JPH04105578U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPH04105578U JPH04105578U JP825491U JP825491U JPH04105578U JP H04105578 U JPH04105578 U JP H04105578U JP 825491 U JP825491 U JP 825491U JP 825491 U JP825491 U JP 825491U JP H04105578 U JPH04105578 U JP H04105578U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- foil pattern
- soldered
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000011888 foil Substances 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 36
- 239000011889 copper foil Substances 0.000 abstract description 30
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 230000003014 reinforcing effect Effects 0.000 abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】
【構成】銅張り配線基板1の表裏層に設けた各導電性金
属箔回路パターン3,4の露出部およびこの露出部の穴
面5がはんだづけができない金属6により選択的にめっ
きされたものである。
【効果】はんだ付けできない金属6,6aで補強用銅箔
パターン3と接地用銅箔パターン4をめっきしているた
め、電子部品を搭載してフローソルダリングを行っても
接地用銅箔パターン4のねじ穴のはんだつららを完全に
防ぐことができ、耐熱性テープを貼る必要が無くなる。
また、銅に比べニッケルの方が高硬度であるため、ねじ
止めに対する銅箔の変形を抑制することができ、穴の内
部にもめっきすることにより、ねじ止め時の圧縮力の耐
性も向上する。さらに、銅箔表面はソルダーレジストマ
スクまたははんだづけできない金属6aで完全に覆って
おり腐食からも保護することができる。
(57) [Summary] [Structure] The exposed portions of the conductive metal foil circuit patterns 3 and 4 provided on the front and back layers of the copper-clad wiring board 1 and the hole surfaces 5 of these exposed portions are selectively formed by the metal 6 that cannot be soldered. It is plated on. [Effect] Since the reinforcing copper foil pattern 3 and the grounding copper foil pattern 4 are plated with metals 6 and 6a that cannot be soldered, even if electronic components are mounted and flow soldering is performed, the grounding copper foil pattern 4 Solder icicles can be completely prevented from forming in the screw holes, eliminating the need to apply heat-resistant tape.
In addition, since nickel has higher hardness than copper, it can suppress the deformation of the copper foil when screwed, and by plating the inside of the hole, it also improves resistance to compressive force when screwed. . Furthermore, the surface of the copper foil is completely covered with a solder resist mask or a non-solderable metal 6a, so that it can be protected from corrosion.
Description
【0001】0001
本考案は印刷配線板に関し、特に各電子部品を機械的に固定して筺体に対する シャーシの働きも備えた印刷配線板に関する。 The present invention relates to printed wiring boards, and in particular, mechanically fixes each electronic component to a housing. It relates to a printed wiring board that also functions as a chassis.
【0002】0002
従来の筺体にねじ止めすることで接地するパターンを持つ印刷配線板は、図3 (a)〜(c)に示すように、印刷配線板の基材1上にあけた直径2.8〜4m mのねじ穴5の周辺に電気的に接続できるように直径8〜15mmの開口部を設 けたソルダーレジストマスク2と、基材1の裏面に設けた接地用銅箔パターン4 と、基板1の上面にねじの頭があたるように設けた補強用銅箔パターン3とを有 しているものがある(従来例1)。 A conventional printed wiring board with a pattern that can be grounded by screwing it to the housing is shown in Figure 3. As shown in (a) to (c), the diameter is 2.8 to 4 m on the base material 1 of the printed wiring board. An opening with a diameter of 8 to 15 mm is provided around the screw hole 5 of A girder solder resist mask 2 and a grounding copper foil pattern 4 provided on the back side of the base material 1 and a reinforcing copper foil pattern 3 provided so that the head of the screw touches the top surface of the board 1. (Conventional Example 1)
【0003】 また、図4(a)〜(c)に示すように、接地用銅箔パターン4aとして、ね じ穴5の回りに0.2〜0.5mmの非銅箔部を設けた従来例2がある。この従 来例2で0.2〜0.5mmの非銅箔部を設ける訳は、ねじ穴5をまたぐ接地用 銅箔パターンの距離を取ることにより、はんだの重みではんだつららを防止する 結果をねらっている。0003 In addition, as shown in FIGS. 4(a) to 4(c), as a grounding copper foil pattern 4a, There is a conventional example 2 in which a non-copper foil portion of 0.2 to 0.5 mm is provided around the same hole 5. This servant The reason why the 0.2 to 0.5 mm non-copper foil part is provided in Example 2 is because it is for grounding across the screw hole 5. By keeping the distance between the copper foil patterns, the weight of the solder can prevent solder icicles. Aiming for results.
【0004】 これらの印刷配線板を実装した場合、その取付部分は図5のようになる。この 印刷配線板を筺体11に接地するために、ねじ7に座金9とばね座金8を通した のち、ねじ7を補強用銅箔パターン3側から接地用銅箔パターン4,4a側へ通 し、ここで突出したねじ山を筺体11側の金属部に設けためねじ10にねじこむ 。ここで、ばね座金8は省略される場合もある。0004 When these printed wiring boards are mounted, the mounting portion will be as shown in FIG. 5. this In order to ground the printed wiring board to the housing 11, a washer 9 and a spring washer 8 were passed through the screw 7. After that, pass the screw 7 from the reinforcing copper foil pattern 3 side to the grounding copper foil pattern 4, 4a side. Then, install the protruding thread on the metal part on the side of the housing 11 and screw it into the female screw 10. . Here, the spring washer 8 may be omitted.
【0005】[0005]
上述した印刷配線板の接地用銅箔パターン4,4aは、ねじ穴5を印刷配線板 のねじ止めと兼用するので、はんだ付け面になり、印刷配線板に電子部品を搭載 後、端子リードをフロー・ソルダリングすることになる。この場合、第1に銅の はんだ濡れ特性によってねじ穴5に、図6に示すような、はんだつらら12を作 ってしまい、ねじを通すことができない問題がある。また、第2にこのはんだつ ららを防ぐために接地用銅箔パターン4,4aを含めて、穴上に耐熱性テープを 貼り、はんだが銅箔に触れないようにする必要があり、工数的・費用的に損失と なる。第3に、ねじ穴5の周り0.2〜0.5mmの非銅箔部を設けて穴周りの 接地銅箔パターン4,4aを遠ざけることにより改善を得ようとしても、実験で は直径4mmの穴の周り2〜5mm以上の非銅箔部を設けなければ完全にはんだ つららを防げないため、対策にならなかった。 The grounding copper foil patterns 4, 4a of the printed wiring board described above have screw holes 5 connected to the printed wiring board. Since it also serves as a screw fastener, it becomes a soldering surface for mounting electronic components on printed wiring boards. Afterwards, the terminal leads will be flow soldered. In this case, firstly, copper Depending on the solder wetting characteristics, solder icicles 12 are created in the screw holes 5 as shown in Figure 6. There is a problem that the screws cannot be inserted. Also, secondly, this soldering Place heat-resistant tape over the holes, including the grounding copper foil patterns 4 and 4a, to prevent It is necessary to prevent the solder from touching the copper foil, which results in losses in terms of man-hours and costs. Become. Thirdly, a non-copper foil part of 0.2 to 0.5 mm is provided around the screw hole 5. Even if an attempt was made to improve by moving the ground copper foil patterns 4 and 4a away, experiments showed that It will not be completely soldered unless there is a non-copper foil part of 2 to 5 mm or more around the 4 mm diameter hole. It was not a countermeasure because it could not prevent icicles.
【0006】 本考案の目的は、これらの問題を解決し、はんだつららを防止できる印刷配線 板を提供することにある。[0006] The purpose of this invention is to solve these problems and to provide printed wiring that can prevent solder icicles. The purpose is to provide a board.
【0007】[0007]
本考案の構成は、銅張り配線基板の表裏層に設けた各導電性金属箔回路パター ンの露出部およびこの露出部の穴面が、はんだづけができない金属により選択的 にめっきされたものであることを特徴とする。 The structure of the present invention consists of conductive metal foil circuit patterns provided on the front and back layers of a copper-clad wiring board. The exposed portion of the connector and the hole surface of this exposed portion may be selectively removed due to non-solderable metal. It is characterized by being plated with.
【0008】[0008]
図1(a),(b),(c)は本考案の一実施例の部分上面図,断面図および 底面図である。基材1上に設けた直径2.8〜4.0mm程度のねじ穴5の周囲 に、上面図や底面図のような補強用銅箔パターン3と接地用銅箔パターン4を直 径7〜12mmもしくは、一辺が7〜12mmの長方形の大きさで設け、上面図 や底面図のように、ソルダーレジストマスク2で露出させたくない部分を覆って いる。さらに、図のように露出している部分に、はんだづけできない金属6であ るニッケルを無電解めっき、または電解めっきで厚みが0.2〜5μm程度のめ っきをする。このめっきの厚さは、厚ければ厚いほど強度は増すが、実験による と、厚さ2μm程度あれば、はんだの濡れにくさは十分であり5μm以上は過剰 である。 Figures 1(a), (b), and (c) are a partial top view, a sectional view, and a partial top view of an embodiment of the present invention. It is a bottom view. Around the screw hole 5 with a diameter of about 2.8 to 4.0 mm provided on the base material 1 Directly connect the reinforcing copper foil pattern 3 and the grounding copper foil pattern 4 as shown in the top and bottom views. Provided in a rectangular size with a diameter of 7 to 12 mm or a side of 7 to 12 mm, top view As shown in the bottom view, cover the parts you do not want to expose with solder resist mask 2. There is. Furthermore, as shown in the figure, there is a metal 6 that cannot be soldered on the exposed part. Electroless plating or electrolytic plating of nickel with a thickness of about 0.2 to 5 μm I'm going to do something. The thickness of this plating increases as the strength increases, but according to experiments. A thickness of about 2 μm is sufficient to prevent solder from getting wet, and a thickness of 5 μm or more is excessive. It is.
【0009】 図2(a),(b),(c)は本考案の第2の実施例の部分上面図,断面図お よび底面図である。本実施例が、図1と比較して異なるところは、断面図におい て補強用銅箔パターン3および接地用銅箔パターン4の側面まではんだづけでき ない金属6aで覆っている点である。[0009] FIGS. 2(a), (b), and (c) are partial top views, sectional views, and cross-sectional views of the second embodiment of the present invention. and a bottom view. The difference in this embodiment compared to FIG. 1 is in the cross-sectional view. It is possible to solder up to the sides of the reinforcing copper foil pattern 3 and the grounding copper foil pattern 4. This point is covered with metal 6a.
【0010】0010
以上説明したように本考案は、第1に、はんだ付けできない金属で補強用銅箔 パターンと接地用銅箔パターンをめっきしているため、電子部品を搭載してフロ ーソルダリングを行っても接地用銅箔パターンのねじ穴のはんだつららを完全に 防ぐことができ、耐熱性テープを貼る必要が無くなる。また、銅に比べニッケル の方が高硬度であるため、ねじ止めに対する銅箔の変形も抑制することができ、 また穴の内部にもめっきすることにより、ねじ止め時の圧縮力の耐性も向上する 。さらに、銅箔表面はソルダーレジストマスクまたははんだづけできに金属で完 全に覆っており腐食からも保護することができる。 As explained above, the present invention has the following advantages: First, the reinforcement copper foil is made of metal that cannot be soldered. Because the pattern and grounding copper foil pattern are plated, it is possible to install electronic components on the floor. - Completely remove solder icicles from the screw holes of the grounding copper foil pattern even after soldering. This eliminates the need to apply heat-resistant tape. Also, compared to copper, nickel Because it has higher hardness, it can suppress the deformation of the copper foil when screwed. Also, by plating the inside of the hole, resistance to compressive force when screwed is improved. . Furthermore, the copper foil surface cannot be soldered using a solder resist mask or is completely metal. It is fully covered and can be protected from corrosion.
【図1】本考案の一実施例の上面図,断面図および底面
図。FIG. 1 shows a top view, a sectional view, and a bottom view of an embodiment of the present invention.
【図2】本考案の第2の実施例の上面図,断面図および
底面図。FIG. 2 shows a top view, a sectional view, and a bottom view of a second embodiment of the present invention.
【図3】従来例の印刷配線板の上面図,断面図および底
面図。FIG. 3 is a top view, a sectional view, and a bottom view of a conventional printed wiring board.
【図4】従来例の他の印刷配線板の上面図,断面図およ
び底面図。FIG. 4 is a top view, a sectional view, and a bottom view of another conventional printed wiring board.
【図5】従来例の補強用銅箔パターンと接地用銅箔パタ
ーンとの使用状態を説明する断面図。FIG. 5 is a cross-sectional view illustrating how a conventional reinforcing copper foil pattern and a grounding copper foil pattern are used.
【図6】従来例のはんだつららの一例の断面図。FIG. 6 is a cross-sectional view of an example of a conventional solder icicle.
1 基材
2 ソルダーレジストマスク
3 補強用銅箔パターン
4,4a 接地用銅箔パターン
5 ねじ穴
6,6a はんだづけができない金属(接地用銅箔パ
ターン上)
7 ねじ
8 ばね座金
9 座金
10 めねじ
11 筺体
12 はんだつらら1 Base material 2 Solder resist mask 3 Reinforcing copper foil pattern 4, 4a Grounding copper foil pattern 5 Screw holes 6, 6a Metal that cannot be soldered (on the grounding copper foil pattern) 7 Screw 8 Spring washer 9 Washer 10 Female thread 11 Housing 12 Solder icicles
Claims (1)
性金属箔回路パターンの露出部およびこの露出部の穴面
が、はんだづけができない金属により選択的にめっきさ
れたものであることを特徴とする印刷配線板。[Claim 1] The exposed portions of each conductive metal foil circuit pattern provided on the front and back layers of a copper-clad wiring board and the hole surfaces of these exposed portions are selectively plated with a metal that cannot be soldered. Characteristic printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP825491U JPH04105578U (en) | 1991-02-22 | 1991-02-22 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP825491U JPH04105578U (en) | 1991-02-22 | 1991-02-22 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04105578U true JPH04105578U (en) | 1992-09-10 |
Family
ID=31899374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP825491U Pending JPH04105578U (en) | 1991-02-22 | 1991-02-22 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04105578U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019204852A (en) * | 2018-05-22 | 2019-11-28 | ファナック株式会社 | Printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856495A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Printed circuit board and method of producing same |
-
1991
- 1991-02-22 JP JP825491U patent/JPH04105578U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856495A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Printed circuit board and method of producing same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019204852A (en) * | 2018-05-22 | 2019-11-28 | ファナック株式会社 | Printed circuit board |
US10973130B2 (en) | 2018-05-22 | 2021-04-06 | Fanuc Corporation | Printed wiring board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5605477A (en) | Flexible etched circuit assembly | |
JPS61203695A (en) | Part mounting system for single-side wiring board | |
US4967042A (en) | System for enhancing current carrying capacity of printed wiring board | |
JPH04105578U (en) | printed wiring board | |
JP2521034B2 (en) | Printed wiring board | |
JPH05136593A (en) | Shield structure | |
JPH0747897Y2 (en) | Printed board | |
JPH0397958U (en) | ||
JPS6188471A (en) | Connector | |
JP2613952B2 (en) | Printed wiring board connection method | |
JPH09321417A (en) | Single side printed-wiring board | |
JPH0751822Y2 (en) | Pattern seat for screwing printed wiring boards | |
JPH0723975Y2 (en) | Ground metal mounting structure | |
JPS6286894A (en) | Printed wiring board | |
JPS5825057U (en) | flexible print circuit | |
JPH0710969U (en) | Printed board | |
JPH056685Y2 (en) | ||
JPH0711769U (en) | Power supply connector mounting device | |
JPS5856471U (en) | Chip parts mounting device | |
JPH0631166U (en) | Printed wiring board | |
JPS5951590A (en) | Printed board | |
JPS6024091A (en) | Printed circuit board | |
JPH05144492A (en) | Printed circuit board mounting method | |
JP2003017814A (en) | Electronic component assembly | |
JPH06209147A (en) | Printed-wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970128 |