | Integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04116855A true JPH04116855A (en) | 1992-04-17 |
Family
ID=16997295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23620290A Pending JPH04116855A (en) | 1990-09-06 | 1990-09-06 | Integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04116855A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014218480A1 (en) * | 2014-09-15 | 2016-03-17 | Continental Automotive Gmbh | Spatial light modulator |
-
1990
- 1990-09-06 JP JP23620290A patent/JPH04116855A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014218480A1 (en) * | 2014-09-15 | 2016-03-17 | Continental Automotive Gmbh | Spatial light modulator |
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