JPH04116198A - Diamond eutectic plating film and plating method thereof - Google Patents
Diamond eutectic plating film and plating method thereofInfo
- Publication number
- JPH04116198A JPH04116198A JP2232228A JP23222890A JPH04116198A JP H04116198 A JPH04116198 A JP H04116198A JP 2232228 A JP2232228 A JP 2232228A JP 23222890 A JP23222890 A JP 23222890A JP H04116198 A JPH04116198 A JP H04116198A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- diamond
- plated
- diamond particles
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 48
- 238000007747 plating Methods 0.000 title claims abstract description 48
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims description 10
- 230000005496 eutectics Effects 0.000 title abstract 2
- 239000002245 particle Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 239000004094 surface-active agent Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000009210 therapy by ultrasound Methods 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- DWKNOLCXIFYNFV-HSZRJFAPSA-N 2-[[(2r)-1-[1-[(4-chloro-3-methylphenyl)methyl]piperidin-4-yl]-5-oxopyrrolidine-2-carbonyl]amino]-n,n,6-trimethylpyridine-4-carboxamide Chemical compound CN(C)C(=O)C1=CC(C)=NC(NC(=O)[C@@H]2N(C(=O)CC2)C2CCN(CC=3C=C(C)C(Cl)=CC=3)CC2)=C1 DWKNOLCXIFYNFV-HSZRJFAPSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001272720 Medialuna californiensis Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- MCRWZBYTLVCCJJ-DKALBXGISA-N [(1s,3r)-3-[[(3s,4s)-3-methoxyoxan-4-yl]amino]-1-propan-2-ylcyclopentyl]-[(1s,4s)-5-[6-(trifluoromethyl)pyrimidin-4-yl]-2,5-diazabicyclo[2.2.1]heptan-2-yl]methanone Chemical compound C([C@]1(N(C[C@]2([H])C1)C(=O)[C@@]1(C[C@@H](CC1)N[C@@H]1[C@@H](COCC1)OC)C(C)C)[H])N2C1=CC(C(F)(F)F)=NC=N1 MCRWZBYTLVCCJJ-DKALBXGISA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003721 gunpowder Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229940049920 malate Drugs 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- AYOOGWWGECJQPI-NSHDSACASA-N n-[(1s)-1-(5-fluoropyrimidin-2-yl)ethyl]-3-(3-propan-2-yloxy-1h-pyrazol-5-yl)imidazo[4,5-b]pyridin-5-amine Chemical compound N1C(OC(C)C)=CC(N2C3=NC(N[C@@H](C)C=4N=CC(F)=CN=4)=CC=C3N=C2)=N1 AYOOGWWGECJQPI-NSHDSACASA-N 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- XULSCZPZVQIMFM-IPZQJPLYSA-N odevixibat Chemical compound C12=CC(SC)=C(OCC(=O)N[C@@H](C(=O)N[C@@H](CC)C(O)=O)C=3C=CC(O)=CC=3)C=C2S(=O)(=O)NC(CCCC)(CCCC)CN1C1=CC=CC=C1 XULSCZPZVQIMFM-IPZQJPLYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、微細なダイヤモンド粒子を含むメッキ被膜
およびそのメッキ法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a plating film containing fine diamond particles and a plating method therefor.
（従来の技術）
機械部品の表面にダイヤモンドの微粒子をメッキよって
定着させ、耐摩耗性と潤滑性を改善することはすてに知
られている（例えば、特公昭５６−２４０３２号公報、
特開昭４８−１１２３９号公報）。(Prior Art) It is well known to improve wear resistance and lubricity by fixing fine diamond particles on the surface of mechanical parts by plating them (for example, Japanese Patent Publication No. 56-24032,
(Japanese Unexamined Patent Publication No. 48-11239).
従来この種のメッキに用いられるダイヤモンドの粒径は
小さくても数ミクロン（１μ＝０．００１＋ｎｍ）であ
り、ダイヤモンド粒子が、接触する相手側部品に微細な
傷を付ける欠点があった。また、従来、単結晶のダイヤ
モンドが使われており、この単結晶ダイヤモンドは１２
面体、８面体または６面体の形状をなし、鋭利な角が有
るので、相手方に一層キズをつけやすい。Conventionally, the particle size of diamond used in this type of plating is at least a few microns (1μ=0.001+nm), and the diamond particles have the disadvantage of causing minute scratches on the mating parts they come into contact with. In addition, conventionally, single-crystal diamond has been used, and this single-crystal diamond has 12
It has the shape of a face, octahedron, or hexahedron, and has sharp corners, making it easier to damage the other party.
さらに、ダイヤモンド粒子が大きいため、メッキ浴中に
分散させても、すくに凝集沈降してしまう。このため、
メッキ液中で下向きになる面は上向きになる面に比べて
、ダイヤモンド粒子の共析量が極端に少ないという問題
がある。そこで、共析処理条件、メッキ槽構造およびメ
ッキ液循環方式等複雑な条件を吟味する必要があった。Furthermore, since diamond particles are large, they easily coagulate and settle even when dispersed in a plating bath. For this reason,
There is a problem in that the amount of eutectoid diamond particles on the surface facing downward in the plating solution is extremely smaller than on the surface facing upward. Therefore, it was necessary to carefully examine complex conditions such as eutectoid treatment conditions, plating tank structure, and plating solution circulation system.
ダイヤモンド粒径が大きいことによる他の問題は、メッ
キ被膜の表面が粗くなり、メッキ後、表面を平滑にする
ため機械的な二次加工が必要であった。Another problem caused by the large diamond particle size is that the surface of the plating film becomes rough, requiring mechanical secondary processing to smooth the surface after plating.
（発明が解決しようとする課題）
この発明は、相手側部品にキズを付けることがなく、機
械的な二次加工を必要のない、潤滑性の優れたダイヤモ
ンド共析メッキ被膜を得るを目的とする。他の目的は、
被メッキ体全面にわたって均一なダイヤモンドの共析量
が得られ、しかも、特殊な設備を要せず、簡単にてきる
メッキ法を提供することにある。(Problems to be Solved by the Invention) The purpose of this invention is to obtain a diamond eutectoid plating film with excellent lubricity that does not damage the mating parts and does not require mechanical secondary processing. do. Other purposes are
To provide a plating method which can obtain a uniform eutectoid amount of diamond over the entire surface of an object to be plated, and which can be easily performed without requiring special equipment.
（課題を解決するための手段）
この発明では、ダイヤモンド粒子として、平均粒径が１
０〜１００人（１人＝１０ 印）のものを用いる。粒径
は小さいほと好ましい。しかも、多結晶のものを用いる
。多結晶ダイヤモンドは、単結晶のものと違って鋭利な
角がなく丸みを帯びている。(Means for solving the problem) In this invention, diamond particles have an average particle size of 1
0 to 100 people (1 person = 10 marks) will be used. The smaller the particle size, the better. Furthermore, a polycrystalline material is used. Unlike single crystal diamonds, polycrystalline diamonds have no sharp edges and are rounded.
一般に超微粒ダイヤモンドは、不活性ガスで満たした圧
力容器内でＴＮＴ火薬を爆発させ、黒鉛に超高圧超高温
を加えることによって製造されるが、この発明で用いら
れるような数十人の多結晶ダイヤモンドは、特に粒子成
長速度を大きな値（例えば約５ ｗＩＩＩ／ Ｓ ）に
制御することによって得られる。粒径の大きさを揃える
ための分級工程も不可欠である。Generally, ultrafine diamonds are produced by exploding TNT gunpowder in a pressure vessel filled with inert gas and applying ultrahigh pressure and ultrahigh temperature to graphite. Diamonds are obtained in particular by controlling the grain growth rate to large values (e.g. about 5 wIII/S). A classification process is also essential to make the particle size uniform.
メッキ液は、電解でも無電解でもよく、ニッケル、クロ
ム、ニッケル合金、コバルト、ニッケルーコバルト合金
、コバルト合金、ニッケルータングステン合金、銅、等
のメッキ可能な金属を含むものを用いることができる。The plating solution may be electrolytic or electroless, and may contain a platingable metal such as nickel, chromium, nickel alloy, cobalt, nickel-cobalt alloy, cobalt alloy, nickel-tungsten alloy, copper, or the like.
ダイヤモンド粒子はメッキ液に均一に分散させる。例え
ば、純水中にダイヤモンド粒子を入れ、超音波処理を施
して、メッキ液に混ぜる。懸濁状態を長時間維持するた
めに、必要に応して界面活性剤を添加する。The diamond particles are uniformly dispersed in the plating solution. For example, diamond particles are placed in pure water, treated with ultrasonic waves, and mixed into the plating solution. In order to maintain a suspended state for a long time, a surfactant is added as necessary.
ダイヤモンドの粒径がたいへん小さいため、メッキ浴中
でのダイヤモンド粒子の沈降速度はたいへん遅く、数時
間にわたって懸濁状態を維持することができる。なお、
金属が析出する際に水素等のガスが発生し、これによっ
てメッキ液が対流を起こすので、メッキ液を撹拌しなく
とも、良好な懸濁状態を維持する。Due to the very small particle size of diamond, the settling rate of diamond particles in the plating bath is very slow and they can remain in suspension for several hours. In addition,
Gas such as hydrogen is generated when the metal is deposited, and this causes convection in the plating solution, so that a good suspended state is maintained without stirring the plating solution.
このメッキ浴に被メッキ物を漫潰し、所要の厚さのメッ
キ被膜を得る。ピンホールを作らないため、メッキの最
中、被メッキ物に適度の揺動または衝撃を与えるとよい
。メッキ液中にはダイヤモンド粒子が均一に分散してい
るので、上向きの面でも下向きの面にでもダイヤモンド
が均一に共析する。The object to be plated is crushed in this plating bath to obtain a plated film of the required thickness. To avoid creating pinholes, it is best to apply appropriate shaking or impact to the object to be plated during plating. Since diamond particles are uniformly dispersed in the plating solution, diamonds are eutectoid uniformly on both upward and downward surfaces.
得られたメッキ被膜は、粒径が微細で、しかも多結晶の
丸みを帯びたダイヤモンド粒子を含んでいるので、接触
する相手方にキズをつけることがなく、表面が平滑であ
って、他の部品と摺り合わせたとき、潤滑性がよく、耐
摩耗性に優れる。The resulting plating film has a fine grain size and contains rounded polycrystalline diamond particles, so it does not scratch the object it comes into contact with, and has a smooth surface that makes it easy to protect other parts. When rubbed together, it has good lubricity and excellent wear resistance.
（実施例）
実施例−１（電解メッキの例）
硫酸ニッケル １５０ｇ／ｚ塩化二・ン
ケル ２００ｇ／ｌホウ酸
３５ｇ／を界面活性剤
２〜３滴ダイヤモンド粒子（粒径２０〜５０人）Ｉｇ／
を上記の組成のメッキ液を温度６０℃、ＰＨ１，５に保
ち、被メッキ体を陰極に配置し、電流密度５Ａ／ｄイで
１０分間メッキを行ない、３μｍの厚さのメッキ被膜を
得た。(Example) Example-1 (Example of electrolytic plating) Nickel sulfate 150g/z dichloride 200g/l boric acid
35g/surfactant
2-3 drops diamond particles (particle size 20-50) Ig/
A plating solution having the above composition was maintained at a temperature of 60°C and a pH of 1.5, the object to be plated was placed on the cathode, and plating was performed at a current density of 5 A/d for 10 minutes to obtain a plated film with a thickness of 3 μm. .
実施例−２（無電解メッキの例）
硫酸ニッケル ３５ｙ、／ｌグリシン
２０ｇ／ｌリンゴ酸塩
３５ｇ／ｌＤＭＡＢ
５ｇ／を界面活性剤 ２〜３滴
ダイヤモンド粒子（粒径２０〜５０人）１ｇ／を上記の
組成のメッキ液を温度６５℃、ＰＨ６，７に保ち、被メ
ッキ体を３０分浸漬し、３μｍの厚さのメッキ被膜を得
た。Example-2 (Example of electroless plating) Nickel sulfate 35y,/l glycine 20g/l malate
35g/lDMAB
5g/ of surfactant, 2-3 drops of diamond particles (particle size: 20-50), 1g/of plating solution with the above composition, kept at temperature 65℃ and pH 6,7, immersed the object to be plated for 30 minutes, 3μm A plating film with a thickness of .
実施例−３（無電解メッキの例）
硫酸ニッケル
２’２ｚ／ｌ
乳酸 ２８ ｇ／乙ジ
プロピオン酸 ２．２ｇ／を次亜リン酸ナ
トリュウム ２０ｇ／を界面活性剤
２〜３滴ダイヤモンド粒子（粒径２０〜５０人）
Ｉｇ／を上記の組成のメッキ液を温度９０℃、ＰＨ４，
６〜５．５に保ち、被メッキ体を３０分浸漬し、６μｍ
の厚さのメッキ被膜を得た。Example 3 (Example of electroless plating) Nickel sulfate 2'2z/l Lactic acid 28 g/Dipropionic acid 2.2 g/Sodium hypophosphite 20 g/Surfactant
2-3 drops diamond particles (particle size 20-50)
Ig/plating solution with the above composition was heated at 90°C, pH 4,
6 to 5.5, immerse the object to be plated for 30 minutes, and
A plating film with a thickness of .
実施例−４
マイクロドリル（ｏ、３φ）に無電解メッキ法および電
解メッキ法てダイヤモンド共析メッキ（膜厚３μｍ）を
施し、自動穴明は機を使って真鍮の穴加工を行なったと
ころ、従来の超硬トリルに比へ約３倍の寿命（実加工個
数６０００個）が得られた。Example 4 A micro drill (o, 3φ) was coated with diamond eutectoid plating (film thickness 3 μm) using electroless plating and electrolytic plating, and an automatic hole drilling machine was used to machine a brass hole. Approximately three times longer life than conventional carbide trills (6,000 pieces actually machined).
実施例−５
半月形ドリル（０，７２φ、深さ１．８＋ｗ）に無電解
メッキ法および電解メッキ法でダイヤモンド共析メッキ
（膜厚３μｍ）を施し、自動穴明は機を使って真鍮の穴
加工を行なったところ、従来の超硬トリルに比べ約４．
４倍の寿命（実加工個数２００，０００ホール）が得ら
れた。加工面粗さおよび光沢については良好な結果が得
られた。Example-5 Diamond eutectoid plating (film thickness 3 μm) was applied to a half-moon drill (0.72φ, depth 1.8+W) by electroless plating and electrolytic plating, and automatic hole drilling was performed using a brass plate using a machine. When drilling the hole, it was approximately 4.5mm smaller than the conventional carbide drill.
Four times longer life (200,000 holes actually machined) was obtained. Good results were obtained regarding machined surface roughness and gloss.
実施例−６
面取りカッタ（１５φ、９０”、９５°）に無電解メッ
キ法および電解メッキ法でダイヤモンド共析メッキ（膜
厚２μｍ）を施し、自動面取り機を使ってＳＳ材の面取
り加工を行なったところ、従来のハイス材トリルに比へ
約３倍の寿命（実加工個数９，０００個）が得られた。Example-6 A chamfering cutter (15φ, 90”, 95°) was coated with diamond eutectoid plating (film thickness 2 μm) using electroless plating and electrolytic plating, and an automatic chamfering machine was used to chamfer the SS material. As a result, the lifespan was approximately three times longer than that of conventional high speed steel trills (9,000 pieces actually processed).
実施例−７
エンドミル（３，５φ）に無電解メッキ法および電解メ
ッキ法でダイヤモンド共析メッキ（膜厚４μｍ）を施し
、自動穴明は機を使ってフェライトコアの穴加工を行な
ったところ、従来の超硬に比べ約１．２倍の寿命（実加
工個数１，２００個）が得られた。Example 7 An end mill (3.5φ) was coated with diamond eutectoid plating (film thickness: 4 μm) using electroless plating and electrolytic plating, and an automatic hole drilling machine was used to drill holes in the ferrite core. Approximately 1.2 times longer life than conventional carbide (1,200 pieces actually machined) was obtained.
実施例−８
レンズ加工用治具に無電解メッキ法および電解メッキ法
でダイヤモンド共析メッキ（膜厚６μｍ）を施したとこ
ろ、従来の治具に比べ約４倍の寿命（実加工日数２日）
が得られた。Example 8 When a lens processing jig was coated with diamond eutectoid plating (film thickness: 6 μm) using electroless plating and electrolytic plating, the lifespan was approximately 4 times that of conventional jigs (actual processing time was 2 days). )
was gotten.
実施例−９
フェライト加工用治具に無電解メッキ法および電解メッ
キ法でダイヤモンド共析メッキ（膜厚１０μｍ）を施し
、耐摩擦摺動部品として使用したところ、超硬品と比へ
ほぼ同一の寿命（実加工個数約２０万個）が得られた。Example 9 A ferrite processing jig was coated with diamond eutectoid plating (film thickness 10 μm) using electroless plating and electrolytic plating and used as a friction-resistant sliding component. A long service life (approximately 200,000 pieces actually processed) was achieved.
実施例−１Ｏ
コレットチャックに無電解メッキ法でダイヤモンド共析
メッキを施し、耐摩擦摺動部品として使用したところ、
従来のイオンブレーティング法およびその他の被膜生成
法では精度不良により使用てきなかったものが、機械的
フレ精度は２μｍ以下と良好な結果が得られた。Example-1O A collet chuck was coated with diamond eutectoid plating using an electroless plating method and used as a friction-resistant sliding component.
Conventional ion blating methods and other film forming methods have not been used due to poor accuracy, but good results were obtained with mechanical runout accuracy of 2 μm or less.
実施例−１１
マイクロドリル（０，４８φ）に無電解メッキ法および
電解メッキ法でダイヤモンド共析メッキ（膜厚４μｍ）
を施し、自動穴明は機を使ってマセライト（セラミック
）の穴加工を行なったところ、従来の超硬ドリルに比べ
約５倍の寿命（実加工個数５００個）が得られた。Example-11 Diamond eutectoid plating (film thickness 4 μm) using electroless plating method and electrolytic plating method on micro drill (0.48φ)
When we used an automatic drilling machine to drill holes in macerite (ceramic), we were able to obtain a lifespan approximately five times longer than that of conventional carbide drills (500 pieces actually machined).
実施例−１２
焼入れ鋼の散髪用ハサミに膜厚３μｍのダイヤモンド共
析メッキを施したところ、普通では４〜６週間で再研磨
刃付は加工を行なう必要があるが、１４力月間使用でき
た。Example 12 Hardened steel haircut scissors were coated with diamond eutectoid plating with a thickness of 3 μm, and the scissors could be used for 14 months, whereas normally the blades would need to be re-sharpened in 4 to 6 weeks. .
実施例−１３
鋼製の糸供給ガイドは普通、酸化アルミ（Ａｌ□０３）
を被覆するが、これに代えて膜厚４μｍのダイヤモンド
共析メッキを施したところ、０倍以上寿命が延びた。Example-13 Steel thread supply guide is usually made of aluminum oxide (Al□03)
However, when diamond eutectoid plating with a thickness of 4 μm was applied instead, the life was extended by more than 0 times.
て、長時間にわたって懸濁状態を保持することができ、
したがって、被メッキ部品の表面に均一にダイヤモンド
が共析する効果がある。can maintain a suspended state for a long time,
Therefore, there is an effect that diamond is eutectoid uniformly on the surface of the part to be plated.
実施例−１４
化学工業用ポンプの鋼シールに４μｍのダイヤモンド共
析メッキを施したところ、寿命が４０００時間から７０
００時間に延びた。Example 14 When the steel seal of a chemical industrial pump was coated with 4 μm diamond eutectoid plating, the life span was changed from 4000 hours to 70 hours.
It was extended to 00 hours.
Claims (2)
０〜１００Åの多結晶ダイヤモンド粒子が分散している
ダイヤモンド共析メッキ被膜。1. The average particle size is 1 in a metal matrix such as nickel.
A diamond eutectoid plating film in which polycrystalline diamond particles of 0 to 100 Å are dispersed.
粒子をメッキ浴中に懸濁させ、それに被メッキ物を浸漬
し、被メッキ物の表面に析出する金属被膜内にダイヤモ
ンド粒子を共析させることを特徴とするメッキ法。2. It is characterized by suspending polycrystalline diamond particles with an average particle size of 10 to 100 Å in a plating bath, immersing the object to be plated in it, and causing the diamond particles to eutectoid in the metal film deposited on the surface of the object to be plated. plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232228A JPH04116198A (en) | 1990-08-31 | 1990-08-31 | Diamond eutectic plating film and plating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2232228A JPH04116198A (en) | 1990-08-31 | 1990-08-31 | Diamond eutectic plating film and plating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04116198A true JPH04116198A (en) | 1992-04-16 |
Family
ID=16935986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2232228A Pending JPH04116198A (en) | 1990-08-31 | 1990-08-31 | Diamond eutectic plating film and plating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04116198A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011089933A1 (en) * | 2010-01-22 | 2011-07-28 | アイテック株式会社 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| JP2012505087A (en) * | 2008-10-07 | 2012-03-01 | デートワイラー・スイステック・アーゲー | Diamond coated doctor blade |
| JP2012092416A (en) * | 2010-09-30 | 2012-05-17 | Eyetec Co Ltd | Method for forming composite plating film |
| EP2269952A3 (en) * | 2001-08-30 | 2014-04-16 | Tadamasa Fujimura | Stable aqueous suspension liquid of finely divided particles metallic film containing diamond particles and method of producing the same |
| JP2017066437A (en) * | 2015-09-28 | 2017-04-06 | 株式会社ダイセル | Nano diamond containing plating film and nano diamond containing plating article |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2503095Y2 (en) * | 1993-07-20 | 1996-06-26 | 株式会社イデア | Barrier Poll |
-
1990
- 1990-08-31 JP JP2232228A patent/JPH04116198A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2503095Y2 (en) * | 1993-07-20 | 1996-06-26 | 株式会社イデア | Barrier Poll |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2269952A3 (en) * | 2001-08-30 | 2014-04-16 | Tadamasa Fujimura | Stable aqueous suspension liquid of finely divided particles metallic film containing diamond particles and method of producing the same |
| EP2269953A3 (en) * | 2001-08-30 | 2014-04-16 | Tadamasa Fujimura | Stable aqueous suspension liquid of finely divided particles metallic film containing diamond particles and method of producing the same |
| JP2012505087A (en) * | 2008-10-07 | 2012-03-01 | デートワイラー・スイステック・アーゲー | Diamond coated doctor blade |
| WO2011089933A1 (en) * | 2010-01-22 | 2011-07-28 | アイテック株式会社 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| JP2011149071A (en) * | 2010-01-22 | 2011-08-04 | Eyetec Co Ltd | Composite plating solution having diamonds particle dispersed therein, and method for producing the same |
| CN102753734A (en) * | 2010-01-22 | 2012-10-24 | 爱德有限公司 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| CN102753734B (en) * | 2010-01-22 | 2015-02-11 | 爱德有限公司 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| JP2012092416A (en) * | 2010-09-30 | 2012-05-17 | Eyetec Co Ltd | Method for forming composite plating film |
| JP2017066437A (en) * | 2015-09-28 | 2017-04-06 | 株式会社ダイセル | Nano diamond containing plating film and nano diamond containing plating article |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0674725B1 (en) | Electrodeposition of nickel-tungsten amorphous and microcrystalline coatings | |
| US20040256236A1 (en) | Compositions and coatings including quasicrystals | |
| US20090223829A1 (en) | Micro-Arc Assisted Electroless Plating Methods | |
| CA1063966A (en) | Electroplating method | |
| US4613388A (en) | Superplastic alloys formed by electrodeposition | |
| EP0181927B1 (en) | Electrodeposition of amorphous alloys | |
| Ebrahimi et al. | The effect of substrate on the microstructure and tensile properties of electrodeposited nanocrystalline nickel | |
| KR100338386B1 (en) | Wire saw with adhesive diamond electrodeposited on it and its manufacturing method | |
| JPH04116198A (en) | Diamond eutectic plating film and plating method thereof | |
| CA2782421A1 (en) | Electroless ni-composite plated substrate and method | |
| Rezende et al. | A review of corrosion resistance nanocomposite coatings | |
| JP2011084774A (en) | Method of manufacturing nickel alloy electroformed blade | |
| Sofer et al. | Evaluation and uses of composite Ni-Co matrix coatings with diamonds on steel applied by electrodeposition | |
| US4043878A (en) | Electroplating method | |
| Stoychev et al. | The influence of pulse frequency on the hardness of bright copper electrodeposits | |
| Kucharska et al. | Corrosion resistance of Ni/Al2O3 nanocomposite coatings | |
| Bobanova et al. | Properties of CoW alloy coatings electrodeposited from citrate electrolytes containing surface active substances | |
| KR102012726B1 (en) | Hexavalent Chrome Plating Solution And Crack Free Pulse-Reverse Electroplating Method Using of The Same | |
| US3168457A (en) | Apparatus for producing composite electroplated articles | |
| Chiou et al. | A novel method of composite electroplating on lap in lapping process | |
| US2763606A (en) | Electrodepositing baths and plating methods | |
| Steer | The Influence of Surface Behaviour on the Characteristics of Electrodeposits | |
| Huang et al. | Grinding performances of electroplated Ni–B-diamond tools prepared through composite electroplating with intermittent stirring | |
| TW201350594A (en) | Metal material | |
| TWI243856B (en) | Method for reducing internal stress of electroplated layer made of nickel-based alloy material |