JPH0410556Y2 - - Google Patents
Info
- Publication number
- JPH0410556Y2 JPH0410556Y2 JP5298989U JP5298989U JPH0410556Y2 JP H0410556 Y2 JPH0410556 Y2 JP H0410556Y2 JP 5298989 U JP5298989 U JP 5298989U JP 5298989 U JP5298989 U JP 5298989U JP H0410556 Y2 JPH0410556 Y2 JP H0410556Y2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- furnace
- electronic components
- shaped
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 19
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Tunnel Furnaces (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5298989U JPH0410556Y2 (ko) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5298989U JPH0410556Y2 (ko) | 1989-05-10 | 1989-05-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02144394U JPH02144394U (ko) | 1990-12-07 |
JPH0410556Y2 true JPH0410556Y2 (ko) | 1992-03-16 |
Family
ID=31573778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5298989U Expired JPH0410556Y2 (ko) | 1989-05-10 | 1989-05-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0410556Y2 (ko) |
-
1989
- 1989-05-10 JP JP5298989U patent/JPH0410556Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH02144394U (ko) | 1990-12-07 |
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